TWI800544B - 用於半導體製造設備的淺角度、多波長、多接收器、可調靈敏度的對準感測器 - Google Patents

用於半導體製造設備的淺角度、多波長、多接收器、可調靈敏度的對準感測器 Download PDF

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Publication number
TWI800544B
TWI800544B TW107137757A TW107137757A TWI800544B TW I800544 B TWI800544 B TW I800544B TW 107137757 A TW107137757 A TW 107137757A TW 107137757 A TW107137757 A TW 107137757A TW I800544 B TWI800544 B TW I800544B
Authority
TW
Taiwan
Prior art keywords
wavelength
receiver
semiconductor manufacturing
manufacturing equipment
shallow angle
Prior art date
Application number
TW107137757A
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English (en)
Other versions
TW201928289A (zh
Inventor
約翰 巴格特
比利 班諾特
喬 費瑞拉
布萊恩 泰瑞
Original Assignee
美商艾克塞利斯科技公司
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Filing date
Publication date
Application filed by 美商艾克塞利斯科技公司 filed Critical 美商艾克塞利斯科技公司
Publication of TW201928289A publication Critical patent/TW201928289A/zh
Application granted granted Critical
Publication of TWI800544B publication Critical patent/TWI800544B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW107137757A 2017-10-25 2018-10-25 用於半導體製造設備的淺角度、多波長、多接收器、可調靈敏度的對準感測器 TWI800544B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762576791P 2017-10-25 2017-10-25
US62/576,791 2017-10-25

Publications (2)

Publication Number Publication Date
TW201928289A TW201928289A (zh) 2019-07-16
TWI800544B true TWI800544B (zh) 2023-05-01

Family

ID=64308813

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137757A TWI800544B (zh) 2017-10-25 2018-10-25 用於半導體製造設備的淺角度、多波長、多接收器、可調靈敏度的對準感測器

Country Status (6)

Country Link
US (1) US10794694B2 (zh)
JP (1) JP7199432B2 (zh)
KR (1) KR102642205B1 (zh)
CN (1) CN111201594A (zh)
TW (1) TWI800544B (zh)
WO (1) WO2019084260A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10720354B2 (en) * 2018-08-28 2020-07-21 Axcelis Technologies, Inc. System and method for aligning light-transmitting birefringent workpieces
KR20210154008A (ko) 2020-06-11 2021-12-20 현대모비스 주식회사 자동차용 램프 및 그 램프를 포함하는 자동차

Citations (10)

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US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
US6677602B1 (en) * 2000-08-18 2004-01-13 Sensys Instruments Corporation Notch and flat sensor for wafer alignment
TW200527576A (en) * 2003-12-19 2005-08-16 Mattson Tech Canada Inc Methods and systems for supporting a workpiece and for heat-treating the workpiece
TW200746343A (en) * 2005-10-26 2007-12-16 Micronic Laser Systems Ab Platforms, apparatuses, systems and methods for processing and analyzing substrates
WO2014062406A1 (en) * 2012-10-19 2014-04-24 Applied Materials, Inc. Substrate orienter chamber
US20140272685A1 (en) * 2013-03-12 2014-09-18 Micronic Mydata AB Method and device for writing photomasks with reduced mura errors
TW201447288A (zh) * 2013-03-15 2014-12-16 Kla Tencor Corp 掃描晶圓檢查系統之影像同步
US20150018622A1 (en) * 2013-03-13 2015-01-15 Camplex, Inc. Surgical visualization systems
TW201538967A (zh) * 2014-02-12 2015-10-16 克萊譚克公司 多點掃描收集光學元件
US20170323925A1 (en) * 2016-05-04 2017-11-09 Glo Ab Monolithic multicolor direct view display containing different color leds and method of making thereof

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JPS62243339A (ja) 1986-04-16 1987-10-23 Hitachi Nakaseiki Ltd ウエハ搬送装置のオリフラ合わせ機構
JP2997360B2 (ja) * 1992-01-29 2000-01-11 東京エレクトロン株式会社 位置合わせ装置
TW315504B (zh) 1995-03-20 1997-09-11 Tokyo Electron Co Ltd
US7109511B2 (en) * 2000-11-02 2006-09-19 Kabushiki Kaisha Yaskawa Denki Techniques for wafer prealignment and sensing edge positions
JP2002198279A (ja) * 2000-12-25 2002-07-12 Nikon Corp 位置検出方法、光学特性測定方法、光学特性測定装置、露光装置、及びデバイス製造方法
US6585908B2 (en) 2001-07-13 2003-07-01 Axcelis Technologies, Inc. Shallow angle interference process and apparatus for determining real-time etching rate
US7253443B2 (en) * 2002-07-25 2007-08-07 Advantest Corporation Electronic device with integrally formed light emitting device and supporting member
US7453160B2 (en) 2004-04-23 2008-11-18 Axcelis Technologies, Inc. Simplified wafer alignment
JP2007165655A (ja) 2005-12-14 2007-06-28 Varian Semiconductor Equipment Associates Inc ウエハ方向センサー
JP2009121920A (ja) 2007-11-14 2009-06-04 Nsk Ltd 透明基板の位置測定装置、該位置測定装置を備える露光装置及び基板製造方法並びにプリアライメント装置
JP2010003795A (ja) * 2008-06-19 2010-01-07 Sinfonia Technology Co Ltd 基板位置検出装置及び基板位置検出方法
US7796278B2 (en) * 2008-09-19 2010-09-14 Gii Acquisition, Llc Method for precisely measuring position of a part to be inspected at a part inspection station
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KR101386602B1 (ko) * 2011-02-10 2014-04-17 하이지트론, 인코포레이티드 나노기계 테스트 시스템
US9255894B2 (en) 2012-11-09 2016-02-09 Kla-Tencor Corporation System and method for detecting cracks in a wafer
US10449619B2 (en) * 2015-11-09 2019-10-22 Peddinghaus Corporation System for processing a workpiece
US10041789B2 (en) * 2016-09-30 2018-08-07 Axcelis Technologies, Inc. Integrated emissivity sensor alignment characterization

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
US6677602B1 (en) * 2000-08-18 2004-01-13 Sensys Instruments Corporation Notch and flat sensor for wafer alignment
TW200527576A (en) * 2003-12-19 2005-08-16 Mattson Tech Canada Inc Methods and systems for supporting a workpiece and for heat-treating the workpiece
TW200746343A (en) * 2005-10-26 2007-12-16 Micronic Laser Systems Ab Platforms, apparatuses, systems and methods for processing and analyzing substrates
WO2014062406A1 (en) * 2012-10-19 2014-04-24 Applied Materials, Inc. Substrate orienter chamber
US20140272685A1 (en) * 2013-03-12 2014-09-18 Micronic Mydata AB Method and device for writing photomasks with reduced mura errors
US20150018622A1 (en) * 2013-03-13 2015-01-15 Camplex, Inc. Surgical visualization systems
TW201447288A (zh) * 2013-03-15 2014-12-16 Kla Tencor Corp 掃描晶圓檢查系統之影像同步
TW201538967A (zh) * 2014-02-12 2015-10-16 克萊譚克公司 多點掃描收集光學元件
US20170323925A1 (en) * 2016-05-04 2017-11-09 Glo Ab Monolithic multicolor direct view display containing different color leds and method of making thereof

Also Published As

Publication number Publication date
JP2021501460A (ja) 2021-01-14
TW201928289A (zh) 2019-07-16
WO2019084260A1 (en) 2019-05-02
US10794694B2 (en) 2020-10-06
KR20200071089A (ko) 2020-06-18
KR102642205B1 (ko) 2024-02-28
CN111201594A (zh) 2020-05-26
JP7199432B2 (ja) 2023-01-05
US20190120617A1 (en) 2019-04-25

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