KR100734638B1 - 발광 소자 - Google Patents
발광 소자 Download PDFInfo
- Publication number
- KR100734638B1 KR100734638B1 KR1019990029926A KR19990029926A KR100734638B1 KR 100734638 B1 KR100734638 B1 KR 100734638B1 KR 1019990029926 A KR1019990029926 A KR 1019990029926A KR 19990029926 A KR19990029926 A KR 19990029926A KR 100734638 B1 KR100734638 B1 KR 100734638B1
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- KR
- South Korea
- Prior art keywords
- layer
- active region
- led
- active layer
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- Prior art date
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- Expired - Lifetime
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- 238000002835 absorbance Methods 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 35
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 20
- 239000001301 oxygen Substances 0.000 claims abstract description 20
- 229910045601 alloy Inorganic materials 0.000 claims description 26
- 239000000956 alloy Substances 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 230000004888 barrier function Effects 0.000 claims description 16
- 238000000605 extraction Methods 0.000 abstract description 28
- 230000007423 decrease Effects 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 11
- 239000006096 absorbing agent Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 421
- 239000002019 doping agent Substances 0.000 description 22
- 238000010521 absorption reaction Methods 0.000 description 15
- 125000004429 atom Chemical group 0.000 description 9
- 239000000969 carrier Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000006798 recombination Effects 0.000 description 7
- 238000005215 recombination Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 230000003071 parasitic effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 239000002784 hot electron Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 230000005428 wave function Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/8242—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP characterised by the dopants
Landscapes
- Led Devices (AREA)
Abstract
Description
Claims (21)
- 발광 소자(light-emitting device)에 있어서,복수의 반도체 층을 포함하되,상기 반도체 층은제 1 전도 타입의 3족 인화물 하부 한정층과,제 2 전도 타입의 3족 인화물 상부 한정층과,상기 하부 한정층과 상기 상부 한정층 사이에 위치하는 3족 인화물 활성 영역을 포함하며,상기 활성 영역의 흡광도는 상기 소자 내의 전체 반도체 층의 총 흡광도의 적어도 20% 이고, 상기 활성 영역의 두께는 2000Å 이하인발광 소자.
- 제 1 항에 있어서,상기 하부 한정층에 가장 가까이 위치하는 상기 제 1 전도 타입의 반도체 기판과,상기 상부 한정층에 가장 가까이 위치하는 상기 제 2 전도 타입의 반도체 윈도우 층을 더 포함하는 발광 소자.
- 제 1 항에 있어서,상기 활성 영역과, 상기 하부 및 상부 한정층 중 하나의 사이에 위치하는 AlGaInP 합금의 역전층(set-back layer)을 더 포함하되,상기 역전층의 합금 합성물은 (AlxGa1-x)yIn1-yP (여기서, x ≥0.55 및 0 ≤y ≤1)인 발광 소자.
- 제 1 항에 있어서,상기 상부 한정층은 1017 cm-3보다 크고 5x1018 cm-3보다 작은 농도의 산소로 도핑되는 발광 소자.
- 제 3 항에 있어서,상기 역전층은 상기 활성 영역과 상기 상부 한정층 사이에 위치하고, 1015 cm-3보다 크고 5x1016 cm-3보다 작은 농도의 산소로 도핑되는 발광 소자.
- 제 1 항에 있어서,상기 활성 영역은 복수의 양자 웰 층과, 두 개의 상기 양자 웰 층 사이에 위치하는 적어도 하나의 배리어층을 더 포함하는 발광 소자.
- 삭제
- 삭제
- 삭제
- 삭제
- 삭제
- 제 1 항에 있어서,상기 활성 영역의 두께는 1500Å보다 작은 발광 소자.
- 제 1 항에 있어서,상기 활성 영역의 두께는 1000Å보다 작은 발광 소자.
- 제 1 항에 있어서,상기 활성 영역의 두께는 100Å보다 큰 발광 소자.
- 삭제
- 삭제
- 삭제
- 제 1 항에 있어서,상기 활성 영역은 최고 파장이 600nm 미만의 빛을 방출하도록 구성되며, 상기 활성 영역의 두께는 1000Å 내지 2000Å 사이인 발광 소자.
- 제 1 항에 있어서,상기 활성 영역은 최고 파장이 600nm 내지 620nm 사이의 빛을 방출하도록 구성되며, 상기 활성 영역의 두께는 500Å 내지 2000Å 사이인 발광 소자.
- 제 1 항에 있어서,상기 활성 영역은 최고 파장이 620nm보다 큰 빛을 방출하도록 구성되며, 상기 활성 영역의 두께는 200Å 내지 1500Å 사이인 발광 소자.
- 제 3 항에 있어서,상기 역전층은 상기 활성 영역과 상기 상부 한정층 사이에 위치하며, 상기 활성 영역과 상기 역전층의 총 두께는 5000Å 내지 10000Å 사이인 발광소자.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/122,568 US20010020703A1 (en) | 1998-07-24 | 1998-07-24 | Algainp light emitting devices with thin active layers |
US09/122,568 | 1998-07-24 | ||
US9/122,568 | 1998-07-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000011917A KR20000011917A (ko) | 2000-02-25 |
KR100734638B1 true KR100734638B1 (ko) | 2007-07-02 |
Family
ID=22403472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990029926A Expired - Lifetime KR100734638B1 (ko) | 1998-07-24 | 1999-07-23 | 발광 소자 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20010020703A1 (ko) |
JP (1) | JP2000058906A (ko) |
KR (1) | KR100734638B1 (ko) |
DE (1) | DE19911701B4 (ko) |
GB (1) | GB2339965A (ko) |
TW (1) | TW410485B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150051625A (ko) * | 2013-11-05 | 2015-05-13 | 삼성디스플레이 주식회사 | 유기 발광 다이오드, 유기 발광 표시 장치의 화소, 및 유기 발광 표시 장치 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6469314B1 (en) * | 1999-12-21 | 2002-10-22 | Lumileds Lighting U.S., Llc | Thin multi-well active layer LED with controlled oxygen doping |
JP2002151734A (ja) * | 2000-09-04 | 2002-05-24 | Sharp Corp | 発光ダイオード |
JP2002111052A (ja) * | 2000-09-28 | 2002-04-12 | Toshiba Corp | 半導体発光素子及びその製造方法 |
US6891202B2 (en) | 2001-12-14 | 2005-05-10 | Infinera Corporation | Oxygen-doped Al-containing current blocking layers in active semiconductor devices |
US7528417B2 (en) | 2003-02-10 | 2009-05-05 | Showa Denko K.K. | Light-emitting diode device and production method thereof |
WO2005104236A2 (en) * | 2004-04-15 | 2005-11-03 | Trustees Of Boston University | Optical devices featuring textured semiconductor layers |
US8035113B2 (en) * | 2004-04-15 | 2011-10-11 | The Trustees Of Boston University | Optical devices featuring textured semiconductor layers |
JP4225510B2 (ja) * | 2005-07-06 | 2009-02-18 | 昭和電工株式会社 | 化合物半導体発光ダイオードおよびその製造方法 |
DE102005047168A1 (de) * | 2005-09-30 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
US8212262B2 (en) | 2007-02-09 | 2012-07-03 | Cree, Inc. | Transparent LED chip |
US8692286B2 (en) * | 2007-12-14 | 2014-04-08 | Philips Lumileds Lighing Company LLC | Light emitting device with bonded interface |
US8592800B2 (en) * | 2008-03-07 | 2013-11-26 | Trustees Of Boston University | Optical devices featuring nonpolar textured semiconductor layers |
JP5315899B2 (ja) * | 2008-09-30 | 2013-10-16 | 信越半導体株式会社 | 発光素子 |
JP5309971B2 (ja) * | 2008-12-24 | 2013-10-09 | 信越半導体株式会社 | 発光素子 |
JP5608589B2 (ja) * | 2011-03-10 | 2014-10-15 | スタンレー電気株式会社 | 半導体発光素子および半導体発光素子の製造方法 |
KR101513803B1 (ko) * | 2013-10-02 | 2015-04-20 | 광전자 주식회사 | 투명 기판 위에 직접 성장된 고 효율 AlGaInP 발광다이오드 및 그 제조방법 |
KR102098937B1 (ko) * | 2014-01-27 | 2020-04-08 | 엘지이노텍 주식회사 | 발광소자 |
US10490691B2 (en) | 2015-07-31 | 2019-11-26 | Apple Inc. | Light emitting diode with displaced P-type doping |
US20230070171A1 (en) * | 2021-09-09 | 2023-03-09 | Seoul Viosys Co., Ltd. | Light emitting diode and method of fabricating the same |
CN114038960A (zh) * | 2021-09-09 | 2022-02-11 | 重庆康佳光电技术研究院有限公司 | 微发光二极管磊晶结构及其制造方法、微发光二极管 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0072782A2 (en) * | 1981-06-29 | 1983-02-23 | Power System AB | Method and apparatus for eliminating aerosol particles in display screen environments |
JPH08125285A (ja) * | 1994-09-01 | 1996-05-17 | Mitsubishi Chem Corp | 半導体発光装置 |
JPH08213652A (ja) * | 1994-10-24 | 1996-08-20 | Mitsubishi Chem Corp | 半導体発光装置 |
EP0727827A2 (en) * | 1995-02-15 | 1996-08-21 | Mitsubishi Cable Industries, Ltd. | Semiconductor light emitting element |
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US5060028A (en) | 1989-01-19 | 1991-10-22 | Hewlett-Packard Company | High band-gap opto-electronic device |
JP3290672B2 (ja) * | 1990-08-20 | 2002-06-10 | 株式会社東芝 | 半導体発光ダイオード |
US5153889A (en) * | 1989-05-31 | 1992-10-06 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device |
US5008718A (en) | 1989-12-18 | 1991-04-16 | Fletcher Robert M | Light-emitting diode with an electrically conductive window |
JPH04306886A (ja) * | 1991-04-03 | 1992-10-29 | Mitsubishi Electric Corp | 半導体発光素子 |
US5233204A (en) | 1992-01-10 | 1993-08-03 | Hewlett-Packard Company | Light-emitting diode with a thick transparent layer |
JP3373561B2 (ja) * | 1992-09-30 | 2003-02-04 | 株式会社東芝 | 発光ダイオード |
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JPH08288544A (ja) * | 1995-04-14 | 1996-11-01 | Toshiba Corp | 半導体発光素子 |
TW319916B (ko) * | 1995-06-05 | 1997-11-11 | Hewlett Packard Co | |
DE19524655A1 (de) * | 1995-07-06 | 1997-01-09 | Huang Kuo Hsin | LED-Struktur |
DE19629920B4 (de) * | 1995-08-10 | 2006-02-02 | LumiLeds Lighting, U.S., LLC, San Jose | Licht-emittierende Diode mit einem nicht-absorbierenden verteilten Braggreflektor |
JP3635757B2 (ja) * | 1995-12-28 | 2005-04-06 | 昭和電工株式会社 | AlGaInP発光ダイオード |
JP3643665B2 (ja) * | 1996-12-20 | 2005-04-27 | シャープ株式会社 | 半導体発光素子 |
US5917201A (en) * | 1997-08-07 | 1999-06-29 | Epistar Co. | Light emitting diode with asymmetrical energy band structure |
-
1998
- 1998-07-24 US US09/122,568 patent/US20010020703A1/en not_active Abandoned
-
1999
- 1999-02-05 TW TW088101778A patent/TW410485B/zh not_active IP Right Cessation
- 1999-03-16 DE DE19911701A patent/DE19911701B4/de not_active Expired - Lifetime
- 1999-07-23 JP JP20990199A patent/JP2000058906A/ja active Pending
- 1999-07-23 GB GB9917437A patent/GB2339965A/en not_active Withdrawn
- 1999-07-23 KR KR1019990029926A patent/KR100734638B1/ko not_active Expired - Lifetime
-
2001
- 2001-11-05 US US10/011,521 patent/US7087941B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0072782A2 (en) * | 1981-06-29 | 1983-02-23 | Power System AB | Method and apparatus for eliminating aerosol particles in display screen environments |
JPH08125285A (ja) * | 1994-09-01 | 1996-05-17 | Mitsubishi Chem Corp | 半導体発光装置 |
JPH08213652A (ja) * | 1994-10-24 | 1996-08-20 | Mitsubishi Chem Corp | 半導体発光装置 |
EP0727827A2 (en) * | 1995-02-15 | 1996-08-21 | Mitsubishi Cable Industries, Ltd. | Semiconductor light emitting element |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150051625A (ko) * | 2013-11-05 | 2015-05-13 | 삼성디스플레이 주식회사 | 유기 발광 다이오드, 유기 발광 표시 장치의 화소, 및 유기 발광 표시 장치 |
KR102124416B1 (ko) * | 2013-11-05 | 2020-06-19 | 삼성디스플레이 주식회사 | 유기 발광 다이오드, 유기 발광 표시 장치의 화소, 및 유기 발광 표시 장치 |
Also Published As
Publication number | Publication date |
---|---|
GB2339965A (en) | 2000-02-09 |
GB9917437D0 (en) | 1999-09-22 |
DE19911701B4 (de) | 2009-12-03 |
TW410485B (en) | 2000-11-01 |
DE19911701A1 (de) | 2000-02-03 |
US7087941B2 (en) | 2006-08-08 |
US20020127751A1 (en) | 2002-09-12 |
KR20000011917A (ko) | 2000-02-25 |
JP2000058906A (ja) | 2000-02-25 |
US20010020703A1 (en) | 2001-09-13 |
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