KR100616719B1 - Pattern Substrate Defect Correction Method and Apparatus and Pattern Substrate Manufacturing Method - Google Patents

Abstract

The present invention provides a defect correction method, a defect correction apparatus, and a pattern substrate manufacturing method of a pattern substrate capable of stably correcting defects.

The defect correction apparatus according to the present invention is a defect correction apparatus for correcting a defect on a patterned substrate, comprising: a stage 7 on which a substrate 6 is placed, a short pulse laser light source 1, and a short pearl laser light source. A beam shaping mechanism 2 for shaping short pulsed laser light from (1), and air blowing means 13 for bringing the film 5 close to the substrate 6 are provided. By irradiating the film 5 with a laser beam, the film 5 and a defect are removed simultaneously. In addition, the film reel 8 is moved to bring the film 5 having the colored layer 51 close to the substrate 6, and the pattern is transferred to the substrate.

Description

Pattern Substrate Defect Correction Method and Apparatus and Pattern Substrate Manufacturing Method}

1 is a view showing the configuration of a defect correction apparatus according to a first embodiment of the present invention.

2 is a top view showing the structure of a film of a defect repair apparatus according to Example 1 of the present invention.

3 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the first embodiment of the present invention.

4 is a top view showing the structure of a film of a defect repair apparatus according to Example 1 of the present invention.

5 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the first embodiment of the present invention.

6 is a top view showing the structure of a film of a defect repairing apparatus according to Example 2 of the present invention.

7 is a diagram showing the configuration of a defect correction apparatus according to a third embodiment of the present invention.

8 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the third embodiment of the present invention.

9 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the fourth embodiment of the present invention.

Fig. 10 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the fourth embodiment of the present invention.

Fig. 11 is an enlarged cross-sectional view showing the configuration of another defect portion of the defect correction apparatus according to the fourth embodiment of the present invention.

12 is an enlarged cross-sectional view showing the configuration of another defect portion of the defect correction apparatus according to the fourth embodiment of the present invention.

Fig. 13 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the fifth embodiment of the present invention.

14 is an enlarged cross-sectional view showing the configuration of a color filter substrate.

15 is a diagram showing the configuration of a defect correction apparatus according to a sixth embodiment of the present invention.

It is a top view which shows the structure of the film which has an opening part and the transfer layer in the defect inspection apparatus which concerns on Example 6 of this invention.

It is sectional drawing which shows the structure of the film which has a transfer layer which concerns on Example 6 of this invention.

18 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the sixth embodiment of the present invention.

Fig. 19 is a sectional view showing the structure of a heater block in the defect correction apparatus according to the sixth embodiment of the present invention.

Fig. 20 is a top view showing the structure of an opening and an air removing portion of a film in the defect correction apparatus according to the seventh embodiment of the present invention.

Fig. 21 is an enlarged cross-sectional view showing the configuration of a defective portion in the defect correction apparatus according to the seventh embodiment of the present invention.

It is a top view which shows the other structure of the opening part of an film, and the air removal part in the defect correction apparatus which concerns on Example 7 of this invention.

It is a top view which shows the other structure of the opening part of a film and the air removal part in the defect correction apparatus which concerns on Example 7 of this invention.

24 is a diagram showing the configuration of a defect correction apparatus according to Embodiment 8 of the present invention.

Fig. 25 is an enlarged cross-sectional view showing the configuration of a defective portion of the defect correction apparatus according to the eighth embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

1: short pulse laser light source 2: beam forming mechanism

3: half mirror 4: objective lens

5: film 6: substrate

7: stage 8: film reel

9: lamp light source 10: wavelength variable filter

11: half mirror 12: CCD camera

13 air blowing means 14 film reel rotation means

15 laser spot 16 nozzle

17: resin solution 17b: crystal layer

18: film 19: film reel

20: heater block 21: air removal unit

22: base layer 23: expansion layer

24: separation layer 25: transfer layer

51: colored layer of red 52: colored layer of green

53: blue colored layer, 54: black matrix

61: colored layer of red 62: colored layer of green

63: blue colored layer 64: black matrix

65: foreign material 66: defective part

67: resist 68: chrome film

69: government

The present invention relates to a defect correction method, a defect correction apparatus, and a manufacturing method of a pattern substrate for correcting a defect of a pattern substrate.

In the manufacturing process of the color filter for liquid crystal display, defects in a color filter substrate are corrected in order to improve the product ratio. This defect correction method includes a method of applying a resist to the tip of a needle and dropping it on the defect to fix it. However, in this method, since the amount of dropping changes depending on the viscosity of the resist, it is difficult to control the amount of dropping and correction accuracy, and it is difficult to stably fix it. In addition, a drying process is required, and a modification time is required for a long time, resulting in low productivity.

In addition, there is a film transfer method as another defect correction method. In this method, a film having a colored layer is brought into close contact with a white defect portion having no colored layer in the color filter substrate, and the colored layer is transferred from the film to correct the defect (for example, Patent Document 1).

The problem of this method will be described with reference to FIG. 14 is an enlarged cross-sectional view showing the configuration of the color filter substrate. 14 shows the configuration of a part of the color filter substrate. As for the board | substrate 6 for color filters, the black mattress 71 (henceforth BM) is normally provided in matrix form. And red, green, and blue colored layer 70 is provided between BM. Since a part of this colored layer 70 is overlaid on the BM 71, it becomes a structure which has an unevenness | corrugation. For example, in the color filter of the resin black matrix structure, since BM and a colored layer are each about 1 micrometer, the uneven | corrugated surface is about 1 micrometer. Therefore, the film partially adhered to the convex portion of the colored layer 70, so that the film could not be closely adhered to the defective portion in the concave portion. The film could not be brought into close contact with the white defects of the colored layer, and it was difficult to thermally transfer the colored layer stably to correct defects. Moreover, in the conventional transfer method, in order to transfer a film to a board | substrate, it is set as the multilayer structure which has a material different from the colored layer at the board | substrate side. Therefore, a pixel is formed by the material different from the colored layer on the board | substrate side, and there exists a possibility that it may affect the quality of a display apparatus.

[Patent Document 1]

Japanese Patent Application Laid-Open No. 11-230861.

As described above, in the conventional defect correction method, there is a problem that the defect of the pattern substrate cannot be fixed stably.

The defect correction apparatus according to the present invention is a defect correction apparatus for removing defects on a patterned substrate, and includes a pulsed laser light source for emitting a pulsed laser (for example, the short pulsed laser light source 1 in the embodiment of the present invention). } And a film set to face the substrate (for example, the film 5 in the embodiment of the present invention), and the film is irradiated with pulsed laser light from the pulsed laser light source to the film. The laser ablation will remove some of the defects and roughly the same time. Thereby, the defect on a pattern board can be eliminated with a simple structure.

In the defect inspection apparatus described above, the film may be made thin by irradiating pulsed laser light so as to remove part of the film and defects at about the same time by laser ablation.

In the defect correction apparatus described above, film changing means for changing the film to a film having a transfer layer (for example, the colored layer 51 in the embodiment of the present invention) transferred to the substrate (for example, The film reel rotation means 14 etc. in the Example of this invention are further provided, and it irradiates the said pulsed laser light to the film which has the said transfer layer, and transfers the said transfer layer to the said board | substrate. Accordingly, the white defect and the black defect can be stably corrected with a simple configuration.

In the defect correction apparatus described above, the transfer layer may be transferred to a location where the defect is removed. As a result, defect correction can be promptly performed.

The defect correction apparatus according to the present invention, in the defect correction apparatus described above, further comprises a nozzle for attaching the correction liquid according to the pattern to be corrected on the substrate to the substrate, thereby attaching the correction liquid to the substrate from the removed portion of the film. It is to fix the defect. As a result, the pattern can be corrected accurately.

The defect inspection apparatus according to the present invention, in the defect inspection apparatus described above, further includes a film having a transfer layer movable at a position where the film is removed, and the transfer layer is removed from the portion where the film is removed. Is to fix the defects.

The defect correction apparatus according to the present invention is a defect correction apparatus for correcting a defect by transferring a pattern to a defective portion of a patterned substrate, the film having a transfer layer transferred to the substrate on a surface facing the substrate, A pulse laser light source for emitting pulsed laser light irradiated onto a film corresponding to the defective portion, a film corresponding to the defect portion, and a pulse laser light source from the pulsed laser light source is irradiated to the film having the transfer layer, thereby causing defects in the substrate. The transfer layer is transferred to the part. Thereby, a pattern can be formed correctly in a defect part, and stable correction can be performed.

A preferred embodiment of the defect correction apparatus described above is a photomask substrate having a light shielding film and a resist pattern formed on the light shielding film, wherein the defects of the resist pattern are corrected. Thereby, the pattern of the photomask substrate can be corrected.

The defect correction apparatus according to the present invention is a defect correction apparatus for correcting a defect of a patterned substrate, and a film provided opposite to the substrate, and a pulse that emits pulsed laser light that is irradiated to the film to form an opening in the film. A laser light source and a nozzle movable to a position of the opening, comprising a nozzle for attaching a correction liquid according to a pattern to be corrected to the substrate to a substrate, to fix the defect by attaching the correction liquid to the substrate from a portion where the film is removed. It is. As a result, the pattern can be attached with high accuracy, and defects can be corrected accurately.

The defect correction apparatus according to the present invention is a defect correction apparatus for correcting a defect of a patterned substrate, and a pulse laser for emitting a film provided opposite the substrate, and a pulse laser irradiated to the film to form an opening in the film. And a film having a light source and a transfer layer movable to a position corresponding to the opening (for example, the film 18 in the embodiment of the present invention), the transfer layer being attached to the substrate through the opening. The defect is corrected by transferring. As a result, the defect can be corrected with a simple configuration.

A preferred example of the defect correction apparatus described above is further provided with a heater block (for example, the heater block 20 in the embodiment of the present invention) that is movable to a position corresponding to the opening. A film having a transfer layer is pressed onto the substrate to transfer the transfer layer. Thereby, the transfer layer can be transferred with good adhesion with a simple configuration.

In the defect correction apparatus described above, the heater block may further include a convex portion corresponding to the opening, and the convex portion may press the film having the transfer layer with the substrate. Thereby, adhesiveness can be improved.

In the defect correction apparatus described above, a fixing means for fixing the film having the opening portion may be further provided. Thereby, the shift | offset | difference of an opening part can be prevented.

In the defect correction apparatus described above, the film having the transfer layer further includes an absorbing layer (for example, the expansion layer 23 in the embodiment of the present invention) that absorbs the pulsed laser light, and pulses the absorbing layer. Preferably, the laser beam is irradiated to transfer the transfer layer to the substrate. Thereby, the transfer layer can be transferred efficiently.

In the defect correction apparatus described above, it is preferable that after the transfer layer is transferred to the substrate, a separation layer for separating the absorption layer from the transfer layer is provided between the absorption layer and the transfer layer. As a result, the absorption layer can be prevented from adhering to the substrate, and defects can be corrected correctly.

The defect correction apparatus according to the present invention is characterized in that in the defect correction apparatus described above, the pulsed laser light is irradiated to remove the correction liquid at the periphery of the portion where the film is removed. This allows you to modify the pattern exactly.

In the above defect correction apparatus, it is preferable to further include an ejecting means for ejecting gas into the film or the film having the transfer layer, and to close the film or the film having the transfer layer to the substrate by the ejecting means. Do. Thereby, a board | substrate and a film can be closely approached with precision.

In the above-mentioned defect correction apparatus, the beam shaping | molding mechanism (for example, the beam shaping mechanism 2 in the Example of this invention) which shape | molds the pulsed laser light from the said pulsed laser light source is further provided, The said beam It is preferable to irradiate the film or the film which has the said transfer layer with the pulsed laser light shape | molded by the shaping | molding apparatus. As a result, the defect can be corrected with high accuracy.

In the defect correction apparatus described above, an observation light source for irradiating light to the substrate on the same axis as the pulse laser light from the pulse laser light source and detection means for detecting light from the observation light source irradiated to the substrate. It is preferable to further provide. As a result, light can be irradiated accurately to the defect detection location.

The film having the transfer layer further has a transparent layer (for example, the transparent layer 55 in the embodiment of the present invention) that transmits the light of the observation light source, and the position where the light is irradiated is from the transparent layer. It is also possible to further provide the film reel (for example, the film reel 8 in the Example of this invention) which sends the film which has the said transfer layer so that it may be changed into a transfer layer. Thereby, with a simple structure, position shift at the time of defect detection and defect correction can be prevented.

In the defect correction apparatus described above, a wavelength variable filter for selecting the wavelength of light from the light source for observation can be further provided, and the transfer layer can be heated by the light emitted from the wavelength variable filter. Thereby, the adhesiveness of a board | substrate and a transfer layer can be improved.

The defect correction method according to the present invention is a defect correction method for correcting a defect by removing a defect on a patterned substrate, the step of detecting a defect on a substrate, and irradiating pulsed laser light on a film provided opposite the substrate to the film. And a step of removing substantially all at the same time with the defect laser ablation.

In the defect correction method described above, further comprising the step of thinning the film by irradiating the pulsed laser light, irradiating the pulsed laser light to a portion where the film is thinned, and lasering a part of the film and the defect. It is also possible to remove it at about the same time with an ablation.

In the defect correction method described above, the step of changing the film to a film having a transfer layer transferred to the substrate, and the step of transferring a laser beam to the film having the transfer layer to transfer the transfer layer to the substrate. It is desirable to have. Thereby, arbitrary patterns can be corrected.

The defect correction method according to the present invention further includes a step of attaching a correction liquid corresponding to a pattern to be corrected in the defect correction method described above to the substrate from a portion from which the film is removed, and removing the film from the substrate. will be. Thereby, arbitrary patterns can be corrected.

The defect correction method according to the present invention is a defect correction method for correcting a defect by transferring a pattern to a defective portion of a patterned substrate, the method comprising: detecting a defect on a substrate, and transferring the transferred onto the substrate on a surface facing the substrate; And a step of bringing the film having a layer into close proximity and irradiating pulsed laser light to the film to transfer the transfer layer to a defective portion of the substrate. Thereby, it is stable and defects can be corrected.

The defect correction method according to the present invention is a defect correction method for correcting a defect of a patterned substrate, comprising the steps of detecting a defect on a substrate, bringing the film close to the substrate, and irradiating the laser with pulsed laser light, A step of forming an opening, a step of attaching a correction liquid in accordance with a pattern to be corrected to a defective portion of the substrate through the opening, and a step of removing the film from the substrate. Thereby, a pattern can be correctly attached to a defect part.

A defect correction method according to the present invention is a defect correction method for correcting a defect of a patterned substrate, comprising the steps of detecting a defect on a substrate, opposing the substrate to a film, and irradiating the film with pulsed laser light. And a step of forming an opening, a step of providing a film having a transfer layer at a position of the opening, and a step of transferring the transfer layer to a substrate through the opening. As a result, the transfer layer can be prevented from being transferred to portions other than the openings, and defects can be corrected with a simple configuration.

In the above-described defect correction method, further comprising the step of removing the film around the opening and providing an air removing section for removing air between the substrate and the film having the transfer layer, wherein the opening And it is preferable to provide a film having the transfer layer in the position of the air removing unit. Thereby, the adhesiveness of a transfer layer can be improved.

A preferred embodiment of the defect correction method described above is characterized in that a gas is blown onto the film or the film having the transfer layer to bring it closer to the substrate. As a result, an accurate pattern can be formed.

The pattern substrate manufacturing method according to the present invention comprises the steps of forming a pattern on a substrate, detecting a defect on the substrate on which the pattern is formed, and irradiating pulsed laser light onto a film proximate to the substrate to form a portion of the film and the It has a step of removing defects at about the same time by laser ablation. As a result, a pattern substrate free of defects can be produced.

In the above-described pattern substrate manufacturing method, the step of changing the film into a film having a transfer layer transferred to the substrate, and irradiating pulsed laser light to the film having the transfer layer, transfers the transfer layer to the substrate. You may have a step. Thereby, the pattern substrate which has a pattern correctly can be manufactured.

The pattern substrate manufacturing method according to the present invention includes the steps of attaching a correction liquid corresponding to a pattern to be corrected in the pattern substrate manufacturing method described above to the substrate from a portion from which the film is removed, and removing the film from the substrate. To have more. Thereby, arbitrary patterns can be formed in a defect part.

A pattern substrate manufacturing method according to the present invention is a pattern substrate manufacturing method for transferring a pattern to a defective portion of a patterned substrate to form a pattern, the method comprising: detecting a defect on a substrate on which a pattern is formed, and a surface facing the substrate; And a step of bringing the film having the transfer layer transferred to the substrate into close proximity and irradiating pulsed laser light to the film to transfer the transfer layer to a defective portion of the substrate. Thereby, the pattern can be transferred stably.

A pattern substrate manufacturing method according to the present invention is a pattern substrate manufacturing method for manufacturing a patterned substrate, comprising the steps of forming a pattern on a substrate, detecting a defect on the substrate, opposing the film to the substrate, Irradiating pulsed laser light to the film to form an opening, providing a film having a transfer layer at a position of the opening, transferring the transfer layer to the substrate through the opening, and It is provided with the step of removing a film from the said board | substrate.

The pattern substrate manufacturing method according to the present invention is a pattern substrate manufacturing method for correcting a defect of a patterned substrate, comprising the steps of forming a pattern on the substrate, detecting a defect on the substrate, and bringing the film close to the substrate; Irradiating pulsed laser light to the film to form an opening, attaching a correction liquid according to a pattern to be corrected to a defective portion of the substrate through the opening, and removing the film from the substrate. It is provided. As a result, an accurate pattern can be formed on the substrate.

In the above-described patterned substrate manufacturing method, the method further comprises a step of removing the film around the opening to form an air removing unit for removing air between the substrate and the film having the transfer layer. It is preferable to provide a film having the transfer layer at an opening and a position of the air removal unit. Thereby, the adhesiveness of a transfer layer can be improved.

The preferred embodiment of the pattern manufacturing method described above is characterized in that the gas is blown onto the film or the film having the transfer layer and brought close to the substrate.

EXAMPLE

Embodiments of the present invention will be described below with reference to the drawings. The following description shows preferred embodiments of the present invention, and the scope of the present invention is not limited to the following embodiments. In the following description, the same reference numerals indicate substantially the same contents.

Example 1

A defect correction apparatus for a patterned substrate according to the present embodiment will be described with reference to FIG. 1 is a diagram showing the configuration of a defect correction apparatus. 1 is a short pulse laser light source, 2 is beam forming apparatus, 3 is half mirror, 4 is objective lens, 5 is film, 6 is substrate, 7 is stage, 8 is film reel, 9 is lamp light source, 10 is filter, 11 Silver half mirror, 12 are CCD cameras, 13 are air blowing means, 14 are film reel rotating means.

In this embodiment, the substrate 6 to correct the defect is a color filter substrate used for the liquid crystal panel of the liquid crystal display device. The substrate 6 for color filters is usually provided with a colored layer and a black matrix on a transparent glass substrate. The substrate 6 is placed horizontally on the stage 7 to determine whether or not each pixel of the color filter substrate is defective. The laser tail is irradiated to correct the defective pixel. The stage 7 is an XY stage provided with an XY drive mechanism (not shown), and can move the board | substrate 6 to arbitrary positions. The defect correction apparatus of this embodiment is provided with a defect detection mechanism for detecting a defect of the substrate 6 and a defect correction mechanism for correcting the detected defect. Specifically, after the position of the defect is detected by the defect detection mechanism, the defect is corrected by irradiating a laser to the defect portion of the substrate 6 by the defect detection mechanism. In addition, the structure of the optical system of the defect detection mechanism and the defect correction mechanism shown is an example, and may be provided with other optical components, such as a filter, a lens, and a mirror.

First, the defect detection mechanism will be described. Detection is performed using the lamp light source 9 as the observation light source. The lamp light source 9 emits white light for illuminating the surface of the substrate 6. The observation light emitted from the lamp light source 9 passes through the filter 10 and enters the half mirror 11. The filter 10 is a wavelength variable filter and can shield only a predetermined wavelength. Here, the filter 10 may correct the wavelength in combination with the transmittance of the film 5 so that the detected light may be white light. Light incident on the half mirror 11 reflects in the direction of the substrate 6. This light is reflected by the half mirror 3 and enters the objective lens 4. Between the objective lens 4 and the board | substrate 6, the film 5 which consists of polyimide of thickness about 10 micrometers is provided facing the board | substrate 6. As shown in FIG. The light collected by the objective lens 4 penetrates the film 5 and enters the surface of the substrate 6 to illuminate a portion of the substrate. The light reflected by the substrate 6 passes through the film 5, the objective lens 4, the half mirror 3, and the half mirror 11 and enters the CCD camera 12. The CCD camera 12 detects an image in accordance with the reflected light on the surface of the substrate 6. The CCD camera 12 is connected to an information processing apparatus such as a personal computer (PC), and determines the presence or absence of a defect in the substrate 6 in accordance with the detected image. For example, a die-to-die may be used that compares with a detected reference die. If the detected image is different from the reference die, it is determined that the defective portion is present. In this defect detection mechanism, opaque black defects and transparent white defects can be distinguished and detected. In addition, the PC is connected to the XY drive mechanism of the stage 7, the detection point is specified from the position of the stage 7 at the time of defect detection, and the coordinates of the defective pixel on the substrate are detected. Of course, the defect detection mechanism is not limited to the illustrated configuration, and a defect detection mechanism having a configuration other than this may be used. In this defect detection mechanism, the same structure as the conventional defect detection apparatus can be used. By moving the stage 7, the relative position of the light from the board | substrate 6 and the lamp light source 9 is changed, and defect detection of the whole surface of the board | substrate 6 is detected.

The defect detected by the above-described defect detection mechanism is corrected by the defect correction mechanism. The defect correction mechanism will be described below. The short pulsed laser light source 1 is a Q-switched YAG laser and can emit short pulsed light of 10 nsec or less. The short pulse laser light emitted from the short pulse laser light source 1 is incident on the beam forming mechanism 2. The beam shaping mechanism 2 is provided with an aperture, a slit, a lens, etc., and can shape | mold the spot of a short pulse light into the beam spot of a suitable shape. For example, the beam spot of short pulse light on a board | substrate is shape | molded in rectangular shape substantially the same as the pixel of a color filter. Alternatively, the mold may be molded into a shape substantially the same as that of the defect. The half mirror 3 reflects short pulsed light in the direction of the substrate 6. Here, each optical component is arranged so that the light from the short pulse laser light source 1 and the lamp light source 9 becomes coaxial. The short pulse light reflected by the half mirror 3 is irradiated to the film 5.

The film 5 is wound around two film reels 8 connected to the film reel rotating means 14. The film reel rotating means 14 includes a motor and the like, and can rotate each of the film reels 8. By rotating the two film reels 8, the film 5 is continuously conveyed in the Y direction. The film reel rotating means 14 is driven to warp the film 5 before correcting the defect, thereby rotating one of the film reels 8. In this case, the film 8 may be warped to such an extent that the film 8 does not come into contact with the substrate 6. The air blowing means 13 includes an air tank, a pipe, an ionizer, a filter, and the like, and is capable of blowing air ionized from above the film 5. For example, a cylinder having a bottom surface on the substrate side is provided under the objective lens 4. The cylinder is tapered and the substrate side is thinned. Pipes are connected to the side surfaces so that air can flow in the cylinders. And by letting air flow, the internal pressure in a cylinder will become high and air will blow off to a film side. At the time of defect correction, air is blown out to bring the film 5 close to the substrate side, and the film 5 and the substrate 6 are brought close to each other. By adhering the film 5 and the board | substrate 6, a micro clearance gap is formed in the board | substrate 6 and the film 5 in a defect part. In this case, the protrusions other than the defective part of the board | substrate 6 and the film 5 may contact. The distance between the film 5 and the substrate 6 is adjusted by the blowing amount of the air blowing means 13 or the like. Or you may adjust the curvature and tension of the film 5 by the film reel rotation means 14. Further, the interval may be adjusted by providing a mechanism for moving the stage 7 in the Z direction. By adhering the film 5 and the substrate 6 by the air blowing means 13, there is no need to bring the film 5 into close contact with the substrate. Thereby, stable correction can be performed and the influence on the pattern of the board | substrate 6 can further be reduced.

As shown in FIG. 2, this film 5 can be changed into another film according to the kind of defect to fix. The film of the defect correction apparatus is composed of a film 5a and a film reel 8a for black defect correction, a film 5b and a film reel 8b for white defect correction. Different films are used for the films 5a and 5b depending on the defects to be corrected. The film reel 8 is attached to reel moving means (not shown), such as a linear guide, and is slidably mounted in the X direction. The film reel 8a and the film reel 8b are moved to a X direction, and short pulse light is irradiated to the film 5 according to the defect of the object to correct | amend. That is, when correcting a black defect, the film 5a is moved to the position of the laser spot 15 of the short pulse light from the short pulse laser light source 1. On the other hand, when correcting the white defect, the film 5b is moved to the position of the laser spot 15 of the short pulse light from the short pulse laser light source 1. Since the light from the short pulsed laser light source 1 and the lamp light source 9 is adjusted to have the same optical axis, the laser spot 15 and the light for observation in the film 5 are approximately the same position. . At the time of movement of the film reel 8 and at the time of conveying the film 5, the film reel 8 is rotated to give the film 5 an appropriate tension to form a gap between the substrate 6 and the film 5. Then, the film is moved and conveyed without blowing air. On the other hand, when correcting a defect, the film 5 is deformed, the air is blown out by the air blowing means 13, and the film 5 is brought close to the substrate surface.

The structure of this film 5a and the board | substrate 6 is demonstrated using FIG. 3 is an enlarged cross-sectional view showing the configuration of a correction point. Fig. 3 (a) shows the structure of the film and the substrate under irradiation with short pulse light. 3B shows the structure of the modified substrate. 61 is a colored layer of red (R), 62 is a colored layer of green (G), 63 is a colored layer of blue (B), 64 is a black matrix (BM), and these are provided on the substrate 6. First, the general manufacturing method of a color filter substrate is demonstrated. On the substrate 6 for color filters, a chromium film serving as a light shielding film is formed on a transparent glass substrate or the like by sputter deposition or the like, and patterned by exposure and development processes. As a result, the chromium film becomes BM64 formed in a matrix. From this, the photosensitive resin which disperse | distributed the pigment corresponding to the color of a colored layer is apply | coated, and is patterned by an exposure and a developing process. By repeating this process, the colored layer 61 of R, the colored layer 62 of G, and the colored layer 63 of B are provided in order between BM64. From this, a protective film and a pixel electrode are formed. Here, as shown to Fig.3 (a), the foreign material 65 is affixed to the colored layer 61 of R. As shown to FIG. The pixel to which this foreign material 65 adheres is detected by the black defect which does not permeate | transmit light by a defect detection mechanism. This film 5a is substantially in contact with the substrate 6.

The short pulsed light of 10 nsec or less from the short pulsed laser light source 1 is irradiated to the pixel with this foreign material 65 attached. The short pulsed light collected by the objective lens 4 is incident on the film 5a close to the substrate 6 by the air ejecting means. The power is adjusted so that this short pulsed light partially opens the film 5a by laser ablation. In this embodiment, since a polyimide film is used, when 355 nm of triple harmonics or 266 nm of quadruple harmonics of the YAG short pulse laser light source 1 are used, the short pulsed light is easily absorbed. An opening can be formed in (). In addition, since the polyimide film has no absorption in the visible light region and is almost transparent, the polyimide film can be easily observed, and defects can be detected using the lamp light source 9. Moreover, the film 5a is not limited to polyimide, The material which opens by chemical decomposition, thermal decomposition, sublimation, or ablation by light irradiation can be used. Since the laser beam is molded by the beam forming mechanism 2 so as to have a shape of a defect or a shape of a pixel, the shape of the opening of the film 5a can be approximately the same as the shape of a defect or the pixel of R. have. By laser ablation, the foreign material 65 and a part of film can be removed substantially simultaneously. The removed foreign material 65a passes through the opening part of the film 5a, and is separated from the board | substrate, as shown to FIG. 3 (b). In addition, since the periphery of the rectifier is covered with a film, the foreign material 65 does not adhere to the periphery of the rectifier to create new defects. In this way, the film and the defect can be removed at substantially the same time by laser ablation. In addition, although the removed foreign material 65a is one piece, it may become many debris and land on a film. The power of the short pulsed laser light source 1 may be adjusted to gradually puncture the film 5a, or may be adjusted to simultaneously remove the foreign matter and the hole of the film. In the case where a hole is gradually drilled into the film 5a, as shown in Fig. 3C, the film 5a is made thin, and a short pulsed laser beam is irradiated to a portion where the film 5a is thinner to provide foreign matter. Remove it. In addition, when the size of the opening is small, the opening may be formed while transferring the film. When the ultraviolet rays are used, since the film 5a is chemically decomposed, when the residue of the film remains on the substrate surface after the removal of the foreign matter, the ultraviolet ray can be irradiated to remove the residue of the film.

In addition, when the foreign material 65 is transparent, laser ablation does not occur even if the foreign material is irradiated with short pulsed light because there is no absorption of light. On the other hand, when a short pulse laser light is irradiated in a state in which the absorbing film is in contact with the upper part of the foreign material using a film that absorbs light such as polyimide as the film 5, the film is opened by laser ablation. At the same time, foreign matter is pressed against the substrate by the gas or deburring forward, and can be separated from the substrate by the subsequent peninsula.

Since the colored layer 61 is removed simultaneously with the foreign material 65 on a board | substrate by the process mentioned above, a black defect turns into a white defect 66 which permeate | transmits light. In order to correct this white defect 66, as shown in FIG. 4, the film reel 8a and the film reel 8b are moved to an X direction, and the film 5b is moved to the position of the laser spot 15. FIG. . And short pulse light is irradiated to the film 5b, and the white defect 66 is correct | amended. The correction method of this white defect is demonstrated using FIG. 5 is an enlarged cross-sectional view showing the configuration between the film 5b and the substrate 6. The colored layer 51 is coated on the surface of the board | substrate side of the film 5b. As the film 5b, a dry film resist having a polyethylene film having a thickness of about 10 to 20 µm as a base film and a resist having a thickness of about 1 µm as the colored layer 51 can be used. It is preferable to use the material which does not absorb short pulse light for the film 5b, It is not limited to polyethylene, Polypropylene, PET film, etc. can be used, The thickness is not limited to said thickness, either. In addition, it is also possible to use the material similar to the colored layer of R of the board | substrate side for the colored layer 51. FIG. Accordingly, deterioration of the quality of the liquid crystal display device can be prevented. Of course, the material and thickness of the film 5b and the colored layer 51 are not limited to said thing.

The air ionized by the air blowing means 13 is blown out to bring the film 5b close to the substrate 6. As a result, the film 5b comes into contact with the protruding portion of the substrate 6 and the like, and a small gap is formed between the portion (defect portion) of the colored layer of the substrate. And the short pulse light shape | molded by the beam shaping mechanism to the shape substantially the same as a defect part is irradiated to the film 5b. The output of short pulse light is adjusted so that the colored layer 51 may peel from the film 5b by laser ablation. The colored layer 51 which peeled from the film 5b flies the space between the film 5b and the board | substrate 6, and lands on a defective part. Thereby, the red colored layer 51b can be adhered to the defective portion and transferred. When the sufficient amount of the colored layer 51b cannot be transferred by one transfer, the short reel light may be irradiated while rotating the film reel 8 and transferring the film 5b in the Y direction. Moreover, the board | substrate 6 and the film 5b can be proximate by irradiating short pulsed light to the film 5b from the surface on the opposite side to the surface where the colored layer 51 is provided. Since the clearance between the film 5 and the board | substrate 6 is a small distance, the frequency | count of collision with the molecule | numerator in air | atmosphere and the colored layer 51b is small. Thereby, the process of defect correction can be performed by laser ablation deposition in air | atmosphere. In addition, since the air blowing means 13 is close to each other, it is possible to finely adjust the spacing. Therefore, the defect can be corrected stably without being influenced by the surface state of the substrate.

In addition, in this embodiment, the colored layer 51 of the film 5 can be heated by adjusting the power, wavelength, etc. of the lamp light source 9 beforehand. For example, infrared light is selected by the wavelength variable filter for the light from the lamp light source 9. By irradiating this board | substrate 6 to this infrared ray, only the colored layer 51 of a defective part can be spot heated. Thereby, the adhesiveness to the board | substrate when it lands on the board | substrate 6 can be improved. In addition, by heating the light from the lamp light source 9 to the film 5b and the colored layer 51 as light having a low absorption rate and having a high absorption rate of the substrate, the substrate 6 can be heated. do. Thereby, the adhesiveness to the board | substrate when it lands on the board | substrate 6 can be improved. As described above, in the defect correction apparatus according to the present invention, heating can be performed by adjusting the output and the wavelength of the lamp light source 9 for injecting the CCD camera.

In addition, since one defect correction can be corrected only by the movement of the film reel 8 without following the movement of an optical system or a stage, all the above operations can be observed under one objective lens. In addition, only one short pulsed laser light source 1 can remove foreign matters and apply color, thereby correcting white defects and black defects. Further, after the correcting operation is finished, the CCD camera 12 may detect whether correcting is performed correctly. Although only the two films 5 of the film 5a and the film 5b are shown in FIG.2 and FIG.4, the film provided with the light shielding layer for correcting the defect of G, B, and the coloring layer of G and B other than R was provided. (5) and the film reel 8 may be further provided. The defects in the colored layers of G and B and the locations of BM can also be corrected in the same manner as in the colored layer 61 of R. Resists in which green and blue pigments are dispersed can be used for the G and B colored layers. For the modification of BM, a film coated with a material such as chromium in which visible light is shielded can be used. Thereby, all the defects of the pixel of R, G, B, and BM can be correct | amended, and the apparatus which can correct | amend all the area | regions of a board | substrate can be realized with a simple structure. In addition, since all defects can be corrected only by the movement and rotation of the film reel, correction can be made in a short time, and there are advantages such as small displacement.

Since modification is performed by laser ablation in the present invention, it is not necessary to bring the film and the substrate into close contact with each other. Therefore, stable correction can be made regardless of the surface state of the substrate. By adjusting the power and irradiation time of the short pulsed light, the adhesion amount of the colored layer can be easily controlled. Therefore, it is possible to correct the pixel to have a display characteristic substantially the same as the pixel of the pattern portion of the substrate, and since any material can be used for the colored layer, the quality of the liquid crystal display device can be improved. In the above description, the color filter substrate for the liquid crystal display device has been described, but it can also be used for color filter substrates for solid-state image pickup devices such as CCD cameras. Of course, it can be used for pattern substrates other than color filter substrates. For example, it can also be used for the correction of phosphors such as PDP and CRT. In addition, although the foreign material 65 was made into the opaque material which becomes black defect in the above-mentioned description, you may make it the foreign material which consists of a transparent material. Furthermore, you may remove the colored layer etc. which were not provided with high precision. These foreign substances which should be removed shall be called a defect. By eliminating this defect, the defect can be corrected.

Example 2

The defect correction apparatus which concerns on a present Example changes the film 5 in the defect correction apparatus demonstrated in Example 1. FIG. In the configuration described in the first embodiment, the description is omitted because it is the same configuration. The film used for the defect correction apparatus in this Example is demonstrated using FIG. 6 is a plan view illustrating the structure of the film 5. In FIG. 6, 51 is a colored layer of R, 52 is a colored layer of G, 53 is a colored layer of B, 54 is a light shielding layer, and 55 is a transparent layer. In this embodiment, one film is provided with R, G, B colored layers, light shielding layers, and transparent layers, and one film can correct defects in R, G, B pixels, and BM locations on the color filter substrate. It would be. Moreover, the colored layer 51 of R, the colored layer 52 of G, the colored layer 53 of B, the light shielding layer 54, and the transparent layer 55 are each formed in the part from which a film differs.

The film 5 is provided with the base film and the colored layer 51 of R, the colored layer 52 of G, the colored layer 53 of B, and the light shielding layer 54 which were provided in one surface. 6 shows the structure of a part of the film, and in practice, the colored layer 51 of R, the colored layer 52 of G, the colored layer 53 of B and the light shielding layer 54 are repeated on the film 5. Is installed. The colored layer 51 of R, the colored layer 52 of G, the colored layer 53 of B and the light shielding layer 54 are provided with a space | gap, and the transparent layer 55 comprised only with a base film between each is provided. Have The transparent layer 55 may transmit light from the lamp light source 9 so that the defect portion can be observed by the CCD camera 12, and layers other than the base film may be provided. The materials of the base film, the colored layer, and the light shielding layer 54 may be the same as those of the above-described embodiment. The film 5 is wound around the film reel 8 and placed so that the surface on which these colored layers and the light shielding layer 54 are provided faces the substrate 6 as in the above-described embodiment. By rotating the film reel 8, the film is transferred in the direction of the arrow, and the position of the laser spot is moved to the transparent layer 55, the colored layer 51 of R, the colored layer 52 of G, and the colored layer of B ( 53) or the light shielding layer 54.

At the time of defect detection and foreign material removal, the transparent layer 55 is positioned at the laser spot. If the transparent layer 55 is a material which transmits the light from the lamp light source 9, this light is detected by the CCD camera 12. As shown in FIG. Then, after defect detection as in Example 1, the transparent layer 55 of the film 5 is opened by laser ablation to remove foreign substances. As a result, the black defect becomes a white defect. The film reel 8 is rotated so that the colored layer or the light shielding layer corresponding to the defect point becomes the position of the laser spot. Then, as in the above embodiment, the white defect is corrected by transferring the colored layer or the light shielding layer 54 by laser ablation. Moreover, it is preferable to adjust the output of a laser or to provide a filter etc. so that a base film may not open when repairing a white defect.

The defect correction apparatus according to the present invention is not limited to the color filter substrate, but can also be used for other pattern substrates. For example, the thin film transistor array substrate of the liquid crystal display device can be used. In this case, the film is provided with a conductive layer made of metal such as chromium, and the pattern of wiring, electrodes, etc. can be corrected by transferring the conductive layer with short pulse light. As a result, short-sleeved clothing can be used. Alternatively, an insulating film may be provided on the film to correct defects in the insulating layer between the wirings. Furthermore, the photomask pattern can be modified. Also in this case, pattern correction is possible by transferring a light shielding layer such as chromium. In order to correct the defects in this way, by providing the transfer layer (coloring layer, light shielding layer, conductive layer, etc.) of the material corresponding to the point to be corrected, the defects of various kinds of pattern substrates can be corrected. If the substance to be transferred is transparent to short pulsed laser light, a light absorption layer may be added between the film and the transfer layer. Alternatively, the film itself may be made of a material that absorbs short pulsed laser light. In this case, the light absorbing layer becomes a propantant for laser ablation deposition. The structure in which the light absorption layer is provided on this film is suitable for a method of depositing a phosphor. In the present embodiment, as described above, by rotating the film reel, the position of the laser spot can be changed from the transparent layer 55 to the light shielding layer 54 or the colored layer. Therefore, after detecting a defect, short pulse light can be irradiated to a defect position, without moving an optical system or a stage. Therefore, short pulse light can be irradiated correctly with respect to the position of a defect, and repair can be performed correctly.

Moreover, the means for changing the position where the short pulse laser light is irradiated to another layer is used as the film changing means. A film for rotating the film reel 8 in which the film 5 is set by providing another transfer layer on one film 5, as shown in this embodiment, with the optical system and the stage fixed to the film changing means. In addition to the reel rotating means 14, film reel moving means for moving the film reel 8 and exchanging the film 5 with another layer set as shown in Example 1 above is included. Furthermore, it is supposed to include moving the optical system and the substrate stage successively to move the irradiation position of the laser to another layer. Of course, you may use it in combination.

Example 3

A defect correction apparatus and a defect correction method according to the present embodiment will be described with reference to FIGS. 7 and 8. In addition, description is abbreviate | omitted about the content similar to what was demonstrated in Example 1 and Example 2. FIG. 7 is a diagram illustrating a configuration of a defect correction apparatus. 8 is an enlarged cross-sectional view showing the structure of a substrate and a film. Fig. 8 (a) shows the structure when the short pulse light is irradiated to the film to fix the defect, and Fig. 8 (b) shows the structure of the substrate on which the defect is corrected. In this embodiment, a transparent glass substrate for a photomask is used for the substrate 6. First, the manufacturing process of a photomask is demonstrated. On the substrate 6, a chromium film 68 is formed by vapor deposition, spatter, or the like. This chromium film 68 functions as a light shielding film in the exposure step. On the chromium film 68, a resist 67 for patterning the chromium film 68 is provided. The resist 67 is a photosensitive resin or the like, and is applied onto the chromium film 68 by a spin coater or the like. After drawing a pattern by the drawing apparatus using an electron beam or a laser beam, a resist pattern is formed with an alkali developing solution. This results in the configuration shown in Fig. 8A. When the chromium film 68 which exposed the resist pattern as a mask is etched, a light shielding pattern is formed. After removing the resist, the photomask is completed.

In this embodiment, a method of correcting the white defect 66 provided in a part of the resist 67 will be described. When a part of the resist pattern has a white defect 66 such as a pinhole, the chromium film 68 under the white defect 66 is etched at the time of etching the chromium film. Therefore, if etching is performed as it is when there is a white defect in a resist, the location of the white defect of a resist pattern will become a white defect of a photomask. In order to prevent the white defect of the photomask, a method for correcting the white defect of the resist pattern will be described. In this embodiment, the substrate 6 for photomask, on which the resist pattern after resist development is provided, is placed on the stage 7. The defect correction apparatus according to this embodiment includes a lamp light source 9, a CCD camera 12, and the like as a defect detection mechanism. As a defect correction mechanism, a short pulse laser light source 1, a beam shaping mechanism 2, and the like are provided. The white light for observation emitted from the lamp light source 9 enters the objective lens 4 by the half mirror 11. This light is collected by the objective lens 4, passes through the film 5, and enters the substrate 6. The light reflected by the substrate 6 is detected by a CCD camera, and the presence or absence of a defect is determined as in the first embodiment. The stage 7 is an XY stage, and can detect the defect of the whole surface of the board | substrate 6.

On the board | substrate 6, the film 5 is provided. This film 5 blows off air using the air blowing means 13, so that the gap with the substrate 6 is about 10 µm. Since the resist 67 is usually formed of a resin or the like, the surface is concave-convex. The gap can be made at a suitable distance. It does not affect a resist pattern by pressurization etc. As a result, the transfer can be performed with high accuracy.

This film 5 is wound around the rotatable film reel 8. As shown in Example 2, the film 5 is provided with a transparent layer and a transfer layer. At the time of defect detection, the light from the lamp light source 9 passes through a portion of the transparent layer and is irradiated onto the substrate, and defect detection is performed by detecting the light on the CCD camera 12 as in the first embodiment. At the time of defect correction, the film reel 8 is rotated to move the transfer layer to the position of the laser spot. The short pulsed light from the short pulsed laser light source 1 is shaped so that the spot light having the same shape as that of the defect is irradiated by the beam forming mechanism 2 and enters the half mirror 3. Then, the light is reflected by the half mirror 3 in the direction of the substrate 6, is collected by the objective lens 4, and enters the film 5. Since the short pulsed laser light from the short pulsed laser light source 1 and the illumination light from the lamp light source are coaxial, the short pulsed laser light can be irradiated at the same position as the detected defect position, and the defect is corrected accurately. There is a number. The state in which the short pulse laser light is irradiated to the film 5 is as showing to FIG. 8 (a).

Here, the silicon layer 56 is provided in the surface of the board | substrate side of the film 5. This silicon layer 56 functions as a transfer layer transferred to the substrate 6 by laser irradiation. Then, the silicon layer 56 is transferred to the portion of the white defect 66 of the resist 67, and when the chromium film 68 is etched, the chromium film 68 is prevented from being immersed in the etching liquid. As the etching solution of the chromium film 68, for example, an acid such as aqueous solution of cerium acetate ammonium acetate is used. Therefore, it is preferable to use a material resistant to the etching liquid, and metals, semiconductors, silicides or organic substances, etc., other than silicon can be used. These substances are previously coated on the film 5. Moreover, even in the case of dry etching, it is preferable to use a material having etching resistance.

The short pulse laser light from the short pulse laser light source 1 is collected and irradiated to the film 5 on the location where the defect is detected. As the short pulse laser light source 1, a YAG laser can be used as in the first embodiment. Short pulse light is irradiated using 355 nm of triplex harmonics of the YAG laser. By laser ablation, the silicon layer 56 in the same portion as the shape of the defect is removed from the film 5, deposited in the region of the white defect 66, and transferred onto the chromium film 68. Thereby, it becomes the structure shown in FIG. 8 (b), and the silicon layer 56 is transferred and the correction part 69 is provided in the location with the white defect 66. FIG. By etching in this state, it is possible to prevent the chromium film 68 under the water fixing unit 69 from being immersed in the etching liquid and to leave the chromium film 68 as a light shielding film. That is, since the correction unit 69 of the chromium film 68 functions as a resist, white defects are corrected. Thereby, a chrome pattern can be formed correctly. Thereafter, the resist 67 and the correction unit 69 are removed. By the method mentioned above, the pattern of a photomask can be formed correctly, and the productivity of a photomask can be improved. By using this photomask, it is possible to improve the productivity and processing of semiconductor devices and liquid crystal display devices. In the case of pattern index crystals, a silicon layer is deposited more than a defective portion. After the chromium film 68 is etched, the chromium film of the portion pushed out by the laser ablation is removed to form a pattern edge.

By the above-described method, occurrence of white defects (lack of chrome pattern) can be prevented. Conventionally, partial deposition techniques such as laser CVD, FIB deposition, spot exposure, or lift-off have been required to correct white defects in a photomask. However, as shown in this embodiment, part of a defect inspection apparatus is defective. By applying the correction mechanism, stable defects can be corrected with a simple configuration. In addition, since the laser can be irradiated exactly to the same position where the defect is detected, stable repair is possible. Also in the present embodiment, it is also possible to provide the wavelength variable filter as in the first embodiment and to heat light from the lamp light source 9.

Example 4

A defect correction method of the pattern substrate according to the present embodiment will be described with reference to FIGS. 9 and 10. 9 and 10 are enlarged cross-sectional views showing the configuration of a defective portion in a step of correcting a defect. The structure of the defect correction apparatus of this embodiment is the same as that of the first embodiment. Then, as in Example 1, foreign matter or defects on the color filter substrate are detected, and short pulse light is irradiated to the portion through the film. As a result, part of the film 5a and the foreign matter are removed at the same time by laser ablation. Thereby, it becomes the structure shown in FIG.9 (a), and the opening part is formed in the film 5a.

The colored resin solution 17 is dripped from the top using the liquid dispenser from it. The dropped resin solution 17 adheres to the substrate 6 at the opening of the film 5a, and expands and adheres to the film 5a. For example, the nozzle of the liquid dispenser is provided in the defect correction apparatus so as to be movable in the horizontal direction, and the nozzle 16 is moved above the opening of the film 5a as shown in Fig. 9B. The colored resin solution 17 is blown out over an area wider than the opening. This resin solution 17 is colored so that it may become substantially the same color as the color of the color layer of the color filter which carries out defect correction, and is colored in red here. The resin solution 17 may have an appropriate viscosity by adjusting the concentration of the resin. Moreover, as a method of attaching the resin solution 17 to a board | substrate from a nozzle, there exists a method of spraying micron order microparticles | fine-particles using a spray nozzle other than the method of flowing a drop of the resin solution 17. And the resin solution 17a adhering to the board | substrate 6 is dried suitably. In this drying step, the resin solution 17a can be dried by light heating using the lamp light source 9, as shown in Fig. 9C. That is, the light from the lamp light source 9 is irradiated to all or part of the resin solution 17a and dried. At this time, it is also possible to adjust the range to which the objective lens is moved in the optical axis direction to change the area irradiated with light and to dry. Alternatively, the blowing solution 13 may blow off air to dry the resin solution 17a. By drying the resin solution 17a, the solvent may evaporate and the adhesion point may shrink, so that the resin solution 17a is preferably attached thickly by a predetermined film thickness.

After drying, it is also possible to remove the resin solution 17a by irradiating the short pulsed light from the short pulsed laser light source 1 to the edge portion of the opening. That is, as shown in Fig. 10 (d), the resin solution 17a of the defective portion remains without irradiating short pulsed light to the center of the opening, and irradiates short pulsed light only to the periphery of the opening. The resin solution 17a is removed. Here, an optical component of a mirror or a lens that is movable in the optical path of the short pulse light is provided to control the irradiation position of the short pulse light. For example, by changing the inclination of the half mirror 3, the delicate position adjustment of a laser spot can be performed. The laser spot is further reduced by the beam shaping mechanism 2 or the objective lens 4, and short pulse laser light is irradiated over the entire circumference of the opening using such an optical component. Thereby, while the resin solution 17a of the center of an opening part remains in the state which remained, the resin solution 17a of the edge part of an opening part is removed by laser ablation. Thereby, it becomes the structure shown in FIG.10 (e). The film reel 8 is rotated while the resin solution 17 near the edge of the opening is removed to move the opening of the film 5a. Then, the stage 7 is moved to remove the film 5a from the substrate 6. Thereby, as shown in FIG.10 (f), resin adheres to a defect part, this resin turns into the correction layer 17b, and a defect is corrected. Since the resin solution 17a of the edge part of the opening part is removed by laser ablation as mentioned above, the film 5a can be removed promptly, and the film 5a adheres to the board | substrate 6, and becomes a defect. Can be prevented. In addition, since the resin solution 17a removed by laser ablation is reattached on the film 5a or near the center of the opening portion, it is not a new defect. Moreover, since the resin solution 17a is removed by irradiating short pulse light, the shape of the attachment part of the resin solution 17a can be adjusted. As a result, the defect can be corrected accurately.

In the defect correction method according to this embodiment, the allowable amount for the position at which the resin solution is to be attached is increased. In addition, since a relatively large amount of resin may be blown out at one time, a large nozzle can be used even for correction of a minute pattern. This makes it easier to manage the openings that are required when the minute amount is ejected than the minute nozzles. Since the size of the opening part of the film 5a can be adjusted by the beam shaping mechanism 2, pulse laser light can be irradiated to a film in arbitrary shapes. Thereby, the shape of the opening of the film can be matched to the pixel shape, and it is easy to correct the rectangular area of the area substantially the same as the pixel shape. By heating and drying the resin solution 17a, when peeling off the film 5a, the resin adhering to the defective part of the board | substrate sticks to the film side, and the phenomenon which peels from the defective part of a board | substrate can be prevented. In addition, in order to remove the resin accumulated at the tip of the nozzle or to bring the resin solution to a prescribed concentration, it is necessary to drill holes other than the defect point. Can make the time difference less. In addition, by observing the landing point at the time of drilling with a CCD camera, it is possible to correct the position shift caused from the nozzle flush to the landing. Thus, by using the defect correction method according to the present embodiment, it is possible to perform defect correction with high accuracy.

After attaching the correction liquid 17a to the substrate or drying the resin solution, it is also possible to collect resin in the openings with skids or the like, or to remove excess resin solution with skids. Thereby, even when the amount of flushing is excessive, the amount of the resin solution 17a attached to the defective portion of the substrate 6 can be controlled by the ratio of the solvent in the resin solution (reduced after drying) and the film thickness of the film. There is a number. That is, the film thickness of the final crystal layer 17b can be controlled and the pattern can be formed correctly. This makes it possible to control the color and transmittance of the defect correction portion. Further, the point of attachment of the resin solution on the film may be shifted from the moving start position direction of the skid at the film opening. Even in this case, the resin solution 17a can be uniformly attached to the defective portion of the substrate 6 by collecting the resin in the opening portion using the skid.

On the other hand, the material of the skid is composed of a material such as silicone or Teflon (registered trademark), which splashes the resin solution, and if the material of the film is composed of a material having higher wettability than skid, such as polyimide, the scraped resin is formed into a film. Will remain. As a result, the resin can not be left in the ski area, so the cleaning of the ski area becomes unnecessary, or the cleaning cycle can be lengthened. In addition, since the excess resin remains in the state of being attached to the film 5a and is wound at the same time as the used film 5a, it is prevented from attaching other than the defective portion of the substrate 6, thereby making new defects. none. In addition, since excess resin can be recovered by exchanging the used film 5a, the resin does not adhere to the apparatus, and maintenance can be facilitated.

In addition, when the resin solution 17 is blown out from the nozzle 16 to the board | substrate, the resin solution 17a may be rounded by surface tension, and the resin solution 17a may not be able to contact the board | substrate 6. In this case, it is preferable to make the periphery of the opening part of the film 5a thin. This procedure will be described with reference to FIG. First, as shown to Fig.11 (a), the part near the opening part of the film 5a is made thin by laser ablation. By irradiating the short pulse laser light from the short pulse laser light source 1 to the periphery of the opening part of the film 5a, a part is removed and it becomes the structure shown to FIG. 11 (a). At this time, the output of the short pulse laser light source 1 is made lower than when penetrating the film 5a and forming an opening part. Then, the position of the laser spot is moved to irradiate short pulsed laser light around the entire opening. By making the periphery of the opening part of the film 5a thin in this way, when the film 5a is thick, the board | substrate 6 and the resin solution 17a can be contacted. Thereby, it becomes the structure shown in FIG.11 (b). At this time, since the thin part and the thick part are formed in the film 5a, a step is possible, and the resin solution 17a adheres on it. And as shown in FIG.11 (c), the light from the lamp light source 9 is irradiated and dried. Since the subsequent steps are the same as those shown in Fig. 10, the description is omitted. Thereby, even if the quantity of the resin solution 17a to adhere is large, it can attach easily.

Alternatively, as shown in FIG. 12, the resin solution 17 may be attached to the substrate 6 by spraying the fine particles from the nozzle 16. In this case, as shown in Fig. 12A, an opening is formed in the film 5a by laser ablation. And as shown to FIG. 12 (b), microparticles | fine-particles are generate | occur | produced with respect to the board | substrate 6 from the opening part using the nozzle 16. As shown to FIG. As a result, even when the film 5a is thick, the resin solution 17a can be attached to the defective portion of the substrate 6. And as shown in FIG.12 (c), the light from the lamp light source 9 is irradiated and dried. Since the subsequent steps are the same as those shown in Fig. 10, the description is omitted. Thereby, even if the quantity of the resin solution 17a necessary for making it adhere is large, it can attach easily.

In the above embodiment, the resin solution 17 colored in red is attached to the substrate 2 from the nozzle 16, but may be blue, green or black. Thereby, defect correction of a blue colored layer, a green colored layer, and BM is possible. In addition, it is not limited to the board | substrate for color filters, What is necessary is just to attach the resin solution colored to the color corresponding to the pattern to correct to a substrate. By drying this resin solution, the water in the solution evaporates, and the resin adheres to the defective portion. Of course, solutions other than the resin solution may be sufficient, and what is necessary is just to make the correction liquid according to the pattern to fix to the board | substrate 1 through the opening part of the film 5a. Further, a correction liquid may be added dropwise from above by a nozzle and attached. By affixing the correction liquid colored according to the correction pattern to the board | substrate 1, the pattern of arbitrary color can be corrected. Further, by adjusting the size of the opening by adjusting the spot of the short pulsed laser light, the resin solution can be attached to the same size as the detected white defect, and the white defect can be corrected with high accuracy. Therefore, the display quality is not deteriorated when the color filter substrate or the like is corrected.

Example 5

A defect correction method of the pattern substrate according to the present embodiment will be described with reference to FIG. It is an expanded sectional view which shows the structure of the defect part in the process of correct | amending a defect. The structure of the defect correction apparatus of this embodiment is the same as that of the first embodiment. Then, as in Example 1, foreign matter or defects on the color filter substrate are detected, and short pulse light is irradiated to the portion through the film. As a result, part of the film 5a and the foreign matter are removed at the same time by laser ablation. Thereby, it becomes the structure shown to FIG. 13 (a), and the opening part is formed in the film 5a. In this embodiment, the nozzle 16 of the liquid dispenser movable in the horizontal direction is provided as in the above-described embodiment.

In this state, the nozzle 16 is moved above the opening. This results in the configuration shown in Fig. 13A. Similarly, the resin solution 17 colored in the color according to the correction pattern is attached to the tip of the nozzle 16 of the dispenser. This resin solution 17 is pushed out from the tip of the nozzle 16. In this embodiment, the nozzle 16 is provided to be movable in the vertical direction. The nozzle 16 is moved downward to approach the substrate 6, and the resin solution 17 is brought into contact with the film 5a and the substrate 6. In addition, the stage of the board | substrate 6 may be moved upward and the board | substrate 6 and the nozzle 16 may approach. Thereby, the resin solution 17a adheres to the defect part of the board | substrate 6 through an opening part, as shown to FIG. 13 (b). When the distance between the substrate 6 and the nozzle 16 is reduced by moving the nozzle 16 upward or downward, most of the resin solution 17a attached to the tip of the nozzle 16 is at the nozzle side. Come back about. Thereby, it becomes the structure shown in FIG.13 (c), and the resin solution 17a adheres to a defect part like Example 4. FIG. In this embodiment, even if it is dripped using a large nozzle, the adhesion amount of the resin solution 17a to the board | substrate 6 can be restrict | limited. Therefore, a small amount of resin solution can be attached to the substrate 6, and the thickness of the attached resin layer can be easily controlled. Thereafter, the resin solution 17a around the opening is removed using the short pulse laser light source 1 as in Example 4, and the resin solution is dried using the lamp light source 9. And the film 5a is rotated, it peels off from the board | substrate 6, the stage 7 is moved, and the film 5a is removed from the board | substrate 6. As shown in FIG. As a result, colored resin adheres to the defective portion as shown in Fig. 13 (d), and a correction layer 17b is provided to correct the defect of the colored layer. By the device configuration and the defect correction method described above, the white defects of the pattern substrate can be corrected accurately. In addition, by applying a step of correcting these defects to the manufacturing process of the pattern substrate, it is possible to manufacture a pattern substrate without defects.

Example 6

A defect correction apparatus according to the present embodiment will be described with reference to FIG. Fig. 15 is a diagram schematically showing the configuration of a defect inspection apparatus of a color filter substrate according to the present embodiment. Since the configuration described in the above embodiment is the same configuration, the description is omitted. In this embodiment, after removing the foreign matter on the film by laser ablation as in the above-described embodiment, the colored layer provided on the other film from the formed opening is thermally transferred by the heater block.

In this embodiment, in addition to the defect inspection apparatus shown in Fig. 1, as shown in Fig. 15, a film 18 having a colored transfer layer on the film 5 and a heater block 20 for thermal transfer are provided. . The film 18 is attached to the film reel 19, and the film 18 is transferred by rotating the film reel 19. The film 18 and the heater block 20 slide to move above the defect position of the substrate. For example, the objective lens 4, the air blowing means 13, the film reel 19, and the heater block 20 may be connected to one slider (not shown) to move the slide. When the foreign material is removed, the objective lens 4 and the air blowing means 13 are disposed on the defect position. When the transfer layer is transferred, the slider is moved to move the film 18 and the heater block 20 on the defect position. Can be placed. Of course, it may be moved by a moving means other than the slide. It is also possible to move the film 18 and the heater block 20 under the air blowing means 13 without moving the objective lens 4 and the air blowing means 13.

Moving the film 18 above the defect position results in the configuration shown in FIG. 16. 16 is a top view showing the structure of the substrate 6 and the film. When the film 18 is moved in the X direction, the film 18 is disposed on the film 5. The film 18 and the board | substrate 6 are mutually arrange | positioned through the opening part 15 of the film 5 formed in the defect position, and the transfer layer of the film 18 is provided in the position of the opening part 15. As shown in FIG. As a result, the transfer layer of the film 18 can be transferred to the defective portion of the substrate through the opening 15.

If the film 18 is moved above the film 5, the air from the air blowing means 13 will not be blown off to the film 5 here. Thereby, there exists a possibility that the position of the opening part 15 of the film 5 may shift | deviate from a defect position. In this case, it is preferable to fix the position of the board | substrate 6 and the film 5 before moving the film 18. FIG. As a method of fixing the film 5 and the substrate 6, a method of placing silicone rubber or the like on the film 5 while the air is blown or fixing the film 5 is fixed to the substrate 6 by electrostatic force. There is a way.

In the method of placing silicone rubber, silicone rubber is placed on both sides of the opening. Thereby, the position of the film 5 is fixed. Moreover, in the method of fixing the film 5 by electrostatic force, when the film 5 is conveyed by rotating the film reel 19, the film 5 is charged by friction, for example. And the position of the film 5 and the board | substrate 6 is fixed by the electrostatic force of the film 5 charged. In the present embodiment, the opening 5 may be formed in the film 5 by fixing the film 5 and the substrate 6 by the above-described method without using the air blowing means 13. Furthermore, air may be blown off to the part in which the film 18 does not overlap as both sides of the opening part 15, and the film 5 and the board | substrate 6 may be fixed.

The film 18 is a film having a transfer layer to be transferred by thermal transfer, and for example, a transcript (trademark) manufactured by FUJIFILM Corporation can be used. By this film, the adhesiveness of the transfer layer can be improved. The structure of this film 18 is demonstrated using FIG.

This film 18 is equipped with the cushion layer 18d formed on the base layer 18e. An oxygen barrier layer 18c is provided on the cushion layer 18d, and a transfer layer 18b colored by various pigments is provided thereon. The transfer layer 18b is formed of photosensitive resin, for example. The pigment of this transfer layer 18b is colored according to the pixel of the color filter to correct. The transfer layer 18b is transferred to the substrate 6 to correct white defects. The cover film 18a of polypropylene is pressed on the transfer layer 18b for surface protection. Further, an electron conductive antistatic layer 18f is provided on the back surface of the base layer 18e for the purpose of preventing adhesion of dust or the like due to peeling charging or the like.

The base layer 18e is formed by PET of about 75 micrometers in thickness, for example. As the cushion layer 18d, a weak alkali soluble thermoplastic resin having a thickness of about 20 µm can be used. By this cushion layer 18d, the step in the defective part of a board | substrate can be absorbed and the adhesiveness of a transfer layer can be improved. The oxygen barrier layer was 1.6 mu m thick, the transfer layer 18b was 2.0 mu m thick, and the cover film was 1.2 mu m thick. The structure of this film 18 is a typical example, and is not limited to the structure mentioned above. For example, the cover film 18a, the oxygen barrier layer 18c, or the antistatic layer 18f may not be provided. In particular, since the dust is rarely attached to the location of the film 18 arranged in the opening 15, the cover film 18a may not be provided. The transfer layer 18b is not limited to the photosensitive resin layer, but may be a colored layer according to a pattern to be transferred.

The heater block 20 is provided to be movable up and down. When the transfer layer 18b of the film 18 is attached, the heater block 20 moves downward to press the film 18 onto the substrate 6. The structure of the board | substrate 6 and the film 18 at this time is shown in FIG. 18 is a cross-sectional view showing the structure of the substrate 6 in the defect correction portion. Here, the cover film 18a, the oxygen barrier layer 18c, the base layer 18e, and the antistatic layer 18f of the film 18 are omitted. Pressing the film 18 by the heater block 20 results in a configuration shown in Fig. 18A.

By pressing and attaching the heater block 20, the film 5 having the opening 15 is inserted into the film 18 having the substrate 6 and the transfer layer. Therefore, the transfer layer 18b is pressed against the defect position of the board | substrate 6 through the opening part 15 of the film 5. Since the openings are provided at the same size and at the same position as the position where the foreign material is removed by laser ablation, they coincide with the positions requiring correction. The transfer layer 18b adheres to the substrate 6 at the opening by transferring the transfer layer 18b through the film 5. On the other hand, in regions other than the opening, the transfer layer 18b is attached to the surface of the film 5.

Thus, by transferring the transfer layer 18b used as a colored layer through the opening part of the film 5, attachment of the transfer layer 18b to the area | regions other than a defect location can be prevented. Thereby, the transfer layer 18b can be transferred only to a defect location with a simple structure, and it becomes possible to correct a defect correctly. In addition, since the transfer layer 18b does not adhere to the extra part, it is not necessary to remove the extra transfer layer 18b in a later step, and the productivity can be improved.

In this embodiment, the transfer layer 18b is pushed down through the thermoplastic resin layer 18d. The thermoplastic resin layer 18d has elasticity, and functions as a cushion layer when the film 18 is pressed against the substrate 6. As a result, the step on the substrate caused by the colored layer 62, the BM 64, and the film 5 is absorbed, so that the thermoplastic resin layer 18b can be accurately transferred. Since the thermoplastic resin layer 18 has a thickness of 20 µm, for example, even if the colored layer has a thickness of 2 µm, BM of 2 µm, and the film 5 of 8 µm, the thermoplastic resin layer 18 absorbs the step difference caused by these and accurately transfers it. You can do it.

After raising the heater block 20 and separating it from the board | substrate 6, when the film 18 is moved and the film 18 is peeled from the board | substrate 6, it becomes a structure shown in FIG. 18 (b). In this way, the defect can be corrected by the dry process. At this time, when the oxygen barrier layer 18c or the thermoplastic resin layer 18d adheres to the substrate 6 side, a shower spray treatment is performed with the weak alkaline solution to perform the oxygen barrier layer 18c or the thermoplastic resin layer 18d. ). Alternatively, the oxygen barrier layer 18c and the thermoplastic resin layer 18d are removed by a polishing tape or a cloth tape. As a result, as shown in Fig. 18B, the transfer layer 18b serving as the colored layer is transferred to the position of the white defect, so that defect correction can be performed.

By using the film 18 in this manner, characteristics such as thickness, color, transmittance, etc. of the layer transferred as the colored layer can be easily controlled. That is, by forming the transfer layer 18b of the film 18 to a desired characteristic, it can fix so that a modified colored layer may be in substantially the same state as a normal colored layer. As a result, accurate defect correction can be performed. In addition, the adhesion of the transfer layer can be improved by transferring using the film 18.

In the above thermal transfer step, the substrate 6 may be preheated in order to increase the transfer speed. For example, it is possible to preheat by placing the board | substrate 6 on a thermostat, and can also preheat by irradiating infrared rays on it. In the case of using infrared rays, the infrared light from the lamp light source 9 may pass through the filter 10, or a heating light source may be provided separately.

In addition, in this embodiment, in order to improve the adhesion of the transfer layer, it is possible to use a heater block having a convex portion according to the defect pattern. The structure of this heater block 20 is demonstrated using FIG. 19 is a cross-sectional view showing the configuration of a heater block. In the center of the heater block 20, a convex portion 20c is provided. By pressing down the heater block 20 in the direction of an arrow, the film 18 is pressed against a board | substrate, and a colored layer can be transferred.

The heater block 20 has a cylindrical shape of 5 mm in order to increase the heat capacity, and is heated to about 130 ° C during transfer. The convex part 20c is provided in the bottom surface of the heater block 20. As shown in FIG. The convex portion 20c is, for example, Φ500 μm and has a cylindrical shape having a height of 10 μm. In this embodiment, in order to form such a small convex portion, the central portion 20b and the outer circumferential portion 20a of the heater block 20 are formed of a material having a different thermal expansion coefficient.

For example, the center portion 20b is made of metal such as iron having a high thermal expansion coefficient, and the outer circumferential portion 20a is formed of a ceramic such as SiC having a small thermal expansion coefficient. At normal temperature, the central portion 20b and the outer peripheral portion 20a are formed to be flat. When the heater block 20 is heated to 130 ° C., the central portion 20b protrudes due to the difference in thermal expansion rate, so that the convex portion 20c is formed. Then, the size and thermal expansion coefficient of the central portion 20b are designed so that the convex portion has a desired shape, size, and height. Thereby, even if it is a minute convex part, a convex part can be formed in exactly desired size.

Since this convex part 20c is fitted corresponding to the defective part of a board | substrate, adhesiveness can be improved even if there exists a level | step difference. In addition, in order to make the height of a convex part constant, you may grind so that the bottom surface of the heater block 20 may become smooth at normal temperature. Of course, the size and height of the convex portion 20c may be used according to the pattern to correct the defect, the thickness of the film, and the like.

Example 7

In this embodiment, in the defect correction method shown in Example 6, a procedure for improving the adhesion of the transfer layer is added. Since the configuration described in the above embodiment is the same configuration, the description is omitted. In the above-described embodiment, the transfer layer was transferred through the rectangular opening 15 after removing foreign matters to be removed by laser ablation. In this case, air between the transfer layer and the substrate 6 remains and there is a fear that the adhesion decreases. A procedure for removing this air will be described with reference to FIG. 20. 20 is a top view illustrating the configuration of the periphery of the opening of the film 5.

In this embodiment, after removing the foreign matter on the substrate by laser ablation, the air removal unit 21 is formed in the film 5. The air removal unit 21 is formed around the opening 15 formed by laser ablation. After the removal of the foreign matter, the laser beam is irradiated around each corner of the opening portion 15 by adjusting the inclination of the half mirror 3. At this time, by irradiating with the power lower than the power of the laser beam at the time of foreign material removal, a part of film 5 is removed and film 5 becomes thin. That is, the air removal part 21 shown with the oblique line in FIG. 20 becomes thinner than the other part of the film 5. The four corners of the opening 15 are similarly irradiated with the laser beam to form the configuration shown in FIG. 20.

Here, the size of the air removal part 21 is made smaller than the opening part 15. As shown in FIG. For example, the size of the opening can be set to a square of 100 mu m on one side, and the size of the air removing unit 21 can be set to a square of 20 mu m on one side. And it forms so that a part of opening part 15 and air rejection 21 may overlap. Since the laser light is irradiated with low power, the pattern on the substrate is not removed even at the portion overlapping with the opening 15. Therefore, the air removal unit 21 can be formed without affecting the optical characteristics of the color filter. By forming such an air removal part 21, the part in which the thickness of the film became thin is formed in the periphery of the rectangular opening part 15. As shown in FIG. Since the opening part 15 has the film 5 removed, the film thickens step by step at the opening part by forming the air removal part 21.

The structure of the film 5 and board | substrate 6 which provided this air removal part 21 is shown in FIG. FIG. 21: is sectional drawing which shows the structure of the film 5 and the board | substrate 6, The state which pressed the film 18 to the board | substrate 6 by the heater block 20 is shown. After the air removing unit 21 is formed, the heater block 20 is moved above the opening 15 to press the heater block 20 downward. Usually, when the film 18 is pressed, the film 18 comes into contact with the substrate 6 at the center of the opening 15. Therefore, air existing between the substrate 6 and the transfer layer 18b gradually escapes outward from the center of the opening 15. Since the air removal part 21 is formed in the periphery of an opening part, as shown in FIG. 21, the film 5 has two steps. If the air removal portion 21 is not formed, the edge of the opening and the transfer layer 18b contact each other, and there is no place for air to escape, and there is a possibility that air remains, but the air removal portion 21 is provided. Air between the opening part 15 and the transfer layer 18b escapes from this two-step part. Thereby, adhesiveness can be improved.

In FIG. 20, although the air removal part 21 is formed in four corners of the opening part 15, you may form the air removal part 21 in the whole outer periphery of the rectangular opening part 15 as shown in FIG. That is, it is also possible to form a rectangular air removing portion 21 larger than the opening 15. Alternatively, as shown in FIG. 23, a rectangular air removing unit 21 extending from each side of the square 15 may be formed. Thereby, the air removal part 21 connected to one side of four corners of the opening part 15 is formed. Of course, the configuration of the air removing unit 15 is not limited to the illustrated configuration. The shape of the air removal part 21 can be arbitrarily formed by changing the slit width etc. of the beam forming mechanism 2. As shown in FIG. When the opening 15 and the air removal part 21 are formed by changing the slit width of the beam shaping | molding mechanism 2, it is preferable to make the opening part 15 and the air removal part 21 into rectangular shape. Of course, the structure of the opening part 15 and the air removal part 21 is not limited to a rectangular shape.

The air removal unit 21 can be any thickness by controlling the power of the laser light source 1. Furthermore, not only a part of the film 5 may be removed to make it thin, but the film 5 may be removed completely. In this case, since the film 5 penetrates, it is preferable to narrow the width of the air removal unit 21 so that the transfer layer is not transferred through the air removal unit 21. The air removal unit 21 described above is not limited to the defect correction apparatus using the heater block, and can also be used for the defect inspection apparatus using the dispenser shown in Example 5, for example. That is, after forming the opening part 15 by laser ablation, the air removal part 21 is formed, and the colored resin solution may be dripped from the above by the dispenser. Since the resin solution comes into contact with the substrate at the center of the opening, the air existing between the resin solution and the substrate can thereby reduce the air remaining between the resin solution and the substrate. Therefore, the adhesiveness of a correction point can be improved. In addition, since the air removal part shown in this embodiment can remove even gas other than air, the air removal part 21 shall also include removing gas other than air.

Example 8

A defect correction apparatus according to the present embodiment will be described with reference to FIG. In the configuration described in the above embodiment, the description is omitted because it is the same configuration. In the present Example, the film 18 provided with the colored layer for transferring on the film 5 like the Example 6 is overlapped. And the laser beam from the laser light source 1 is irradiated on the film 18, and the colored layer is transferred.

As in Example 6, openings are formed in the film 5 by laser ablation to remove defects. And the film reel 19 is moved and the film 18 is arrange | positioned on an opening part. This results in a configuration as shown in FIG. Since the heater block is not used in this embodiment, it is not necessary to move the objective lens 4 and the air blowing means 13. However, when the film 18 is arrange | positioned on the film 5 which has an opening part, it is preferable to fix the film 5, when air blowing is interrupted and the position of an opening part shifts. In order to fix the film 5, the same means as in the above-described embodiment can be used.

When the film 18 is arrange | positioned on the film 5, it becomes a structure shown to FIG. 25 (a). The film 18 used in the present embodiment includes a base film 22, and an expansion layer 23, a separation layer 24, and a transfer layer 25 are provided in this order. And the film 18 is arrange | positioned so that the defect part of the board | substrate 6 and the transfer layer 25 may face through the opening part of the film 5.

The base film 22 of the film 18 is formed of the material which transmits the laser beam, such as polyethylene, for example. The expansion layer 23 is an absorption layer which absorbs laser light, and is preferably formed of a material having a low boiling point. When the defect is corrected, the pulse width is irradiated with a laser beam having a order of µsec, and when the expansion layer 23 is momentarily heated, it vaporizes and expands. Since the base film 22 is provided on the expansion layer 23, there is no place where gas escapes on the base film side, and the vaporized expansion layer 23 flows out to the substrate side. As a result, the separation layer 24 and the transfer layer 25 are separated from the base film 22 and adhered to the substrate 6. And when the irradiation of a laser is stopped, the expansion layer 23 cools and returns to solid, and it is a structure shown to FIG. 25 (b). By transferring through the opening of the film 5, the transfer layer 25 adheres on the film 5 at the portions other than the defective portion, so that the transfer layer 25 and the like adhere only to the defective portion in the substrate. Therefore, a defect can be corrected correctly, without affecting only a defect part.

The separation layer 24 is provided between the transfer layer 25 and the expansion layer 23 so as to separate the transfer layer 25 and the expansion layer 23, and is, for example, in a solution such as an acid or an alkali. It is formed of a dissolving material. By dropping the solution onto the substrate 6 and dissolving the separation layer 24 adhered to the substrate, the separation layer 24 adhering on the transfer layer 25 on the substrate side can be removed, and the transfer layer ( It is possible to separate the expanded layer 23 from 25. By separating the transfer layer 25 and the expansion layer 23 using the separation layer 24, the expansion layer 23 is removed from the substrate, and only the transfer layer 25 remains on the substrate 6. Therefore, only the transfer layer 25 necessary for defect correction can be accurately transferred. As a result, the configuration shown in FIG. 25C is obtained. Since the transfer layer 25 has characteristics such as color, transmittance, and film thickness of the defect to be corrected, the defect can be corrected accurately. Of course, the method of separating the transfer layer 25 and the expanded layer 23 is not limited to this.

Although the transfer layer 25 was transferred using the laser light source 1 in the above-described embodiment, a light source different from the laser light source 1 is further provided, and the transfer layer is transferred by irradiating light from the light source. good. In addition, in order to improve adhesiveness, the substrate 6 may be preheated by irradiating infrared rays from the lamp light source 9, for example. It goes without saying that some of the above-described embodiments can be used in combination.

The present invention can provide a defect correction method, a defect correction apparatus and a pattern substrate manufacturing method capable of stably correcting a defect with a simple configuration.

Claims (38)

A defect correction apparatus for removing defects on a patterned substrate, A pulsed laser light source for emitting a pulsed laser, A film provided opposite to the substrate, And a portion of the film and the defect are substantially removed by laser ablation by irradiating the film with pulsed laser light from the pulsed laser light source. The method of claim 1, wherein the removal of a portion of the film by laser ablation is performed by thinning the film by irradiating the pulsed laser light, and then irradiating the thinned portion with the pulsed laser light again. And correcting the defects at about the same time. The film changing means according to claim 1 or 2, further comprising film changing means for changing the film into a film having a transfer layer transferred to the substrate. And a laser beam is irradiated onto the film having the transfer layer to transfer the transfer layer to the substrate. 4. The defect repair apparatus according to claim 3, wherein said transfer layer is transferred to a portion from which said defect has been removed. The nozzle according to claim 1 or 2, further comprising a nozzle for attaching the correction liquid according to the pattern to be corrected to the substrate, to the substrate, A defect correction apparatus for fixing the defect by attaching the correction liquid to the substrate from the portion from which the film is removed. The film according to claim 1 or 2, further comprising a film having a transfer layer movable at a position where the film is removed, And a defect correction apparatus for transferring the transfer layer to the substrate from the portion where the film is removed to correct the defect. A defect correction apparatus for correcting a defect by transferring a pattern to a defective portion of the patterned substrate, A film having a transfer layer transferred to the substrate on a surface facing the substrate, the film proximate to the substrate; A pulsed laser light source for emitting pulsed laser light irradiated onto the film having the transfer layer, The film having the transfer layer is irradiated with pulsed laser light from the pulsed laser light source to peel the transfer layer from the film, and the peeled transfer layer flies through the space between the film and the substrate, thereby causing defects in the substrate. And a transfer layer transferred to a defective portion of the substrate by landing on the substrate. The method of claim 7, wherein the substrate is a light shielding film, A photomask substrate having a resist pattern formed on the light shielding film, A defect correction apparatus for correcting defects in said resist pattern. A defect correction apparatus for correcting defects in a patterned substrate, A film provided opposite the substrate, A pulsed laser light source that is irradiated to the film and emits a pulsed laser to form an opening in the film; A nozzle which is movable to the position of the said opening part, Comprising: The nozzle which adheres the correction liquid according to the pattern which correct | amends to the board | substrate, The defect correction apparatus which fixes a defect by attaching the said correction liquid to a board | substrate from the said opening part. A defect correction apparatus for correcting defects in a patterned substrate, A film provided opposite the substrate, A pulsed laser light source that is irradiated to the film and emits a pulsed laser to form an opening in the film; A film having a transfer layer movable to a position corresponding to the opening, And a defect correction apparatus for transferring the transfer layer to the substrate through the opening to correct a defect. The method of claim 10, further comprising a heater block movable to a position corresponding to the opening, And fixing the transfer layer by pressing the film having the transfer layer onto the substrate by the heater block. The method of claim 11, wherein the heater block further comprises a convex portion corresponding to the opening, The defect correction apparatus which presses the film which has the said transfer layer, and the said board | substrate by the said convex part. The defect repair apparatus according to any one of claims 9 to 12, further comprising fixing means for fixing the film on which the opening is formed. The defect correction method according to claim 7 or 10, wherein the film having the transfer layer further comprises an absorbing layer for absorbing the pulsed laser light, wherein the absorbing layer is irradiated with pulsed laser light to transfer the transfer layer to the substrate. Device. 15. The defect repair apparatus according to claim 14, further comprising a separation layer between the absorber layer and the transfer layer that separates the absorber layer from the transfer layer after transferring the transfer layer to the substrate. 10. The defect repair apparatus according to claim 9, wherein after the correction liquid is attached to the substrate, the correction liquid attached to the periphery of the opening is removed by irradiating the pulsed laser light. The jetting device according to any one of claims 1, 7, 9, or 10, further comprising a blowing means for blowing a gas to the film or the film having the transfer layer, And the film or the film having the transfer layer is brought close to the substrate by the ejecting means. 11. The beam forming apparatus according to any one of claims 1, 7, 9, or 10, further comprising a beam shaping mechanism for shaping the pulsed laser light from the pulsed laser light source. The defect correction apparatus which irradiates the film or the film which has the said transfer layer with the pulsed laser light shape | molded by the said beam shaping mechanism. The observation light source according to any one of claims 1, 7, 9, and 10, wherein the observation light source irradiates the substrate on the same axis as the pulsed laser light from the pulsed laser light source; And a detecting means for detecting light from the observation light source irradiated to the substrate. 20. The film according to claim 19, wherein the film having the transfer layer further has a transparent layer that transmits light of the observation light source, And a film reel for sending a film having the transfer layer so that the position at which the light is irradiated is changed from the transparent layer to the transfer layer. 20. The apparatus of claim 19, further comprising a wavelength tunable filter for selecting a wavelength of light from the observation light source, And a defect correction apparatus for heating the substrate or the transfer layer by the light emitted from the wavelength variable filter. A defect correction method for removing defects on a patterned substrate, Detecting a defect on the substrate; And a step of irradiating pulsed laser light on a film provided opposite said substrate to remove a portion of said film and a defect at about the same time by laser ablation. The method of claim 22, further comprising the step of thinning the film by irradiating the pulsed laser light, And a portion of the film and the defect are removed at the same time by laser ablation by irradiating pulsed laser light to the thinned portion of the film. The method of claim 22 or 23, further comprising: changing the film into a film having a transfer layer transferred to the substrate; And irradiating pulsed laser light to the film having the transfer layer to transfer the transfer layer to the substrate. The method according to claim 22 or 23, wherein the step of attaching the correction liquid in accordance with the pattern to be corrected to the substrate from a portion from which the film is removed; And fixing the film from the substrate. A defect correction method of correcting a defect by transferring a pattern to a defective portion of a patterned substrate, Detecting a defect on the substrate; A step of bringing a film having a transfer layer transferred to the substrate close to a surface facing the substrate,  The film is irradiated with pulsed laser light to peel the transfer layer from the film, and the peeled transfer layer flies through the space between the film and the substrate and lands on the defective portion of the substrate, thereby transferring the transfer layer to the substrate. And a step of transferring to the defective portion of the defect. As a defect correction method for correcting defects in a patterned substrate, Detecting a defect on the substrate; Opposing the film to the substrate; Irradiating pulsed laser light to the film to form an opening; Attaching a correction liquid according to a pattern to be corrected to a defective portion of the substrate through the opening; And removing the film from the substrate. As a defect correction method for correcting defects in a patterned substrate, Detecting a defect on the substrate; Opposing the film to the substrate; Irradiating pulsed laser light to the film to form an opening; Providing a film having a transfer layer at a position of the opening; And transferring the transfer layer to the substrate through the opening. 29. The method of claim 28, further comprising: removing the film around the opening to form an air removal section for removing air between the substrate and the film having the transfer layer, And a film having the transfer layer at the opening and the air removal portion. 29. The defect correction method according to any one of claims 22, 26, 27, or 28, wherein gas is blown onto the film or a film having the transfer layer and brought close to the substrate. . Forming a pattern on the substrate; Detecting a defect on the substrate; And a step of irradiating pulsed laser light on a film provided opposite said substrate to remove a portion of said film and said defect substantially simultaneously with a laser ablation. 32. The method of claim 31, further comprising: changing the film to a film having a transfer layer transferred to the substrate; And transferring the transfer layer onto the substrate by irradiating pulsed laser light onto the film having the transfer layer. 32. The method according to claim 31, further comprising the step of attaching a correction liquid in accordance with the pattern to be corrected to the substrate from a portion from which the film is removed; And a step of removing the film from the substrate. A pattern substrate manufacturing method for forming a pattern by transferring a pattern to a defective portion of a patterned substrate, Forming a pattern on the substrate; Detecting a defect on the substrate on which the pattern is formed; A step of bringing a film having a transfer layer transferred to the substrate close to a surface facing the substrate, The film is irradiated with pulsed laser light to peel the transfer layer from the film, and the peeled transfer layer flies through the space between the film and the substrate and lands on the defective portion of the substrate, thereby transferring the transfer layer to the substrate. A pattern substrate manufacturing method comprising the steps of transferring to a defective portion of the substrate. A patterned substrate manufacturing method for manufacturing a patterned substrate, Forming a pattern on the substrate; Detecting a defect on the substrate; Opposing the film to the substrate; Irradiating pulsed laser light to the film to form an opening; Attaching a correction liquid according to a pattern to be corrected to a defective portion of the substrate through the opening; And a step of removing the film from the substrate. A patterned substrate manufacturing method for manufacturing a patterned substrate, Forming a pattern on the substrate; Detecting a defect on the substrate; Opposing the film to the substrate; Irradiating pulsed laser light to the film to form an opening; Providing a film having a transfer layer at a position of the opening; Transferring the transfer layer to the substrate through the opening; And a step of removing the film from the substrate. The method of claim 36, further comprising the step of removing the film around the opening to form an air removal unit, A pattern substrate manufacturing method for providing a film having a transfer layer in the opening and the position of the air removing portion. 37. The method of manufacturing a patterned substrate according to any one of claims 31, 34, 35 or 36, wherein a gas is blown onto the film or a film having the transfer layer and brought close to the substrate. .

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