KR100678878B1 - 집적 회로 패키지 및 그 제조 방법 - Google Patents

집적 회로 패키지 및 그 제조 방법 Download PDF

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Publication number
KR100678878B1
KR100678878B1 KR20010043826A KR20010043826A KR100678878B1 KR 100678878 B1 KR100678878 B1 KR 100678878B1 KR 20010043826 A KR20010043826 A KR 20010043826A KR 20010043826 A KR20010043826 A KR 20010043826A KR 100678878 B1 KR100678878 B1 KR 100678878B1
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South Korea
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integrated circuit
conductive layer
substrate
package
region
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Korean (ko)
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KR20020008781A (ko
Inventor
콘찰레스
호크주니어도널드어리
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에이저 시스템즈 가디언 코포레이션
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    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR20010043826A 2000-07-21 2001-07-20 집적 회로 패키지 및 그 제조 방법 Expired - Lifetime KR100678878B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/620,939 US6465882B1 (en) 2000-07-21 2000-07-21 Integrated circuit package having partially exposed conductive layer
US09/620939 2000-07-21

Publications (2)

Publication Number Publication Date
KR20020008781A KR20020008781A (ko) 2002-01-31
KR100678878B1 true KR100678878B1 (ko) 2007-02-07

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Country Status (5)

Country Link
US (1) US6465882B1 (enExample)
JP (2) JP4352365B2 (enExample)
KR (1) KR100678878B1 (enExample)
GB (1) GB2370413B (enExample)
TW (1) TW512503B (enExample)

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US7088559B2 (en) * 2001-08-10 2006-08-08 Seagate Technology Llc Integrated interconnect and method of manufacture therefor
DE10233607B4 (de) 2002-07-24 2005-09-29 Siemens Ag Anordnung mit einem Halbleiterchip und einem mit einer Durchkontaktierung versehenen Träger sowie einem ein Anschlusspad des Halbleiterchips mit der Durchkontaktierung verbindenden Draht und Verfahren zum Herstellen einer solchen Anordnung
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US7423340B2 (en) * 2003-01-21 2008-09-09 Siliconware Precision Industries Co., Ltd. Semiconductor package free of substrate and fabrication method thereof
US20040183167A1 (en) * 2003-03-21 2004-09-23 Texas Instruments Incorporated Recessed-bond semiconductor package substrate
US6956286B2 (en) * 2003-08-05 2005-10-18 International Business Machines Corporation Integrated circuit package with overlapping bond fingers
US7166905B1 (en) 2004-10-05 2007-01-23 Integrated Device Technology, Inc. Stacked paddle micro leadframe package
TWI286917B (en) * 2005-01-14 2007-09-11 Au Optronics Corp Thermal bonding structure and manufacture process of flexible printed circuit (FPC)
TW200703606A (en) * 2005-07-15 2007-01-16 Siliconware Precision Industries Co Ltd Semiconductor package and fabrication method thereof
US8447700B2 (en) 2005-10-11 2013-05-21 Amazon Technologies, Inc. Transaction authorization service
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CN103000539B (zh) * 2012-11-16 2016-05-18 日月光半导体制造股份有限公司 半导体封装构造及其制造方法

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GB2370413A (en) 2002-06-26
GB2370413B (en) 2004-10-20
GB0117310D0 (en) 2001-09-05
JP5135493B2 (ja) 2013-02-06
KR20020008781A (ko) 2002-01-31
JP2008172267A (ja) 2008-07-24
TW512503B (en) 2002-12-01
US6465882B1 (en) 2002-10-15
JP4352365B2 (ja) 2009-10-28

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