KR100649387B1 - 초소형전자 제조에 사용하기 위한 공정수행 간 제어기 - Google Patents

초소형전자 제조에 사용하기 위한 공정수행 간 제어기 Download PDF

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Publication number
KR100649387B1
KR100649387B1 KR1020017016508A KR20017016508A KR100649387B1 KR 100649387 B1 KR100649387 B1 KR 100649387B1 KR 1020017016508 A KR1020017016508 A KR 1020017016508A KR 20017016508 A KR20017016508 A KR 20017016508A KR 100649387 B1 KR100649387 B1 KR 100649387B1
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model
control
metrology
tool
processing tool
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Korean (ko)
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KR20020019928A (ko
Inventor
케빈 디. 스토다드
브래들리 디. 슐츠
콘스탄티노스 타칼리스
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브룩스 오토메이션 인코퍼레이티드
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31086—Communication of carriage, agv data, workpiece data at each station
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31104—Remote configuration of parameters of controlled devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31422—Upload, download programs, parameters from, to station to, from server
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32388—Autonomous flexible system, cells and agv autonomous
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Feedback Control In General (AREA)
  • Control By Computers (AREA)
  • Numerical Control (AREA)
KR1020017016508A 1999-06-22 2000-06-20 초소형전자 제조에 사용하기 위한 공정수행 간 제어기 Expired - Fee Related KR100649387B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14043499P 1999-06-22 1999-06-22
US60/140,434 1999-06-22
US16898499P 1999-12-03 1999-12-03
US60/168,984 1999-12-03

Publications (2)

Publication Number Publication Date
KR20020019928A KR20020019928A (ko) 2002-03-13
KR100649387B1 true KR100649387B1 (ko) 2006-11-27

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KR1020017016508A Expired - Fee Related KR100649387B1 (ko) 1999-06-22 2000-06-20 초소형전자 제조에 사용하기 위한 공정수행 간 제어기

Country Status (8)

Country Link
US (1) US6587744B1 (enExample)
EP (1) EP1200885A1 (enExample)
JP (1) JP2003502771A (enExample)
KR (1) KR100649387B1 (enExample)
CN (1) CN1239969C (enExample)
AU (1) AU5881700A (enExample)
TW (1) TW484043B (enExample)
WO (1) WO2000079355A1 (enExample)

Families Citing this family (172)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6201999B1 (en) 1997-06-09 2001-03-13 Applied Materials, Inc. Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
US6850806B2 (en) * 1999-04-16 2005-02-01 Siemens Energy & Automation, Inc. Method and apparatus for determining calibration options in a motion control system
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6449524B1 (en) * 2000-01-04 2002-09-10 Advanced Micro Devices, Inc. Method and apparatus for using equipment state data for run-to-run control of manufacturing tools
US7209793B2 (en) 2000-07-12 2007-04-24 Aspen Technology, Inc. Automated closed loop step testing of process units
US6461878B1 (en) 2000-07-12 2002-10-08 Advanced Micro Devices, Inc. Feedback control of strip time to reduce post strip critical dimension variation in a transistor gate electrode
WO2002005042A2 (en) * 2000-07-12 2002-01-17 Aspen Technology, Inc. Automated closed loop step testing of process units
US6625512B1 (en) * 2000-07-25 2003-09-23 Advanced Micro Devices, Inc. Method and apparatus for performing final critical dimension control
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
TW526530B (en) * 2001-01-26 2003-04-01 Applied Materials Inc Method and apparatus for automatically generating schedules for wafer processing within a multichamber semiconductor wafer processing tool
US20020147960A1 (en) * 2001-01-26 2002-10-10 Applied Materials, Inc. Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control
JP4191484B2 (ja) * 2001-02-14 2008-12-03 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド エッチング選択度を制御するための方法
US6901984B1 (en) * 2001-02-27 2005-06-07 Cypress Semiconductor Corporation Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocol
US6931298B1 (en) 2001-02-27 2005-08-16 Cypress Semiconductor Corporation Integrated back-end integrated circuit manufacturing assembly
US7120514B1 (en) * 2001-03-22 2006-10-10 Advanced Micro Devices, Inc. Method and apparatus for performing field-to-field compensation
JP3993396B2 (ja) * 2001-03-30 2007-10-17 株式会社東芝 半導体装置の製造方法
US6901340B1 (en) * 2001-04-02 2005-05-31 Advanced Micro Devices, Inc. Method and apparatus for distinguishing between sources of process variation
US6859747B2 (en) * 2001-04-26 2005-02-22 Siemens Energy & Automation, Inc. Method and apparatus for self-calibrating a motion control system
US6865499B2 (en) * 2001-04-26 2005-03-08 Siemens Energy & Automation, Inc. Method and apparatus for tuning compensation parameters in a motion control system associated with a mechanical member
DE60133452T2 (de) * 2001-04-27 2009-10-01 Motorola, Inc., Schaumburg Verfahren zur Justierung von Verarbeitungsparametern plattenförmiger Gegenstände in einer Verarbeitungsvorrichtung
US6910947B2 (en) * 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US20020192966A1 (en) * 2001-06-19 2002-12-19 Shanmugasundram Arulkumar P. In situ sensor based control of semiconductor processing procedure
US7047099B2 (en) * 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7031783B2 (en) * 2001-06-29 2006-04-18 Agilent Technologies, Inc. Virtualized generic equipment model data and control router for factory automation
US6970758B1 (en) * 2001-07-12 2005-11-29 Advanced Micro Devices, Inc. System and software for data collection and process control in semiconductor manufacturing and method thereof
US6839713B1 (en) 2001-07-12 2005-01-04 Advanced Micro Devices, Inc. System and software for database structure in semiconductor manufacturing and method thereof
US7337019B2 (en) * 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
JP3857623B2 (ja) * 2001-08-07 2006-12-13 株式会社日立国際電気 温度制御方法及び半導体装置の製造方法
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
IL144911A (en) * 2001-08-15 2007-02-11 Nova Measuring Instr Ltd Method and system for measurements in patterned structures
US6616759B2 (en) * 2001-09-06 2003-09-09 Hitachi, Ltd. Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor
US6810291B2 (en) * 2001-09-14 2004-10-26 Ibex Process Technology, Inc. Scalable, hierarchical control for complex processes
AU2002341677A1 (en) * 2001-09-18 2003-04-01 Applied Materials, Inc. Integrated equipment set for forming an interconnect on a substrate
KR20030026862A (ko) * 2001-09-25 2003-04-03 다이닛뽕스크린 세이조오 가부시키가이샤 기판 처리장치 제어 시스템 및 기판 처리장치
US6725098B2 (en) 2001-10-23 2004-04-20 Brooks Automation, Inc. Semiconductor run-to-run control system with missing and out-of-order measurement handling
EP1444556A4 (en) * 2001-10-23 2006-06-07 Brooks Pri Automation Inc SEMICONDUCTOR RUN TO RUN CONTROL SYSTEM WITH CONDITION AND MODEL PARAMETER ESTIMATE
US6745140B2 (en) * 2001-10-23 2004-06-01 Agilent Technologies, Inc. Electronic test system with test results view filter
US20030220708A1 (en) * 2001-11-28 2003-11-27 Applied Materials, Inc. Integrated equipment set for forming shallow trench isolation regions
US6954883B1 (en) * 2002-01-11 2005-10-11 Advanced Micro Devices, Inc. Method and apparatus for performing fault detection using data from a database
US6698009B1 (en) * 2002-02-28 2004-02-24 Advanced Micro Devices, Inc. Method and apparatus for modeling of batch dynamics based upon integrated metrology
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
TWI252516B (en) * 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6922595B1 (en) * 2002-04-29 2005-07-26 Advanced Micro Devices, Inc. Selecting control algorithms based on business rules
US6751518B1 (en) * 2002-04-29 2004-06-15 Advanced Micro Devices, Inc. Dynamic process state adjustment of a processing tool to reduce non-uniformity
US6701206B1 (en) * 2002-05-03 2004-03-02 Advanced Micro Devices, Inc. Method and system for controlling a process tool
US6787376B1 (en) * 2002-05-22 2004-09-07 Advanced Micro Devices, Inc. Creating a process recipe based on a desired result
US20040206621A1 (en) * 2002-06-11 2004-10-21 Hongwen Li Integrated equipment set for forming a low K dielectric interconnect on a substrate
US20040007325A1 (en) * 2002-06-11 2004-01-15 Applied Materials, Inc. Integrated equipment set for forming a low K dielectric interconnect on a substrate
US6799311B1 (en) * 2002-06-27 2004-09-28 Advanced Micro Devices, Inc. Batch/lot organization based on quality characteristics
US7067333B1 (en) * 2002-06-28 2006-06-27 Advanced Micro Devices, Inc. Method and apparatus for implementing competing control models
US7069103B1 (en) * 2002-06-28 2006-06-27 Advanced Micro Devices, Inc. Controlling cumulative wafer effects
US7668702B2 (en) 2002-07-19 2010-02-23 Applied Materials, Inc. Method, system and medium for controlling manufacturing process using adaptive models based on empirical data
US6773931B2 (en) * 2002-07-29 2004-08-10 Advanced Micro Devices, Inc. Dynamic targeting for a process control system
US6999836B2 (en) 2002-08-01 2006-02-14 Applied Materials, Inc. Method, system, and medium for handling misrepresentative metrology data within an advanced process control system
US8185230B2 (en) * 2002-08-22 2012-05-22 Advanced Micro Devices, Inc. Method and apparatus for predicting device electrical parameters during fabrication
US6912437B2 (en) * 2002-09-30 2005-06-28 Advanced Micro Devices, Inc. Method and apparatus for controlling a fabrication process based on a measured electrical characteristic
US7337091B1 (en) * 2002-10-31 2008-02-26 Advanced Micro Devices, Inc. Method and apparatus for coordinating fault detection settings and process control changes
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
US7254453B2 (en) * 2002-11-21 2007-08-07 Advanced Micro Devices, Inc. Secondary process controller for supplementing a primary process controller
US8359494B2 (en) 2002-12-18 2013-01-22 Globalfoundries Inc. Parallel fault detection
US6912433B1 (en) * 2002-12-18 2005-06-28 Advanced Mirco Devices, Inc. Determining a next tool state based on fault detection information
US6834213B1 (en) * 2003-01-06 2004-12-21 Advanced Micro Devices, Inc. Process control based upon a metrology delay
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7221993B2 (en) * 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US7778721B2 (en) * 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7213478B2 (en) * 2003-02-18 2007-05-08 Tokyo Electron Limited Method for automatic configuration of processing system
US6845340B2 (en) * 2003-03-06 2005-01-18 Ford Motor Company System and method for machining data management
US6884147B2 (en) * 2003-03-28 2005-04-26 Yield Dynamics, Inc. Method for chemical-mechanical polish control in semiconductor manufacturing
US7375035B2 (en) * 2003-04-29 2008-05-20 Ronal Systems Corporation Host and ancillary tool interface methodology for distributed processing
JP4368143B2 (ja) * 2003-05-30 2009-11-18 富士通マイクロエレクトロニクス株式会社 信号処理装置及び信号処理方法
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7272454B2 (en) * 2003-06-05 2007-09-18 Fisher-Rosemount Systems, Inc. Multiple-input/multiple-output control blocks with non-linear predictive capabilities
US7026170B1 (en) * 2003-06-11 2006-04-11 Advanced Micro Devices, Inc. Methods of controlling optical properties of a capping insulating layer on memory devices, and system for performing same
US7158851B2 (en) * 2003-06-30 2007-01-02 Tokyo Electron Limited Feedforward, feedback wafer to wafer control method for an etch process
US20050021272A1 (en) * 2003-07-07 2005-01-27 Jenkins Naomi M. Method and apparatus for performing metrology dispatching based upon fault detection
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US6947805B1 (en) * 2003-08-04 2005-09-20 Advanced Micro Devices, Inc. Dynamic metrology sampling techniques for identified lots, and system for performing same
US8014991B2 (en) * 2003-09-30 2011-09-06 Tokyo Electron Limited System and method for using first-principles simulation to characterize a semiconductor manufacturing process
US8036869B2 (en) 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8032348B2 (en) 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8296687B2 (en) 2003-09-30 2012-10-23 Tokyo Electron Limited System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US7218983B2 (en) 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
US7020535B1 (en) * 2003-11-06 2006-03-28 Advanced Micro Devices, Inc. Method and apparatus for providing excitation for a process controller
US7720557B2 (en) * 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US20050130329A1 (en) * 2003-12-16 2005-06-16 Yushan Liao Method for the prediction of the source of semiconductor part deviations
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7198964B1 (en) 2004-02-03 2007-04-03 Advanced Micro Devices, Inc. Method and apparatus for detecting faults using principal component analysis parameter groupings
US20050192690A1 (en) * 2004-02-26 2005-09-01 Taiwan Semiconductor Manufacturing Co. Chip probing equipment and test modeling for next generation MES (300MM)
US7177716B2 (en) * 2004-02-28 2007-02-13 Applied Materials, Inc. Methods and apparatus for material control system interface
TWI290875B (en) * 2004-02-28 2007-12-11 Applied Materials Inc Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
US7274971B2 (en) 2004-02-28 2007-09-25 Applied Materials, Inc. Methods and apparatus for electronic device manufacturing system monitoring and control
US7127358B2 (en) * 2004-03-30 2006-10-24 Tokyo Electron Limited Method and system for run-to-run control
US7289858B2 (en) * 2004-05-25 2007-10-30 Asml Netherlands B.V. Lithographic motion control system and method
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US7289864B2 (en) * 2004-07-12 2007-10-30 International Business Machines Corporation Feature dimension deviation correction system, method and program product
US7292906B2 (en) * 2004-07-14 2007-11-06 Tokyo Electron Limited Formula-based run-to-run control
US7296103B1 (en) * 2004-10-05 2007-11-13 Advanced Micro Devices, Inc. Method and system for dynamically selecting wafer lots for metrology processing
US20060079983A1 (en) * 2004-10-13 2006-04-13 Tokyo Electron Limited R2R controller to automate the data collection during a DOE
US7409261B2 (en) * 2004-10-25 2008-08-05 Ford Motor Company Data management and networking system and method
US20070088454A1 (en) * 2004-10-25 2007-04-19 Ford Motor Company System and method for troubleshooting a machine
US7571022B2 (en) * 2004-10-25 2009-08-04 Ford Motor Company System and method for monitoring machine health
US7383097B2 (en) * 2004-10-25 2008-06-03 Ford Motor Company Method for managing machine tool data
US7282374B1 (en) * 2004-11-03 2007-10-16 Advanced Micro Devices, Inc. Method and apparatus for comparing device and non-device structures
US7606677B1 (en) * 2004-11-10 2009-10-20 Kla-Tencor Technologies Corporation Dynamic measurement control
JP4828831B2 (ja) * 2005-01-18 2011-11-30 パナソニック株式会社 半導体装置の製造方法
US7340374B2 (en) * 2005-02-25 2008-03-04 International Business Machines Corporation Determining fleet matching problem and root cause issue for measurement system
US7532999B2 (en) * 2005-02-25 2009-05-12 International Business Machines Corporation Determining root cause of matching problem and/or fleet measurement precision problem for measurement system
US7117059B1 (en) * 2005-04-18 2006-10-03 Promos Technologies Inc. Run-to-run control system and operating method of the same
US9287158B2 (en) * 2005-04-19 2016-03-15 Ebara Corporation Substrate processing apparatus
US7315765B1 (en) * 2005-07-29 2008-01-01 Advanced Micro Devices, Inc. Automated control thread determination based upon post-process consideration
US7444191B2 (en) 2005-10-04 2008-10-28 Fisher-Rosemount Systems, Inc. Process model identification in a process control system
US8036760B2 (en) * 2005-10-04 2011-10-11 Fisher-Rosemount Systems, Inc. Method and apparatus for intelligent control and monitoring in a process control system
US7444272B2 (en) * 2005-10-13 2008-10-28 International Business Machines Corporation Self-modulation in a model-based automated management framework
US7631286B2 (en) * 2005-12-30 2009-12-08 Wafertech Llc Automated metrology recipe generation
US7366575B2 (en) * 2005-12-30 2008-04-29 Intel Corporation Wafer polishing control
US7363094B2 (en) * 2006-01-09 2008-04-22 General Electric Company Multivariable controller design method for multiple input/outputs systems with multiple input/output constraints
US7305320B2 (en) * 2006-02-15 2007-12-04 International Business Machines Corporation Metrology tool recipe validator using best known methods
JP4839101B2 (ja) * 2006-03-08 2011-12-21 東京エレクトロン株式会社 基板処理装置、基板処理条件検討方法及び記憶媒体
US7894918B2 (en) * 2006-07-27 2011-02-22 Abb Research Ltd. System for analyzing batch processes
US7587253B2 (en) * 2006-08-01 2009-09-08 Warf (Wisconsin Alumni Research Foundation) Partial enumeration model predictive controller
KR100836655B1 (ko) * 2006-08-02 2008-06-10 경북대학교 산학협력단 오프셋 제어장치 및 그 방법
JP2008077286A (ja) * 2006-09-20 2008-04-03 Dainippon Screen Mfg Co Ltd 産業プロセス評価装置、産業プロセス評価方法及び産業プロセス評価プログラム
JP5242906B2 (ja) * 2006-10-17 2013-07-24 東京エレクトロン株式会社 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体
KR100835276B1 (ko) * 2006-10-23 2008-06-05 삼성전자주식회사 반도체 장비 제어 시스템 및 제어 방법
US7509186B2 (en) * 2006-11-07 2009-03-24 International Business Machines Corporation Method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process
US7756657B2 (en) 2006-11-14 2010-07-13 Abb Inc. System for storing and presenting sensor and spectrum data for batch processes
US7494893B1 (en) 2007-01-17 2009-02-24 Pdf Solutions, Inc. Identifying yield-relevant process parameters in integrated circuit device fabrication processes
US8544064B2 (en) * 2007-02-09 2013-09-24 Sony Corporation Techniques for automatic registration of appliances
US20080312875A1 (en) * 2007-06-12 2008-12-18 Yu Guanyuan M Monitoring and control of integrated circuit device fabrication processes
US8530247B2 (en) * 2007-12-28 2013-09-10 Texas Instruments Incorporated Control of implant pattern critical dimensions using STI step height offset
US8271122B2 (en) 2008-03-07 2012-09-18 Mks Instruments, Inc. Process control using process data and yield data
US7622308B2 (en) * 2008-03-07 2009-11-24 Mks Instruments, Inc. Process control using process data and yield data
US8155932B2 (en) * 2009-01-08 2012-04-10 Jonas Berggren Method and apparatus for creating a generalized response model for a sheet forming machine
US8209048B2 (en) * 2009-01-12 2012-06-26 Abb Automation Gmbh Method and apparatus for creating a comprehensive response model for a sheet forming machine
US20100198364A1 (en) * 2009-02-05 2010-08-05 Shih-Chin Chen Configurable Multivariable Control System
JP5334787B2 (ja) * 2009-10-09 2013-11-06 株式会社日立ハイテクノロジーズ プラズマ処理装置
CN102082546B (zh) * 2009-11-27 2013-02-27 台达电子工业股份有限公司 变频器的脉冲宽度调制死区补偿装置及其方法
US8073556B2 (en) 2009-12-16 2011-12-06 General Electric Company System and method for controlling a machine
US8406911B2 (en) * 2010-07-16 2013-03-26 HGST Netherlands B.V. Implementing sequential segmented interleaving algorithm for enhanced process control
US9002498B2 (en) * 2012-02-02 2015-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Tool function to improve fab process in semiconductor manufacturing
US10042357B2 (en) * 2012-10-23 2018-08-07 Applied Materials, Inc. Portable, adaptable equipment health user interface
CN103792858B (zh) * 2012-10-26 2017-03-15 洛克威尔自动控制技术股份有限公司 灵活的控制模型系统和方法
US8892237B2 (en) * 2013-03-15 2014-11-18 GlobalFoundries, Inc. Systems and methods for fabricating semiconductor device structures using different metrology tools
US9989858B2 (en) 2014-01-24 2018-06-05 Asml Netherlands B.V. Apparatus operable to perform a measurement operation on a substrate, lithographic apparatus, and method of performing a measurement operation on a substrate
WO2016078861A1 (en) 2014-11-17 2016-05-26 Asml Netherlands B.V. Process based metrology target design
JP6174652B2 (ja) * 2015-10-05 2017-08-02 ファナック株式会社 加工エリアの大きさによるパラメータの自動選定機能を有する数値制御装置
US10310490B2 (en) * 2016-02-01 2019-06-04 Qoniac Gmbh Method and apparatus of evaluating a semiconductor manufacturing process
JP6991833B2 (ja) * 2017-10-31 2022-01-13 株式会社日立製作所 因果関係モデル構築システムおよび方法
US11209795B2 (en) 2019-02-28 2021-12-28 Nanotronics Imaging, Inc. Assembly error correction for assembly lines
JP6790154B2 (ja) * 2019-03-07 2020-11-25 東芝デジタルソリューションズ株式会社 協調型学習システム及び監視システム
CN111983978A (zh) * 2019-05-22 2020-11-24 西安电子科技大学 具有吸收式策略和分布式策略特征的Petri网稳健性控制方法
US11156991B2 (en) 2019-06-24 2021-10-26 Nanotronics Imaging, Inc. Predictive process control for a manufacturing process
US11063965B1 (en) 2019-12-19 2021-07-13 Nanotronics Imaging, Inc. Dynamic monitoring and securing of factory processes, equipment and automated systems
US11100221B2 (en) 2019-10-08 2021-08-24 Nanotronics Imaging, Inc. Dynamic monitoring and securing of factory processes, equipment and automated systems
KR20220093171A (ko) 2019-11-06 2022-07-05 나노트로닉스 이미징, 인코포레이티드 제조 공정을 위한 시스템, 방법 및 매체
US12153408B2 (en) 2019-11-06 2024-11-26 Nanotronics Imaging, Inc. Systems, methods, and media for manufacturing processes
US12165353B2 (en) 2019-11-06 2024-12-10 Nanotronics Imaging, Inc. Systems, methods, and media for manufacturing processes
TWI887697B (zh) 2019-11-20 2025-06-21 美商奈米創尼克影像公司 用於判定網路攻擊及產生警告之製造系統及電腦實施方法
US11086988B1 (en) 2020-02-28 2021-08-10 Nanotronics Imaging, Inc. Method, systems and apparatus for intelligently emulating factory control systems and simulating response data
US11562137B2 (en) 2020-04-14 2023-01-24 Bank Of America Corporation System to correct model drift for natural language understanding
US11209737B1 (en) 2020-06-30 2021-12-28 Kla Corporation Performance optimized scanning sequence for eBeam metrology and inspection
US12498705B2 (en) 2022-11-28 2025-12-16 Applied Materials, Inc. Chamber matching by equipment constant updates

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0153901B1 (de) 1984-01-25 1991-05-29 Hahn-Meitner-Institut Berlin Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von halbleitenden Materialien und/oder Halbleiter-Bauelementen
US4819176A (en) 1987-02-06 1989-04-04 Treasure Isle, Inc. Process control and data collection system
DE69030078T2 (de) 1990-02-22 1997-08-07 At & T Corp Fertigungsjustierung während Produktherstellung
US5495417A (en) * 1990-08-14 1996-02-27 Kabushiki Kaisha Toshiba System for automatically producing different semiconductor products in different quantities through a plurality of processes along a production line
JP3139867B2 (ja) * 1993-03-04 2001-03-05 株式会社東芝 半導体生産システム
US5196997A (en) 1991-01-22 1993-03-23 International Business Machines Corporation Method and apparatus for quality measure driven process control
JPH0648903A (ja) 1992-07-08 1994-02-22 Azetsukusu:Kk 合成樹脂組成物
US5347460A (en) 1992-08-25 1994-09-13 International Business Machines Corporation Method and system employing optical emission spectroscopy for monitoring and controlling semiconductor fabrication
JPH06301690A (ja) * 1993-04-13 1994-10-28 Hitachi Ltd 製造ライン及び該製造ラインにおける条件設定方法
US5492440A (en) 1993-05-18 1996-02-20 U.S. Philips Corporation Apparatus for movement of an object
US5408405A (en) 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
US5546312A (en) 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
US5526293A (en) 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5658423A (en) 1995-11-27 1997-08-19 International Business Machines Corporation Monitoring and controlling plasma processes via optical emission using principal component analysis
JPH09160605A (ja) * 1995-12-11 1997-06-20 Omron Corp 分散制御システムにおいて用いられるコントローラおよび分散制御方法
US5710700A (en) * 1995-12-18 1998-01-20 International Business Machines Corporation Optimizing functional operation in manufacturing control
US5654895A (en) 1996-04-04 1997-08-05 Lsi Logic Corporation Process monitor usig impedance controlled I/O controller
US6110214A (en) * 1996-05-03 2000-08-29 Aspen Technology, Inc. Analyzer for modeling and optimizing maintenance operations
US5901059A (en) * 1996-09-13 1999-05-04 Honeywell Measurex Corp Method and apparatus for controlling a process using adaptive prediction feedback
US5859964A (en) * 1996-10-25 1999-01-12 Advanced Micro Devices, Inc. System and method for performing real time data acquisition, process modeling and fault detection of wafer fabrication processes
JP2867982B2 (ja) * 1996-11-29 1999-03-10 日本電気株式会社 半導体装置の製造装置
US5926690A (en) * 1997-05-28 1999-07-20 Advanced Micro Devices, Inc. Run-to-run control process for controlling critical dimensions
US6148239A (en) * 1997-12-12 2000-11-14 Advanced Micro Devices, Inc. Process control system using feed forward control threads based on material groups
US6263255B1 (en) * 1998-05-18 2001-07-17 Advanced Micro Devices, Inc. Advanced process control for semiconductor manufacturing
US6197604B1 (en) * 1998-10-01 2001-03-06 Advanced Micro Devices, Inc. Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication
US6446022B1 (en) * 1999-02-18 2002-09-03 Advanced Micro Devices, Inc. Wafer fabrication system providing measurement data screening
US6424876B1 (en) * 1999-07-22 2002-07-23 Advanced Micro Devices, Inc. Statistical process control system with normalized control charting

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