KR20060127753A - Print-soldering inspection apparatus - Google Patents

Abstract

A print-soldering inspection apparatus is provided to set a judgment reference value for an operator to judge quantitatively, by recognizing the distribution of shape values indicating the shape of a measured solder. In a print-soldering inspection apparatus, a measurement unit(2) measures displacement of a plurality of solders printed on a print board. A histogram calculation unit(5a) calculates frequency distribution of a shape value for judgment on the basis of the measured value of the measurement unit. A ratio calculation unit(5b) calculates at least one of error rate or non-error rate of shapes of the printed solder. A display control unit(6) displays the calculated error rate or non-error. An operation unit(9) indicates the distribution range. The display control unit changes the position of an upper limit value and a lower limit value displayed on the frequency distribution before the latest indication, to the position corresponding to the upper limit value and the lower limit value by the latest indication.

Description

Print Solder Inspection Equipment {PRINT-SOLDERING INSPECTION APPARATUS}

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure for demonstrating the functional block of embodiment which concerns on this invention.

FIG. 2 is a display example of the present embodiment of FIG. 1, which is a display example of the NG rate and frequency distribution when a measurement range and shape are designated.

3 is a diagram illustrating an operation flow of the present embodiment of FIG. 1.

4 is a diagram illustrating an operation flow by use different from that of FIG. 3.

FIG. 5 is a functional block diagram showing a configuration of another embodiment of the embodiment of FIG. 1.

6 is a diagram illustrating an operation flow of another embodiment of FIG. 5.

7 is a diagram illustrating a display example in another embodiment of FIG. 5.

 <Description of the symbols for the main parts of the drawings>

1 substrate (printed plate) 2 measuring means

3: determination means for generating data 4: determination means

5: calculation means 5a: histogram calculation means

5b: NG rate calculating means 6: Display control means

7: display means 8: control means

9: operation means

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a printed solder inspection apparatus for measuring and inspecting a state of formation of solder when a cream-shaped solder is printed on a printed circuit board for mounting electronic components or the like on the surface. In particular, it relates to techniques that make it easy to set criteria for good health judgment.

Conventionally, as a printed solder inspection apparatus, there is a sensor that irradiates a surface of a substrate (hereinafter, referred to simply as a substrate) with a laser beam or the like and receives the reflected light from the surface of the substrate. The measured value obtained as a result of the measurement (triangulation) includes, for example, the displacement (including height) of the printing solder point on the substrate or the luminance (the amount of light reflected from the substrate and the amount of received light (light intensity)). Is judged by comparison with reference data serving as a reference for determination (Japanese Patent Publication No. 3537382, prior art).

In such an inspection apparatus (method), generally, the criterion to be judged is initially stored as an initial value (default value), and is actually judged by the measured values of the plurality of substrates and their default values, and the operator determines the defective rate (hereinafter, NG rate) or yield rate (hereinafter referred to as OK rate) is obtained, and if necessary, the default value is changed to an appropriate reference value and tested.

For example, by measuring the shape of the same printed solder of several substrates, calculating the volume representing the shape of the solder, ± 3σ of the average value of the distribution is in the range of OK, and other in the range of NG. Doing. The value ± 3σ, or another numerical value, was a configuration that can be arbitrarily set.

As mentioned above, conventionally, the operator has made the examination and setting the reference value (permissible value) of the determination from the data which was actually examined and determined by the printing solder inspection apparatus. In reality, the tendency differs from each other from the type of substrate, the shape of the solder, the design value, and the like. Therefore, when there are many kinds of substrates and solder shapes to be judged, and when there are many items to be judged, considerable time and experience were required to examine the reference values (allowed values). In the item to be judged, for example, data indicating the shape of the solder (hereinafter referred to as a shape value) includes a deviation of the solder area, the solder height, and the original position of the solder in addition to the volume of the solder as described above. , The width of the solder and the height unevenness of the solder (irregular height, variation) and the like.

An object of the present invention is to provide a technique that allows an operator to easily set a reference value (allowed value) or the like while determining quantitatively while recognizing a distribution of shape values representing the shape of the measured solder.

In order to achieve the above object, the invention described in claim 1,

Measuring means (2) for measuring the displacement of a plurality of solders printed on a printed plate, and for each of one or a plurality of types of determination shapes obtained by determining the solder state as a shape based on the measured value output by the measuring means The defective rate and yield rate of the shape of the printed solder are determined by the histogram calculating means 5a for obtaining the frequency distribution of the shape value for determination, and the distribution range representing the range of the quantity of the obtained frequency distribution and the shape of the printed solder. NG rate calculating means 5b for calculating at least one of the following, operating means 9, display means 7, and display control means 6 for displaying the calculated defective rate or yield rate on the display means. In the printed solder inspection apparatus provided,

The operation means is capable of indicating the distribution range represented by the upper limit value and the lower limit value,

The display control means displays the frequency distribution, and when the latest means of the distribution range is received from the operation means, a position corresponding to the upper limit value and the lower limit value displayed on the frequency distribution before the latest instruction. The printing solder inspection apparatus characterized by changing the display to a position corresponding to the upper limit value and the lower limit value according to the latest instruction.

In the invention according to claim 2, in the invention according to claim 1, the NG rate calculating means is based on the upper limit value and the lower limit value according to the latest indication and the frequency distribution when the latest indication of the distribution range is given. At least one of the defective rate and the yield rate is newly calculated,

The display control means is configured to change at least one of the defective rate and yield rate displayed on the display means before the latest instruction, and display the newly calculated defective rate or yield rate.

In the invention according to claim 3, in the invention according to claim 1 or 2, the operation means can be instructed by changing at least one of the defective rate and the yield rate displayed on the display means.

The NG rate calculating means calculates an upper limit value and a lower limit value based on at least one of the instructed defective rate and yield rate based on the frequency distribution when instructed to change at least one of the defective rate and yield rate from the operation means. and,

The display control means is configured to change the upper limit value and the lower limit value displayed on the display means before the change instruction, and to display the newly calculated upper limit value and the lower limit value on the frequency distribution.

The invention according to claim 4 is, in the invention according to claim 1, the determination data generating means 3 which receives the measurement value of the measuring means and obtains the determination shape value for each printing solder point;

The determination means 4 which determines the shape value for determination output by the said determination data generation means on the basis of a permissible value as the defect or quantity for every said printing solder point was provided.

In the invention according to claim 5, in the invention according to claim 4, when there is the latest indication of the distribution range from the operation means,

The NG rate calculating means newly calculates at least one of the defective rate and the yield rate based on the upper limit value, the lower limit value, and the frequency distribution according to the latest instruction;

The judging means judges at least one of the defect and the quantity of the shape value for determination for each of the soldering points, based on the new allowable value based on the upper limit value and the lower limit value according to the latest instruction,

The display control means is configured to display the newly calculated defective rate or yield rate with respect to the display means.

In the invention according to claim 6, in the invention according to claim 4 or 5, the operation means can be instructed by changing at least one of the defective rate and the yield rate displayed on the display means.

The NG rate calculating means calculates a new upper limit value and a lower limit value on the basis of the defective rate or yield rate and the frequency distribution indicated by the change,

The judging means judges the defect or the quantity of the shape value for determination for each of the solder points by the new allowable value based on the calculated upper limit value and lower limit value,

The display control means is configured to display the newly calculated upper limit value and lower limit value with respect to the display means.

In the invention according to claim 7, in the invention according to claim 4, the display control means displays a layout indicating solder points of the printed board with respect to the display means, and the determination means is provided on the displayed layout. It is the structure which makes it possible to distinguish and display the location judged as defective.

In the invention according to claim 8, in the invention according to claim 7, when there is the latest indication of the distribution range from the operation means,

The NG rate calculating means newly calculates at least one of the defective rate and the yield rate based on the upper limit value and the lower limit value according to the latest instruction and the frequency distribution;

The judging means judges at least one of the defect and the quantity of the shape value for determination for each of the solder points by the new allowable value based on the upper limit value and the lower limit value according to the latest instruction,

The display control means changes the defective rate or yield rate displayed before the latest instruction to the display means and displays the newly calculated defective rate or yield rate, and the determination means causes the new allowable value. Based on this configuration, the solder points determined to be defective are distinguishablely displayed on the layout.

In the invention according to claim 9, in the invention according to claim 7 or 8, the operation means can be instructed by changing at least one of the defective rate and the yield rate displayed on the display means.

The NG rate calculating means calculates a new upper limit value and a lower limit value on the basis of the defective rate or quantity rate and the frequency distribution instructed by the change,

The judging means judges the defect or the quantity of the shape value for determination for each of the solder points by the new allowable value based on the calculated upper limit value and lower limit value,

The display control means changes the upper limit value and the lower limit value displayed before the instruction to change to the display means, and displays the newly calculated upper limit value and the lower limit value. On the layout described above.

Invention of Claim 10 measures the displacement of the some solder printed on the printed board beforehand, The measuring step which calculates the shape value which shows the said solder state based on the measured value, and the one calculated by the said measuring step Or the printed solder according to a histogram calculating step of obtaining a frequency distribution of the determination shape value for each of a plurality of types of determination shapes, and a distribution range indicating a range of the obtained power distribution and the shape of the printed solder. A printing solder inspection method comprising: an NG rate calculating step of calculating at least one of a defective rate and a yield rate of a; and a positive part displaying step of displaying the calculated defective rate or yield rate on the display means,

Instructing, by the operating means, changing the distribution range indicated by the upper limit value and the lower limit value;

When the display control means receives the latest instruction of the distribution range indicated by the lower limit value and the upper limit value from the operation means, the position on the frequency distribution corresponding to the upper limit value and the lower limit value displayed before the latest instruction is set to the position. And a range display step of changing and displaying the position on the frequency distribution corresponding to the upper limit value and the lower limit value according to the latest instruction.

In the invention according to claim 11, in the invention according to claim 10, each time the latest instruction is received, the NG rate calculation step is performed based on the upper limit value and the lower limit value according to the latest instruction and the frequency distribution. Repeating the displaying and displaying the range,

In the repeating step, a determination step of determining the desired upper limit value and the lower limit value,

After the determination step, a determination step of determining whether the shape value was acquired in the measurement step based on the desired upper limit value and the lower limit value determined above was provided.

The invention as set forth in claim 12 is the invention as set forth in claim 10, further comprising the steps of: instructing, by the operating means, changing at least one of the defective rate and the yield rate displayed on the display means;

The NG rate calculating step calculates an upper limit value and a lower limit value based on the indicated defective rate or yield rate on the basis of the frequency distribution, whenever an instruction to change at least one of the defective rate and yield rate is received from the operation means. Repeating the step of calculating the NG rate, the display of the positive part and the display of the range, based on the calculated upper and lower limits and the frequency distribution;

In the repeating step, a determination step of determining the desired upper limit value and the lower limit value,

After the determination step, a determination step of determining whether or not the shape value acquired in the measurement step was judged on the basis of the determined desired upper limit value and lower limit value was provided.

In the invention according to claim 13, in the invention according to claim 11 or 12, the measuring step is a preliminary test measurement step, which measures the displacement of the solder printed on the printed plate between the determination step and the determination step. And an inspection measurement step of obtaining a shape value representing the solder state based on the measured measurement value.

In the determination step, the shape value of the inspection measurement step is determined based on the determined desired upper limit value and lower limit value instead of the shape value obtained in the test measurement step.

 Embodiment of the Invention

Embodiment of this invention is described using drawing. 1 is a functional block diagram showing a configuration of an embodiment according to the present invention. FIG. 2 is a display example of the NG rate and frequency distribution at the time of designating a measurement range and a shape as a display example of this embodiment of FIG. 1. FIG. 3 is a diagram illustrating an operation flow of the present embodiment of FIG. 1. 4 is a diagram illustrating an operation flow by use different from that of FIG. 3. FIG. 5 is a functional block diagram illustrating a configuration of another embodiment of the embodiment of FIG. 1. FIG. 6 is a diagram illustrating an operation flow of another embodiment of FIG. 5. FIG. 7 is a diagram illustrating a display example in another embodiment of FIG. 5.

In FIG. 1, the measuring means 2 is the layout information (outer dimension, solder position) of the printed board 1 (henceforth a board | substrate 1) from the control means 8 as a measurement object. It receives the information, etc., and has the moving mechanism part (not shown) which makes the sensor move and scan relatively with respect to the board | substrate 1, and measures the displacement of the height direction in a solder position according to a layout. It also measures the luminance over the solder position.

The measuring means 2 in FIG. 1 is, as an example, a laser displacement meter by triangulation. The sensor is capable of irradiating a laser in the direction of the X-axis or the Y-axis while being scanned by the moving mechanism unit with respect to the substrate 1. A laser light source and light-receiving means for receiving the reflected light from the substrate 1, and in particular, the displacement of the solder point where the solder is printed, that is, the height (Z-axis direction) of the solder point corresponds to the position of the printing solder point. Measure In that case, the light reception amount (luminance) corresponding to a position can also be obtained from a solder surface. Although the detailed description of operation as a laser displacement meter is omitted, as a principle, there exists a thing of Unexamined-Japanese-Patent No. 3-291512 filed by the same applicant.

The determination data generating means 3 receives the measured value measured by the measuring means 2 (it is stored in a storage means not shown in the drawing), and a filter and a solder bridge ( Determination data representing the amount of solder at each printed solder point based on a number of predetermined image parameter values indicating sensitivity for identifying delicate patterns such as bridges and solder pattern edges. That is, it processes into a shape value. In addition, the determination data generating means 3 is data for determination (shape value) indicating the shape value of the solder in the soldering area. The volume, the area, the height, the width, the deviation, the height unevenness and / or the defect (layout) Means for determining, by calculation, a state in which the amount of solder is not present in a place where a solder point should be present. On the other hand, it cannot be said that all of the above images are required to determine the quality of the substrate 1. However, at least any one of the volume, the area, the height, the width, the deviation, the height unevenness and / or the defect is indispensable. Moreover, the memory in the determination data generation means 3 is for storing each shape value calculated | required by calculation.

As the determination shape value output by this determination data generating means 3, a value indicating the calculated volume, area, height, width, deviation, height unevenness and / or missing in absolute values is output. Or / and (2) the ratio of the design value of the volume, area, height, and width designed for each printing solder point in advance to the volume, area, height, and width of (1) above (e.g., calculated from actual measurement at any solder point). The volume value / volume value of the design price increase in the corresponding soldering point) may be output as the shape value standardized by the design value. The design value (hereinafter may be referred to as design value) is the reference data (which may be a design value itself, and is corrected by empirical data) in the design information storage means 8a in the control means 8 of FIG. 1. Since one may be used as reference data, that is, the reference is not limited to the design value.

On the other hand, when the frequency distribution mentioned later is calculated | required by the absolute frequency distribution, it is necessary from a viewpoint of a comparison to obtain the frequency distribution by selecting the same solder-shaped point by design (for example, several board | substrates). In the case of obtaining the frequency distribution between (1), the frequency distribution of the same soldering point). When the frequency distribution is obtained by the standardized shape value, it is not necessary to be limited to the same shape. However, when the tendency of frequency distribution is easy to be influenced by a shape, it is preferable to calculate the frequency distribution in the solder parts which also have the same shape. Here, the value output by the determination data generating means 3 outputs a standardized value with respect to volume, area, height, and width, from the attribute of the shape value, and shifts and unevenness (= average value of height). / Maximum height) is described as outputting an absolute value.

On the other hand, the determination data generating means 3 is for evaluating the solder state in terms of the area or volume, which is represented by a positive amount, and may not be evaluated only by the height, for example. In this case, however, the reference data to be described later is a design value (reference data) with respect to the height, and the determination means 4 makes a determination on the height of the solder state, and the calculation means 5 The frequency distribution is obtained only for the height.

The calculation means 5 is equipped with the histogram calculation means 5a and the NG rate calculation means 5b. The histogram calculating means 5a receives the shape value for determination from the determination data generation means 3 and receives the measurement frequency of the shape value from the control means 8, thereby determining the frequency of the same shape value. Calculate the distribution. In that case, for example, if the shape value to be used is the volume value at the shape value standardized, the frequency of the shape value range of 0.05 (5%) interval (16 equal parts) from 0.6 (60%) to 1.4 (140%) To obtain the distribution (even if the shape is an absolute value). This shape value range is set in advance (it may be variable). In addition, about the solder shape made into the object, distribution of any one of following (a) to (d) and (c) is produced | generated. (a) to (c) are the cases where the distribution for the case where the solder points are the same shape is obtained, and (d) is the case for obtaining the distribution including other shapes in the same substrate 1 (shape as described above). By standardizing the value, it can be obtained). (a) A shape value of the same shape is received from one substrate 1, and the number N produces a distribution of N1 times. (b) The shape value of any solder point is measured across the board | substrate 1 of N sheets of the same kind, and the distribution is produced | generated. (c) The same number of shape values in one substrate 1 is measured as N1, and the substrate 1 of the same kind of N2 sheets is measured to generate a distribution of N = N1 × N2. Then, the distribution of the standardized shape values in terms of volume, area, height, and width are shifted, and the distribution of absolute values is selectively generated in terms of the height unevenness value (individual distributions of N1 and N2 can also be generated.) (D ) The number of all the shape values of one substrate 1 is N3, and the substrate 1 of the same kind of N4 sheets is measured, and the distribution of N = N3 × N4 is generated. Then, the distribution of the standardized shape values for the volume, the area, the height, and the width are shifted, and the distribution of the absolute values is generated selectively for the height unevenness value (the individual distribution of N3 and N4 can also be generated). The calculation means 5 determines the kind of shape at the time of obtaining such a distribution, the position of the soldering point, the range of the soldering point (corresponding to the number N1), the number of sheets of the substrate 1 as the target (corresponding to the number N2), and the like. Is received from the operation means 9 via the control means 8 and processed.

2 shows a display example of the frequency distribution of the volume. 2, the "range designation" of the "measurement range" on the left side is selected by the operating means 9, and further specified by the manipulation means 9 in the layout display area on the right side as the range designation marker. For the soldering range of the range (in the dotted line in FIG. 2), the distribution of the number of sheets N of the substrate 1 is shown by a bar graph in the histogram display area. In Fig. 2, the abscissa axis is divided into 16 equal parts by the volume ratio (= volume of actual measurement / design value) as a reference value, and the vertical axis represents the frequency. In the example of FIG. 2, a selection key (part of the operating means 9) for selecting the shape value shown in the lower part of FIG. 2 is selected by clicking &quot; volume &quot; When different areas, shifts, widths, and height unevenness are clicked, the histogram calculating means 5a calculates the frequency distribution of the corresponding shape values, and the display control means 6 causes the display means 7 to display them. In FIG. 2, the display control means 6 also controls the dotted line marker to be displayed at the position of the horizontal axis corresponding to ± 3σ (σ: standard deviation value) calculated by the histogram calculating means 5a. This is the basis for viewing the trend of the distribution.

On the other hand, in the "lower limit" and "upper limit" solid line markers in the histogram display area, a range exceeding the lower limit and the upper limit in the distribution range where the lower limit and the upper limit becomes positive (positive) by a positive judgment is negative. It becomes the target which shows the distribution range to become (bad). In FIG. 2, the markers of "lower limit" and "upper limit" indicate positions corresponding to the numerical values of the lower limit 80% and the upper limit 110% of the screen center (when the value is changed by the operation means 9, the position of the bar markers). It also works in conjunction with it.). The upper limit value and the lower limit value representing the distribution range of this number are represented by the shape value standardized by the reference data (design value) or the ratio (percentage) to the reference data (design value). Same as the range).

The NG calculating means 5b sets an upper limit value and a lower limit value for the distribution range of the desired frequency from the calculation distribution of the histogram calculation means 5a and the operation means 9 (for example, the numeric keys or the output of an encoder). (It is set independently of each other. The value which becomes an allowable value at the time of confirmation as mentioned later.) It receives as NG data shown, compares both, and compares with a lower limit and an upper limit in the calculation distribution of the histogram calculation means 5a. NG rate (defective rate) is calculated about the range which does not fall in between (OK rate may be calculated about the range which falls between a lower limit and an upper limit in the calculation distribution of the histogram calculation means 5a). The upper limit value and the lower limit value input from the operation means 9 are shown at the lower end of the right column toward FIG. 2, and the + NG rate exceeding the upper limit and the lower limit value calculated by the NG rate calculation means 5b are shown below. Indicates the -NG rate. In the frequency distribution of FIG. 2, the display control means 6 displays a solid line marker for visual recognition at the position of the horizontal axis corresponding to the upper limit value and the lower limit value input from the operation means 9.

When the operator experiments with various upper limit values and lower limit values, and finally determines the upper limit value and the lower limit value deemed appropriate (when the confirmation key in FIG. 2 is clicked on the operation means 9), the lower limit value at that time From the upper limit to the upper limit, a new allowable value (permissible distribution range) of the determination of the solder shape at the position where the solder shape is present with respect to the shape value. That is, since the frequency distribution shows the distribution of the measured value with respect to a design value, when the upper limit value and the lower limit value are used as a criterion of determination, it becomes an allowable value as it is.

If the NG calculation means 5b calculates the frequency distribution of the histogram calculation means 5a, the desired NG rate and the frequency distribution are calculated when the desired NG rate is input from the calculation distribution and the operation means 9. On the basis of this, it is possible to obtain a configuration in which the distribution range (upper limit value, lower limit value) for the desired NG rate is inverted, and the result and the solid line (bar) marker are sent to the display control means 6 for display. In doing so, the operator may know the NG rate by varying the lower limit and the upper limit (distribution range), and may know the lower limit and the upper limit by varying the NG rate (however, the inverse may not necessarily be performed. This can be achieved by varying the lower limit and the upper limit while watching the lower limit and the upper limit, and then reading the NG rate, or by varying the lower limit and the upper limit while keeping an eye on the NG rate. Therefore, according to the present invention, it is possible for the operator to support the process of accident and error setting the allowable value distribution range (lower limit value, upper limit value).

The judging means 4 receives from the control means 8 the default value of the shape value of the solder with respect to the actual solder position from the judging data generating means 3 and the allowable value thereof, or the operation means 9 Receives the allowable value determined by, and compares any of them, and if it is within the allowable value, determines that the shape value of the soldering point is 'amount', and if it is outside the allowable value, it is determined to be defective. Then, the final quality determination is performed by determining the solder location of the entire substrate 1. The allowable value changing means 10 is for selecting either the default value of the allowable value or the determined allowable value, and in the case where there is a determination as the default value initially, the determined allowable value is preferentially determined. You may send to (4). In addition, you may comprise the determination means 4 and the calculation means 5 together. The calculation means 5 also determines whether it is within the distribution range represented by the upper limit value and the lower limit value. The difference is that the calculation means 5 performs statistical processing for obtaining the frequency distribution.

In addition, the determination means 4 performs the determination of the quality of the solder with respect to the actual solder position (solder position) from the determination data generation means 3, and determines the opposite, that is, the solder determined as defective. The point can be specified. Therefore, the display control means 6 receives the layout which shows a solder point from the control means 8, displays the layout, and can point out the solder point judged as defective on the layout. In addition, when the allowable range of the lower limit value and the upper limit value is changed, the determination result of the determination means 4 is also changed, and the solder points determined as the defects are also changed. have.

As described above, the display control means 6 has a display format as shown in FIG. 2 and assigns NG data of the upper limit value and the lower limit value from the operation means 9 to the horizontal axis coordinates of the frequency distribution. To display as a marker. Similarly, by the instruction from the operating means 9, the layout of the substrate 1 to be measured is received from the control means 8 and displayed, and the size of the range designation marker indicating the measurement range from the operating means 9 is displayed. , The position is indicated by an area (dashed line in FIG. 2). In addition, information transfer is performed between the operation means 9 and the control means 8. In addition, as shown in FIG. 7 (the details will be described later), the layout (the arrangement of the substrates 1, which stores the determination result of NG for each solder position by the determination means 4 in the design information storage means 8a). The display means 7 may be displayed in correspondence with the dimensions and solder positions. The black part of the layout of FIG. 7 is filled and filled with NG.

In addition, the display control means 6 bundles and links the user interface which consists of the operation means 9 and the display means 7, the calculation means 5, the determination means 4, etc. That is, the NG rate or the allowable value distribution range (upper limit, lower limit value) input (modified) from the operation means 9 is received and sent to the calculation means 5 to display the resultant allowable value or NG rate as a result. We are in charge of link station to display in (7). Similarly, it is in charge of the link station also in the layout display of the defective part based on the determination result of the determination means 4 at the time of variablely inputting the NG rate into the operation means 9.

A part of the outline of the contents stored in the design information storage means 8a has been described above, and therefore, the parts not described will be described. The design information storage stage 8a uses a design value of the same kind as the determination shape value, that is, a design value for a solder position, such as a volume, an area, a height, a width, and a solder position for misalignment, as reference data. It is stored corresponding to (position). In practical use, the design information storage means 8a stores a layout (arrangement, dimensions, solder positions, etc. of the substrate 1) for each type of substrate 1 to be inspected, and at the start of inspection, The list of kinds is displayed on the display means 7, and the operation means 9 can select the type list.

The control means 8 receives the information from the operation means 9 via the display control means 6, sends the information necessary for each part to process, and controls the operation of each part collectively. . For example, before measurement start, the layout information of the substrate 1 designated by the operation means 9 is read out from the design information storage means 8a, and sent to the display control means 6 for display. Moreover, the solder range (solder point), shape value, NG data, etc. which were designated by the operation means 9 are sent to each part. In addition, the measurement unit 2 is operated to measure the measurement unit 2 according to the layout of the solder locations in the designated range and the reference data of the solder locations in the range is determined. Is sent to generate data (shape value) for judgment.

The operation means 9 is described in part in the description of the above sections, but in summary, the operations shown in the following ① to ④ are performed. 1, although the selection of any one of the specification of the substrate 1 to be measured, whether the measurement range is partial range designation or the entire surface, and the measurement range designation of the partial range move the range designation marker 16. Setting (i.e., designating the position of the soldering point 14 in FIG. 2, specifying the range of the soldering point), inputting the number of sheets of the substrate 1, selecting the shape value for obtaining the distribution (see the lower part of FIG. 2), and the distribution. Setting of markers indicating the lower limit and the upper limit of the (i.e. setting of NG data), and ④ change input of NG rate.

In the above configuration, part of the measuring means 2, the determination data generating means 3, the calculating means 5, the determining means 4, the control means 8 and the display control means 6 are CPUs. And a memory (ROM) storing a program for operating the functions described above in the CPU, a memory (RAM) storing data in the process of operating the function, and the like.

Next, a series of flows of the main operations of the embodiment of FIG. 1 will be described based on FIG. 3. S number of FIG. 3 is the same as the following step S number.

Step S1 (preparation step): name (identification code) of the board | substrate 1 in the state arrange | positioned at the test | inspection position in the design information storage means 13 beforehand, external information including dimensions as a layout, and the board | substrate 1 The positional information of the solder points on the () is stored (a single board 1 having a plurality of solder points or a plurality of boards 1 of the same type). In addition, reference data (design values such as height, area, volume, misalignment, height unevenness, and defect of the solder) of the shape values of the solder at the solder points of the substrate 1 are stored. In addition, you may store the default value of the permissible value (upper limit, lower limit) with respect to the shape value of the solder in each soldering part of the board | substrate 1. As shown in FIG.

Step S2 (input operation step): After the power is turned on, the display control means 6 displays a setting screen in a state where, for example, the histogram distribution of FIG. 2 does not appear and the layout is not displayed. The operator specifies, by the operating means 9, the name, measurement range, and number of sheets 1 placed at the inspection position. When "Range designation" is selected as the "measurement range" in Fig. 2, the layout of the substrate 1 is displayed, so that the distribution marker 16 (dotted line in Fig. 2) is to measure the distribution on the displayed layout. The range and position of the soldering point to specify are specified, and the shape (for example, "volume") is clicked and specified with the shape selection key 12 (refer to the lower part of FIG. 2).

Step S3 (test measurement step): When the control means 8 receives a command of, for example, "NG setting" from the operation means 9, the measurement means 2 measures the measurement of the solder point. The measurement is started for the range (range of position: sometimes referred to as measurement range), and the reference data is sent to the determination data generating means 3, and the shape value and the designated value are given to the calculation means 5. The range, the number of measurements (number of measurements), NG data, and the like are sent to collect data necessary for forming the frequency distribution on the substrate 1. Here, the measuring means 2 is, by the instruction of the control means 8, for example, the number of the same shape values as the one substrate 1 of the above (c) is N1, and the same kind of N2. It is assumed that the substrate 1 of each sheet is measured, and the data of N = N1 × N2 is measured.

The measurement data generation means 3 receives the measurement data from the measurement means 2 and the reference data of the solder point within the specified measurement range, and outputs the shape value for the specified shape. For example, if the specified shape is any one of volume, area, height, and width, the ratio between the shape value as the absolute value calculated from the measured value and the design value is calculated, and it is output as the standardized shape value, and the deviation, If any of the height spots is present, the shape value represented by the absolute value is output.

Step S4 (Histogram Calculation Step): The histogram calculation means 5a receives the shape value from the determination data generation means 3 and receives the measurement number of the shape value from the control means 8, and the same shape value. Calculate the frequency distribution of. At that time, the frequency distribution for all the measurement times N = N1 × N2, the frequency distribution for the measurement frequency N1 on any one substrate 1, or the frequency distribution for the measurement frequency N2 for one soldering point, Either or all may be obtained. In addition, also about the shape value which calculates the frequency distribution, in any one or all of volume, area, height, width (above, the standardized shape value), a shift | offset | difference, and height unevenness (above, shape value as an absolute value) Can be obtained.

Step S5 (distribution display step): NG data of the upper limit value and the lower limit value is input, and the display control means 6 measures the number of times of measurement (the number of samples of the measured shape value) over the predetermined shape value range of the selected shape value (Example : A frequency distribution having a shape value range of 60% to 140% and N measurement counts is displayed on the histogram display area 10 of the display means 7 in a format prepared in advance as shown in FIG. 2 (distribution). Display step).

Step S6 (upper and lower limit value change (input) step): The operator inputs the upper limit value and the lower limit value from the operating means 9 while visually recognizing the frequency distribution, the marker and the upper limit value and the lower limit value of the volume as shown in FIG. 2. . The same applies to other shape values.

Step S7 (NG rate calculating step): The NG calculating means 5b compares the frequency distribution calculated by the histogram calculating means 5a with the upper limit value or the lower limit value input from the operating means 9, and the area exceeding the lower limit value and the upper limit value. For the frequency distribution distributed at, the NG rate (defective rate) is calculated and numerically displayed on the display means 7 as shown in FIG. 2 via the display control means 6 (NG rate calculating step).

Steps S8, S6, S7, S9 (Confirmation Step): The operator changes the upper limit value and the lower limit value by the operating means 9 and repeats the steps S6, S7 while viewing the displayed NG rate, upper limit value, lower limit value, and frequency distribution. When the upper limit value and the lower limit value are appropriate, the determination key is clicked (see Fig. 2). At this time, since the steps S6 and S7 are performed in almost real time, the operator observes the upper limit value and the lower limit value and varies it, so that the operator may know the change in the NG rate. The upper and lower limit values can also be obtained from the NG rate by varying the value of (which at first glance seems to be varying the NG rate) and by reading the upper limit value and the lower limit value (allowable distribution range) at the appropriate NG rate.

Step S10 (Inspection Measurement Step): Based on the upper limit value and the lower limit value of the determined allowable value distribution range, the new allowable value and allowable value change for the substrate type, solder point, and shape value subjected to the frequency distribution during the determination. By the means 10, it is set to the determination means 4. Therefore, when the measurement means 4 measures a new shape after that, when the shape value of the said target object of the soldering point of the said target object was measured on the board | substrate 1 which is the said target kind, the determined new tolerance was determined. It is judged based on the value.

In the above description, it has been described that the test measurement is performed to determine a new allowable value based on the frequency distribution of the shape value, and to determine a new measurement (for example, a measurement for the present test) based on the allowable value. For example, measurement (measurement of this test) is already performed as a test object with a default value. Then, when the determined group of substrates 1 is irradiated, the frequency is determined when the specific NG ratio (ratio of becoming NG in the determination means 4) is investigated in detail with respect to a certain shape value. By calculating and displaying the distribution, viewing the trend, changing the upper and lower limits in a range where there is no abnormality in quality, and examining the NG rate, the appropriate allowable values (upper and lower limits) are reset, and the substrates that have already been measured and determined In order to review the determination result of group (1), this embodiment can also be used.

An example thereof will be described with reference to FIG. 4. Steps S24-S30 in FIG. 4 abbreviate | omit description by the same function as step S3-S9 in FIG. Hereinafter, with reference to FIG. 4, it demonstrates centering on a different part from FIG.

Step S21: For example, the original inspection object is measured from the beginning on the substrate to be tested. And each shape value which is the data for determination which measured and calculated | required and calculated | required is memorize | stored in memory, and it judges by the determination means 4, and displays a result.

Step S22: If the operator considers whether there is a question in the determination result, and if there is no need to examine and examine the details, the inspection is terminated at that point.

Steps S24 to S30: The operator designates the solder point range (measurement range) and shape value to be examined and reads it from the memory, displays the histogram, changes the NG rate, and examines the appropriate upper and lower limits.

Step S31: When the new upper limit value and the lower limit value are determined after the irradiation, the allowable value changing means 10 instructs the judging by the operation to determine the determined shape value of the solder point in the range specified in the step S24 in the determination means 4. Change the upper and lower limit values to the upper and lower limits of the allowable distribution range. Then, the judging means 4 receives the specified shape value of the soldering point in the designated range from the memory which has received the judging instruction, compares it with the new set upper limit value and the lower limit value, and outputs and displays it.

Next, another embodiment (including other usage examples) will be described based on FIGS. 5 and 6. In addition to the configuration in which the NG rate and the allowable value work together, the other embodiments are configured so that the NG location can also be known in conjunction. FIG. 5 is a functional block emphasizing a part of the configuration of FIG. 1 in describing another embodiment. It is emphasized that the NG point specifying means is provided in the determination means 4, and the solder point range from the operation means 9 is instructed in the memory of the determination data. 6 shows its operation flow. Steps of the same reference numerals as those in Fig. 6 perform the same operation. FIG. 7 is a display example of another embodiment in the configuration of FIG. 5. FIG. With reference to FIG. 6 mainly and a part different from FIG. 3, operation | movement is demonstrated below.

Step S2a (input operation step): For example, the soldering point and the number of sheets of the entire surface of the substrate 1 may be specified, and a plurality of shape values are specified.

Step S3a (measurement step): By measuring, the determination data generating means 3 calculates and calculates the specified shape value of the designated soldering point and stores it in the memory. The determination means 4 determines the default upper limit value and the lower limit value as the allowable value for each of the soldering points, and for each shape value, and outputs the determination result to the display control means 6.

Step S3b: Specify the solder point (range) and shape for which the distribution is to be examined.

Steps S4 to S7: The histogram is calculated and displayed for the specified measurement range and shape value, and the NG rate is calculated and displayed for the default upper limit value, lower limit value, or changed input upper limit value and lower limit value.

Step S8a: When it is desired to change the NG rate, the process returns to step S6, where the operator changes and sets each marker indicating the upper limit value and the lower limit value while viewing the distribution of the display screen. The NG rate for the changed upper limit value and lower limit value is obtained and displayed.

Step S11: The designated shape value of the specified range is read from the memory, and the determination means 4 again determines the upper limit value and the lower limit value determined in step S8a as new allowable values.

Step 12: The determination means 4 specifies the solder position of the NG locations on the layout received from the control means 8 by the NG location specifying means. Such specific information is displayed on the display means 9 via the display control means 6. In that case, as shown in the layout column of the layout display area 11 of FIG. 7, the display control means 6 can distinguish NG location 15 and the non-NG location (passed solder location), for example, NG points are displayed in black, and other portions are marked in white. The NG points 15 may be displayed in red and yellow, respectively, so that the -NG and + NG points can be identified.

Step S13: When the operator wants to change the NG rate with reference to the displayed NG rate and the NG point 15 of the layout (YES), the operation of steps S6 to S12 is repeated when the process returns to step S6 and changes again. The changed upper limit value, the NG rate for the lower limit value, and the NG location on the layout can be known.

Step S14: Next, when it is desired to check the NG rate for another measurement range or other shape value, the process returns to step S3a and resets, and the steps S3a to S13 are repeated to perform the reset measurement range or The NG rate on conditions, such as a shape value, and NG location on a layout can be known.

The display example is shown in FIG. Fig. 7 shows the frequency distribution with respect to the volume, the upper limit, the lower limit, the NG rate with respect to the upper limit and the lower limit, and the NG points on the layout. In the case where the measurement range is &quot; range designation &quot; as shown in Fig. 2, the NG location in the designated range (in the dotted line in Fig. 2) can be displayed.

According to the configuration of the present invention, an acceptable distribution range is recognized while recognizing a distribution state for a shape value (e.g., volume, area, height, misalignment, width, height unevenness, etc.) of the measured solder state. If the variable setting, the NG rate for it can be known quantitatively. On the contrary, if the variable setting is paying attention to the NG rate, the allowable distribution range for the NG rate can also be known. Therefore, it is possible to set a distribution range that can be easily accepted while quantitatively recognizing the distribution state. Moreover, since distribution and NG rate can be calculated | required corresponding to the kind of determination item (type of shape value of solder) for every board | substrate, time can be shortened as a whole.

Claims (13)

Measuring means (2) for measuring displacement of a plurality of solders printed on a printed plate, and for each of one or a plurality of types of determination shapes obtained by determining the solder state as a shape based on the measured value output by the measuring means The defective rate and yield rate of the shape of the printed solder are determined by the histogram calculating means 5a for obtaining the frequency distribution of the shape value for determination, and the distribution range representing the range of the quantity of the obtained frequency distribution and the shape of the printed solder. An NG rate calculating means 5b for calculating at least one of; an operating means 9 and a display means 7; and display control means 6 for displaying the calculated defective rate or yield rate on the display means. In one printing solder inspection apparatus, The operation means is capable of indicating the distribution range represented by the upper limit value and the lower limit value, The display control means displays the frequency distribution, and when the latest means of the distribution range is received from the operation means, a position corresponding to the upper limit value and the lower limit value displayed on the frequency distribution before the latest instruction. The printing solder inspection apparatus, characterized in that the display is changed to a position corresponding to the upper limit value and the lower limit value according to the latest instruction. The method of claim 1, The NG rate calculating means calculates at least one of the defective rate and the yield rate on the basis of the upper limit value and the lower limit value according to the latest indication and the frequency distribution when there is an latest indication of the distribution range. And the display control means changes at least one of the defective rate and yield rate displayed on the display means before the latest instruction to display the newly calculated defective rate or yield rate. The method according to claim 1 or 2, The operation means is further capable of instructing by changing at least one of the defective rate and the yield rate displayed on the display means, The NG rate calculating means calculates an upper limit value and a lower limit value based on at least one of the instructed defective rate and yield rate based on the frequency distribution when instructed to change at least one of the defective rate and yield rate from the operation means. and, And the display control means changes the upper limit value and the lower limit value displayed on the display means before the instruction to change, and displays the newly calculated upper limit value and the lower limit value on the frequency distribution. The method of claim 1, Determination data generating means (3) for receiving a measurement value of the measurement means and obtaining a determination shape value for each of the printing solder points; And a judging means (4) for judging the judging shape value outputted from the judging data generating means based on an allowable value for each of the printing solder points as defective or positive. The method of claim 4, wherein When there is an up-to-date instruction of the distribution range from the operation means, The NG rate calculating means newly calculates at least one of the defective rate and the yield rate based on the upper limit value, the lower limit value, and the frequency distribution according to the latest instruction; The judging means judges at least one of the defect and the quantity of the shape value for determination for each of the solder points by the new allowable value based on the upper limit value and the lower limit value according to the latest instruction, And the display control means displays the newly calculated defective rate or yield rate with respect to the display means. The method according to any one of claims 4 to 5, The operation means is further capable of instructing by changing at least one of the defective rate and the yield rate displayed on the display means, The NG rate calculating means calculates a new upper limit value and a lower limit value on the basis of the defective rate or yield rate and the frequency distribution indicated by the change, The judging means judges the defect or the quantity of the shape value for determination for each of the solder points by the new allowable value based on the calculated upper limit value and lower limit value, And the display control means displays the newly calculated upper and lower limit values for the display means. The method of claim 4, wherein The display control means displays a layout indicating solder points of the printed board with respect to the display means, and makes it possible to identify and display the points determined by the determination means on the displayed layout. Printed solder inspection device. The method of claim 7, wherein When there is the latest indication of the distribution range from the operating means, The NG rate calculating means newly calculates at least one of the defective rate and the yield rate based on the upper limit value and the lower limit value according to the latest instruction and the frequency distribution; The judging means judges at least one of the defect and the quantity of the shape value for determination for each of the solder points by the new allowable value based on the upper limit value and the lower limit value according to the latest instruction, The display control means changes the defective rate or yield rate displayed before the latest instruction to the display means and displays the newly calculated defective rate or yield rate, and the determination means causes the new allowable value. And a solder point determined as defective on the basis of the display is distinguishably displayed on the layout. The method according to any one of claims 7 to 8, The operation means is further capable of instructing by changing at least one of the defective rate and the yield rate displayed on the display means, The NG rate calculating means calculates a new upper limit value and a lower limit value on the basis of the defective rate or quantity rate and the frequency distribution instructed by the change, The judging means judges the defect or the quantity of the shape value for determination for each of the solder points by the new allowable value based on the calculated upper limit value and lower limit value, The display control means changes the upper limit value and the lower limit value displayed before the instruction to change to the display means, and displays the newly calculated upper limit value and the lower limit value. And a solder point determined as defective on the basis of the display is distinguishably displayed on the layout. A measurement step of measuring a displacement of a plurality of solders printed on a printed plate in advance, and obtaining a shape value representing the solder state based on the measured value; and one or more types of determination shapes determined in the measurement step At least one of the defective rate and yield rate of the printed solder according to a histogram calculation step of obtaining a frequency distribution of the shape value for determination each time, and a distribution range indicating a range of the obtained quantity of the frequency distribution and the shape of the printed solder. In the printing solder inspection method comprising a NG rate calculating step of calculating a and a positive part display step of displaying the calculated defective rate or yield rate on the display means, Instructing, by the operating means, changing the distribution range represented by the upper limit value and the lower limit value; When receiving the latest instruction of the distribution range represented by the lower limit value and the upper limit value from the operation means, the position on the frequency distribution corresponding to the upper limit value and the lower limit value displayed before the latest instruction is determined by the upper limit value and the lower limit value according to the latest instruction. And a range display step of changing and displaying the position on the frequency distribution corresponding to the printing solder. The method of claim 10, Each time the latest instruction is received, repeating the NG rate calculation step, the display of the positive part and the range display step, based on the upper limit value and the lower limit value and the frequency distribution according to the latest instruction; In the repeating step, it is determined whether the desired upper limit value and the lower limit value are determined, and after the determination step, whether the shape value acquired in the measurement step is positive or bad based on the determined desired upper limit value and the lower limit value. And a judging step. The method of claim 10, Instructing, by the operating means, changing at least one of the defective rate and the yield rate displayed on the display means; The NG rate calculating step calculates and calculates an upper limit value and a lower limit value based on the instructed defective rate or yield rate on the basis of the frequency distribution, whenever an instruction to change at least one of the defective rate and yield rate is received from the operation means. Repeating the step of calculating the NG rate, the display of the positive part and the display of the range, based on the upper and lower limit values and the frequency distribution; In the repeating step, a determination step of determining the desired upper limit value and the lower limit value, And a determination step of determining whether the shape value obtained in the measurement step is determined based on the desired upper limit value and the lower limit value after the determination step. The method according to any one of claims 11 or 12, The measuring step is a preliminary test measuring step, Between the determination step and the determination step, an inspection measurement step of measuring a displacement of the solder printed on the printed plate and obtaining a shape value representing the solder state based on the measured measurement value, And said determining step determines whether or not the shape value of said inspection measurement step is based on said determined desired upper limit value and lower limit value in place of the shape value obtained in said test measurement step.

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