TWI262306B - Pattern substrate defect correction method and apparatus and pattern substrate manufacturing method - Google Patents

Abstract

Pattern substrate defect correction method and apparatus capable of stably correcting defects and a pattern substrate manufacturing method are provided. The pattern defect correction apparatus of this invention is one for correcting defects on a patterned substrate, comprising a stage (7) for loading a substrate (6), a short pulse laser light source (1), a beam forming mechanism (2) for forming the short pulse laser light from the short pulse laser light source (1), and an air jet means (13) for making a film (5) to approach the substrate (6). The film (5) and the defect are removed at the same time by irradiating the film (5) with the laser light. A film reel (8) is then moved to make a film 5 having a colored layer (51) to approach the substrate (6) so as to transfer a pattern to the substrate.

Description

1262306 IX. Description of the Invention: [Technical Field] The present invention relates to a defect correction method for a pattern substrate, a defect correction device, and a pattern substrate manufacturing method. [Prior Art] In the manufacturing process of the color filter for liquid crystal display, the defects in the color filter and the light-film substrate are corrected in order to change the cover ratio. This defect correction method has a method of applying a resist to the front end of the needle and dropping it on the defective portion. However, in this method, the amount of dripping changes due to the viscosity of the photoresist, so that it is difficult to control the amount of dripping and the correction accuracy, and it is difficult to perform the correction stably. Moreover, it is necessary to carry out the drying step and the correction for a long time, resulting in low productivity. Further, other defect correction methods include a film transfer method. In this method, a film having a colored layer is adhered to a white color defect portion of a color filter or a light-substrate substrate which does not have a colored layer, and a colored layer is transferred from the film to correct a defect as described in Patent Document 1). The problem of the method will be explained in Fig. 14. Fig. 14 is an enlarged cross-sectional view showing the configuration of a color filter substrate. Fig. 14 is a view showing the configuration of a portion of the color filter substrate. The substrate 6 for a color filter is usually provided with a black matrix 71 (hereinafter referred to as BM) in a matrix form. And there is a red, green, and supervised color layer 70 between the two. One portion of the colored layer 70 is superposed on the BM 71, thereby forming a structure having irregularities. For example, in the color filter of the resin black matrix structure, the BM and the coloring layer are each about 1/m, and thus the surface convexity is about 1 #m. Therefore, the film partially adheres to the convex portion of the colored layer 7〇, and the thickness of 315540 5 1262306 is not properly adhered to the defective portion located in the concave portion. The method makes the film completely p pay mo 6 # 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有 有Further, in the conventional printing method, since the phase is transferred to the substrate, a multilayer structure having a material different from the layer on the substrate side is formed. In this way, the formation of a halogen element from the same material as the color on the substrate side has an effect on the display quality. In the case of the conventional defect correction method, it is difficult to stably correct the pattern base. The defect correction crack of the present invention is a defect correction device for removing defects on a patterned substrate, and is provided with: a pulsed laser source that emits a pulsed laser (for example, a short pulse laser in the embodiment of the present invention) a light source 1); and a film disposed opposite to the base plate (for example, a film/in the embodiment of the present invention)" is removed by laser irradiation by irradiating pulsed laser light from the pulsed laser light source to the film The (laser abrasi〇n) method roughly removes a part of the film and the defect at the same time. Therefore, the defect on the pattern substrate can be removed with a simple configuration. In the upper defect correction device, by irradiating the pulsed laser light source, the above The thin film is thinned, and a part of the thin film and the defect are removed by the laser removal method. In the widging, the film is changed to have a transfer layer that can be transferred to the substrate (for example, The film changing mechanism of the film of the coloring layer 51) in the embodiment of the invention (for example, the film 315540 6 1262306 reel rotating mechanism 14 in the embodiment of the present invention), and the above pulse The laser light is irradiated onto the substrate having the upper layer and the transfer layer, and the transfer layer is transferred onto the substrate. Therefore, the white defect and the black defect can be stably corrected with a simple configuration. The transfer layer is transferred to a portion where the defect is removed. Therefore, the defect correction can be quickly performed. The defect correction device of the present invention further includes a correction for the pattern to be corrected on the substrate. The liquid adheres to the shell of the substrate, and the correction liquid adheres to the substrate from the portion from which the film has been removed, and is corrected. Therefore, the pattern can be accurately corrected. The defect correction device of the present invention is in the defect correction device described above. Further, a film having a transfer layer movable to a position where the film is removed is further provided, and the transfer layer is transferred from the portion from which the film has been removed to the substrate to perform defect correction. The device is a defect correction device that corrects a defect by transferring a pattern onto a defective portion of the patterned substrate, and is provided with: a surface of the substrate facing the transfer layer that is transferable to the substrate, and a film of the substrate; and a pulsed laser source that emits pulsed laser light that is irradiated onto the film corresponding to the defect portion, and will be from the above The pulsed laser light of the pulsed laser light source is irradiated onto the film having the transfer layer, and the transfer layer is transferred to the defective portion of the substrate. Thereby, the pattern can be correctly formed on the defective portion for stabilization. In a preferred embodiment of the defect correction device, the substrate is a mask substrate having a light-shielding film and a photoresist pattern formed on the light-shielding film, and the defect of the photoresist pattern is corrected. Correction of the pattern of the mask substrate 315540 7 1262306. The defect correction device of the present invention is a defect correction device that corrects the defect of the patterned substrate by 2, and includes a film disposed opposite to the substrate, and emits light. The film is a pulsed laser light source in which a pulsed laser beam is provided in the opening portion of the film; and a position movable to the opening portion The correction liquid of the pattern to be corrected on the substrate adheres to the shell purple, and the correction liquid adheres to the substrate from the portion from which the film has been removed, and the correction is performed. Thereby, the pattern can be attached with high precision, and the defect correction can be performed correctly. In the defect correction device of the present invention, the defect correction device that corrects the defect of the patterned substrate is provided with a film that is disposed opposite to the substrate, and emits a pulse that is irradiated onto the film to provide an opening in the film. a pulsed laser light source of laser light; and a film (for example, a film 18 in the embodiment of the present invention) having a transfer layer movable to a position corresponding to the opening, and transferring the transfer layer through the opening The defect is corrected by printing on the above substrate. Thereby, the defect can be correctly corrected with a simple configuration. A preferred example of the defect correction device further includes a heating block movable to a position corresponding to the opening (for example, the thermal block 20 in the embodiment of the present invention), and the heating block has the above-mentioned rotation The film of the printing layer is pressed against the substrate to transfer the transfer layer. Thereby, the transfer layer can be transferred with good adhesion with a simple configuration. In the above defect correction apparatus, the heating block may further include a convex portion corresponding to the upper opening, and the film having the transfer layer and the substrate may be pressed by the convex portion. Therefore, the adhesion can be improved. 315540 8 1262306 In the above defect correction device, a fixing mechanism for fixing a film provided with the opening may be provided. Thereby, the offset of the opening portion can be prevented. In the above defect correction device, the film having the transfer layer is preferably further provided with an absorption layer that absorbs the pulsed laser light (for example, the intumescent layer 23 in the embodiment of the present invention), and irradiates the pulsed laser light to the absorption layer. And transferring the above transfer layer to the above substrate. Thereby, the transfer layer can be efficiently transferred. In the above defect correction device, it is preferable that a separation layer for separating the rubbing layer from the transfer layer after the transfer layer is transferred onto the substrate is provided between the absorption layer and the transfer layer. Thereby, the absorbing layer can be prevented from adhering to the substrate, and the defect can be corrected correctly. The defect correction device of the present invention is directed to the defect correction device for illuminating the pulsed laser light to remove the correction liquid of the peripheral portion of the portion from which the film has been removed. Thereby, the pattern can be corrected correctly. Preferably, the defect correction device is further provided with a discharge mechanism for discharging a gas to the film or the film having the transfer layer, so that the upper (four) film or the transfer layer is provided by the discharge mechanism. Close to the above substrate. Thereby, the substrate and the film can be brought close to each other with high precision. Preferably, the soil is further provided with a beam shaping mechanism (for example, the beam shaping mechanism 2 in the embodiment of the present invention) for shaping pulsed laser light from the pulsed laser source, and the beam is to be borrowed. The pulsed laser light formed by the forming mechanism is irradiated onto the film or the film having the upper layer. Thereby, the defect can be corrected with high precision. Preferably, the defect correction device further includes: an observation light source for illuminating the substrate on the axis substantially the same as the pulsed laser light of the pulsed laser light source of the above-mentioned 315540 9 1262306; and for detecting the illumination A detecting mechanism for light emitted from the observation light source of the substrate. Thereby, light can be accurately incident on the defect detecting portion. The film having the above transfer layer further has a light-transmissive transparent layer of the above-mentioned observation light source (for example, the transparent layer 55 in the embodiment of the present invention), and may further comprise a film for feeding the transfer layer so that A film reel (for example, the film reel 8 in the embodiment of the present invention) that changes the position of the light from the transparent layer to the transfer layer. Thereby, the positional deviation at the time of the x-defect detection and the defect correction can be prevented with a simple configuration. "In the above defect correction device, a wavelength variable filter for selecting a wavelength of light from the light source for observation may be further provided to heat the light by the light emitted from the wavelength filter n In this way, the adhesion between the substrate and the transfer layer can be achieved. 缺陷 The defect of the present invention is 4 你 你 玄 玄 玄 玄 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 图案 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷Upper: set: i: sudden:: and irradiating the pulsed laser light with the above-mentioned substrate and the above-mentioned missing mode, while removing the above-mentioned film, the white punching method is also more capable of illuminating the above-mentioned friends: : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : a step of transferring a film of the transfer layer of the substrate; and a step of irradiating the film having the transfer layer with pulsed laser light to transfer the transfer layer to the substrate. Thereby, any pattern can be corrected. Defect modification of the present invention The method further includes: a correction liquid according to the above defect: a step of removing the correction liquid of the pattern to be corrected, a step of attaching the portion from which the film has been removed to the substrate; and a step of removing the film from the substrate. Correcting an arbitrary pattern. The defect correction method of the present invention is a defect correction method for correcting a defect by transferring a pattern onto a defective portion of a patterned substrate, and having a step of detecting a defect on the substrate; a step of facing the substrate facing the film transferred to the transfer layer of the substrate; and a step of transferring the pulsed laser beam onto the film to transfer the transfer layer to the defective portion of the substrate. Therefore, the defect correction method can be stably performed. The defect correction method of the present invention is a defect correction method for correcting a defect of a patterned substrate, comprising: a step of detecting a defect on the substrate; and bringing the film close to the substrate a step of irradiating the pulsed laser light on the C 4 film and d placing the opening portion; and modifying the pattern to be corrected by the opening portion a step of adhering the liquid to the defective portion of the substrate; and removing the film from the substrate. Thereby, the pattern can be correctly attached to the defective portion. The defect correction method of the present invention is a defect of the patterned substrate. The defect correction method according to the correction method includes a step of detecting a defect on the substrate, a step of causing the film to face the substrate, and a step of providing pulsed laser light to the film 4 to provide an opening; a position of the portion 315540 11 1262306. The step of providing the film of the transfer layer; and the step of transferring the transfer layer to the substrate through the opening. Thereby, the transfer layer can be prevented from being transferred outside the opening In the above defect correction method, the defect correction method further includes: removing the thin film around the opening portion, and providing the substrate to remove the substrate and having the above-mentioned turn ρ; a step of removing the air removing portion of the air between the films, and preferably providing a thin portion of the transfer layer at a position of the opening Γ and the air removing portion . Thereby, the adhesion of the transfer layer can be improved. In a preferred embodiment of the above defect correction method, gas is ejected to the upper (four) film or the film of the transfer layer to be brought close to the substrate. By this, a correct pattern can be formed. The method for manufacturing a pattern substrate according to the present invention includes the steps of: forming a pattern on the substrate, detecting a defect on the substrate on which the pattern is formed; and irradiating the pulsed laser light on the film close to the substrate, and using a laser removal method The step of simultaneously removing one of the above films and the above defects is roughly performed. Thereby, a defect-free substrate can be manufactured. In the method of manufacturing a pattern substrate, the film may be changed to a film having a transfer layer transferable to the substrate, and a pulsed laser light may be applied to the film having the transfer layer. The step of transferring the transfer layer to the above substrate. Thereby, the patterned substrate can be manufactured correctly. The method for producing a pattern substrate according to the present invention includes: a step of removing a portion of the correction liquid in a pattern to be corrected according to the method of manufacturing the substrate, and removing the thin layer 315540 1262306 from the substrate; and removing the water from the substrate The steps of the boat. Thereby, an arbitrary pattern can be formed in the defective portion. The method for manufacturing a pattern substrate according to the present invention is a method for producing a pattern substrate in which a pattern is transferred onto a defective portion of a patterned substrate, and has a step of detecting a defect on a substrate on which a pattern is formed; Two: a film having a transfer layer transferable to the substrate on the opposite side is close to: and a step of irradiating the upper layer to the defective portion of the substrate by irradiating the pulsed laser light onto the film. Thereby, the printed pattern can be stabilized. The method for manufacturing a pattern substrate according to the present invention is a method for producing a patterned substrate, comprising: a step of forming a pattern on the substrate; a step of detecting a defect on the substrate; and causing the film to face the substrate; a step of irradiating the film with the opening and providing an opening; a step of providing a film having a transfer layer at a position of the opening; a step of transferring the transfer layer to the substrate through the opening; and The step of removing the above film from the substrate. The pattern substrate manufacturing method of the present invention is a method for manufacturing a patterned substrate, comprising: a step of forming a pattern on the substrate; a step of detecting a defect on the substrate; and a step of bringing the film close to the substrate a step of irradiating the laser light onto the film to provide an opening portion, a step of adhering the correction liquid of the pattern to be corrected through the opening to the defective portion of the substrate, and removing the film from the substrate step. Thereby, a pattern of positive cancer can be formed on the substrate. In the above method for manufacturing a pattern substrate, the method further comprises the steps of: removing the opening 315540 13 1262306 敎 the periphery H (4), and providing an air removing portion for removing the air between the substrate and the film having the transfer layer, and preferably A ruthenium film having the transfer layer is provided at a position of the opening portion and the air removal portion. Thereby, the adhesion of the transfer layer can be improved. In a preferred embodiment of the above-described method of fabricating a wood, a gas is ejected to the film or a film having the upper (four) printing layer to be adjacent to the substrate. The present invention provides a defect correction method and a defect correction I and a pattern substrate manufacturing method in which a defect is easily corrected in a simple configuration. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following description is a preferred embodiment of the invention. The scope of the invention is not limited to the following examples. In the following description, the same symbol is used to indicate substantially the same content. 1 - A defect correction device for a pattern substrate of this embodiment will be described with reference to Fig. 1. Fig. 1 is a configuration diagram of a defect correction device.丨 is a short pulse #射光源, 2 is a beam shaping mechanism, 3 is a half mirror, 4 is a counter lens, 5 is a film, 6 is a substrate '7 is a table' 8 is a film reel' 9 is a light source,! 〇 is a filter, 11 is a half mirror, 12 is a CCD camera, 13 is an air ejection mechanism, and 14 is a film reel rotating mechanism. In the present embodiment, the target substrate 6 to be corrected for defects is a color filter substrate used in a liquid crystal panel of a liquid crystal display device. The color filter substrate 6 is usually provided with a colored layer and a black matrix on a transparent glass substrate. The substrate 6 is horizontally placed on the stage 7 to determine whether or not there is a defect in the mouth of the color filter substrate 315540 14 1262306. The laser tail is illuminated to correct the gold of the defective portion. The stage 7 is a χ γ stage including a χ γ driving mechanism (not shown), and the substrate 6 can be moved to an arbitrary position. The defect correction device of the present embodiment includes a defect detecting mechanism for detecting a defect of the substrate 6, and a defect correcting mechanism for correcting the detected defect. Specifically, after the defect detecting means grasps the missing position, the laser beam is irradiated onto the defective portion of the substrate 6 by the defect correcting means to correct the defect. In other words, the defect detecting means shown in the figure and the optical system of the lacking of the positive branch are an example, and other optical members such as a filter, a lens, and a mirror may be provided. First, the defect detection mechanism will be explained. The light source for observation uses the light source 9 for detection. The light source 9 emits a surface light for illuminating the surface of the substrate 6. The light for observation emitted from the lamp light source 9 is incident on the second mirror 11 through the chopper 10. The filter 1G is a wavelength-variable filter that blocks only the light of the pre-wavelength. Here, the filter 1〇 can also match the transmittance of the film 5 to be long, so that the detected light becomes white light. Injecting semi-reflectives 糸 Reflecting in the direction of the substrate 6. This light is reflected by the half mirror 3 and is incident on the objective lens 4. Between the object reading lens 4 and the substrate 6, a film 5 made of polyacrylonitrile having a thickness of about 1 〇 (4) is placed on the substrate 6 1 . : ' The light condensed on the object lens 4 passes through the film 5 and enters the surface of the substrate 6 to illuminate one of the substrates. The film 5, the objective lens 4, and the light reflected by the plate 6 are transmitted through the thin camera lens 3 and the half mirror 11 (10): the 2° CCD camera 12 is privately measured based on the reflected light on the surface of the substrate 6. For example, the CCD camera is connected to a personal computer (pC), etc., and the 315540 15 1262306' is used to determine the defect of the substrate 6 based on the detected artifact. For example, the reference wafer can be detected and detected. Phase = t., mode. The detected image is different from the reference wafer in part 2 (4). The defect detection mechanism can distinguish the opaque inner phase and the transparent white defect. Furthermore, the PC system and the station 7 are χ, · The mechanism ^1, 'can detect the position of the defective material on the substrate 7 from the position of the defect detection when the defect is detected, and, of course, the defect detector is limited to the configuration shown in the figure, and can also be used. Has the defect of other structures "m structure. The defect detecting mechanism can adopt the same configuration as the conventional defect detecting mechanism. By moving the stage 7, the relative position of the substrate 6 and the light source 9 can be changed to perform the overall defect detection of the substrate 6. ^ The defect detected by the above defect detecting mechanism is corrected by the defect correcting mechanism. The defect correction mechanism will be described below. Short-pulse laser source ^ is a Q-switched YAG laser that emits short pulse light below 1〇nsec. The short-pulse laser light emitted from the neo-pulse laser light source is incident on the beam shaping mechanism. The beam shaping mechanism 2 is provided with an aperture, a slit (sHt) or a lens, etc., and the short pulse light spot can be formed into an appropriate shape. The light point of the shape. For example, the spot of the short pulse light on the substrate can be formed into a rectangular shape substantially the same as the element of the color filter. Alternatively, it may be formed into a shape substantially the same as the shape of the defect. The half mirror 3 reflects the short pulse light toward the substrate 6. Here, each optical component is disposed in such a manner that the light from the short-pulse laser light source 1 and the light source 9 are formed in the same axis. The short pulse light reflected by the half mirror 3 is irradiated onto the film 5. The film 5 is wound around two thin 16 315540 1262306 secret shafts 8 connected to the film reel rotating mechanism 14. The reel rotation mechanism i4 is provided with a two-film reel 8 such as a motor. The razor (1) is rotated by the reel 8 and the film 5; =: out. The HI reel rotating mechanism 14 for bending the film 5 before the defect correction is performed, and the one of the film reels 8 is bent so as not to be in contact with the substrate 6. Air = machine = with gas tank, piping, ionizer (Caf (4) and 遽 = 透: Γ ionized air is ejected from the film 5. For example, under the %: material = the bottom side of the substrate side is opened The cylinder has a tapered cone on the substrate side. In order to allow gas to flow in the cylinder, the side surface is connected to the pipe. By circulating the gas, the internal pressure in the cylinder is increased to the film. When the defect is corrected, the gas is ejected so that the y is reversed from the side of the y, and the ruthenium film 5 is brought close to the substrate 6. By making the film 5 close to the M mesh, the substrate 6 and the film 5 are in the defective portion. There is a micro-gap gap to make the protrusion φ=film contact other than the defective portion of the substrate 6. The distance between the film 5 and the substrate 6 is adjusted by:: ejection of the mechanism 13 Alternatively, the film = rotation mechanism 14 may be used to adjust the bending, tension, and tension of the film 5. Further, it is also possible to adjust the interval of the mechanism that moves in the Z direction by the air jetting machine U. When the film 5 is close to the substrate 6, it is not necessary to make the film $ close to the substrate. Therefore, stable correction can be performed. The effect of the pattern on the substrate 6 can be reduced. The film 5 is as shown in Fig. 2, and can be modified according to the same method. The film of the defect correction device is a film 5a modified by black defects. The film reel 8a and the white defect correction film 讣, thin 315540 17 1262306 are not perfect. The thin film and the film 5b are used in accordance with the modified object. The film reel 8 is mounted on a reel such as a linear guide. =::, and it can be set to slide in the direction of the 。. Make the film reel h for a long time, look for the reel 8b to the X-party dream, and the white whistle, the sub-short pulse light is illuminated on the plate: : = : The film 5, that is, when the black defect is corrected, when the laser light spot 15 of the short pulse light from the short pulse laser light source 1 is corrected to correct the white defect, the film (4) is moved to the short pulse: The position of the laser spot 15 of the pulsed light. The light from the short light source 1 and the light source 9 is adjusted to be on the same optical axis, and the laser spot 15 in 5 is substantially the same as the light system for observation. When the reel reel f is moved and the film 5 is fed out, the film 疋' is applied to the enamel film 5 with appropriate tension. 'The gap is provided between the substrate 6 and the film b. Then, the film is pressed and sent out without the gas being blown out. Further, when the defect is corrected, the film 5 is bent, and the empty emulsion discharge mechanism 13 makes the gas The film 5 is ejected to approach the surface of the substrate. The structure of the film 5a and the substrate 6 will be described with reference to Fig. 3. Fig. 3 shows the enlarged view of the structure of the M4 (the structure of the M4 is shown in Fig. 3 (4) showing the short pulse of irradiation " /Special film and substrate composition. 61 is a red (R) color layer, 62 is a color (6) color layer '63 is a blue (9) color layer, is a black matrix (M), these are placed on the substrate 6 First, a method of manufacturing a color light-emitting sheet substrate will be described. A chromium film as a light-shielding film is formed on the substrate 6 for a color filter by a gray plating method. And use the exposure and development steps to pattern. Therefore, the chromium film becomes a matrix-shaped BM64. A photosensitive resin in which a simple color corresponding to the color of the coloring layer is dispersed is applied from 315540 18 1262306 BM64, and patterned by exposure and development steps. By repeating this step, a color layer 6 of G, a color layer 62 of B, and a color layer 63 of B are disposed between the legs 64 in this order. A protective film and a halogen electrode are formed on the colored layer. Here, as shown in Fig. 3 (4), a stain adheres to the color layer 61 of R. The halogen adhering to the foreign matter 65 is detected as a black defect that is not transparent by the defect detecting means. The film 5a is in great contact with the substrate 6. The halogen having the foreign matter 65 attached thereto is irradiated with short pulse light of lOnsec or less from the short-pulse laser light source 1. The short pulse condensed by the object lens 4 is first incident on the film which is close to the substrate 6 by the air ejecting mechanism. The short pulse light system uses a laser removal method to adjust the power to make the film portion

Opening. In the present embodiment, a polyimide film is used, so that one of the three-fold high-spectrum cuts of the YAG 1 pulsed laser light source 1 or the four-fold high-spectrum wave is easily absorbed by the short pulse light. The opening of the film h and the polyimide film are not absorbed in the visible light region and are slightly transparent, so that it is easy to observe that the defect can be detected by using the lamp light source 9. Further, the film 5a = defines a polyimine, and any material which is opened by chemical decomposition, thermal decomposition, sublimation or grinding, etc., can be used by irradiation of light. The field shot can be formed by the beam shaping mechanism 2

Since the shape is such that the shape of the opening of the film 5 can be formed into a shape similar to that of the defect shape or the R shape. By removing the T-ray, the portion of ^=65 and (4) can be roughly simultaneously. The cut foreign matter is detached from the substrate through the opening of the film 5a as shown in Fig. 3 (8). Further, since the periphery of the portion is covered by the film, the object is less likely to adhere to the periphery of the correction portion 315540] 9 l2623〇6 and becomes a new defect. In this way, the laser removal method can be used to remove the film and defects. Further, the removed foreign matter 65a may be one piece: there is also a case where a large number of fragments are formed and fall on the film. The power of the short-pulse laser light source and 1 can be gradually adjusted to open on the film 5a, and can also be adjusted to simultaneously remove the opening of the film and the removal of foreign matter. When the film 5a is gradually opened, as shown in Fig. 3(c), the film 5a is formed into a thin state, and then the short pulse light is irradiated at a portion where the film 5 is thinned to remove foreign matter. When the opening size is small, the opening portion can be provided while the film 5 is being fed. If the far-ultraviolet film is used, the film 5a will be chemically decomposed. Therefore, when the foreign matter is removed and the surface of the substrate is scraped, the far-ultraviolet rays can be removed to remove the debris of the film. Further, when the foreign matter 65 is transparent, even if the short-pulse light is irradiated to the foreign matter, the absorption of light cannot be performed, so that the laser is not removed. On the other hand, in the film 5, a film that absorbs light such as polyacrylonitrile is used, and when the short film is irradiated with a short pulse of laser light, the film is opened by a laser removal method while the film is opened. The gas or the sheet that jumps forward is pushed to the substrate in an instant, and the substrate is removed from the substrate by the subsequent debounce. The foreign matter 65 and the color layer 61 on the substrate are removed by the above treatment. The white light is missing, in order to correct the white defect 66, such as the younger brother 4, no, the film reel 8a moves in a direction similar to the film reel, and the sub-wave version 5 b moves to the Thunder powder 1 m (four) to the field shot point 15 The location. Then, the short pulse light is incident on (4) 5b to correct the white defect 66. The white defect is illustrated in Figure 5: the positive method. The first corpse shows an enlargement of the structure between the film 5 and the substrate 6. 'view. The colored layer 5 ι is applied to the surface of the enamel film 5b on the substrate side. Film 335540 20 1262306 It is known that a polyethylene film having a thickness of 1 G to 2 () is used as a substrate thin film and a photoresist having a thickness of about 1 Am is used as the dry film of the colored layer 51: first resistance. The film 5b is preferably made of a material that does not absorb short-pulse light, and is not limited to polyethylene, but may also be made of polypropylene or a PET film, and the thickness is not limited (the thickness of the layer 51 can also be used with the substrate side). The material of R is substantially the material of (4). #This can prevent the liquid crystal display. Of course, the material and thickness of the film 5b and the coloring layer 51 are not limited: the air ejection 2 that is ionized by the air ejection mechanism 13 is close to the substrate. 6. Therefore, _5b contacts the protruding portion of the substrate 6 and forms a minute space between the colored layer portion (defective portion) of the substrate and 'the beam forming mechanism is formed to be substantially in phase with the defective portion. The short pulse light of the shape is irradiated on the film 5b. The output of the short pulse light is adjustable: the color layer 剥离 is peeled off from the film by laser removal. The color layer 51 peeled off from the film is flying on the film 5b and the substrate. 6*!, and landing on the defective part. By this, the red color layer 51a: can be transferred to the defective portion. When a sufficient amount of the coloring layer 5U cannot be transferred by primary transfer, the film reel can also be used. 8 rotation 'send film 5b in the gamma direction At the same time, the short pulse light is irradiated. Further, by irradiating the short pulse light to the film 5b from the surface opposite to the surface on which the colored layer 51 is provided, the substrate 6 can be made close to the thin: 5b. Between the ruthenium film 5 and the substrate 6. Since the gap is a small distance, the number of collisions between the molecules in the atmosphere and the coloring layer 51a is small. Thereby, the process of defect correction can be performed by using the laser in the atmosphere to remove the vapor deposition. Furthermore, by the air The ejection mechanism 13 is close to 'therefore, the fine adjustment of the interval can be made 315540 21 1262306. Therefore, the defect correction can be stably performed without being affected by the surface state of the substrate. In the present embodiment, the lamp light source is adjusted in advance by this embodiment. The color layer 51 of the film 5 can heat the color layer 51 of the film 5. For example, the infrared ray can be used to illuminate the light from the light source 9 by the wavelength variable filter. The coloring layer 5 of the defective portion is heated, whereby the adhesion to the substrate when the substrate 6 is on the substrate 6 can be improved. χ, the light from the lamp source 9 is made into the film % and the coloring layer 51 has a low absorption rate. Wave with high wavelength and high absorption rate of the substrate The long light can be used for the substrate 6 to be twisted. This can improve the profitability of the substrate when it falls on the substrate 6. Thus, in the defect correction device of the present invention, the ccd camera can be adjusted for access. The output of the light source 9 and the wavelength of the light source are heated. 〇2: The defect correction of a part can be corrected by the movement of the film reel 8 without the optical system or J, so that the above can be observed under the object lens. Action: Use only one short pulse Rayleigh lack;:,: It can remove foreign matter and color, and can perform white defect and == Again, the correction action is light, and can be detected by CCD camera 12 θ film 5 a and film; b two = into 5 rows: the first and the fourth figure only show the film 2 with G and B: but in addition to R, the film can be further layered 5 and thin ^ The defect of the light-shielding portion for correcting the defect of BM is also the same as that of the color layer of G' B and the color layer of the belly. The correction of g and b can be achieved by using the photoresist of the pigment of the ancient color. For the legs, a film with a material such as chrome that can block visible light is used. By means of 315540 22 1262306, the defects of m, G, B and all of the defects can be corrected by simply modifying the entire area of the substrate. And the correction, so you can short the door, 隹一: _ can be all the defects into the text ^ between the correction, has a position because she uses the laser to remove the correction, so = habitually The substrate is in close contact. Due to the influence of 2, the defect correction is performed stably. The surface state is set to be the same as that of the 佥辛夫2 attached to the substrate. Therefore, it is possible to repair and feast the quality and quality of the same display characteristics.曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 曰 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用 使用. Of course, it is also possible to use a pattern substrate in a color scheme. For example, correction of a glare body such as a PDP or a sonic ray tube can also be utilized. Further, in the above-described description, the opaque material may be an irregularity/page 2 composed of a transparent material, and a coloring layer or the like which is not provided with excellent precision may be removed. The repair of the defect: the foreign matter or the like is referred to as a defect. By removing the defect, the defect correction device is changed in the defect described in the first embodiment. The configuration of the present embodiment is the same as that of the embodiment. The description will be made with reference to Fig. 6 to illustrate the film used in the defect correcting device of the present embodiment. Fig. 6 is the structure of the film 5 315540 23 1262306 ΐ: bribe view: in Fig. 6, '51 is the color layer of R, 52 G is 53 for the color layer, 54 for the light shielding layer, and 55 for the transparent layer. In this embodiment, the color layers of R, G, and B, and the light layer and the transparent layer are provided on the film. A film is used to correct the defect of the pixel and the bm portion of the color filter substrate GB. Further, the color layer 52 of the color layer 0 of the color layer 52, the color layer 53 of the B layer, the light shielding layer 54 and the transparent layer 55 are respectively formed. The film 5 has a base film and a color layer 51 provided on one side of the base film, a color layer 52 of G, a color layer 53 of B, and a light shielding layer 54. A part of the color layer 5i, the color layer 52, the color layer 53 of the B, and the light shielding layer 54 are actually formed. The color layer 51 provided on the thin/upper R color layer 51, the G coloring layer 52, and the B coloring layer 53 are disposed with a gap therebetween, and have a transparent layer 55 composed only of a base film therebetween. The layer 55 can observe the defective portion by the CCD camera 12 through the aperture from the light source 9. It can also be provided with a layer other than the base & film. The material of the far base film, the colored layer and the light shielding layer can be used with the above embodiment. Similarly, the film 5 is wound around the film roll 8: in the same manner as in the above embodiment, the surface on which the color layer and the light shielding layer 54 are provided is disposed so as to face the substrate 6. By rotating the film roll 8, The position of the laser spot which is sent to the film in the front direction is aligned with the color layer 5 of the transparent layer 55, r, the color layer 52 of G, the color layer 53 of B or the light shielding layer 54. When the defect is detected and the foreign matter is removed, The transparent layer 55 is located at the position of the laser spot. If the transparent layer 55 is a light permeable material from the light source 9, the light can be detected by the CCD camera 12. Then, in the same manner as in the first embodiment, 315540 24 1262306 After the defect is detected, it is removed by laser removal. The film 5 is transparent, and is opened to remove foreign matter. Thereby, the black defect becomes a white defect. The thin shaft 8 is rotated to make the coloring layer or the light shielding layer corresponding to the defective portion; ", occupying the position. Then, in the same manner as in the above embodiment, the colored layer or the light shielding layer 54 is transferred by laser removal to correct white defects. Further, it is preferable to output a laser or a filter or the like so as to provide a filter or the like. The base film does not open when the white defect is repaired. The defect correction device of the present invention is not limited to the color filter substrate, and may be used for other pattern substrates. For example, a thin film transistor for a liquid crystal display device may also be used. Array substrate. In this case, the film is provided with a conductive layer made of a metal such as chrome, and the conductive layer is transferred by short pulse light to correct the pattern of the wiring or the electrode. This can also be used to repair the wire breakage. Or an insulating film is provided on the film to correct the defect of the insulating layer between the wirings. Further, the mask pattern can be corrected. At this time, defect correction can also be performed by transferring a light shielding layer such as chromium. In order to correct the defect as described above, the film is converted into a transfer layer (a colored layer, a light-shielding layer, and a conductive layer) of a material to be corrected, whereby defects of various types of pattern substrates can be corrected. When the transferred substance is in a transparent state with respect to the short-pulse laser light, a light absorbing layer may be added between the film and the transfer layer. The film can also be constructed of a material that absorbs short pulsed laser light. At this time, the light absorbing layer is a propellant for performing laser removal of the money. A method of providing a key glomerium of a light absorbing layer in the film. In the present embodiment, as described above, the position of the laser spot can be changed from the transparent layer to the light shielding layer 54 or the colored layer by the rotation of the shaft 8 = rotation. Thereby, after the defect is detected, the short pulse light is irradiated to the defect position without moving the optical system 315540 25 1262306 or the stage. Therefore, the short pulse light can be irradiated to the position of the defect, and the repair can be performed correctly. Further, a mechanism for changing the position at which short-pulse laser light is to be irradiated at a different layer is used as the film changing mechanism. In the film changing mechanism, in the state of fixing the optical system and the stage, a different transfer layer is provided on one film 5 as shown in this embodiment, and the film roll for providing the film 5 is rotated: In addition to the film reel rotating mechanism 14, a film reel moving mechanism in which the film reel 8 is moved without changing the film film 5 having different layers as in the above embodiment is included. Further, a member for moving the irradiation position of the laser to a different layer by interlocking the optical system and the substrate stage is further included. Of course, the above components can be combined for use. (Embodiment 3) A defect correction device and a sea monk method of this embodiment will be described with reference to Figs. 7 and 8. With the embodiment! The contents described in the second embodiment are the same as ==, and the description thereof is omitted. Fig. 7 is a configuration diagram of the defect correcting device. The figure 8 shows an enlarged cross-sectional view showing the structure of the substrate and the film. Fig. 8 (a) a configuration in which short-pulse light is not irradiated onto a film to perform defect correction, and Fig. 8(b) shows a configuration in which a defect correction of a cup 6 is employed. In the present embodiment, the substrate is on a transparent glass substrate. First, explain the process of the reticle. _Reverse _, _, etc. make (4) 68 wire. The film ^ (4) to suppress the patterned photoresist 67. Secondly set up to coat the film with a spin coater : The second is photosensitive resin, etc. 'Light'...: Hunting by electron beam or laser first (4) Catalogue 1 315540 26 1262306: This forms the composition shown in Figure 8. Using the resist pattern as a cover The exposed chrome film 68 is etched to form a light-shielding pattern. The photoresist is removed after the photoresist is removed. In the present embodiment, a method of correcting the white defect 66 provided in a portion of the photoresist 67 is described. When the white defect of the pinhole or the like is %, the chrome film 68 under the white defect 66 is etched while the chrome film is etched. Therefore, when the photoresist has a white defect, the white defect of the photoresist pattern is directly performed. Part of it becomes a white defect of the reticle. The following description is to repair the white defect of the reticle. A method of white defect of a positive photoresist pattern. In the present embodiment, a substrate 6 for a photomask having a photoresist pattern after photoresist development is provided, and a defect detecting mechanism of the defect correction device of the present invention is disposed on the crucible 7 The k-light source 9 and the CCD camera η are provided. The defect correction mechanism includes a short pulse, a laser light source 1 and a beam shaping mechanism 2, etc. The white light that is emitted from the light source 9 is used by the half mirror i The human lens is incident on the object lens 4. The light is collected by the objective lens 4 and transmitted through the film 5 to the human substrate 6. The light reflected on the substrate 6 is detected by a CCD camera, and the presence or absence of defects is determined in the same manner as in the example i. In the XY stage, it is possible to detect that the film 5 is provided on the entire surface of the substrate 6. The film 5 is made to eject the milk by the air ejecting mechanism 13 and the gap with the substrate 6 becomes a claw. 67 is formed of a normal resin or the like. Therefore, the surface has an uneven shape. However, by using the working and discharging mechanism 13 to bring the film 5 into close contact with the substrate 6, the gap between the film 5 and the substrate can be made a suitable distance. (4) The situation in which the photoresist pattern is caused by the material. Therefore, the precision is excellent. The film 5 is wound around a rotatable film reel 8. The film 5 is as shown in Example 2 of 315540 1262306, and is provided with a transparent layer and a transfer layer. When detecting defects, from the light source of > The light of 9 is irradiated onto the substrate through a portion of the transparent layer, and the light is detected by the CCD camera 12 in the same manner as in the first embodiment to detect the defect. When the defect is corrected, the film reel 8 is rotated to make the transfer layer Moving to the position of the laser spot. The short-pulse light from the short-pulse laser light source 1 is formed into a spot-like light having the same shape as the defect shape by the beam shaping mechanism 2, and is incident on the half mirror 3. Then, The half mirror 3 reflects the direction of the sheet 6, and collects light on the objective lens 4 to enter the film 5. The short pulse light from the short-pulse laser source i is coaxial with the illumination light from the lamp source, so that short-pulse laser light can be irradiated at the same position as the detected defect, and the defect can be correctly performed. Correction. The state in which the short-pulse laser light is projected on the film 5 is as shown in Fig. 8(a). On the other hand, the surface of the film 5 is provided with a layer %. The layer brother has a function of being transferred to the transfer layer of the substrate 6 by laser irradiation. Secondly, the stone layer 56 is transferred to the white defect% portion of the photoresist 67, and when the chrome plate 68 is inscribed, the chromium film 68 can be prevented from being exposed to the money engraving liquid. As the etching solution of the chromium film μ, for example, an acid such as a nitric acid (tetra) aqueous solution can be used. Therefore, it is best to use the money for the liquid (four) sex material f. It can be made ", metal, semiconductor compound or organic matter, etc. These materials are pre-coated on the film $. Also, in the case of dry cooking, it is also best to use a material that is resistant to puncture. It will come from a short pulse laser source. The short pulse light is condensed, and the film 5 on the part where the defect is detected. The short-pulse laser light source is imaginary, and the YAG laser can be used in the same manner as in Example 1. It is 3 times that of the YAG laser. 355 (4) of the local spectrum wave to illuminate the short pulse light. By the laser removing method 315540 28 1262306, the same portion of the defect shape is removed from the film 5, and the money is evaporated in the area of the white defect 66, and the transfer On the chrome film 68, the structure shown in Fig. (b) is formed, and the correction portion 69 having the ruthenium layer 56 is provided at the portion having the white defect 66. By performing etching in this state, the correction can be prevented. The chrome film 68 under the ridge portion 69 is exposed to the etching liquid, and the chrome film 68 can be left as a light shielding film. That is, the correction portion 69 of the chrome film 68 has a function of light resistance, so that white defects can be corrected. Therefore, the chrome pattern can be formed correctly. Then, % removes the photoresist 6 7 and the correcting portion 69. The pattern of the photomask can be correctly formed by the above method: the productivity of the photomask can be improved. Moreover, the productivity and yield of the semiconductor device or the liquid crystal display device can be improved by using the photomask. Further, when the edge of the pattern is corrected, the ruthenium layer may be more widely evaporated than the defect portion. Then, after the chrome film 68 is etched, the excess chrome film is removed by laser removal to form a pattern edge. The above method can prevent the occurrence of white defects (defects of the chrome pattern) in the past because of the white defect of the correction mask, so a partial film forming technique such as laser cVD, FIB deposition, spot exposure or lift_off is required, but In the embodiment, the defect correction mechanism is added to one of the defect inspection devices, and the defect correction can be stably performed in a simple manner. The laser can be accurately irradiated at the same position as the portion where the defect is detected, so that stable repair can be performed. In the present embodiment, a wavelength variable filter is provided similarly to the embodiment, and light from the lamp light source 9 can be used for heating. FIG. 1 and FIG. 1 are views showing a method of correcting a defect of a pattern substrate in the present embodiment, and FIG. 9 and FIG. 1 are enlarged cross-sectional views showing a configuration of a defect portion 315540 29 1262306 in the step of correcting a defect. The configuration of the defect correcting device is the same as that of the first embodiment. Further, similarly to the embodiment, the foreign matter or the defect on the color filter substrate is detected, and the short pulse light is irradiated through the film to the foreign matter or the defect. The film removing method can remove a portion of the film 5a and foreign matter at about the same time, thereby forming the configuration shown in Fig. 9, and the film 5a is provided with an opening.

Then, the resin sputum 17 for coloring the defective portion is dropped therefrom by means of a liquid dispenser. The dropped resin solution 丨7 is attached to the opening from the opening of the film 5a, and is simultaneously adhered to the film. For example, the nozzle of the liquid dispenser is placed in the defect correction so as to be horizontally movable. In the apparatus, as shown in Fig. 9 (8), the nozzle 16 is moved to the upper portion of the opening of the film & the resin solution 17 which is colored in a region wider than the opening portion π. The tree is colored and the solution 17 is colored and The color layer of the color filter to be corrected by the defect is "to the same color" and is colored red in this case. The resin solution 17: straw has an appropriate viscosity by adjusting the concentration of the resin. The method of causing the resin solution 1 = the nozzle to adhere to the substrate, in addition to the method of dropping the resin solution 17, there is also a method of spraying the micron-sized fine particles using a spray nozzle. Further, both of them are dried at a resin solution 17ait of the substrate 6. In the drying step of Fig. 19 (c), the resin can be dissolved/dried by heating with a light source of light. That is, the light from the light source 9 is irradiated to the resin solution II? Part or part to make it dry. At this time, 'the lens of the object can be moved toward each movement' to change the area of the illumination light, and the adjustment should be made to dry (7) dry and cut. (4) The mechanism 13 can be used to make the air nozzle to make the resin solution B and wood When the resin solution 17a is dried, the solvent evaporates and the adhesion of 315540 30 1262306 is reduced, so that the resin solution i7a| is attached to the thickness of the predetermined film. After drying, the short pulse light from the short pulse laser light source 1 is irradiated to the edge portion of the opening portion to remove the resin solution 17a. That is, as shown in the figure (4), the resin solution 17a remaining in the state where the short-pulse light is not irradiated remains in the center of the opening, and the short-pulse light is irradiated only, and the vicinity of the periphery of the opening is removed to remove the edge portion. The resin solution H is provided with a movable mirror or a lens in the optical path of the short pulse light to control the irradiation position of the short pulse light by the optical component. For example, the tilt of the half mirror 3 is changed, and the laser spot is positive. The beam shaping mechanism 2 and the objective lens 4 are caused to have a laser at = small and the short-pulse laser light is irradiated for the entire circumference using the optical member described above. Thereby, the resin solution in the center of the opening portion - the laser is removed; the resin solution in the vicinity of the edge of the force opening portion can be formed by removing the door opening 1 = thereby forming the structure shown in Fig. 10 (4). In the state where the reel is in the vicinity of the resin solution in the vicinity of the crucible, the thin shaft is "turned" to move the opening portion of the film 9. Then, the thin crucible 5a is removed from the substrate 6. Thus, as in the second The θ formed on the defective portion is not modified by the defect. The opening edge = the second correction layer i7b is removed by the laser removal method as described above: the _5a (four) can be prevented from being on the substrate 6__2/=^, and the manner is removed Add ri i ^ / war defect. Also, hunting the resin solution from the center of the mouth to the mouth ^ will be attached to the thin film or the payment, so no new defects will be formed. Again, by 315540 31 1262306 The short pulse light is emitted to remove the resin solution 17a, so that the shape of the attachment portion of the resin solution m can be adjusted. Thereby, the defect can be correctly corrected. In the defect correction method of the present embodiment, the resin solution is attached. Since the allowable amount of the position becomes large, and a large amount of resin is blown out at a time, even if it is a small correction, a larger nozzle can be used, and therefore it is easier to manage than a nozzle having a small opening required for blowing a small amount. Forming mechanism ^5 Since the size of the opening of the film is large, the pulsed laser light can be irradiated onto the film in an arbitrary shape. Therefore, the opening shape of the film can be matched with the pixel shape, and the rectangular region of the region substantially the same as the pixel shape can be easily corrected. By heating the resin solution 17a and then drying it, it is possible to prevent the resin adhering to the defective portion of the substrate from sticking to the film side and peeling off from the defective portion of the substrate by peeling off the film μ. The resin at the tip end of the mouth or the resin solution is at a predetermined concentration, and it is necessary to perform a blanking outside the defect portion. However, the film is vacant on the periphery of the correction portion (4), and the time difference between the short and the short correction is obtained. Observing; the position of the hitter can correct the positional deviation generated when the nozzle is ejected to the ground. Thus, by using the defect correction method of the embodiment, the defect correction can be performed. After the solution 丨7a or after drying the resin solution, the resin may be scraped into the opening portion by a squeegee or the like, or the excess resin may be removed by a doctor blade. Therefore, even when the amount of discharge is too large, the resin solution 17& which adheres to the defective portion of the substrate 6 can be controlled by the ratio of the dissolution in the resin solution (the reduction ratio after drying) to the film thickness of the film or the like. The amount of adhesion, that is, the film thickness of the final correction layer 17b can be controlled, and can be correctly 315540 32 1262306::: 卞 Therefore, the color and transmittance of the defect correction section of the town control. The attachment point may be shifted from the opening of the film toward the position of the female opening of the blade. In this case, the resin may be scraped into the opening by a knife or the like, and the resin solution na may be uniformly attached. In the defective part of the substrate 6. The material of the α / Ί刀 is made of a resin material (4) or a Teflon name, and the material of the film is a material having a higher wettability than the blade of the polyamic acid. The composition allows the scraped resin to remain in the thin, = hunting, so that the resin does not remain on the scraper, so there is no need to carry out the scraper or to extend the cleaning cycle. χ ‘Because the excess resin is attached, it is left in the state of the adhesive film 5a, and is rolled together with the thin film of the material. Therefore, it does not adhere to the portion other than the defective portion of the substrate 6, and does not form a new defect. Since the Dolan resin can be recovered by exchanging the used film 5a, the resin is not attached to the resin and can be easily repaired. Further, when the resin solution 17 is ejected from the nozzle 16 to the substrate, the resin solution 17a is formed into a spherical shape due to the surface tension, and the resin solution m is not in contact with the substrate 6. At this time, it is preferable to make the periphery of the opening of the film ^ thin. The above steps are explained in Fig. 11. As shown in Fig. 4 (4), the peripheral portion of the opening of the film 5a is thinned by the laser removing method. With the future from short pulse laser light source! The short-pulse laser light is irradiated around the opening of the film 5&, and the portion shown in Fig. 4 is formed by removing the portion. At this time, a short pulse laser source! The wheeling system is set to be lower than when the opening is formed through the film formation. Then, the position of the moving laser spot is caused to cause the short-pulse laser light source 1 to illuminate the entire circumference of the opening. By making the periphery of the opening of the film 5a 315540 1262306::: When the thickness is thick, the substrate 6 can be brought into contact with the resin solution. Therefore, the u-th image is formed (the thick film of the i7a film 5a is set and the "inch" is attached to the step difference in the thin liquid Ha. Therefore, a step difference is formed, and the resin dissolves & +, r η and then the image of the brother 11 C) The light of the light source 9 is irradiated, and the #, (^, and the work is dried. The subsequent steps are omitted because the steps are the same. The younger ones are not worth the money, Α π six Even if the resin solution 17a attached to the attached day can be easily attached to it, the Geer, as shown in the figure 12, you can add the resin solution η to the resin solution: In this case, the opening portion is formed in a thin film by the transport removal method as shown in Fig. 4 (4). As shown in Fig. 12), Μ 'generates fine particles' is dropped from above the opening portion to the substrate 6. Therefore, Even if the film 5a is thick, the resin solution% may be (4) in the defective portion of the substrate 6. Then, as shown in the 12th, the light source 9 is irradiated and dried, and the subsequent steps are as shown in Fig. 1 Since the steps are the same, the description thereof is omitted. Therefore, even if the amount of the resin solution Pa required for adhesion is large, it is easy to be used. Further, in the above-mentioned yoke example, the resin solution colored in red is attached to the substrate 6, but it may be colored in blue, green or black, and can be monitored. The coloring layer, the green coloring layer, and the green coloring layer are not limited to the color filter substrate, and a resin solution colored in a color corresponding to the pattern to be corrected may be adhered to the substrate. When the resin solution is dried, the water in the solution evaporates, and the resin is fixed to the defective portion. Of course, a solution other than the resin solution may be passed through the opening of the film 5a so as to correspond to the pattern to be corrected, 315540 34 1262306 The positive liquid may be attached to the substrate 6. Alternatively, the correction liquid may be dropped from the upper surface by the nozzle, and the correction liquid colored in accordance with the pattern to be corrected may be attached to the substrate 6, thereby correcting the pattern of any color. Moreover, by adjusting the point of the short-pulse laser light to adjust the size of the opening portion, it is possible to adhere to the resin solution having the same size as the detected white defect, and the white defect can be corrected with high precision. Therefore, even in the case of correcting the color filter substrate or the like, the display quality is not deteriorated. Embodiment 5 The defect method of the pattern substrate of the present embodiment will be described with reference to Fig. 13. Fig. 13 shows the steps of correcting the defect. An enlarged cross-sectional view of the defective portion of the present embodiment is the same as that of the embodiment. In the same manner as in the first embodiment, the foreign matter or the defect on the color filter substrate is detected, and the short pulse light is transmitted through the thin film. Foreign matter or defective portion. Therefore, it is possible to remove a part of the thinned portion and the foreign matter by the laser beam splitting method. Therefore, in the configuration shown in Fig. 13(a), an opening portion is provided in the film 5a. In this embodiment, As in the above embodiment, a nozzle 16 that can move the liquid distributor in the horizontal direction is provided. In this state, the nozzle 16 is moved to the opening. Therefore, the configuration shown in Fig. 13(a) is formed. A resin solution 17 colored in a color corresponding to the pattern to be corrected is also attached to the tip end of the nozzle 16 of the dispenser. The resin solution 17 is extruded from the front end of the nozzle 16. In the present embodiment, the nozzle μ is provided so as to be movable in the up and down direction. The nozzle 16 is moved downward so as to be close to the substrate 6, and the resin solution 17 is brought into contact with the film & and the substrate 6. Further, it is also possible to move the stage of the substrate 6 upward, and the base is close to the mouthpiece 16. Therefore, as shown in Fig. 8 (8), the resin solution is caused to flow through the opening portion of the defect portion of the substrate 6. Further, when the nozzle 16 is moved upward or the table is moved downward to separate the base, the resin liquid 17a attached to the front end of the nozzle 16 is large = back = 16 side. Therefore, the configuration shown in Fig. 13 (4) is formed, and the resin solution 17a adheres to the defective portion in the same manner as in the fourth embodiment. In the present embodiment, even when a large nozzle is dropped, the amount of adhesion of the resin solution (7) to the substrate 6 can be restricted. Therefore, a small amount of the resin solution can be attached to the substrate 6, and the thickness of the adhered resin layer can be easily controlled. Thereafter, in the same manner as in the fourth embodiment, the short-pulse laser light source i was used to remove the resin solution around the opening, and the lamp source 9 was used to dry the resin solution. Then, the ruthenium film 5a is rotated and peeled off from the substrate 6, and the ruthenium 7 is moved to remove the film "from the substrate 6. Therefore, as shown in Fig. 13 (4), the colored resin is attached to the defective portion, and the correction layer 17b is modified. The defect of the color layer. The white defect of the pattern substrate can be correctly corrected by the above device configuration and defect correction method. Further, by adding the steps of correcting the defects to the process of the pattern substrate, defect-free can be manufactured. [Embodiment 6] The defect correction device of the present embodiment will be described with reference to Fig. 15. The first $ is a diagram showing the configuration of the defect inspection device of the color filter substrate of the present invention. The description of the embodiment is omitted, and the description thereof is omitted. In the present embodiment, the foreign matter on the film is removed by the laser removal method in the same manner as in the above embodiment, and then the heating block is provided from the formed opening portion. The coloring layer of the different film is subjected to thermal transfer. 315540 36 1262306 In the present embodiment, in addition to the defect inspection device shown in Fig. 1, it is provided as shown in Fig. 15 to have a coloration on the film 5. The film 18 of the transfer layer and the heating block 2 for thermal transfer. The film 18 is attached to the film reel 19, and is thinned by rotating the film reel 19. The film 18 and the heating block 2G slide. For example, the object lens 4, the air ejecting mechanism 13, and the film reel 19 f heating block 2 can be connected to a sliding body (not shown) to make it slippery. When the foreign matter is removed, the objective lens 4 and the air ejection mechanism 13 can be disposed at the defect position, and when the transfer layer is transferred, the slider is moved to arrange the film at the defect position by the heating block 20. It can also be moved by the sliding body=moving mechanism. Alternatively, the film can be placed under the heating block to the air ejecting mechanism 13 without moving the objective lens 4 and the empty::out mechanism 13 Μ When the film 18 is moved to the defect position, a top view of the configuration of the 1"two substrate 6 and the film shown in Fig. 16 is formed. The film is set to be two, and the film 18 is disposed on the film 5. White: the opening 15 of the binding film 5 of the crucible 5 makes the film 18 and the substrate 6 = direction A film is provided at the position of the opening portion 15 as a transfer layer. The defect portion passes through the opening portion 15 to transfer the transfer layer of the film 18 to the substrate at a position of two. It is preferable to pre-fix j =: film: when the film 18 is moved, the positions of the substrate 6 and (10) 5 are fixed. The fixed substrate 6 and 3] 5540 37 1262306 film 5 > ancient, i., / there: in the air ejection A method of placing a rubber or the like on the film 5, and a method of charging the film 5 to the substrate 6 by electrostatic force. The method of placing the stone rubber is to mount the stone rubber on both sides of the opening. The position of the film 5 is fixed. Further, the film 5 is fixed by electrostatic force = when the film roll 19 is rotated to feed the film 5, the friction is 6 gold. (1) The electrostatic force of the charged film 5 is fixed to fix the position of the substrate 13" to = 5. In the present embodiment, the substrate 6 and the film 5 are fixed by the above method without using the air ejecting mechanism, and the opening portion 15 A m $ + You have to connect the stone and the stone is thin. In addition, you can also spray air on the sides of the opening 15 and the 5 ^ 18 will not overlap, so that the fixed substrate 6 and the film film 18 have thermal transfer. Thinness of the transfer layer to be transferred = For example, Toraya (registered trademark) manufactured by Fujifilm Co., Ltd. can be used. The adhesion of the transfer layer can be improved by the = film. The structure of the film can be described in Fig. 17. "The film 18 has a buffer layer i8d formed on the base layer 18e. An oxygen shielding layer 18c' is provided on the buffer layer 18d, and a transfer layer 18b colored by the pigment is provided on the oxygen shielding layer 18c. The transfer layer 18b is formed of, for example, a photosensitive resin. The pigment of the transfer layer 18b is colored according to the color of the color ray to be corrected. The transfer layer 18b is transferred onto the substrate 6 to correct the white defect. A cover film 18a for surface protection is crimped onto the transfer layer 18b. X, in order to prevent the dust from being attached by the peeling, an electron-conducting electrification preventing layer is provided on the back surface of the base layer 18e. 315540 38 1262306 The base layer 18e is formed, for example, of PET having a thickness of about / / m. As the buffer layer 18d, a thermoplastic resin having a thickness of about 2 μm which is soluble in a weak base can be used. The adhesion of the transfer layer is improved by the buffer layer 丨 8d absorbing the step of the defective portion of the substrate. The thickness of the oxygen shielding layer is 16 "yang, the thickness of the transfer layer 18b is 2 Å / / m, and the thickness of the cover film is [" η. The configuration of the film 18 is a typical example and is not limited to the above configuration. For example, the cover film 18a, the oxygen shielding layer 18c or the static electricity prevention layer (8) may not be provided. In particular, since the phenomenon of dust adhering to the portion of the film 18 disposed in the opening portion 15 is extremely small, the cover film (8) may not be provided. Further, the transfer layer 18b is not limited to the photosensitive resin layer, and may be a coloring layer corresponding to the pattern to be transferred. The heating block 20 is arranged to be movable up and down, so that when the film is attached to the two printed layers 18b, the film 18 is moved downward and pressed against the substrate. The image of the substrate 6 and the film 18 is shown in Fig. 18. Fig. 18 is a cross-sectional view showing the configuration of the substrate 6 lacking the correction portion. Here, the illustration of the cover film 18a, the oxygen shielding layer 18, the underlying layer, and the charging prevention of 2 18 is omitted. The film 18 is pressed by the heating block 2 In the temple, the structure shown in the first (a) is formed. u By pressing the heating block 20, a thin, insulting film having the opening portion 5 is formed between the substrate 6 and the thin layer 18 having the transfer layer. Therefore, the transfer 8 8 is pressed through the opening 15 of the film 5 to the defect portion L of the substrate 6 and the opening portion 15 is provided to be the same size and the same as the portion for removing the foreign matter by the barrage removal method. The position "the portion to be corrected" is obtained. By transferring the transfer layer 18b through the film 5, the transfer layer 18b 315540 39 1262306 can be attached to the substrate 6 in the interlayer. Further, in the region other than the opening portion, The transfer layer 1 will adhere to the top of the film 5. Thus, by opening the film 5 The transfer layer 18b, which is a colored layer, can prevent the transfer layer 18b from adhering to a region other than the defect portion. Therefore, the transfer layer I 8b can be transferred only to the defect portion with a simple configuration, and can be corrected. The defect is corrected. Since the transfer layer 18b does not adhere to the excess portion, it is not necessary to remove the transfer layer 18b of the excess portion in the subsequent step, and the productivity can be improved.

And in this embodiment, it is pressed through the thermoplastic resin layer 18d; the printed layer 18b. The thermoplastic resin layer 18d has an inert property, and has a function as a buffer layer when the film 18 is pressed against the substrate 6. Therefore, the step on the substrate due to the g layer 62, the BM 64, and the coloring film 5 can be absorbed, and the thermoplastic resin layer 18d can be accurately transferred. Since the thickness of the thermoplastic resin layer = m', even if the thickness of the colored layer is 2 front, the thickness of the film / / film 5 is 8 " m, which can be absorbed and thus correctly produced as & Transfer.

After the heating block 20 is lifted up and left from the substrate 6, the film is moved! 8 is peeled off. When peeling off from the substrate 6, the image shown in Fig. 18(b) is formed, which can be defective/defected by a dry process. ? The W or the thermoplastic resin layer 18d is adhered to the second day of the A; the water is dissolved on the substrate 6 side, and the weak test solution is used to carry out the spray treatment to remove the resin 厣 18d. $ 41 PR 虱k敝 layer 18 or e heat-producible m Γ stripped oxygen masking layer 18c or 埶 plastic, ^ 由 布 布 tribute tribute 4, etc., as shown in Figure 18 (b), The transfer layer 18b, which is the 'color layer', can be printed at the white defect position for defect correction. = The thickness, color, and transmission of the layer transferred as the colored layer can be easily controlled using the film 18'. That is, H is the characteristic of the teaching = the transfer layer 18b of the film 18, and the corrected color layer can be corrected to be substantially the same as the color layer of the positive hanging. Therefore, the correct defect can be repaired. The straw is transferred by using the film 18, and the adhesion of the transfer layer can be improved. 0 In the above thermal transfer step, the substrate 6 can be preheated in order to increase the transfer speed. For example, preliminary heating can be performed by placing the substrate 6 on a hot plate, and preliminary heating can be performed by irradiating infrared rays, and infrared light from the lamp light source 9 can be passed through the filter 10 by using infrared rays %. In addition, a heating source is provided. Further, in the present embodiment, in order to improve the adhesion of the transfer layer, a heating block having a convex portion corresponding to the defect pattern can be used. The constitution of the heating block 20 will be described with reference to Fig. 19. Fig. 19 is a cross-sectional view showing the constitution of the heating block. A convex portion 2〇c is provided in the center of the heating block 20. The colored layer can be transferred by pushing the film 18 to the substrate by pushing the heating block 2 下 in the direction of the arrow. Since the heat capacity of the heating block 20 is large, it is formed into a cylindrical shape of 0 5 mm, and is heated to about 13 Torr during transfer. Hey. A convex ridge 2〇C is provided on the bottom surface of the heating block 2〇. The convex portion 2〇c is, for example, a cylindrical shape of 0 500 // m and a height of Ι θ / zm. In the present embodiment, in order to form such a small convex portion, the central portion 20b and the outer peripheral portion 20a of the heating block 20 are formed by using materials having different thermal expansion coefficients. For example, the central portion 20b is made of iron having a large thermal expansion coefficient. Gold 41 315540 1262306 is a 5 and forms a peripheral portion 2〇a using a ceramic such as SiC having a small thermal expansion coefficient. At the normal temperature, the central portion 20b and the outer peripheral portion 20a are formed into a flat shape. Further, when the heating block 20 is heated to 130 °C, the central portion 20b is protruded due to the difference in thermal expansion coefficient, and the convex portion 20c is formed. In order to make the convex portion into a desired shape, size, and height, the size of the central portion 20b and the thermal expansion coefficient are designed. Thereby, even if it is a minute convex part, a convex part can be formed correctly by a desired magnitude. Since the convex portion 20c is fitted to the defective portion of the substrate, the adhesion can be improved even when there is a step. Further, since the southness of the convex portion is made constant, the bottom surface of the heating block 2 can be polished to a smooth shape at normal temperature. Of course, the size and height of the convex portion 20c are those which are in accordance with the pattern of the correction defect, the thickness of the film, and the like. Example 7

The upper view of α taken from Fu. In this embodiment, the use of mine

利用 Using the laser removal method = The foreign matter removal unit 21 on the substrate is removed by laser removal. The air removing portion 21 is formed around the opening portion 15 of the shape. Remove the inclination of the hunting half mirror 3 of the different 315540 42 1262306 it, and irradiate the laser light at the opening: the mysterious low, Γ. At this time, by partially removing the film 5 by the work of the laser light when the foreign matter is removed, the film thickness is also Μ 2 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气 空气thin. The configuration shown in Fig. 20 is formed by the same angle of the four corners of the opening 15 and the injection of the field. Here, the size of the air removing portion 21 is smaller than that of the opening portion 15. For example, I sets the size of the opening to one side, called a square, and sets the size of the air 3 portion 21 to a square of one side and a claw. Further, the portion of the opening portion 'air removing portion 21 is formed in an overlapping manner. Since the laser light is irradiated at a low rate, the pattern of the substrate 2 is not removed even at a portion overlapping the opening 15. Therefore, the gas removing portion 21 can be formed without affecting the characteristics of the color filter. The portion of the thin plate which is thinned by the degree is formed by the shape air removing portion 2 at the peripheral portion of the rectangular opening portion 15. Since the opening portion 15 removes the thin crucible 5, the air removing portion 21 is formed, whereby the film can be thickened from the opening portion. The external drawing of Fig. 21 shows the configuration of the film 5 and the substrate 6 which form the air removing portion 21. Fig. 21 is a cross-sectional view showing the configuration of the film 5 and the substrate 6, and shows a state in which the film 5 is pressed against the substrate 6 by the heating block 20. After the air removing portion 21 is formed, the heating block 2 is moved to the opening portion 15, and the heating block 20 is pressed. Generally, when the film 18 is pressed, the film 18 comes into contact with the substrate 6 from the center of the opening 15. Therefore, the air existing between the substrate 6 and the transfer layer 18b is slowly discharged to the outside from the center of the opening portion i5. The air removing portion 21 is provided around the opening 卩, so that the film 5 is formed in two stages as shown in Fig. 21 315540 43 !2623 〇6. The edge of the portion where the air removing portion 2 is not provided is in contact with the transfer layer 18b, and there is no air discharged: the air may remain in the mouth, but the air removing portion 2 is provided: the mouth is turned and turned The air between the printed layers 18b is discharged from the above-mentioned two segments. Therefore, the adhesion can be improved. In the Fig. 20, the four corners of the opening portion 5 are provided with an empty space: 21'. However, as shown in Fig. 22, the air removing portion 21 may be provided in the second opening of the rectangular portion. That is, the air removing portion 21 having a rectangular shape smaller than the opening portion ° 5 ° can be formed. Alternatively, as shown in Fig. 23, a rectangular air removing portion 21 extending from each side of =15 may be formed. Therefore, the air removing portion 21 of the four corners of the opening portion 15 is formed. The configuration of the iron and the second milk removal unit is not limited to the configuration shown in the drawings. When the air removal portion has a shape in which the slit width of the beam shaping mechanism 2 is changed, and the slit width of the beam shaping mechanism 2 is changed to form the opening/two gas removing portion 21, it is preferable to open the opening portion 15 with the air. The removal portion 21 is also defined as a rectangle. Of course, the opening portion j 5 and the air removing portion 2! are not rectangular. The air removing portion 2 1 can completely remove the film 5 by controlling any thickness of the laser light source and not only removing the portion of the film 5 but also changing it. At this time, since the film 5 is penetrated, it is preferable to narrow the air 邛 2 1 and the ruthenium transfer layer is not transmitted through the air removing portion 21 > The air removing portion 21 is not limited to the heat detecting block 20, and the flaw correcting device may be, for example, a defect detecting device as shown in the embodiment $. That is, after the opening portion 315540 44 1262306 = is set by the laser removing method, the air removing portion 21 is formed, and the colored resin solution is dripped from above by the dispenser. Since the resin solution comes into contact with the substrate from the center of the opening portion, the air existing between the resin solution and the substrate can be reduced, and the air of the tree lining liquid and the base (4) can be reduced. Therefore, the jointability of the correction portion can be improved. X, even if it is a gas other than air, the air removing portion shown in this embodiment can be removed. Therefore, the air removing portion 21 includes a gas other than the air. In the case of the second embodiment, the defect correction device of the present embodiment - the old 丨丨 正 正 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 囚 。 囚 囚 囚 囚 囚 囚 囚 囚 囚 囚 囚 囚. In the present embodiment, in the same manner as in the sixth embodiment, a film 18 having a color layer for transfer is superposed on the film 5, and laser light from the laser light source is irradiated from the film 18, and transfer coloring is performed. In the same manner as in the sixth embodiment, the film is disposed by the laser removal method to remove the defect. Then, the film reel 19 is moved to arrange the film 8 on the opening portion, and between, Shunong + & The configuration is the same as that of the younger figure 16. In the example, since the heating block is not used, it is not necessary to move the air lift-out mechanism 13.

Since the Pm is moved to the film 5 having the opening portion 18, the air is ejected and the position of the opening is shifted to the fixed film 5. The fixing film 5 can be used in the above-described manner: When the film 18 is placed on the film 5, the second structure is formed. The film 18 used in the present embodiment is provided with a crucible and is provided with an intumescent layer 23 'sound two soils & an ankle boat 22 '曰) knife release layer 24 and a transfer layer 25. Moreover, 315540 45 1262306 The defect portion of the soil faces the transfer layer 25, and the film 18 is disposed through the opening of the film 5. The film: the base film 22 of the film 8 is made of laser light such as polyethylene, which is transparent to the point of view: the intumescent layer 23 It is the absorption layer of the absorption light, preferably formed by the grade 1 "quality. When the defect is corrected, the irradiation pulse width (4) is in the light of the sky, the heating layer is heated for 23 days, the intumescent layer 23 is expanded, and the base film 22 is provided on the intumescent layer 23, so that the base film 22 is ventilated at a place where it is discharged. The intumescent layer 23 will flow out to the substrate side. The wide separation layer 24 and the intumescent layer 23 are separated from the base film 22 to adhere to the substrate 6. Then, when the irradiation of the laser is stopped, the intumescent layer 23 is cooled and returned to a solid to form the structure shown in Fig. 25(b). By transferring through the film 5: = portion, the transfer layer 25 adheres to the plate 5 at a portion other than the defect portion. Therefore, the transfer layer 25 or the like adheres only to the defect portion on the substrate. Therefore, it does not affect the parts other than the defects, and the defects can be corrected correctly. The separation layer 24 is formed between the transfer layer h and the intumescent layer 23 by separating the transfer layer 25 from the intumescent layer 23, and is formed of a material which can be dissolved, for example, in an acid or test solution. By dissolving the solution on the substrate 6 to dissolve the knife 24 attached to the substrate, the separation layer 24 adhering to the transfer layer on the substrate side can be removed, and the intumescent layer 23 can be separated from the transfer layer 25. By separating the transfer layer 25 from the expanded layer 23 by using the separation layer 24, the expanded layer 23 can be removed from the substrate, leaving only the transfer layer 25 on the substrate 6. Therefore, only the transfer layer 25 required for defect correction can be correctly transferred. Therefore, the configuration shown in Fig. 25(c) is formed. The transfer layer 25 has characteristics such as color, transmittance, and film thickness corresponding to the 315540 46 1262306 color layer of the defect to be corrected, so that the defect can be accurately corrected. Of course, the method of separating the transfer layer 25 from the intumescent layer 23 is not limited to the above method. & In the above embodiment, the transfer layer 25 is transferred using the laser light source 1, but a light source different from the laser light source may be provided, and the light from the light source may be irradiated to transfer the transfer layer 25. Further, in order to improve the adhesion, the infrared ray from the lamp light source 9 may be irradiated to prepare the heating substrate 6. Of course, the above embodiments can also be utilized in combination. BRIEF DESCRIPTION OF THE DRAWINGS [FIG. 1] FIG. 1 is a configuration diagram of a defect correction device according to an embodiment of the present invention. Fig. 2 is a top plan view showing the configuration of a film of the defect correcting device of the first embodiment of the present invention. / (3) (a) to (c) are enlarged cross-sectional views showing the configuration of a defective portion of the defect correcting device of the embodiment of the present invention. Thin film of defect correction device of 1 and Fig. 4 is a top view showing the constitution of the embodiment of the present invention. Fig. 5 (a) and (b) are enlarged cross-sectional views showing the configuration of a defective portion of the defect correcting device of the first embodiment of the present invention. Less, Fig. 6 shows a simplified structure of the defect of the second embodiment of the present invention. Dm = 7 is a configuration diagram of the defect correcting device of the third embodiment of the present invention. Fig. 8 (a) and (b) are enlarged cross-sectional views showing the configuration of the defect correction portion of the defect correction according to the third embodiment of the present invention. Fig. 9 (a) to (c) are enlarged cross-sectional views showing the configuration of a defective portion of the defect correcting device 315540 47 1262306 of the embodiment of the present invention. Fig. 10 (d) to (f) are enlarged cross-sectional views showing the configuration of a defective portion of the defect correcting device of the fourth embodiment of the present invention. Fig. 11 (a) to (C) are enlarged cross-sectional views showing the configuration of other defective portions of the defect correcting device of the fourth embodiment of the present invention. Fig. 12 (a) to (c) are enlarged cross-sectional views showing the configuration of other defective portions of the defect correcting device of the fourth embodiment of the present invention. Fig. 13 (a) to (d) are enlarged cross-sectional views showing the configuration of a defective portion of the defect correcting device of the fifth embodiment of the present invention. The f 14 diagram shows an enlarged cross-sectional view showing the configuration of the color filter substrate. Fig. 15 is a configuration diagram of the # trap correction device of the sixth embodiment of the present invention. Fig. 16 is a top view showing the configuration of the opening portion of the defect inspection device of the sixth embodiment of the present invention and the film having the transfer layer. Figure 17 is a cross-sectional view showing the constitution of a film having a transfer layer in Example 6 of the present invention. Fig. 18 (a) and (b) are enlarged cross-sectional views showing the configuration of a part (4) of the defect correction in the sixth embodiment of the present invention. Fig. 19 is a cross-sectional view showing the configuration of the south block of the defect correcting mount of the sixth embodiment of the present invention. The film of the positive device The defect of the positive device The film of the positive device Fig. 2 is a top view showing the configuration of the defect repairing portion and the air removing portion of the seventh embodiment of the present invention. Fig. 21 is an enlarged cross-sectional view showing the configuration of a defect repairing portion of the embodiment of the present invention. Fig. 22 is a top view showing another configuration of the opening portion and the air removing portion of the defect repairing 315540 48 1262306 of the embodiment of the present invention. Fig. 23 is a top view showing another configuration of the opening 邛 and the air removing portion of the defect correcting device of the seventh embodiment of the present invention. Fig. 24 is a perspective view showing the configuration of a defective portion of the defect correcting device of the embodiment of the present invention. Figs. (a) to (c) are enlarged sectional views showing the configuration of a defective portion of the defect correcting opening of the embodiment of the present invention. [Description of main component symbols] 1 Short-pulse laser light source 3, 11 Mirrors 5, 5a, 5b, 18, 18a 6 Substrate 8, 8a, 8b Λ 19 Film reel 9 Light source 12 CCD camera 14 Film reel rotating mechanism 15 Laser spot U, 17a resin solution, 25 transfer layer I8d buffer layer I8f charge prevention layer 2〇a outer peripheral portion 2〇c convex portion 23 intumescent layer 51, 61 red colored layer 2 beam forming mechanism 4 thin film objective lens 7 10 wavelength variable filter 13 air ejection mechanism 16 nozzle 17b correction layer 18c oxygen shielding layer 18e, 22 base layer 20 heating block 20b central portion 21 air removal portion 24 separation layer 52, 62 green colored layer 315540 49 1262306 53, 63 Blue colored layer 54, 64 black matrix (BM) 55 transparent layer 56 矽 layer 65 foreign matter 66 defective portion 67 photoresist 68 chrome film 69 correction portion

Claims (1)

!2623〇6 f2, the scope of patents: The defect correction device is a defect correction device for removing defects on the patterned substrate, and has a pulsed laser source that emits a pulsed laser; and And a film disposed opposite to the substrate, and irradiating the film with the pulsed laser light from the pulsed laser source, and removing the defect of the film and the defect by using a laser removal method. The defect correction device of claim 1, wherein the film is thinned by irradiating the pulsed laser light, and a portion of the film and the defect are removed by a laser removal method. 3. The defect correction device according to claim 1 or 2, further comprising: a film changing mechanism for changing the film to a film having a P layer which can be transferred to the substrate, and the pulse ray is The light is irradiated onto the film having the transfer layer, and the transfer layer is transferred onto the substrate. 4. The defect correction device of claim 3, wherein the transfer layer is transferred to a portion where the defect is removed. 5. The defect correction device according to claim 1 or 2, further comprising: a nozzle for adhering a correction liquid according to a pattern to be corrected on the substrate to the substrate, and removing the film from the correction liquid The knives attached to the substrate correct the defects. 6. The defect correction device according to claim 1 or 2, further comprising a film having a position of 315540 51 l2623〇6 7. movable to a position where the film has been removed, and The transfer layer is provided with a defect correction device that removes a defect by partially transferring the defect to the substrate, and the defect correction device is configured to transfer the pattern to the patterned defect portion to correct the defect. Soil, a film having a printing layer which is transferable to the substrate and adjacent to the substrate, and a pulsed laser source which emits a pulsed laser irradiated on the film having the transfer layer, and The pulsed laser light from the pulsed laser light source is irradiated onto the film having the transfer layer, and the transfer layer is transferred to the defective portion of the substrate. The substrate is a substrate for a mask having a light-shielding film and a photoresist pattern formed on the light-shielding film, and the defect of the photoresist pattern is corrected. A defect correction device for correcting a defect of a patterned substrate includes: a film disposed opposite to the substrate; and a pulsed laser light source that emits pulsed laser light that is irradiated on the film to provide an opening in the film And a position that can be moved to the opening, and the correction liquid according to the pattern to be corrected on the substrate is attached to the nozzle of the substrate, and the correction liquid is adhered to the substrate from the portion from which the film has been removed, thereby correcting the defect. - A defect correction device for repairing a defect of a patterned substrate; a defect correction device of 52 315540 1262306, comprising: a film disposed opposite to the substrate; emitting an irradiation on the film to provide an opening in the film a pulsed laser light source for pulsed laser light; and a film having a transfer layer movable to a position corresponding to the opening portion, and transferring the transfer layer to the substrate by the opening portion to correct a defect. For example, the defect correction device of the first aspect of the patent application, in which the spear is more The heat transfer to the position corresponding to the opening is performed, and the transfer layer is transferred by pressing the film having the transfer layer onto the substrate by the heating block. In the defect correction device of the above aspect, the heating block further includes a convex portion corresponding to the opening, and the film having the transfer layer and the substrate are pressed by the convex portion. 13·= Patent Application No. 9 The defect correction device of any one of item 12, wherein the fixing mechanism for fixing the film having the opening is provided. 14=Application of any one of items 7 to 1 of the patent scope In the defect correction device, the film having the transfer layer further includes an absorption layer that absorbs the pulsed laser light, and irradiates the pulsed laser light onto the absorption layer to transfer the transfer layer to the substrate. The defect correction device of claim 14, wherein the absorption layer and the transfer layer are provided with: the transfer layer is transferred onto the substrate 315540 53 1262306, and the absorption layer is transferred from the above Separation layer for the separation of the layers. The defect correction device of claim 9, wherein the pulsed laser light is irradiated to remove the correction liquid from which the portion of the film or the peripheral portion of the opening portion has been removed. The defect correction device of any one of the items of the invention, wherein the method further comprises: a discharge mechanism for ejecting a gas to the film or a film having the transfer layer: The mechanism brings the film or the film having the transfer layer close to the substrate. In the scope of claim 1, the defect correction device of the item of the invention is further provided with a beam shaping mechanism for shaping pulsed laser light from the pulsed laser source, and a pulsed beam formed by the beam shaping mechanism The light is irradiated onto the film or the film having the transfer layer. 19. t. In the scope of application for patents, paragraphs 7, 9, and 1G, the defect correction I set 'which' is more: light is irradiated on the same axis as the pulsed laser light from the pulsed laser source. The observation light source α of the substrate and a detecting mechanism for detecting light emitted from the observation light source irradiated on the substrate. 20. The defect correction device of claim 19, wherein the film having the transfer layer further comprises a light transmissive transparent layer of the observation light source, and a film for feeding the transfer layer A film reel that changes the position at which the light is irradiated from the transparent layer to the transfer layer. 21. The defect correction device of claim 19, wherein the 315540 54 1262306 2 wavelength is used to select the wavelength of the light from the observation source to be filterable by the wavelength The light emitted from the filter heats the substrate or the transfer layer. 22. A defect correction method for removing a defect on a patterned substrate, comprising: a step of detecting a defect on the substrate; and: irradiating the pulsed laser light to a thin pancreas disposed opposite to the substrate And the step of removing a part of the above film and the defect by using the laser removal method. 3. The defect correction method of claim 22, wherein the method further comprises the step of thinning the film by irradiating the pulsed laser light, and irradiating the pulse in the thinned portion of the film. The laser light is used, and the laser is used to remove the defects of the above-mentioned film at the same time. = a method for correcting defects in item 22 or 23 of the patent range of the invention, which further includes: changing the film to a film having a film transferable to the substrate; and irradiating the pulsed laser light There is a step of transferring the transfer layer to the above substrate. 25.: In the defect of the 22nd item or the (1) part of the patent application, the correction liquid of the eight-corrected pattern is selected from the step of removing the above-mentioned film from the substrate, and the substrate is removed. The step of the above film. 2 = defect correction method, which is a defect correction method for correcting a defect by transferring a pattern onto a defective portion of a patterned substrate, and having a defect: 315540 55 1262306 a step of detecting a defect on the substrate; The surface has a step of approaching a film transferable to the transfer layer of the substrate; and a step of irradiating the transfer film to the substrate by irradiating pulsed laser light onto the film. 27. A defect correction method for correcting a defect of a patterned substrate, comprising: a step of detecting a defect on the substrate; a step of facing the film with the substrate; and irradiating the pulsed laser light a step of providing an opening in the film; a step of adhering the correction liquid of the pattern to be corrected through the opening to the defective portion of the substrate; and a step of removing the film from the substrate. A defect correction method for correcting a defect of a patterned substrate, comprising: a step of detecting a defect on the substrate; a step of aligning the film with the substrate; and irradiating the pulsed laser light a step of providing an opening in the film; a step of providing a film having the transfer layer at a position of the opening; and a step of transferring the transfer layer to the substrate through the opening. 29. If the patent application scope is 27 or 26, the defect correction method is 315540 56 1262306, which is further provided with: removing the above-mentioned film around the opening portion and being provided for removing the substrate and having the above In the step of transferring the air removing portion of the air between the films of the transfer layer, a film having the transfer layer is provided at a position of the opening portion and the air removing portion. The defect correction method according to any one of claims 22, 26, 27, and 28, wherein the gas is ejected to the film or the film having the transfer layer to be bonded to the substrate Close. 31. A method for producing a pattern substrate, comprising: a step of forming a pattern on a substrate; a step of detecting a defect on the substrate; and irradiating the pulsed laser light on a film disposed opposite to the substrate, and using a laser removal method The step of simultaneously removing one of the above films and the above defects is roughly performed. The method of manufacturing a pattern substrate according to claim 31, further comprising: a step of changing the film to a film having a transfer layer transferable to the substrate; and irradiating the pulsed laser light with the above The step of transferring the transfer layer to the substrate by transferring the film of the layer. The method of manufacturing a pattern substrate according to claim 31, further comprising: a step of: applying a correction liquid according to the pattern to be corrected, a portion from which the film has been removed to the substrate; and removing the film from the substrate A step of. A method for producing a pattern substrate, which is a method for producing a pattern substrate by patterning a defect portion of a patterned substrate, and having a pattern of 315540 57 1262306: forming a pattern on the substrate; detecting formation a step of patterning a defect on the substrate; a printing layer having a step of facing the substrate opposite to the substrate having a film transferable to the substrate; and T exposing the pulsed laser light to the defect of the film printed on the substrate Part of the steps. 3 5 . A method of manufacturing a pattern substrate, comprising: patterning the transfer layer to produce a patterned substrate a step of forming a pattern on the substrate; a step of detecting a defect on the substrate; a step of facing the film toward the substrate; irradiating the pulsed laser light onto the film, and the step of providing the opening portion is corrected by the opening π portion (4) Correcting (4) a step of forming a defective portion of the substrate; and a method for manufacturing the pattern substrate by removing the thin film from the substrate, and manufacturing the method for manufacturing a substrate, comprising: a step. a pattern of a patterned substrate; a step of forming a pattern on the substrate; a step of detecting a defect on the substrate; a step of aligning the / film with the substrate; irradiating the pulsed laser light to the film a step of providing an opening portion 315540 58 1262306, a step of providing a film having a transfer layer at a position of the opening portion, a step of transferring the transfer layer to the substrate through the opening portion, and removing the film from the substrate step. The method of manufacturing a pattern substrate according to claim 35 or claim 36, further comprising: a step of removing the film around the opening and providing an air removing portion, and removing the opening and the air A film having the above transfer layer is disposed at a position of the portion. 38. The method for manufacturing a pattern substrate according to any one of the claims, wherein the film is sprayed to the film or the film having the transfer layer to be close to the substrate. . 315540 59