KR100688632B1 - 폴리시클릭 중합체를 기초로한 광감성 조성물 - Google Patents

폴리시클릭 중합체를 기초로한 광감성 조성물 Download PDF

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Publication number
KR100688632B1
KR100688632B1 KR1020047021566A KR20047021566A KR100688632B1 KR 100688632 B1 KR100688632 B1 KR 100688632B1 KR 1020047021566 A KR1020047021566 A KR 1020047021566A KR 20047021566 A KR20047021566 A KR 20047021566A KR 100688632 B1 KR100688632 B1 KR 100688632B1
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South Korea
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polymer
composition
photodefinable
branched
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Korean (ko)
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KR20050033565A (ko
Inventor
엘쎄에드문드
히라노다카시
크로티네제프리씨.주니어
로데스레리에프.
굿달브라이언엘.
자야라만사이쿠마
맥도우걸크리스
선쉔리앙
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스미토모 베이클리트 컴퍼니 리미티드
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
  • Silicon Polymers (AREA)
KR1020047021566A 2002-07-03 2003-07-02 폴리시클릭 중합체를 기초로한 광감성 조성물 Expired - Fee Related KR100688632B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US39372602P 2002-07-03 2002-07-03
US60/393,726 2002-07-03
US10/465,511 US7022790B2 (en) 2002-07-03 2003-06-19 Photosensitive compositions based on polycyclic polymers
US10/465,511 2003-06-19

Publications (2)

Publication Number Publication Date
KR20050033565A KR20050033565A (ko) 2005-04-12
KR100688632B1 true KR100688632B1 (ko) 2007-03-02

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KR1020047021566A Expired - Fee Related KR100688632B1 (ko) 2002-07-03 2003-07-02 폴리시클릭 중합체를 기초로한 광감성 조성물

Country Status (11)

Country Link
US (2) US7022790B2 (https=)
EP (1) EP1532486B1 (https=)
JP (1) JP4623419B2 (https=)
KR (1) KR100688632B1 (https=)
CN (2) CN102298265B (https=)
AT (1) ATE453135T1 (https=)
AU (1) AU2003243013A1 (https=)
DE (1) DE60330672D1 (https=)
MY (1) MY142759A (https=)
TW (2) TWI300167B (https=)
WO (1) WO2004006020A1 (https=)

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JP2006098949A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
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Also Published As

Publication number Publication date
US20040039153A1 (en) 2004-02-26
TWI300167B (en) 2008-08-21
TWI398459B (zh) 2013-06-11
CN1666150A (zh) 2005-09-07
TW200412472A (en) 2004-07-16
JP4623419B2 (ja) 2011-02-02
DE60330672D1 (de) 2010-02-04
US20060167197A1 (en) 2006-07-27
US7022790B2 (en) 2006-04-04
CN102298265A (zh) 2011-12-28
WO2004006020A1 (en) 2004-01-15
CN102298265B (zh) 2014-04-16
JP2005531680A (ja) 2005-10-20
EP1532486B1 (en) 2009-12-23
US8114948B2 (en) 2012-02-14
TW200835710A (en) 2008-09-01
ATE453135T1 (de) 2010-01-15
AU2003243013A1 (en) 2004-01-23
KR20050033565A (ko) 2005-04-12
EP1532486A1 (en) 2005-05-25
MY142759A (en) 2010-12-31

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