KR100627531B1 - 자동 기판 처리 시스템 - Google Patents

자동 기판 처리 시스템 Download PDF

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Publication number
KR100627531B1
KR100627531B1 KR1020007013035A KR20007013035A KR100627531B1 KR 100627531 B1 KR100627531 B1 KR 100627531B1 KR 1020007013035 A KR1020007013035 A KR 1020007013035A KR 20007013035 A KR20007013035 A KR 20007013035A KR 100627531 B1 KR100627531 B1 KR 100627531B1
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KR
South Korea
Prior art keywords
substrate
handling device
image
support
image capture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020007013035A
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English (en)
Korean (ko)
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KR20010015923A (ko
Inventor
엠마뉴엘 비어
존 엠. 화이트
Original Assignee
에이케이티 가부시키가이샤
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Publication of KR20010015923A publication Critical patent/KR20010015923A/ko
Application granted granted Critical
Publication of KR100627531B1 publication Critical patent/KR100627531B1/ko
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37555—Camera detects orientation, position workpiece, points of workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37575—Pre-process, measure workpiece before machining
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37576—Post-process, measure worpiece after machining, use results for new or same
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40622—Detect orientation of workpiece during movement of end effector
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020007013035A 1998-05-20 1999-05-13 자동 기판 처리 시스템 Expired - Fee Related KR100627531B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/082,413 US6215897B1 (en) 1998-05-20 1998-05-20 Automated substrate processing system
US09/082,413 1998-05-20

Publications (2)

Publication Number Publication Date
KR20010015923A KR20010015923A (ko) 2001-02-26
KR100627531B1 true KR100627531B1 (ko) 2006-09-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007013035A Expired - Fee Related KR100627531B1 (ko) 1998-05-20 1999-05-13 자동 기판 처리 시스템

Country Status (6)

Country Link
US (2) US6215897B1 (https=)
EP (1) EP1078392A1 (https=)
JP (1) JP2002516238A (https=)
KR (1) KR100627531B1 (https=)
TW (1) TW412826B (https=)
WO (1) WO1999060610A1 (https=)

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EP1078392A1 (en) 2001-02-28
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US6847730B1 (en) 2005-01-25
US6215897B1 (en) 2001-04-10
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