KR100619214B1 - 광학 소자 실장용 기판 및 그 제조 방법 - Google Patents
광학 소자 실장용 기판 및 그 제조 방법 Download PDFInfo
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- KR100619214B1 KR100619214B1 KR1020040049701A KR20040049701A KR100619214B1 KR 100619214 B1 KR100619214 B1 KR 100619214B1 KR 1020040049701 A KR1020040049701 A KR 1020040049701A KR 20040049701 A KR20040049701 A KR 20040049701A KR 100619214 B1 KR100619214 B1 KR 100619214B1
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- substrate
- thin film
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (10)
- 삭제
- 삭제
- 렌즈 탑재부를 구비하고, 실리콘으로 이루어진 제1 기판과,상기 제1 기판의 일 주면에 대향하여 형성되고, 레이저 다이오드의 탑재부 및 상기 레이저 다이오드에 연락하는 배선층을 그의 기판 상에 구비하며, 상기 제1 기판보다 저항율이 높은 유리로 이루어진 제2 기판과,상기 제1 기판의 상기 일 주면과 반대측의 주면에 대향하여 형성되고, 상기 제1 기판보다 저항율이 높은 유리로 이루어진 제3 기판을 구비하는 것을 특징으로 하는 광학 소자 실장용 기판.
- 삭제
- 삭제
- 삭제
- 삭제
- 렌즈 탑재부를 구비하고, 실리콘으로 이루어진 제1 기판과,상기 제1 기판의 일 주면에 대향하여 형성되고, 레이저 다이오드의 탑재부 및 상기 레이저 다이오드에 연락하는 배선층을 그의 기판 상에 구비하고, 유리로 이루어진 제2 기판과,상기 제1 기판의 상기 일 주면과 반대측의 주면에 대향하여 형성되고, 유리로 이루어진 제3 기판을 구비하는 것을 특징으로 하는 광학 소자 실장용 기판.
- 실리콘으로 이루어진 제1 기판의 일 주면에 렌즈를 설치하는 영역에 홈을 형성하는 홈 형성 공정과,상기 홈이 형성된 제1 기판의 상기 홈이 형성된 주면에, 레이저 다이오드의 탑재부를 구비하며 유리로 이루어진 제2 기판을 접합하는 제1 접합 공정과,상기 제1 기판의 상기 제2 기판을 접합한 주면과 반대측의 주면에, 유리로 이루어진 제3 기판을 접합하는 제2 접합 공정과,상기 제2 기판의 상기 접합된 주면과는 반대측의 주면에 레이저 다이오드에 전기적으로 연락하는 전극막과, 상기 전극막에 전기적으로 연락하여 외부로부터의 배선이 전기적으로 연락되는 배선층을 형성하는 도전막 형성 공정과,상기 도전막 형성 공정에서 형성된 막을 레지스트로 피복하는 레지스트 형성 공정과,상기 레지스트를 패터닝하여 제2 기판의 상기 홈 형성 영역에 대응하는 영역에 개구부를 형성하는 공정을 포함하는 것을 특징으로 하는 광학 소자 실장용 기판의 제조 방법.
- 실리콘으로 이루어진 제1 기판의 일 주면에 광 파이버를 설치하는 영역에 홈을 형성하는 홈 형성 공정과,상기 홈이 형성된 제1 기판의 상기 홈이 형성된 주면에, 레이저 다이오드의 탑재부를 구비하며 유리로 이루어진 제2 기판을 접합하는 제1 접합 공정과,상기 제1 기판의 상기 제2 기판을 접합한 주면과 반대측의 주면에, 유리로 이루어진 제3 기판을 접합하는 제2 접합 공정과,상기 제2 기판의 상기 접합된 주면과는 반대측의 주면에 레이저 다이오드에 전기적으로 연락하는 전극막과, 상기 전극막에 전기적으로 연락하여 외부로부터의 배선이 전기적으로 연락되는 배선층을 형성하는 도전막 형성 공정과,상기 도전막 형성 공정에서 형성된 막을 레지스트로 피복하는 레지스트 형성 공정과,상기 레지스트를 패터닝하여 제2 기판의 상기 홈 형성 영역에 대응하는 영역에 개구부를 형성하는 공정을 포함하는 것을 특징으로 하는 광학 소자 실장용 기판의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003357166A JP4225179B2 (ja) | 2003-10-17 | 2003-10-17 | 光学素子実装用基板およびその製造方法 |
JPJP-P-2003-00357166 | 2003-10-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050037336A KR20050037336A (ko) | 2005-04-21 |
KR100619214B1 true KR100619214B1 (ko) | 2006-09-01 |
Family
ID=34509822
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040049701A KR100619214B1 (ko) | 2003-10-17 | 2004-06-29 | 광학 소자 실장용 기판 및 그 제조 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050084201A1 (ko) |
JP (1) | JP4225179B2 (ko) |
KR (1) | KR100619214B1 (ko) |
CN (1) | CN1320709C (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8716850B2 (en) * | 2007-05-18 | 2014-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
JP2010251588A (ja) * | 2009-04-17 | 2010-11-04 | Renesas Electronics Corp | 光送信装置およびその製造方法 |
JP5707732B2 (ja) * | 2010-05-12 | 2015-04-30 | 住友電気工業株式会社 | 光半導体装置 |
US9058973B2 (en) * | 2011-04-13 | 2015-06-16 | International Business Machines Corporation | Passive devices fabricated on glass substrates, methods of manufacture and design structures |
KR20150012167A (ko) * | 2013-07-24 | 2015-02-03 | 주식회사 포벨 | 초고속 통신용 광 모듈 |
US10193301B2 (en) * | 2017-03-31 | 2019-01-29 | Nichia Corporation | Method of manufacturing light emitting device and light emitting device |
US10168538B2 (en) * | 2017-04-12 | 2019-01-01 | Massachusetts Institute Of Technology | Symmetric micro-optic module |
CN109346926A (zh) * | 2018-09-29 | 2019-02-15 | 北京凯普林光电科技股份有限公司 | 一种扇形密排激光器 |
JP7202874B2 (ja) * | 2018-12-20 | 2023-01-12 | 三菱電機株式会社 | 球レンズの高さ調整方法および光通信モジュールの製造方法 |
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US6944377B2 (en) * | 2002-03-15 | 2005-09-13 | Hitachi Maxell, Ltd. | Optical communication device and laminated optical communication module |
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2003
- 2003-10-17 JP JP2003357166A patent/JP4225179B2/ja not_active Expired - Fee Related
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2004
- 2004-06-25 CN CNB2004100483643A patent/CN1320709C/zh not_active Expired - Fee Related
- 2004-06-29 US US10/880,956 patent/US20050084201A1/en not_active Abandoned
- 2004-06-29 KR KR1020040049701A patent/KR100619214B1/ko not_active IP Right Cessation
Patent Citations (6)
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US5179609A (en) | 1991-08-30 | 1993-01-12 | At&T Bell Laboratories | Optical assembly including fiber attachment |
JPH06275870A (ja) * | 1993-03-24 | 1994-09-30 | Fujitsu Ltd | 光結合部材の製造方法および光結合用部材 |
JP2002062448A (ja) | 1993-08-09 | 2002-02-28 | Nippon Telegr & Teleph Corp <Ntt> | 光サブモジュールおよびハイブリッド光集積回路 |
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Non-Patent Citations (1)
Title |
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06275870 |
Also Published As
Publication number | Publication date |
---|---|
JP4225179B2 (ja) | 2009-02-18 |
CN1320709C (zh) | 2007-06-06 |
CN1610196A (zh) | 2005-04-27 |
US20050084201A1 (en) | 2005-04-21 |
KR20050037336A (ko) | 2005-04-21 |
JP2005123413A (ja) | 2005-05-12 |
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