KR100788107B1 - Rfid 태그 - Google Patents
Rfid 태그 Download PDFInfo
- Publication number
- KR100788107B1 KR100788107B1 KR1020050112954A KR20050112954A KR100788107B1 KR 100788107 B1 KR100788107 B1 KR 100788107B1 KR 1020050112954 A KR1020050112954 A KR 1020050112954A KR 20050112954 A KR20050112954 A KR 20050112954A KR 100788107 B1 KR100788107 B1 KR 100788107B1
- Authority
- KR
- South Korea
- Prior art keywords
- antenna
- rfid tag
- detection unit
- tag
- detector
- Prior art date
Links
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Details Of Aerials (AREA)
- Burglar Alarm Systems (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (10)
- 안테나와 전자 부품으로 이루어지는 RFID 태그에 있어서,송수신하는 안테나와,안테나 주위에 형성된 검지부와,상기 안테나와 검지부에 접속하여, 검지부의 파괴를 검지하는 전자 부품을 갖는 것을 특징으로 하는 RFID 태그.
- 제1항에 있어서,상기 검지부는 반파장의 비정수배의 길이로 하는 것을 특징으로 하는 RFID 태그.
- 제1항에 있어서,상기 검지부는 도전성 재료이고, 또한 2개 라인의 루프로 형성하는 것을 특징으로 하는 RFID 태그.
- 삭제
- 제1항에 있어서,상기 검지부는 1중 루프를 절첩한 형상으로 하는 것을 특징으로 하는 RFID 태그.
- 제1항에 있어서,상기 검지부는 1중 루프를 절첩한 コ자의 형상으로 하는 것을 특징으로 하는 RFID 태그.
- 제1항에 있어서,상기 검지부는 은 페이스트로 형성하고, 또한 상기 안테나는 구리로 형성하는 것을 특징으로 하는 RFID 태그.
- 삭제
- 안테나와 전자 부품으로 이루어지는 RFID 태그에 있어서,송수신하는 안테나와,안테나 주위에 형성된 검지부와,상기 안테나와 검지부에 접속하여, 검지부의 파괴를 검지하는 전자 부품과,상기 안테나, 상기 검지부 및 전자 부품을 실장한 제1 필름과,상기 안테나, 상기 검지부 및 전자 부품을 피복하는 제2 필름과,상기 제1 필름과 제2 필름의 사이에서, 또한 검지부의 일부를 둘러싼 것 같은 외측의 위치에 설치하고, 상기 제2 필름과 강고하게 접착하는 벽부를 갖는 것을 특징으로 하는 RFID 태그.
- 제9항에 있어서,상기 벽부는 경화성 수지로 형성하고, 제1 필름과 접촉하는 표면에 박리 가능한 재질을 도포하는 것을 특징으로 하는 RFID 태그.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005075379A JP4453582B2 (ja) | 2005-03-16 | 2005-03-16 | Rfidタグ |
JPJP-P-2005-00075379 | 2005-03-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060101196A KR20060101196A (ko) | 2006-09-22 |
KR100788107B1 true KR100788107B1 (ko) | 2007-12-21 |
Family
ID=36600204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050112954A KR100788107B1 (ko) | 2005-03-16 | 2005-11-24 | Rfid 태그 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7516901B2 (ko) |
EP (1) | EP1703447B1 (ko) |
JP (1) | JP4453582B2 (ko) |
KR (1) | KR100788107B1 (ko) |
CN (1) | CN100385457C (ko) |
TW (1) | TWI308297B (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4330575B2 (ja) * | 2005-03-17 | 2009-09-16 | 富士通株式会社 | タグアンテナ |
US7698269B2 (en) * | 2005-11-29 | 2010-04-13 | Yahoo! Inc. | URL shortening and authentication with reverse hash lookup |
US20070205900A1 (en) * | 2006-03-03 | 2007-09-06 | Ipico Innovation Inc. | Rfid tag with antenna and sense conductor |
JP2008182438A (ja) * | 2007-01-24 | 2008-08-07 | Nec Tokin Corp | 無線タグ |
JP5054423B2 (ja) * | 2007-05-01 | 2012-10-24 | トッパン・フォームズ株式会社 | Rfidメディア |
JP5236939B2 (ja) * | 2007-12-21 | 2013-07-17 | 大日本印刷株式会社 | データキャリア |
JP5029504B2 (ja) * | 2008-03-21 | 2012-09-19 | ブラザー工業株式会社 | タグテープ |
JP4582507B2 (ja) * | 2008-03-21 | 2010-11-17 | ブラザー工業株式会社 | タグテープ、無線タグラベル、タグテープロール、無線タグ回路素子カートリッジ |
CN101299644B (zh) * | 2008-06-13 | 2011-12-21 | 深圳市远望谷信息技术股份有限公司 | 基于六端口电路的天线信道检测方法 |
JP5146265B2 (ja) * | 2008-11-04 | 2013-02-20 | 富士通株式会社 | タグ用アンテナ及びそれを備えた無線タグ |
KR101024659B1 (ko) * | 2009-02-03 | 2011-03-25 | 성균관대학교산학협력단 | 알에프아이디 장치 |
CN102054152A (zh) * | 2009-10-30 | 2011-05-11 | 中兴通讯股份有限公司 | 一种电子标签的射频增益控制方法、装置和电子标签 |
TW201134332A (en) * | 2010-03-16 | 2011-10-01 | Ind Tech Res Inst | Printed circuit board with embedded antenna for RFID tag and method for manufacturing the same |
US8884764B2 (en) * | 2011-02-25 | 2014-11-11 | Avery Dennison Corporation | Method, system, and apparatus for RFID removal detection |
US20150263427A1 (en) * | 2014-03-12 | 2015-09-17 | Cambridge Silicon Radio Limited | Antenna |
CN105046840A (zh) * | 2015-06-25 | 2015-11-11 | 苏州木兰电子科技有限公司 | 一种基于rfid的无需插卡式银行自助服务终端系统 |
CN106503778A (zh) * | 2015-09-08 | 2017-03-15 | 凸版印刷株式会社 | 带ic标签贴纸及其安装方法 |
CN106557805A (zh) * | 2015-09-24 | 2017-04-05 | 葛兰菲安全有限公司 | 安全无线射频识别卷标、系统及其方法 |
CN110431559B (zh) * | 2016-09-09 | 2023-09-19 | 香港物流及供应链管理应用技术研发中心 | 射频通信设备及其使用方法 |
JP7457519B2 (ja) * | 2020-02-18 | 2024-03-28 | 株式会社ブリヂストン | 航空機用タイヤ |
JP2023020086A (ja) * | 2021-07-30 | 2023-02-09 | 日本航空電子工業株式会社 | Rfidタグ及びそれに用いられるアンテナ部材 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US6421013B1 (en) | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US20030075608A1 (en) * | 2000-03-21 | 2003-04-24 | Atherton Peter S | Tamper indicating radio frequency identification label |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9225654D0 (en) * | 1992-12-08 | 1993-01-27 | Lussey David | Tamper detection sensor |
FR2713809B1 (fr) * | 1993-12-15 | 1996-03-01 | Gerard Lemaire | Dispositif de marquage. |
JPH07220036A (ja) * | 1994-02-04 | 1995-08-18 | Mitsubishi Electric Corp | 非接触形の半導体モジュール |
JP4046167B2 (ja) * | 1998-08-12 | 2008-02-13 | リンテック株式会社 | 非接触データキャリアラベル |
US20040066296A1 (en) * | 2001-11-15 | 2004-04-08 | Atherton Peter S. | Tamper indicating radio frequency identification label with tracking capability |
JP2003209421A (ja) * | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | 透明アンテナを有するrfidタグ、及びその製造方法 |
JP2003242451A (ja) * | 2002-02-19 | 2003-08-29 | Tamura Electric Works Ltd | 非接触icカードリーダライタ装置 |
US7204425B2 (en) * | 2002-03-18 | 2007-04-17 | Precision Dynamics Corporation | Enhanced identification appliance |
JP4013653B2 (ja) * | 2002-05-27 | 2007-11-28 | 凸版印刷株式会社 | 不正防止非接触タグ |
GB0304841D0 (en) * | 2003-03-04 | 2003-04-09 | Koninkl Philips Electronics Nv | Wireless transmission tag, product fitted with such a tag, communication system including such a tag and communication method for such a system |
JP2004280465A (ja) * | 2003-03-14 | 2004-10-07 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP3636202B2 (ja) * | 2003-05-26 | 2005-04-06 | オムロン株式会社 | 情報担持体、情報記録媒体、センサー、物品管理方法 |
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JP2005043978A (ja) * | 2003-07-23 | 2005-02-17 | Dainippon Printing Co Ltd | 再利用不可能なリストバンド型非接触データキャリア |
KR20100021665A (ko) * | 2004-12-14 | 2010-02-25 | 후지쯔 가부시끼가이샤 | 안테나 및 비접촉형 태그 |
JP4750450B2 (ja) * | 2005-04-05 | 2011-08-17 | 富士通株式会社 | Rfidタグ |
US7262701B1 (en) * | 2005-05-23 | 2007-08-28 | National Semiconductor Corporation | Antenna structures for RFID devices |
-
2005
- 2005-03-16 JP JP2005075379A patent/JP4453582B2/ja not_active Expired - Fee Related
- 2005-10-24 US US11/256,056 patent/US7516901B2/en not_active Expired - Fee Related
- 2005-10-28 TW TW094137815A patent/TWI308297B/zh not_active IP Right Cessation
- 2005-11-17 EP EP05025096.8A patent/EP1703447B1/en not_active Ceased
- 2005-11-22 CN CNB2005101248486A patent/CN100385457C/zh not_active Expired - Fee Related
- 2005-11-24 KR KR1020050112954A patent/KR100788107B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6421013B1 (en) | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
US20030075608A1 (en) * | 2000-03-21 | 2003-04-24 | Atherton Peter S | Tamper indicating radio frequency identification label |
Also Published As
Publication number | Publication date |
---|---|
JP2006260042A (ja) | 2006-09-28 |
TWI308297B (en) | 2009-04-01 |
EP1703447A3 (en) | 2009-02-18 |
CN1835000A (zh) | 2006-09-20 |
EP1703447A2 (en) | 2006-09-20 |
US7516901B2 (en) | 2009-04-14 |
JP4453582B2 (ja) | 2010-04-21 |
EP1703447B1 (en) | 2013-11-13 |
US20060208095A1 (en) | 2006-09-21 |
CN100385457C (zh) | 2008-04-30 |
TW200634648A (en) | 2006-10-01 |
KR20060101196A (ko) | 2006-09-22 |
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