KR100702909B1 - 웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체, 웨이퍼의에지 위치 검출장치 및 프리얼라인먼트 센서 - Google Patents

웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체, 웨이퍼의에지 위치 검출장치 및 프리얼라인먼트 센서 Download PDF

Info

Publication number
KR100702909B1
KR100702909B1 KR1020067007398A KR20067007398A KR100702909B1 KR 100702909 B1 KR100702909 B1 KR 100702909B1 KR 1020067007398 A KR1020067007398 A KR 1020067007398A KR 20067007398 A KR20067007398 A KR 20067007398A KR 100702909 B1 KR100702909 B1 KR 100702909B1
Authority
KR
South Korea
Prior art keywords
wafer
signal
sensor
light
edge
Prior art date
Application number
KR1020067007398A
Other languages
English (en)
Korean (ko)
Other versions
KR20060060057A (ko
Inventor
마사미치 이네나가
유지 아리나가
신이치 가츠다
다카유키 이마나카
Original Assignee
가부시키가이샤 야스카와덴키
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000335530A external-priority patent/JP3666738B2/ja
Priority claimed from JP2000338601A external-priority patent/JP3963300B2/ja
Priority claimed from JP2000352309A external-priority patent/JP3528785B2/ja
Application filed by 가부시키가이샤 야스카와덴키 filed Critical 가부시키가이샤 야스카와덴키
Publication of KR20060060057A publication Critical patent/KR20060060057A/ko
Application granted granted Critical
Publication of KR100702909B1 publication Critical patent/KR100702909B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020067007398A 2000-11-02 2001-11-01 웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체, 웨이퍼의에지 위치 검출장치 및 프리얼라인먼트 센서 KR100702909B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000335530A JP3666738B2 (ja) 2000-11-02 2000-11-02 プリアライメントセンサ
JPJP-P-2000-00335530 2000-11-02
JP2000338601A JP3963300B2 (ja) 2000-11-07 2000-11-07 ウエハの外周位置検出方法およびその方法を実行させるプログラムを記録したコンピュータ読み取り可能な記録媒体ならびにウエハの外周位置検出装置。
JPJP-P-2000-00338601 2000-11-07
JP2000352309A JP3528785B2 (ja) 2000-11-20 2000-11-20 ウエハプリアライメント装置およびウエハエッジ位置検出方法
JPJP-P-2000-00352309 2000-11-20

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020037006138A Division KR100618558B1 (ko) 2000-11-02 2001-11-01 웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체,웨이퍼의 에지 위치 검출장치 및 프리얼라인먼트 센서

Publications (2)

Publication Number Publication Date
KR20060060057A KR20060060057A (ko) 2006-06-02
KR100702909B1 true KR100702909B1 (ko) 2007-04-03

Family

ID=27345096

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020037006138A KR100618558B1 (ko) 2000-11-02 2001-11-01 웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체,웨이퍼의 에지 위치 검출장치 및 프리얼라인먼트 센서
KR1020067007398A KR100702909B1 (ko) 2000-11-02 2001-11-01 웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체, 웨이퍼의에지 위치 검출장치 및 프리얼라인먼트 센서

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020037006138A KR100618558B1 (ko) 2000-11-02 2001-11-01 웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체,웨이퍼의 에지 위치 검출장치 및 프리얼라인먼트 센서

Country Status (3)

Country Link
US (2) US7109511B2 (fr)
KR (2) KR100618558B1 (fr)
WO (1) WO2002037555A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002228764A (ja) * 2001-02-02 2002-08-14 Fuji Photo Film Co Ltd 透光性シート体検出装置
JP4566798B2 (ja) 2005-03-30 2010-10-20 東京エレクトロン株式会社 基板位置決め装置，基板位置決め方法，プログラム
KR100719367B1 (ko) * 2005-06-24 2007-05-17 삼성전자주식회사 반도체 제조 장치 및 웨이퍼 가공 방법
US7925075B2 (en) * 2007-05-07 2011-04-12 General Electric Company Inspection system and methods with autocompensation for edge break gauging orientation
FR2971082A1 (fr) * 2011-01-31 2012-08-03 Soitec Silicon On Insulator Dispositif pour la mesure de la largeur de couronne d'une structure multicouche
CN102768976B (zh) * 2011-05-05 2015-11-25 上海微电子装备有限公司 一种基板预对准装置及方法
JP2013153108A (ja) * 2012-01-26 2013-08-08 Yaskawa Electric Corp 基板位置決め装置
JP6114708B2 (ja) * 2013-05-27 2017-04-12 東京エレクトロン株式会社 基板脱離検出装置及び基板脱離検出方法、並びにこれらを用いた基板処理装置及び基板処理方法
US9796045B2 (en) * 2013-12-19 2017-10-24 Sunpower Corporation Wafer alignment with restricted visual access
US9377416B2 (en) * 2014-05-17 2016-06-28 Kla-Tencor Corp. Wafer edge detection and inspection
JP6532800B2 (ja) 2015-10-21 2019-06-19 東芝メモリ株式会社 反射防止部材及びオリエンタ装置
US10186438B2 (en) * 2015-11-05 2019-01-22 Infineon Technologies Ag Method and apparatus for use in wafer processing
CN106248056A (zh) * 2016-08-18 2016-12-21 中国科学院嘉兴微电子仪器与设备工程中心 一种多光源扫描检测方法
TWI800544B (zh) * 2017-10-25 2023-05-01 美商艾克塞利斯科技公司 用於半導體製造設備的淺角度、多波長、多接收器、可調靈敏度的對準感測器
KR20190119803A (ko) * 2018-04-13 2019-10-23 주식회사 넥서스원 웨이퍼의 에지 영역 검사장치 및 검사방법
CN110459497B (zh) * 2018-05-08 2022-04-22 北京北方华创微电子装备有限公司 晶圆预定位方法
US10720354B2 (en) * 2018-08-28 2020-07-21 Axcelis Technologies, Inc. System and method for aligning light-transmitting birefringent workpieces
US11342210B2 (en) * 2018-09-04 2022-05-24 Applied Materials, Inc. Method and apparatus for measuring wafer movement and placement using vibration data
CN111381451B (zh) * 2018-12-29 2021-12-17 上海微电子装备（集团）股份有限公司 预对准系统、预对准方法及光刻设备
WO2020180470A1 (fr) * 2019-03-01 2020-09-10 Applied Materials, Inc. Localisateur de centre de tranche transparente
CN113721428B (zh) * 2021-07-12 2024-02-06 长鑫存储技术有限公司 半导体处理装置
US11927545B1 (en) 2023-01-12 2024-03-12 Camtek Ltd Semiconductor edge and bevel inspection tool system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136264A (ja) * 1989-05-23 1991-06-11 Cybeq Syst Inc 半導体物品の予備位置決め方法及び装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4559452A (en) * 1982-06-02 1985-12-17 Fujitsu Limited Apparatus for detecting edge of semitransparent plane substance
JPS59604A (ja) 1982-06-02 1984-01-05 Fujitsu Ltd 対向照明形縁部検出装置
JPS6370436A (ja) * 1986-09-11 1988-03-30 Canon Inc ウエハ位置決め装置
JP2760918B2 (ja) * 1992-02-03 1998-06-04 大日本スクリーン製造株式会社 ノッチ付ウエハの位置検出装置
JP3098858B2 (ja) * 1992-06-08 2000-10-16 オリンパス光学工業株式会社 超音波モータ
JPH05341167A (ja) * 1992-06-08 1993-12-24 Matsushita Electric Ind Co Ltd レンズ保持部材と薄膜形成方法
JP2913354B2 (ja) * 1993-02-26 1999-06-28 東京エレクトロン株式会社 処理システム
JP3228644B2 (ja) 1993-11-05 2001-11-12 東京エレクトロン株式会社 真空処理装置用素材及びその製造方法
JPH10270742A (ja) * 1997-03-28 1998-10-09 Rohm Co Ltd フォトダイオード
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136264A (ja) * 1989-05-23 1991-06-11 Cybeq Syst Inc 半導体物品の予備位置決め方法及び装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
03136264 *

Also Published As

Publication number Publication date
US7109511B2 (en) 2006-09-19
US20040056216A1 (en) 2004-03-25
KR100618558B1 (ko) 2006-08-31
US7154113B2 (en) 2006-12-26
US20060038142A1 (en) 2006-02-23
WO2002037555A1 (fr) 2002-05-10
KR20030057548A (ko) 2003-07-04
KR20060060057A (ko) 2006-06-02

Similar Documents

Publication Publication Date Title
KR100702909B1 (ko) 웨이퍼 프리얼라인먼트 장치와 그 웨이퍼 유무 판정방법,웨이퍼 에지 위치 검출방법과 그 방법을 실행시키는프로그램을 기록한 컴퓨터 판독 가능한 기록매체, 웨이퍼의에지 위치 검출장치 및 프리얼라인먼트 센서
US6275742B1 (en) Wafer aligner system
JP5949741B2 (ja) ロボットシステム及び検出方法
JP2008084938A (ja) 基板処理装置に対する各種設定値の教示方法、教示用装置及びその校正治具
JPH0961775A (ja) 基板アライメント装置
JP3528785B2 (ja) ウエハプリアライメント装置およびウエハエッジ位置検出方法
US6618135B2 (en) Laser beam inspection apparatus
US6201603B1 (en) Position detecting apparatus for semiconductor wafer
JPH0685038A (ja) ウエハの位置合わせ方法及びその装置並びに透明ウエハの位置合わせ装置
JPH11150172A (ja) 搬送装置
JP2874795B2 (ja) オリエンテーションフラット検出装置
JP2006010466A (ja) 板材の平坦度測定方法および装置
JP2013016747A (ja) 基板位置合わせ方法、基板位置合わせ装置、コンピュータプログラム、及びコンピュータ可読記憶媒体
JP4400341B2 (ja) ウエハのプリアライメント装置およびプリアライメント方法
JP3203852B2 (ja) 実装済みプリント基板の検査装置
JP2002141394A (ja) 検査装置
JP2007242949A (ja) 板状部材の位置決め装置
JPH01272126A (ja) 半導体装置のリード曲り検査装置
JP3568393B2 (ja) 原稿検知装置
JP3247925B2 (ja) 電子部品実装方法
JPH1184004A (ja) 走査型レーザ距離計測装置の処理方法
JP2681651B2 (ja) アライメント方法
JP3628150B2 (ja) 原稿検知装置
JPH0829131A (ja) 光学式測定装置
JPH06258041A (ja) 半導体パッケージのリード検査方法及びその検査装置

Legal Events

Date Code Title Description
A107 Divisional application of patent
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130304

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20140228

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20150302

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20160303

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee