KR100728457B1 - 인쇄땜납 검사장치 - Google Patents

인쇄땜납 검사장치 Download PDF

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Publication number
KR100728457B1
KR100728457B1 KR1020060049338A KR20060049338A KR100728457B1 KR 100728457 B1 KR100728457 B1 KR 100728457B1 KR 1020060049338 A KR1020060049338 A KR 1020060049338A KR 20060049338 A KR20060049338 A KR 20060049338A KR 100728457 B1 KR100728457 B1 KR 100728457B1
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South Korea
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KR1020060049338A
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Korean (ko)
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KR20060127753A (ko
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쓰요시 기무라
에이지 쓰지무라
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안리츠 코포레이션
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Publication of KR20060127753A publication Critical patent/KR20060127753A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
KR1020060049338A 2005-06-07 2006-06-01 인쇄땜납 검사장치 KR100728457B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00167287 2005-06-07
JP2005167287A JP4694272B2 (ja) 2005-06-07 2005-06-07 印刷はんだ検査装置及び印刷はんだ検査方法

Publications (2)

Publication Number Publication Date
KR20060127753A KR20060127753A (ko) 2006-12-13
KR100728457B1 true KR100728457B1 (ko) 2007-06-13

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ID=37509750

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060049338A KR100728457B1 (ko) 2005-06-07 2006-06-01 인쇄땜납 검사장치

Country Status (5)

Country Link
JP (1) JP4694272B2 (zh)
KR (1) KR100728457B1 (zh)
CN (1) CN100432622C (zh)
HK (1) HK1097901A1 (zh)
TW (1) TWI320098B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5411439B2 (ja) * 2008-03-19 2014-02-12 アンリツ株式会社 印刷はんだ検査装置
CN101583249A (zh) * 2008-05-15 2009-11-18 松下电器产业株式会社 印刷的软钎膏的检查方法以及装置
JP5182122B2 (ja) 2009-01-27 2013-04-10 オムロン株式会社 部品実装基板の品質管理用の情報表示システムおよび情報表示方法
JP5353790B2 (ja) * 2010-03-30 2013-11-27 コニカミノルタ株式会社 生体情報測定装置および該方法
EP2573508B1 (en) * 2011-03-14 2014-01-29 Panasonic Corporation Solder height detection method and solder height detection device
JP5418542B2 (ja) * 2011-06-14 2014-02-19 パナソニック株式会社 印刷状態計測結果の表示装置および表示方法
CN103185736B (zh) * 2012-01-03 2015-05-27 宏恒胜电子科技（淮安）有限公司 电路板孔内焊锡的测试方法
JP5907429B2 (ja) * 2012-07-24 2016-04-26 日本電気硝子株式会社 板状体の反り検査装置及びその反り検査方法
KR20180054063A (ko) * 2016-11-14 2018-05-24 주식회사 고영테크놀러지 검사체에 대한 양부 판정 조건을 조정하는 방법 및 장치
JP2018112533A (ja) * 2017-01-13 2018-07-19 キヤノン株式会社 計測装置、情報処理装置、情報処理方法、およびプログラム
JP2019152486A (ja) * 2018-03-01 2019-09-12 株式会社東京精密 設計公差の補正方法及び補正装置
CN109000560B (zh) * 2018-06-11 2021-07-06 广东工业大学 基于三维相机检测包裹尺寸的方法、装置以及设备
CN109444587B (zh) * 2018-11-15 2020-10-16 国网江苏省电力有限公司电力科学研究院 基于频数分布的不停电检测技术可靠性计算方法及系统
CN111421954B (zh) * 2019-01-10 2022-02-18 鸿富锦精密电子(天津)有限公司 智能判定回馈方法及装置
WO2021223940A1 (en) * 2020-05-04 2021-11-11 Asml Netherlands B.V. System and method for generating level data for a surface of a substrate
CN111645424A (zh) * 2020-06-15 2020-09-11 蔡怀峰 墨盒头配板方法
CN111660674A (zh) * 2020-06-15 2020-09-15 蔡怀峰 墨盒头配板装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196980A (ja) 1987-02-10 1988-08-15 Toshiba Corp プリント基板の半田付外観検査装置
JPH06288931A (ja) * 1993-04-02 1994-10-18 Nec Corp 実装基板検査装置
KR950030753A (ko) * 1994-04-08 1995-11-24 이헌일 X선을 이용한 납땜상태 검사장치 및 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1055997A (zh) * 1990-04-25 1991-11-06 哈尔滨工业大学 印刷电路板焊点激光全息检测法及装置
US5178965A (en) * 1992-02-14 1993-01-12 Rockwell International Corporation Uniform solder coating on roughened substrate
JPH0612377A (ja) * 1992-06-29 1994-01-21 Sharp Corp 工程能力指数計算機能付き小型電子計算機
JPH0658736A (ja) * 1992-08-07 1994-03-04 Matsushita Electric Ind Co Ltd ３次元形状検査方法と３次元形状検査装置
JP3033413B2 (ja) * 1992-12-11 2000-04-17 トヨタ自動車株式会社 はんだ付検査装置
JP3250309B2 (ja) * 1993-03-02 2002-01-28 オムロン株式会社 実装部品検査用データの教示方法
JPH11298200A (ja) * 1998-04-10 1999-10-29 Nagoya Denki Kogyo Kk プリント基板の部品実装プロセスにおける自動品質管理方法およびその装置
JP2001109733A (ja) * 1999-10-12 2001-04-20 Hitachi Ltd 識別モデルの評価方法及び閾値調整方法
JP2002368412A (ja) * 2001-06-04 2002-12-20 Ibiden Co Ltd プリント配線板の検査方法
JP2005135954A (ja) * 2003-10-28 2005-05-26 Matsushita Electric Ind Co Ltd プリント基板検査装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196980A (ja) 1987-02-10 1988-08-15 Toshiba Corp プリント基板の半田付外観検査装置
JPH06288931A (ja) * 1993-04-02 1994-10-18 Nec Corp 実装基板検査装置
KR950030753A (ko) * 1994-04-08 1995-11-24 이헌일 X선을 이용한 납땜상태 검사장치 및 방법

Also Published As

Publication number Publication date
JP4694272B2 (ja) 2011-06-08
CN1877251A (zh) 2006-12-13
CN100432622C (zh) 2008-11-12
HK1097901A1 (en) 2007-07-06
TW200643405A (en) 2006-12-16
JP2006343152A (ja) 2006-12-21
KR20060127753A (ko) 2006-12-13
TWI320098B (en) 2010-02-01

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