HK1097901A1 - Print-soldering inspection apparatus - Google Patents
Print-soldering inspection apparatusInfo
- Publication number
- HK1097901A1 HK1097901A1 HK07104152.9A HK07104152A HK1097901A1 HK 1097901 A1 HK1097901 A1 HK 1097901A1 HK 07104152 A HK07104152 A HK 07104152A HK 1097901 A1 HK1097901 A1 HK 1097901A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- inspection apparatus
- soldering inspection
- soldering
- inspection
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30152—Solder
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005167287A JP4694272B2 (en) | 2005-06-07 | 2005-06-07 | Printed solder inspection apparatus and printed solder inspection method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1097901A1 true HK1097901A1 (en) | 2007-07-06 |
Family
ID=37509750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK07104152.9A HK1097901A1 (en) | 2005-06-07 | 2007-04-20 | Print-soldering inspection apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4694272B2 (en) |
KR (1) | KR100728457B1 (en) |
CN (1) | CN100432622C (en) |
HK (1) | HK1097901A1 (en) |
TW (1) | TWI320098B (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5411439B2 (en) * | 2008-03-19 | 2014-02-12 | アンリツ株式会社 | Printed solder inspection equipment |
CN101583249A (en) * | 2008-05-15 | 2009-11-18 | 松下电器产业株式会社 | Method of inspecting solder paste for printing and a device thereof |
JP5182122B2 (en) | 2009-01-27 | 2013-04-10 | オムロン株式会社 | Information display system and information display method for quality control of component mounting board |
JP5353790B2 (en) * | 2010-03-30 | 2013-11-27 | コニカミノルタ株式会社 | Biological information measuring apparatus and method |
EP2573508B1 (en) * | 2011-03-14 | 2014-01-29 | Panasonic Corporation | Solder height detection method and solder height detection device |
JP5418542B2 (en) * | 2011-06-14 | 2014-02-19 | パナソニック株式会社 | Display device and display method of print state measurement result |
CN103185736B (en) * | 2012-01-03 | 2015-05-27 | 宏恒胜电子科技(淮安)有限公司 | Testing method for circuit board hole solder |
JP5907429B2 (en) * | 2012-07-24 | 2016-04-26 | 日本電気硝子株式会社 | Plate-like warpage inspection apparatus and warpage inspection method thereof |
KR20180054063A (en) * | 2016-11-14 | 2018-05-24 | 주식회사 고영테크놀러지 | Method and apparatus for adjusting condition of quality decision for inspection target |
JP2018112533A (en) * | 2017-01-13 | 2018-07-19 | キヤノン株式会社 | Measuring device, information processing apparatus, information processing method, and program |
JP2019152486A (en) * | 2018-03-01 | 2019-09-12 | 株式会社東京精密 | Method and device for correcting design tolerance |
CN109000560B (en) * | 2018-06-11 | 2021-07-06 | 广东工业大学 | Method, device and equipment for detecting package size based on three-dimensional camera |
CN109444587B (en) * | 2018-11-15 | 2020-10-16 | 国网江苏省电力有限公司电力科学研究院 | Method and system for calculating reliability of uninterrupted power supply detection technology based on frequency distribution |
CN111421954B (en) * | 2019-01-10 | 2022-02-18 | 鸿富锦精密电子(天津)有限公司 | Intelligent judgment feedback method and device |
KR20220163476A (en) * | 2020-05-04 | 2022-12-09 | 에이에스엠엘 네델란즈 비.브이. | Systems and methods for generating level data for the surface of a substrate |
CN111645424A (en) * | 2020-06-15 | 2020-09-11 | 蔡怀峰 | Method for assembling ink box head |
CN111660674A (en) * | 2020-06-15 | 2020-09-15 | 蔡怀峰 | Ink box head plate-matching device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63196980A (en) | 1987-02-10 | 1988-08-15 | Toshiba Corp | Device for inspecting soldering external appearance for printed circuit board |
CN1055997A (en) * | 1990-04-25 | 1991-11-06 | 哈尔滨工业大学 | Printed circuit board solder joint laser hologram detection method and device |
US5178965A (en) * | 1992-02-14 | 1993-01-12 | Rockwell International Corporation | Uniform solder coating on roughened substrate |
JPH0612377A (en) * | 1992-06-29 | 1994-01-21 | Sharp Corp | Small-sized electronic computer with process capacity index calculating function |
JPH0658736A (en) * | 1992-08-07 | 1994-03-04 | Matsushita Electric Ind Co Ltd | Method and device for three dimensional shape inspection |
JP3033413B2 (en) * | 1992-12-11 | 2000-04-17 | トヨタ自動車株式会社 | Soldering inspection equipment |
JP3250309B2 (en) * | 1993-03-02 | 2002-01-28 | オムロン株式会社 | Teaching method of mounted part inspection data |
JPH0765968B2 (en) * | 1993-04-02 | 1995-07-19 | 日本電気株式会社 | Mounted board inspection device |
KR100261970B1 (en) * | 1994-04-08 | 2000-07-15 | 이헌일 | Soldering status checking device and its method using x-ray |
JPH11298200A (en) * | 1998-04-10 | 1999-10-29 | Nagoya Denki Kogyo Kk | Method and apparatus for automatic quality control in process of mounting components on printed board |
JP2001109733A (en) * | 1999-10-12 | 2001-04-20 | Hitachi Ltd | Method for evaluating identification model and method for adjusting threshold |
JP2002368412A (en) * | 2001-06-04 | 2002-12-20 | Ibiden Co Ltd | Method for inspecting printed wiring board |
JP2005135954A (en) * | 2003-10-28 | 2005-05-26 | Matsushita Electric Ind Co Ltd | Printed circuit board inspection device |
-
2005
- 2005-06-07 JP JP2005167287A patent/JP4694272B2/en not_active Expired - Fee Related
-
2006
- 2006-06-01 KR KR1020060049338A patent/KR100728457B1/en not_active IP Right Cessation
- 2006-06-07 CN CNB2006100831759A patent/CN100432622C/en not_active Expired - Fee Related
- 2006-06-07 TW TW095120180A patent/TWI320098B/en not_active IP Right Cessation
-
2007
- 2007-04-20 HK HK07104152.9A patent/HK1097901A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN100432622C (en) | 2008-11-12 |
KR100728457B1 (en) | 2007-06-13 |
KR20060127753A (en) | 2006-12-13 |
JP2006343152A (en) | 2006-12-21 |
JP4694272B2 (en) | 2011-06-08 |
CN1877251A (en) | 2006-12-13 |
TW200643405A (en) | 2006-12-16 |
TWI320098B (en) | 2010-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150607 |