JP2006139271A - Apparatus and method for removing unwanted film, and method for manufacturing photomask blank - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for removing an unwanted film, which can surely remove unwanted resist residues of the periphery part of a substrate having a resist, and to provide a method for manufacturing a photomask blank. <P>SOLUTION: A shielding member (cover member) 4 is provided at a specified interval from the surface of the substrate 1 so that a chemical liquid is not supplied to parts other than the unwanted, and a chemical liquid guide member 3 is provided at the outside the shielding member 4 so that the chemical liquid is supplied to the peripheral part of the substrate. The shielding member 4 is provided with interval adjusting members for adjusting the interval to the major surface of the substrate at three or more locations. If the installation locations of the interval adjustment members is connected to the installation location by a straight line, they will not be positioned on the straight line. When the shielding member is rotated by a prescribed angle with the origin as the center of the surface of the substrate with respect to the substrate 1, it is positioned so as not to overlap with the installation locations of the interval adjusting members before rotation, or the interval adjusting member is provided with a moving mechanism. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to an unnecessary film removing apparatus and an unnecessary film removing method for removing an unnecessary film formed on a part of a substrate surface such as a photomask blank, a semiconductor substrate, a magnetic disk substrate and a color filter, and a photo using the same. The present invention relates to a method for manufacturing mass blanks.

In the field of manufacturing semiconductor substrates, photomasks and photomask blanks, magnetic disk substrates, color filters, etc., it is often required to remove unnecessary portions of coating films and other films formed on one main surface of the substrate. The
Resist on the substrate, resist underlayer anti-reflective coating (BARC), resist anti-reflective coating (TARL), resist upper layer protective film, conductive film, etc. (in this specification, When a representative (generally referred to as a resist) is applied by a spin coating method or the like, or when they are laminated and applied, the coating liquid accumulates at the peripheral edge of the substrate surface, or on the substrate side surface, or in some cases on the substrate back surface. A relatively thick resist is formed on the periphery of the photomask blank.

For example, when the photomask blanks are taken in and out of the container, the resist on the peripheral edge of the substrate is easily peeled off and dropped by contact with the container. In addition, this thick film part cracks easily when it is processed with a chemical solution such as a developer in the subsequent mask manufacturing process, and it is easy to peel off and fall off, and it becomes dust and reattaches to the photomask blank itself or various processing equipment. Finally, it causes defects in masks (including reticles), which are products made from photomask blanks, or causes a reduction in manufacturing yield.
In addition, when a photomask blank having a resist film formed on the main surface of the substrate is attached to the exposure apparatus, the substrate peripheral portion may be supported. In this case, the substrate peripheral portion is raised. If it is, it will not be favorably supported. Furthermore, when the exposure apparatus is an electron beam mask drawing apparatus, when the photomask blank is grounded at the time of exposure, the light shielding film mainly composed of chromium under the resist film and the ground probe are not in good contact. Occurs.
Therefore, in such a case, it is necessary to remove an unnecessary coating film on the peripheral edge of the substrate.

In order to solve the above problems, there is a method disclosed in Japanese Patent Laid-Open No. 2001-259502 as a technique for removing an unnecessary resist film formed on the peripheral edge of the substrate (FIG. 9). In this method of removing unnecessary films, after applying and forming a resist film, the cover member 3 having a large number of fine holes formed on the periphery of the substrate is placed on the substrate, and a chemical solution is supplied from above the cover member. Thus, the chemical solution is supplied to the peripheral portion of the substrate through the fine holes, so that the resist film formed on the peripheral portion of the substrate is dissolved and removed. In addition, the distance between the substrate and the cover member is such that a thread (spacing adjustment member) is formed in the hole at the same position on each side so that the surface tension of the chemical solution is constant so that the chemical solution does not penetrate into the center side of the substrate. The substrate was held by holding bases at two corners of the four corners of the substrate.
However, when expanding the effective area of the substrate (that is, reducing the unnecessary film removal area (width) in the vicinity of the chamfered surface on the main surface of the substrate), strict control of the removal width, and reliable removal without removal residue, etc. However, in the prior art disclosed in Japanese Patent Laid-Open No. 2001-259502, the following problems have become prominent.

1) If the diameter of the fine holes provided in the outer periphery of the cover member is too large, the boundary between the removal region and the non-removal region becomes jagged, and it is difficult to maintain the mechanical strength of the cover member as much as possible. The smaller one was preferred, but when the hole diameter is small, the chemical solution is supplied along the upper surface of the cover member, so the supply amount of the chemical solution to the hole cannot be controlled, and the chemical solution is sufficiently in the removal region. Since it is not supplied, a resist residue may occur at the peripheral edge of the substrate.
2) Since the thread (interval adjusting member) provided in the cover member in order to keep the distance between the substrate and the cover member constant is in contact with the substrate even during the unnecessary film removal, this contact portion The resist residue could not be removed.
3) Since the substrate holding member provided for holding the substrate is in contact with the substrate even during the unnecessary film removal, the resist residue at the portion in contact with the substrate holding member could not be removed. .
JP 2001-259502 A

Accordingly, the present invention provides an unnecessary film removing apparatus and an unnecessary film removing method capable of solving the above-described problems of the prior art and surely removing an unnecessary film (for example, resist) on the peripheral edge of the substrate. In addition, the resist film on the periphery of the substrate is reattached to the photomask blank itself or to various processing equipment by peeling and dropping, and finally the photomask blanks as raw materials are reduced in defects or manufacturing yield. It is an object of the present invention to provide a photomask blank manufacturing method that can be prevented.
The photomask blank referred to in the present invention has a broad meaning including a photomask blank in which a light shielding film is formed on a substrate and a phase shift mask blank in which a phase shift film having a phase shift function is formed on a substrate. Refers to the photomask blank.

The present invention has been made in order to solve the above-described problems, and the gist thereof is the following contents as described in the claims. The following (1) to (6) correspond to claims 1 to 6.
(1) An unnecessary film removing apparatus that removes an unnecessary film portion by supplying a chemical solution only to an unnecessary portion of a film formed on a substrate surface including a peripheral portion of the substrate,
The unnecessary film removing apparatus is
Substrate holding means for holding the substrate so as to rotate the substrate in-plane;
Chemical supply means for supplying the chemical,
A shielding member that covers the substrate main surface such that a certain gap is formed with the main surface in the removal region of the substrate main surface, and a space larger than the gap is formed in the non-removal region of the substrate main surface. When,
The shielding member is provided with three or more spacing adjustment members facing the substrate main surface so that the gap has a size that allows the chemical solution to propagate through the gap and spread only in the gap. And
The installation position of the spacing adjustment member is a position that is not arranged in a straight line when the installation position is connected by a straight line, and the shielding member is rotated by a predetermined angle with respect to the substrate with the center of the substrate surface as the origin And the position that does not overlap with the installation position of the spacing adjustment member before rotation,
The unnecessary film removing apparatus, wherein the shielding member is disposed so as to be rotatable together with the substrate holding means.

According to this solution, the unnecessary film in the region where the shielding member is in contact with the main surface of the substrate, by rotating the shielding member by a predetermined angle with respect to the substrate during the unnecessary film removal step. Residue after removal can be reliably prevented.
Here, the spacing adjusting member may be made of any material as long as it is resistant to the chemical solution so as to have a constant spacing with respect to the main surface of the substrate. A convex portion (protrusion) that is mechanically convex may be formed on the surface of the shielding member facing the substrate main surface, or may be formed of a string-like body (for example, a resin thread) that is resistant to chemicals. good.
Further, three or more spacing adjustment members can be used to specify the plane of the shielding member that faces the substrate main surface, and the distance between the substrate main surface and the plane of the shielding member that faces the substrate main surface is a constant interval. Because it can be done.
The installation position of the interval adjusting member is adjusted according to the shape of the substrate. That is, when the shape of the substrate is a square, when the shielding member is rotated 90 degrees, 180 degrees, and 270 degrees with the center (rotation center) of the substrate main surface as the origin relative to the substrate, the interval adjusting member before the rotation If the substrate shape is rectangular (excluding squares), the rotation is performed when the shielding member is rotated 180 degrees with the center of the substrate surface as the origin relative to the substrate. What is necessary is just to set it as the position which does not overlap with the installation position of the front space | interval adjustment member. That is, after the shielding member rotates by a predetermined angle with respect to the substrate, and when the corresponding position between the substrate and the shielding member before the rotation rotates at an angle that does not change, a position that does not overlap with the installation position of the interval adjusting member before the rotation. do it.

Moreover, it is preferable that the gap is set to have a size that allows the chemical solution to propagate through the gap and spread only in the gap. That is, in the removal region of the main surface of the substrate, the surface tension of the chemical solution acts in the gap formed between the substrate and the shielding member, and the chemical solution is filled (supplied) into the gap. In the space formed in the non-removed area, the surface tension of the chemical solution does not work, so it is not supplied.
In addition, the shielding member is provided in a region (removal region) of an unnecessary film portion formed on the main surface of the substrate with a certain interval and a certain width from the substrate main surface. Is set to a size that can be filled only in the gap by the surface tension of the chemical solution when the chemical solution is supplied to the gap formed by this interval, so that the substrate can be adjusted by adjusting the width. The removal area on the main surface can be controlled.
In addition, the following configuration may be added to this solution.
That is, the unnecessary film removing device has a chemical solution guide member that is positioned outside the shielding member and forms a flow path of the chemical solution in cooperation with the shielding member, and the shielding member and the chemical solution guide member are An unnecessary film removing apparatus, which is disposed so as to be rotatable together with the substrate holding means.
The unnecessary film removing apparatus has a plurality of substrate holding members so that the substrate holding means holds the substrate at a plurality of positions on the bottom surface and the side surface of the substrate, and the installation position of the substrate holding member is the substrate holding device. An unnecessary film removing apparatus that sets a position that does not overlap with an installation position of a substrate holding member before rotation when the substrate is rotated by a predetermined angle with respect to a member.

(2) An unnecessary film removing apparatus that removes an unnecessary film portion by supplying a chemical solution only to an unnecessary portion of a film formed on a substrate surface including a peripheral portion of the substrate,
The unnecessary film removing apparatus is
Substrate holding means for holding the substrate so as to rotate the substrate in-plane;
Chemical supply means for supplying the chemical,
A shielding member that covers the substrate main surface such that a certain gap is formed with the main surface in the removal region of the substrate main surface, and a space larger than the gap is formed in the non-removal region of the substrate main surface. When,
The shielding member is provided with three or more spacing adjustment members facing the substrate main surface so that the gap has a size that allows the chemical solution to propagate through the gap and spread only in the gap. And
An installation position of the interval adjustment member is a position that is not arranged on a straight line when the installation position is connected by a straight line, and a moving mechanism that moves in parallel along the substrate side surface by a predetermined amount is provided.
The unnecessary film removing apparatus, wherein the shielding member is disposed so as to be rotatable together with the substrate holding means.

According to this solution, even if the shielding member is not rotated by a predetermined angle with respect to the substrate during the unnecessary film removal step, it is an unnecessary film portion region (removal region), and the shielding member is in contact with the substrate main surface. Residues after unnecessary film removal at the contacted portion can be reliably prevented.
In addition, as an example of a moving mechanism in which the interval adjusting member moves in parallel by a predetermined amount along the substrate side surface direction, the interval adjusting member has a spherical structure with a diameter of 0.1 mm, and this member is opposed to the main surface of the substrate. It is preferable to use a mechanism that moves to a place where no residue is generated by an electric drive, an air cylinder, or the like by the guide groove of the shielding member provided.
Moreover, it is preferable that the gap is set to have a size that allows the chemical solution to propagate through the gap and spread only in the gap. The reason is as described above.
In addition, the following configuration may be added to this solution.
That is, the unnecessary film removing device has a chemical solution guide member that is positioned outside the shielding member and forms a flow path of the chemical solution in cooperation with the shielding member, and the shielding member and the chemical solution guide member are An unnecessary film removing apparatus, which is disposed so as to be rotatable together with the substrate holding means.
The unnecessary film removing apparatus has a plurality of substrate holding members so that the substrate holding means holds the substrate at a plurality of positions on the bottom surface and the side surface of the substrate, and the installation position of the substrate holding member is the substrate holding device. An unnecessary film removing apparatus that sets a position that does not overlap with an installation position of a substrate holding member before rotation when the substrate is rotated by a predetermined angle with respect to a member.

(3) An unnecessary film removing apparatus that removes an unnecessary film portion by supplying a chemical solution only to an unnecessary portion of a film formed on a substrate surface including a peripheral portion of the substrate,
The unnecessary film removing apparatus is
Substrate holding means for holding the substrate so as to rotate in-plane;
Chemical supply means for supplying the chemical,
A shielding member that covers the substrate main surface such that a certain gap is formed with the main surface in the removal region of the substrate main surface, and a space larger than the gap is formed in the non-removal region of the substrate main surface. When,
The gap is set to a size that allows the drug solution to pass through the gap and spread only in the gap.
The substrate holding means has a plurality of substrate holding members so as to hold the substrate at a plurality of positions on a bottom surface and a side surface of the substrate, and the substrate holding member is installed at a predetermined angle with respect to the substrate holding member. When rotated, set the position so that it does not overlap with the installation position of the substrate holding member before rotation,
The unnecessary film removing apparatus, wherein the shielding member is disposed so as to be rotatable together with the substrate holding means.

According to this solution, by rotating the substrate by a predetermined angle with respect to the substrate holding means during the unnecessary film removing step, conventionally, after unnecessary film removal at the portion where the substrate and the substrate holding member of the substrate holding means abut on each other, Residues can be reliably prevented.
The installation position of the substrate holding member is adjusted according to the shape of the substrate. That is, when the substrate has a square shape, when the substrate is rotated 90, 180, or 270 degrees from the center (rotation center) of the substrate main surface with respect to the substrate holding means, the substrate is held before rotation. When the substrate is rotated by 180 degrees with respect to the substrate holding means with the center of the main surface of the substrate as the origin when the shape of the substrate is rectangular (excluding the square) Furthermore, the position may be a position that does not overlap with the installation position of the substrate holding member before rotation. That is, after the substrate is rotated by a predetermined angle with respect to the substrate holding means and when the corresponding position between the substrate holding means and the substrate before the rotation is rotated at an angle that does not change, it does not overlap with the installation position of the substrate holding member before the rotation. It may be the position.

Moreover, it is preferable that the gap is set to have a size that allows the chemical solution to propagate through the gap and spread only in the gap. The reason is as described above.
In addition, the following configuration may be added to this solution.
That is, the unnecessary film removing device has a chemical solution guide member that is positioned outside the shielding member and forms a flow path of the chemical solution in cooperation with the shielding member, and the shielding member and the chemical solution guide member are An unnecessary film removing apparatus, which is disposed so as to be rotatable together with the substrate holding means.
Further, the unnecessary film removing device may have three or more gap adjustment members facing the substrate main surface so that the gap has a size that allows the chemical solution to propagate through the gap and spread only in the gap. Is provided on the shielding member, and the installation position of the spacing adjustment member is a position that is not arranged on a straight line when the installation position is connected by a straight line, and the center of the substrate surface with respect to the substrate is the origin The unnecessary film removing apparatus which makes it the position which does not overlap with the installation position of the space | interval adjustment member before rotation when the said shielding member rotates a predetermined angle.
Further, the unnecessary film removing device may have three or more gap adjustment members facing the substrate main surface so that the gap has a size that allows the chemical solution to propagate through the gap and spread only in the gap. Is provided on the shielding member, and the installation position of the interval adjusting member is set to a position that is not arranged on a straight line when the installation position is connected by a straight line, and is parallel to the substrate side by a predetermined amount. An unnecessary film removing apparatus comprising a moving mechanism for moving.

(4) An unnecessary film removing method using the unnecessary film removing apparatus according to (1), wherein a substrate is placed on the substrate holding means, and the chemical solution is supplied while rotating the substrate and the shielding member together. After removing the unnecessary film portion by supplying the chemical solution from the means and supplying the chemical solution only to the unnecessary portion of the film formed on the substrate surface including the peripheral edge of the substrate along the outer wall of the shielding member, The shielding member is rotated by a predetermined angle with respect to the substrate with the center of the main surface of the substrate as the origin, and the unnecessary film portion formed at the position where the gap adjusting member and the substrate are in contact with each other is removed. An unnecessary film removing method characterized by the above.
According to this solution, the unnecessary film in the region where the shielding member is in contact with the main surface of the substrate, by rotating the shielding member by a predetermined angle with respect to the substrate during the unnecessary film removal step. Residue after removal can be reliably prevented.

(5) An unnecessary film removing method using the unnecessary film removing apparatus according to (2), wherein a substrate is placed on a substrate holding member of the substrate holding means, and the substrate and the shielding member are both rotated. An unnecessary film portion is supplied by supplying a chemical solution from the chemical solution supply means and supplying the chemical solution only to an unnecessary film portion of the film formed on the substrate surface including the peripheral edge of the substrate through the outer wall of the shielding member. After the substrate is removed, the substrate holding means is rotated by a predetermined angle with respect to the center of the substrate main surface as the origin, and the unnecessary substrate formed at the place where the substrate holding member before rotation and the substrate are in contact with each other is formed. An unnecessary film removing method comprising removing a film portion.
According to this solution, by rotating the substrate by a predetermined angle with respect to the substrate holding means during the unnecessary film removing step, conventionally, after unnecessary film removal at the portion where the substrate and the substrate holding member of the substrate holding means abut on each other, Residues can be reliably prevented.
In addition, the shielding member is rotated by a predetermined angle with respect to the substrate in the middle of the unnecessary film removing step, and further, the substrate is rotated by a predetermined angle with respect to the substrate holding means, so that the shielding member is in contact with the main surface of the substrate, and the substrate. This is preferable because the residue after the unnecessary film removal at the portion in contact with the substrate holding member can be surely prevented.

(6) In the photomask blank manufacturing method including a film forming step of forming a film such as a light shielding film on a light-transmitting substrate, an unnecessary film formed in an unnecessary portion in the film forming step is (4) or (5) A method for producing a photomask blank, comprising a step of removing an unnecessary film by the method for removing an unnecessary film described in 1.
According to this solution, since residues (for example, resist residues) after unnecessary film removal can be reliably prevented, dust generation from the peripheral edge of the substrate when the photomask blank is stored can be prevented. .
The above-described film such as a light shielding film refers to a thin film, a resist film, or a functional film such as a conductive film or a protective film that causes an optical change (light shielding function or phase change) with respect to exposure light. Unnecessary film removal means removing at least one of the films.

According to the present invention, it is possible to provide an unnecessary film removing apparatus and an unnecessary film removing method capable of reliably removing unnecessary resist residues on the peripheral edge of the substrate, and a photomask blank manufacturing method. And dust generation from the peripheral edge of the substrate in the subsequent mask manufacturing process can be reliably prevented. In addition, it is possible to achieve reduction in defects of masks (including reticles) that are products using photomask blanks as raw materials or prevention of reduction in manufacturing yield.
Also, not only the removal of the unnecessary resist film on the peripheral portion with only the solvent, but also resist application → peripheral (unnecessary portion) exposure → periphery (unnecessary portion) development removal → developer supply in the peripheral (unnecessary portion) development removal process by heat treatment It can be used as a means and method, and has significant industrially useful effects. Specifically, it has the following effects.

A shielding member (cover member) provided with three or more interval adjusting members for adjusting the interval with the main surface of the substrate is provided, and the installation position of the interval adjusting member is straightforward when the installation positions are connected by a straight line. A position that is not arranged on a line and that does not overlap with the position of the interval adjusting member before rotation when the shielding member (cover member) is rotated by a predetermined angle with respect to the substrate with the center of the substrate main surface as the origin. Or, by providing the distance adjustment member with a movement mechanism that moves in parallel by a predetermined amount along the side surface direction of the substrate, it is possible to reliably prevent residues after the unnecessary film is removed at the portion where the shielding member contacts the main surface of the substrate. can do.
A substrate holding means for holding a substrate is provided with a plurality of substrate holding members for holding the substrate at a position where the substrate holding unit is in contact with the substrate, and an installation position of the substrate holding member holds the substrate with respect to the substrate holding member. By rotating the substrate by a predetermined angle with respect to the substrate holding member during the unnecessary film removal step, the substrate is not rotated with the position where the substrate holding member is rotated before the rotation by a predetermined angle. It is possible to reliably prevent the residue after the unnecessary film is removed from the portion in contact with the substrate holding member.

Embodiments of the present invention will be described in detail with reference to FIGS.
FIG. 1 is a cross-sectional view showing the structure of the unnecessary film removing apparatus in a state where a substrate with a resist is set in the unnecessary film removing apparatus of the present invention.
In FIG. 1, a substrate 1 includes a transparent substrate (152.4 mm × 152.4 mm × 6.35 mm) made of synthetic quartz glass and a light shielding film mainly composed of chromium formed on the surface of the light shielding film. 2 is a photomask blank in which the resist 2 is formed to a desired film thickness by spin coating or the like.
Here, the resist 2 may be originally formed only in a desired effective region on the surface of the substrate 1. However, when the resist 2 is formed, the resist 2 is formed even on the peripheral portion of the front surface of the substrate 1, the side surface portion of the substrate 1, and possibly the back surface portion of the substrate. The unnecessary film removing method and apparatus according to the present invention are a method and apparatus for removing these unnecessary films.

<First Embodiment>
As shown in FIG. 1, the unnecessary film removing apparatus of the first embodiment removes an unnecessary film portion formed on the substrate 1 and substrate holding means 9 that holds the substrate 1 so as to rotate in-plane. The chemical solution supply means 6 for supplying the chemical solution, the inner cover member 4 which is a shielding member provided so as not to supply the chemical solution to the substrate main surface other than the unnecessary film portion, and the inner cover member 4 can be used together. It is comprised by the outer cover member 3 which is a chemical | medical solution guide member which forms a flow path.
The substrate holding means 9 includes a plurality of substrate holding members 5 provided on a substrate holding base 10 that also serves as a spin chuck so as to be held in parallel at a plurality of positions on the bottom and side surfaces of the substrate 1. The substrate holding member 5 has a shape that makes surface contact or line contact with the bottom and side surfaces of the substrate so that the substrate 1 can be stably held during rotation.
The substrate holding member 5 has, for example, a shape in which one cylinder or two cylinders having different sizes are stacked. When the substrate 1 has a square shape, two corners are provided at both ends of the diagonal direction of the substrate 1 so that the corners are sandwiched, and surface contact and line contact are made at the bottom and side surfaces of the substrate holding member 5 (column). A cylindrical substrate holding member 5 is determined so that the position of the substrate 1 is determined, and the lower surface of the substrate can be held in parallel with the upper surface of the substrate holding member 5 (cylinder) in one position at both ends in the other diagonal direction. Is provided on the substrate holding base 10.

  The inner cover member 4 is shaped to cover the main surface of the substrate 1 so as to cover it. Most of the shape from the central part of the substrate to the periphery has a substantially flat flat part, and both outer peripheral ends of the flat part are bent downward at a substantially right angle to form a side part. ing. When the inner cover member 4 is provided on the main surface of the substrate 1, the inner cover member 4 is fixed so that a certain gap is formed with a bottom surface of the side surface portion of the inner cover member. At this time, the outer side of the bottom surface of the side surface portion of the inner cover member 4 is an unnecessary portion (removal region) on the substrate main surface. Further, the flat portion other than the side surface portion of the inner cover member 4 is formed with a space larger than the size of the gap and becomes a non-removal region. In addition, there is no restriction | limiting in particular how the inner cover member is fixed for forming a certain gap with respect to the substrate. An interval adjusting member to be described later may be provided on the bottom surface of the side surface portion and placed on the main surface of the substrate 1, or may be fixed so as to be suspended from above the substrate main surface. By forming the inner cover member 4 in the above shape, when the chemical solution is supplied to the gap formed between the bottom surface of the side surface portion of the inner cover member 4 and the main surface of the substrate, the surface tension of the chemical solution works, The chemical solution is filled in the gap, but the chemical solution is not supplied because the surface tension of the chemical solution does not work in the space formed in the non-removed region of the main surface of the substrate.

Further, an outer cover member 3 is provided so as to cover the inner cover member 4 and the side surface of the substrate 1 so that the chemical solution can be sufficiently supplied to the gap and unnecessary film portions on the side surface of the substrate. The outer cover member 3 and the inner cover member 4 are fixed by a connecting member 7 so that a gap is formed between the outer cover member 3 and the inner cover member 4, and the outer cover member 3 and the inner cover member 4. Between these is a flow path for the chemical solution, and the supply amount of the chemical solution to an unnecessary film portion can be adjusted by adjusting the cross-sectional area of the flow channel and the flow rate of the chemical solution. The outer cover member 3 supplies the chemical solution above the outer cover member 3 so that the chemical solution supplied by the chemical solution supply means travels along the outer periphery of the inner cover member 4 and is supplied to unnecessary film portions of the substrate 1. An opening serving as a supply port for the chemical solution from the means 6 is provided.
As described above, the present invention provides the chemical liquid guide member that forms the chemical liquid flow path in cooperation with the shielding member (cover member), so that the chemical liquid passes through the gap between the substrate and the shielding member. It is unnecessary among the films formed on the substrate surface by adjusting the distance between the shielding member (cover member) and the chemical solution guide member and the flow rate of the chemical solution while maintaining a size that can be spread only in the gap. The amount of the chemical solution supplied to such a portion can be made sufficiently and controllable, and the residue after removing the unnecessary film can be surely prevented.
The substrate holding base 10 is provided with pins 11 for positioning so that the rotation center of the substrate holding means 9 and the rotation centers of the inner cover member 4 and the outer cover member 3 coincide. (Since the substrate 1 is held by the substrate holding means 9, the rotation centers of the substrate 1, the inner cover member 4, and the outer cover member 3 coincide with each other.)

Unnecessary films formed on the substrate surface are removed by the chemical solution supplied by the chemical solution supply means 6. The chemical solution supply means 6 has, for example, a nozzle shape, and is installed on the opening provided above the outer cover member 3 and on the back surface of the substrate 1. The chemical solution supply means 6 installed on the back surface of the substrate 1 is mainly for removing unnecessary films adhering to the back surface of the substrate 1. For example, a solvent such as acetone or a developer such as TMAH (tetra-meryl-ammonium hydroxide) is used as the chemical solution.
The chemical solution supplied from the chemical solution supply means 6 is supplied to an unnecessary film portion formed on the surface of the substrate through the outer periphery of the inner cover member 4 using the passage between the inner cover member 4 and the outer cover member 3 as a flow path. The The substrate 1 is held by the substrate holding means 9, and the substrate holding means 9 and the outer cover member 3 are fixed by the pins 11 provided on the substrate holding base 10 of the substrate holding means 9 (the outer cover member 3 and Since the inner cover member 4 is fixed by the connecting member 7), the unnecessary film dissolved by the chemical solution is caused by centrifugal force when the substrate 1, the inner cover member 4, and the outer cover member 3 rotate together. Removed outward. When supplying a chemical solution to an unnecessary film portion of the substrate 1, it is preferable that the substrate 1, the inner cover member 4, and the outer cover member 3 are rotated because the chemical solution can be supplied uniformly to the peripheral portion of the substrate 1.

FIG. 10 is a cross-sectional view showing a modification of the unnecessary film removing apparatus of the first embodiment.
In FIG. 10, covering the upper surface side of the substrate with resist (mask blanks) with the inner cover member 4 that is a shielding member is the same as in the first embodiment described above, but the outer cover member 3 that is a chemical guide member. However, it differs in that it is installed on the substrate holding base 10 and is arranged outside so as to surround the side surface portion of the inner cover member 4 and the side surface portion of the substrate 1. The inner cover member 4 has a shape in which the outer periphery of the inner cover member 4 is slanted so that the chemical solution is sufficiently supplied to the flow path between the inner cover member 4 and the outer cover member 3.
The chemical solution supplied from the chemical solution supply means 6 is supplied to the flow path between the inner cover member 4 and the outer cover member 3 from an inclined surface formed on the outer periphery of the inner cover member 4, and is unnecessary formed on the surface of the substrate. Supplied to the membrane part. When the substrate 1, the inner cover member 4, and the outer cover member 3 rotate together, the unnecessary film dissolved by the chemical solution is removed outward by centrifugal force.

FIG. 2 shows the details of the contact portion between the inner cover member and the substrate, showing an example for forming a certain gap between the main surface of the substrate and the inner cover member 4 in the unnecessary film removing region of the main surface of the substrate. FIG.
On the bottom surface of the side surface portion of the inner cover member 4 (unnecessary film removal region on the main surface of the substrate), a convex portion 8 that is a distance adjusting member for adjusting the distance between the inner cover member 4 and the substrate (resist) surface is provided. The distance between the bottom surface of the side surface portion of the inner cover member 4 and the surface of the resist 2 is held at a constant distance of about 0.1 mm by the convex portion 8. This distance is set so that the chemical solution can be transmitted only in the gap formed by the bottom surface of the side surface portion of the inner cover member 4 and the surface of the resist 2 by surface tension. Thereby, it is possible to prevent the chemical solution from entering a desired effective area that should not damage the formed resist film.
Three or more convex portions 8 are provided on the bottom surface of the side surface portion of the inner cover member.
The reason why the number is three or more is that if the number is three or more, the plane can be specified, and the gap between the bottom surface of the side surface portion of the inner cover member 4 and the substrate surface is determined.

  The convex portion 8 may be formed by machining the bottom surface of the side surface portion of the inner cover member 4 or may be attached to the bottom surface of the side surface portion of the inner cover member 4 having a certain height. For example, the convex portion 8 can be formed of a string-like body (for example, a resin thread) that is resistant to a chemical solution. Resin yarn is easy to obtain, and it is easy to keep the gap between the inner cover member 4 and the resist 2 constant by being sandwiched between the bottom surface of the side surface of the inner cover member 4 and the surface of the resist 2. That's why. The thickness d1 of the thread, that is, the size d1 of the gap between the bottom of the side surface of the inner cover member 4 and the surface of the resist 2 is such that when the chemical solution is supplied to this gap, the chemical solution moves from the gap toward the center of the substrate. The size is set such that it can be filled only in the gap without protruding. Preferably, d1 is set to 0.05 to 3 mm. If it is less than 0.05 mm, it will be difficult for the chemical solution to sufficiently enter the gap, and if the gap is not filled with the chemical solution and cannot be removed, or the boundary between the removed portion and the other portion becomes jagged. Because there are cases. If it exceeds 3 mm, the surface tension will not work, so the chemical solution flows toward the center of the substrate, and the resist film is removed to the area where the resist film must be formed (non-removed area).

<Second Embodiment>
FIG. 3 is a view for explaining an installation location of a gap adjusting member which is a main part of the unnecessary film removing apparatus and the unnecessary film removing method of the second embodiment. In the example shown in FIG. 3, the inner cover member 4 and the outer cover member 3 (in the case of explaining FIG. 3, the inner cover member 4 and the outer cover member 3 in the unnecessary film removing apparatus of the first embodiment described above are used. The cover member is also referred to as a cover member.) However, the present invention is not limited to this example, and an unnecessary film removing device using only the inner cover member 4 may be used.
The marks (T1 to T3) in FIG. 3 are positions where the protrusions 8 before the unnecessary film removal step abuts against the unnecessary film removal region 12 on the main surface of the substrate. When the unnecessary film formed on the peripheral edge of the substrate is removed while the convex portion 8 is in contact with the removal region 12 at the position of the mark ●, a resist residue is generated because no chemical solution is supplied to the position of the mark ●. In order to remove the resist residue remaining at the position of the mark ●, the cover member is rotated 90 degrees counterclockwise with respect to the substrate, the position of the convex portion 8 is positioned at the mark X (T1 ′ to T3 ′), and again By restarting the unnecessary film removing step, it is possible to remove the resist residue remaining at the place where the convex portion 8 and the substrate before rotation are in contact with each other. That is, in the unnecessary film removing apparatus and the unnecessary film removing method of the second embodiment, when the position of the gap adjusting member is rotated by a predetermined angle with respect to the substrate, the center of the substrate surface being the origin, By setting the position so as not to overlap with the installation position of the gap adjusting member, it is possible to reliably prevent the residue after the unnecessary film is removed. In this embodiment, the cover member is rotated 90 degrees with respect to the substrate. However, when the substrate is square, it may be rotated 180 degrees or 270 degrees. Further, the cover member may be fixed and the substrate may be rotated.

<Third Embodiment>
FIG. 4 is a diagram for explaining a method of moving the interval adjusting member, which is a main part of the unnecessary film removing apparatus and the unnecessary film removing method according to the third embodiment. In the example shown in FIG. 4, the inner cover member 4 and the outer cover member 3 (in the case of explaining FIG. 4, the inner cover member 4 and the outer cover member 3 in the unnecessary film removing apparatus of the first embodiment described above are used. The cover member is also referred to as a cover member.) However, the present invention is not limited to this example, and an unnecessary film removing device using only the inner cover member 4 may be used.
The marks (T1 to T3) in FIG. 4 are positions where the protrusions 8 before the unnecessary film removal step abuts against the unnecessary film removal region 12 on the main surface of the substrate. When the unnecessary film formed on the peripheral edge of the substrate is removed while the convex portion 8 is in contact with the removal region 12 at the position of the mark ●, a resist residue is generated because no chemical solution is supplied to the position of the mark ●. In order to remove the resist residue remaining at the position of the mark ●, the position of the protrusion 8 is moved to the mark X (T1 ′ to T3 ′), and the unnecessary film removal process is restarted again, so that the protrusion before rotation The resist residue remaining at the place where the substrate 8 is in contact with the substrate 8 can be removed. That is, in the unnecessary film removing apparatus and the unnecessary film removing method of the third embodiment, after the unnecessary film is removed, the installation position of the interval adjusting member is moved in parallel along the substrate side surface direction. Can be reliably prevented.

Although the movement mechanism of this convex part 8 is not ask | required, the convex part 8 has a spherical structure of about 0.1 mm, for example, and the side surface direction of the board | substrate 1 along the groove | channel provided in the side part bottom face of the inner cover member 4. It is preferable to use a mechanism that moves in parallel by an air cylinder or the like.
FIG. 11 is a diagram illustrating the moving mechanism of the convex portion in the present invention.
In FIG. 11, the interval adjusting member (convex portion) can be moved in parallel to the side surface direction of the substrate by a piston cylinder and an elastic body (spring) attached to the inner cover member 4 that covers the upper surface of the substrate.

<Fourth Embodiment>
FIG. 5 is a view for explaining the substrate holding base and the substrate holding member in the substrate holding means which are the main part of the unnecessary film removing apparatus and the unnecessary film removing method of the fourth embodiment.
One (or more) each of the substrate holding base 10 also serving as a spin chuck shown in FIG. 5 is held at both ends in a pair of diagonal directions so as to hold the side surface and the back surface (or the chamfered surface on the back surface side) of the substrate 1. The substrate holding member 5 is provided with one substrate holding member 5 for holding (supporting) the back surface of the substrate 1 in the other diagonal direction. The substrate holding member 5 allows the substrate 1 to be mounted on the substrate holding base. These substrate holding pedestals 10 are rotated together with the substrate 1 and the cover member by a driving device (not shown), and the chemical solution is supplied from the chemical solution requesting means 6 so that the chemical solution is peripheral to the substrate. The unnecessary film is removed by being supplied to the part.

FIG. 6 is a view for explaining an installation position of the substrate holding means and a rotation method of the substrate holding means, which are main parts of the unnecessary film removing apparatus and the unnecessary film removing method of the fourth embodiment.
The circles in FIG. 6 are the positions of the substrate holding member 5 before the unnecessary film removal step. When the unnecessary film formed on the peripheral edge of the substrate is removed in a state where the substrate holding means 5 is in contact with the unnecessary film removal region (side surface and back surface of the substrate) at the position of the circle mark, it contacts the substrate 1 marked with the circle mark. Resist residue is generated because no chemical is supplied to the location. In order to remove the resist residue remaining at the position marked with ○, the substrate holding means is rotated 90 degrees counterclockwise with respect to the substrate, the position of the substrate holding member 5 is positioned at the mark X, and the unnecessary film removing step is performed again. By restarting, it is possible to remove the resist residue remaining at the position where the substrate holding member 5 and the substrate before rotation are in contact with each other. That is, in the unnecessary film removing apparatus and the unnecessary film removing method of the fourth embodiment, the position of the substrate holding member is rotated when the substrate holding means is rotated by a predetermined angle with the center of the substrate surface as the origin relative to the substrate. By setting the position so as not to overlap the previous position of the substrate holding member, it is possible to reliably prevent the residue after the unnecessary film is removed. In this embodiment, the substrate holding means (the position of the substrate holding member) is rotated by 90 degrees with respect to the substrate. However, when the substrate is square, it may be rotated by 180 degrees or 270 degrees. Further, the substrate holding means (the position of the substrate holding member) may be fixed and the substrate may be rotated.

<Example 1>
FIG. 7 (1) is a diagram for explaining the unnecessary film removing step (in the case of using only a chemical solution) of the present invention in the photomask blank manufacturing method. The photomask blank manufacturing process is a thin film such as a light-shielding film. A part after forming is taken out. In the case where the resist unnecessary film removal using only a chemical solution is adopted, the main steps after forming a thin film such as a light shielding film include the steps of resist coating (S101), unnecessary film removal (S102), and heat treatment (S103). .
First, a resist is spin-coated on the main surface of a substrate on which a thin film such as a light-shielding film is formed (S101), and then the resist-coated substrate is placed on the substrate holding base of the above-described unnecessary film removing apparatus. Put. The resist type used here is ZEP7000 (manufactured by Nippon Zeon).

Next, the resist-mounted substrate placed on the substrate holding base is composed of an outer cover member that is a chemical solution guide member and an inner cover member that is a shielding member provided so that no chemical solution is supplied to other than unnecessary portions. An unnecessary film on the peripheral edge of the substrate is supplied by supplying an organic solvent (acetone) to an unnecessary resist film portion on the peripheral edge of the substrate while covering the substrate with the cover member and rotating the resist-coated substrate and the cover member integrally at a predetermined rotation speed. Is removed. Next, the supply of the organic solvent is stopped, and the portion where the unnecessary film is removed is rotated and dried by rotating at a rotation speed higher than the predetermined rotation speed, and the removal of the unnecessary resist film on the peripheral edge of the substrate is completed. (S102).
Thereafter, by performing heat treatment (S103), a photomask blank in which a resist is formed only in a desired effective region at the center of the substrate can be obtained.
Here, FIG. 8 is a flowchart showing details of the unnecessary film removing step in the present invention. First, the resist-coated substrate after applying the resist is placed on the substrate holding base and covered with the above-described cover member.

Next, the substrate holding pedestal is rotated at a rotation speed f1 (adjusted in the range of 200 to 750 rpm (500 rpm in the present embodiment)), and at the same time, the chemical solution is supplied while finely adjusting the supply amount from the chemical solution supply means (nozzle). The substrate holding pedestal was rotated for a rotation time t1 (adjusted in the range of 5 to 300 seconds (30 seconds in this embodiment)), so that the chemical solution dissolved and removed the unnecessary film portion at the peripheral edge of the substrate (first unnecessary film). Removal step).
Next, the supply of the chemical solution from the chemical solution supply means (nozzle) was stopped, and then the substrate holding base was rotated at a rotation speed f2 (adjusted in the range of 350 to 2500 rpm (2000 rpm in this embodiment)). Thereby, the part from which the unnecessary film is removed is dried (first drying step).
At this stage, the entry of the chemical solution is hindered at the place where the three spacing adjusting members (convex parts) arranged on the inner cover member are in contact with the substrate with resist, and resist residue is generated at that place. It was.
Therefore, after the cover member was lifted, the cover member was placed again at a position where the substrate with resist and the substrate holding base were rotated 90 degrees together. By this operation, the position where the interval adjusting member (convex portion) and the resist-attached substrate are in contact with each other before the cover member is rotated with respect to the resist-attached substrate, and the contact after the cover member is rotated with respect to the resist-attached substrate. Since the location changes, the resist residue can be surely removed.

Further, in order to remove the resist residue at the place where the substrate holding member and the substrate with resist are in contact, after lifting the cover member, the substrate with resist is rotated 90 degrees together with the substrate holding base with respect to the cover member. Next, the substrate is lifted, and only the substrate holding pedestal is rotated 90 degrees with respect to the substrate with resist, and the substrate with resist and the cover member are placed again on the substrate holding pedestal. By this operation, both the location where the gap adjusting member and the substrate with resist were in contact before rotation, and the location where the substrate holding member and the substrate with resist were in contact are different from the locations where the contact is made after this operation. Resist residues at both locations can be removed reliably.
Then, the chemical solution supply, unnecessary film removal, and drying are performed again in the same procedure as described above. (Second unnecessary film removing step and second drying step)
By applying heat treatment after applying the resist and removing the unnecessary film, unnecessary resist residue does not remain at the location where the cover member or substrate holding member is placed. Therefore, resist is applied only to the desired effective area in the center of the substrate. A photomask blank having a film formed thereon was obtained.

<Example 2>
FIG. 7 (2) is a diagram for explaining the unnecessary film removing step (in the case of exposure / development processing) of the present invention in the photomask blank manufacturing method. A part after the thin film is formed is taken out. When removing unnecessary resist film by exposure / development processing, the main steps after forming a thin film such as a light shielding film are as follows: resist coating (S201), unnecessary film exposure processing (S202), unnecessary film development processing ( S203) and heat treatment (S204).
First, a resist is spin-coated on the main surface of a substrate on which a thin film such as a light shielding film is formed (S201). Here, the resist type used is a positive type polymer electron beam lithography exposure resist, and is ZEP7000 (manufactured by Nippon Zeon Co., Ltd.) having a slight sensitivity to far infrared rays.

Thereafter, only the unnecessary film portion of the resist-coated substrate coated with the resist is exposed by an exposure processing method to be described later (S202).
The exposed substrate with resist is placed on the substrate holding base of the unnecessary film removing apparatus. Next, the resist-mounted substrate placed on the substrate holding base is composed of an outer cover member that is a chemical solution guide member and an inner cover member that is a shielding member provided so that no chemical solution is supplied to other than unnecessary portions. Cover with the cover member, and supply the standard developer (ZED400 (manufactured by ZEON Corporation)) to the unnecessary resist film part at the peripheral edge of the substrate while rotating the substrate with the resist and the cover member as a unit at a predetermined rotation speed, and then Immediately instead of the developing solution, the standard rinsing solution ZMD-B was supplied to rinse the developing removal portion. Next, the supply of the rinsing liquid is stopped, and the substrate is rotated at a rotation speed higher than the predetermined rotation speed, so that the portion where the unnecessary film is removed is rotationally dried, and the removal of the unnecessary resist film on the peripheral edge of the substrate is completed. (S203).
An exposure method for exposing only the above-described unnecessary film portion was performed as follows. A mercury lamp equipped with a quartz fiber light guide (10 mmφ) fitted with a condenser lens with a focal length of 10 mm at the tip is used as an exposure light source, and a stencil mask having a 3 mm × 3 mm square opening is attached to the focal part. The stencil mask (exposure window) was placed at a position of 3 mm above the substrate so that about 2 mm overlapped from the substrate end toward the substrate center.

Next, the exposure light source was turned on, and at the same time, the substrate with resist was moved under the exposure window at a speed of about 10 mm per second by the scanning means. After the exposure of the two sides of the substrate with resist is completed, the substrate with resist is rotated 90 degrees, the other two sides are exposed in the same manner, and all four sides of the substrate with resist are exposed, so that only unnecessary film portions are exposed. An exposure process was performed.
The unnecessary film development processing was performed under the same processing conditions (rotation speed, rotation time) as in Example 1 except that the developing solution was used instead of the organic solvent in accordance with the flowchart shown in FIG.
Subsequently, the portion where the cover member and the substrate with resist in the unnecessary film development processing step (first unnecessary film removing step, first drying step) were in contact, and the substrate holding member and the substrate with resist were in contact with each other. In order to remove the resist residue at the location, after the cover member is lifted, the substrate with resist is rotated 90 degrees together with the substrate holding base with respect to the cover member, and then the substrate is lifted and only the substrate holding base is registered. The substrate with the resist and the cover member were rotated by 90 degrees with respect to the attached substrate, and the second unnecessary film removing step and the second drying step were performed.
Thereafter, by performing heat treatment (S103), a photomask blank in which a resist is formed only in a desired effective region at the center of the substrate can be obtained.
As a result, as in Example 1, unnecessary resist residue does not remain at the position where the gap adjusting member or the substrate holding member is placed on the resist-coated substrate in the unnecessary film development processing step. Photomask blanks in which a resist film is formed only in the region can be obtained.

<Comparative example>
Using the unnecessary film removing apparatus shown in FIG. 9, the unnecessary film on the peripheral portion of the substrate with the resist on which the resist was applied and formed on the main surface of the substrate on which the thin film such as the light shielding film was formed was removed. The resist used was ZEP7000 (manufactured by Zeon Corporation), which is the same positive polymer type electron beam drawing resist as in Examples 1 and 2. Further, in the flowchart of the unnecessary film removal process, the unnecessary film was removed by the same process as in Example 1 except that only the first unnecessary film removal process and the first drying process in FIG. 8 were performed. As a result, the unnecessary film removing apparatus in FIG. 9 is configured such that the solvent is supplied from the hole located on the peripheral edge of the substrate formed in the shielding member, but there is no outer cover member. Due to the force, most of the solvent supplied from the chemical solution supply means hardly flows into the hole formed in the shielding member (that is, the gap formed between the shielding member and the substrate). As a result, due to insufficient supply of the solvent, a portion that could not be removed occurred, and the boundary between the removed portion and the other portion became jagged. A string-like body (yarn) is used as a member for adjusting the distance between the cover member and the substrate surface with resist, and the place where the string-like body (yarn) is in contact with the substrate with resist and the substrate holding member There was an unnecessary resist residue in the place where the contact was made.

As described above, in Examples 1 and 2 and Comparative Example, in Examples 1 and 2, there is no resist residue at the peripheral edge of the substrate after the unnecessary film is removed. Generation of surface defects can be prevented. On the other hand, in the case of the comparative example, since there is a resist residue at the peripheral edge of the substrate after the unnecessary film is removed, the resist residue adheres to the photomask blank itself or various processing apparatuses due to peeling and dropping, and finally the photo resist It is impossible to prevent defects in the photomask, which is a product made from mask blanks, or a decrease in manufacturing yield.
Here, in the above embodiment, the rotation of the cover member and / or the substrate holding member with respect to the resist-coated substrate was performed once, but when the unnecessary film removing step and the drying step are performed three times or more, the cover member and / or the substrate The holding member may be rotated twice or more.

In the first embodiment, acetone is used as the solvent for dissolving the resist. However, the present invention is not limited to this, and any solvent that can dissolve and remove unnecessary films, such as a solvent that can dissolve the resist, may be used.
As a material constituting the cover member (the inner cover member which is a shielding member and the outer cover member which is a chemical liquid guide member), any material can be used as long as it is difficult to transmit heat, has resistance to chemical liquid, and has a predetermined mechanical strength. For example, a resin material, a glass material, a ceramic material, and a composite material of these materials can be used, among others, it is relatively difficult to transfer heat, easy to process, and easy to reduce weight. In addition, it is preferable that a portion covering a region other than an unnecessary film portion on the substrate surface of the cover member is made of the above material.
In Examples 1 and 2, the positive polymer type electron beam lithography exposure resist is used. However, the present invention is not limited to this, and it is needless to say that the present invention can be applied to a negative type, a chemically amplified resist, and a laser lithography exposure resist. Yes.

Further, in the above embodiment, an example applied to the method of manufacturing a photomask blank in which a resist film is formed on a light shielding film has been described. The present invention can also be applied to a photomask blank manufacturing method in which a prevention film (BARC) or the like is formed and a conductive film or a protective film is formed on the resist film. In that case, the BARC (resist undercoat film), resist film, conductive film or protective film (resist upper layer film), and the method described in Example 1 or 2 can be used as examples to remove unnecessary films. In that case, in addition to the substrate on which the light shielding film is formed, a reflective mask substrate in which a reflective film and an absorber or the like are laminated may be used. The present invention can also be applied to a method of manufacturing a phase shift mask blank in which an SOG film is formed on a light-transmitting substrate and a light shielding film pattern is formed on the SOG film. In that case, a film such as a transparent conductive film or an etching stopper film may be provided outside the light shielding film.
Further, for example, it is formed on the electrode part of the wiring on the substrate for liquid crystal display, or the removal of an unnecessary film formed when the protective film or lubricating film of the magnetic disk medium is applied, or the protective film of the color filter is applied. It can also be applied when removing the insulating film. For example, when the unnecessary film is a resist, a liquid such as a ketone, ester, aromatic hydrocarbon, halogenated hydrocarbon, or ether in which the resist is soluble can be used as the chemical solution.

Also, since the coating film after heat treatment is difficult to dissolve, in Examples 1 and 2 above, unnecessary film was removed before heat treatment. However, depending on the type of film to be removed, dissolution may be possible after heat treatment. is there. The position where the chemical solution supply means is provided is not limited to the above embodiment.
In the above-described embodiment, an example in which the substrate and the cover member are rotated together is described, but this does not necessarily need to be rotated. However, the rotation is preferable because the chemical solution can be spread in the gap relatively quickly and uniformly.
Further, in the above embodiment, the cover member is an example in which the peripheral portion of the coating film (resist film) formed on the square substrate is removed to leave the square coating film, but the shape and the substrate of the substrate are left. The shape of the coating film is not limited to a square, and may be a circle, a triangle, a polygon, or any other shape. In that case, the shape of the chemical solution supply surface and the non-supply surface of the cover member may be formed as such, and the rotation angles of the substrate, the cover member, and the substrate holding base may be selected accordingly.

It is sectional drawing which shows the structure of the unnecessary film removal apparatus in the state which set the board | substrate with a resist to the unnecessary film removal apparatus of this invention. It is detail drawing of the contact part of the inner cover member and board | substrate used for this invention. It is a figure explaining the installation location of the convex part for space | interval adjustment in the unnecessary film | membrane removal method which rotates a cover member. It is a figure explaining the movement method of the convex part for space | interval adjustment in the unnecessary film | membrane removal method which does not rotate a cover member. It is a figure explaining the board | substrate holding base and board | substrate holding member which are used for this invention. It is a figure explaining the rotation method of the board | substrate holding base used for this invention. It is a figure explaining the unnecessary film | membrane removal process (when using only a chemical | medical solution and using exposure / development processing) of this invention. It is a flowchart which shows the Example of the unnecessary film | membrane removal process in this invention. It is sectional drawing which shows the structure of the conventional unnecessary film | membrane removal apparatus. It is sectional drawing which shows the modification of the unnecessary film | membrane removal apparatus of this invention. It is a figure which illustrates the movement mechanism of the convex part in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Resist 3 Outer cover member 4 Inner cover member 5 Substrate holding member 6 Chemical solution supply means 7 Connection member 8 which connects outer cover member and inner cover member 8 Convex part 9 Nozzle

Claims (6)

An unnecessary film removing apparatus that removes an unnecessary film portion by supplying a chemical solution only to an unnecessary portion of a film formed on a substrate surface including a peripheral portion of the substrate,
The unnecessary film removing apparatus is
Substrate holding means for holding the substrate so as to rotate the substrate in-plane;
Chemical supply means for supplying the chemical,
A shielding member that covers the substrate main surface such that a certain gap is formed with the main surface in the removal region of the substrate main surface, and a space larger than the gap is formed in the non-removal region of the substrate main surface. When,
The shielding member is provided with three or more spacing adjustment members facing the substrate main surface so that the gap has a size that allows the chemical solution to propagate through the gap and spread only in the gap. And
The installation position of the spacing adjustment member is a position that is not arranged in a straight line when the installation position is connected by a straight line, and the shielding member is rotated by a predetermined angle with respect to the substrate with the center of the substrate surface as the origin And the position that does not overlap with the installation position of the spacing adjustment member before rotation,
The unnecessary film removing apparatus, wherein the shielding member is disposed so as to be rotatable together with the substrate holding means. An unnecessary film removing apparatus that removes an unnecessary film portion by supplying a chemical solution only to an unnecessary portion of a film formed on a substrate surface including a peripheral portion of the substrate,
The unnecessary film removing apparatus is
Substrate holding means for holding the substrate so as to rotate the substrate in-plane;
Chemical supply means for supplying the chemical,
A shielding member that covers the substrate main surface such that a certain gap is formed with the main surface in the removal region of the substrate main surface, and a space larger than the gap is formed in the non-removal region of the substrate main surface. When,
The shielding member is provided with three or more spacing adjustment members facing the substrate main surface so that the gap has a size that allows the chemical solution to propagate through the gap and spread only in the gap. And
An installation position of the interval adjustment member is a position that is not arranged on a straight line when the installation position is connected by a straight line, and a moving mechanism that moves in parallel along the substrate side surface by a predetermined amount is provided.
The unnecessary film removing apparatus, wherein the shielding member is disposed so as to be rotatable together with the substrate holding means. An unnecessary film removing apparatus that removes an unnecessary film portion by supplying a chemical solution only to an unnecessary portion of a film formed on a substrate surface including a peripheral portion of the substrate,
The unnecessary film removing apparatus is
Substrate holding means for holding the substrate so as to rotate in-plane;
Chemical supply means for supplying the chemical,
A shielding member that covers the substrate main surface such that a certain gap is formed with the main surface in the removal region of the substrate main surface, and a space larger than the gap is formed in the non-removal region of the substrate main surface. When,
The gap is set to a size that allows the drug solution to pass through the gap and spread only in the gap.
The substrate holding means has a plurality of substrate holding members so as to hold the substrate at a plurality of positions on a bottom surface and a side surface of the substrate, and the substrate holding member is installed at a predetermined angle with respect to the substrate holding member. When rotated, set the position so that it does not overlap with the installation position of the substrate holding member before rotation,
The unnecessary film removing apparatus, wherein the shielding member is disposed so as to be rotatable together with the substrate holding means.   2. An unnecessary film removing method using the unnecessary film removing apparatus according to claim 1, wherein a substrate is placed on the substrate holding means, and the chemical solution is supplied from the chemical solution supply means while rotating the substrate and the shielding member together. After removing the unnecessary film portion by supplying the chemical solution only to the unnecessary portion of the film formed on the substrate surface including the peripheral portion of the substrate through the outer wall of the shielding member, the substrate is applied to the substrate. On the other hand, by rotating the shielding member by a predetermined angle with the center of the main surface of the substrate as the origin, the unnecessary film portion formed at a position where the interval adjusting member before the rotation is in contact with the substrate is removed. An unnecessary film removing method.   3. An unnecessary film removing method using the unnecessary film removing apparatus according to claim 2, wherein a substrate is placed on a substrate holding member of the substrate holding means, and the chemical solution is rotated while rotating the substrate and the shielding member together. The chemical solution is supplied from the supply means, and the unnecessary film portion is removed by supplying the chemical solution only to the unnecessary film portion of the film formed on the substrate surface including the peripheral edge portion of the substrate through the outer wall of the shielding member. Later, the substrate holding means is rotated by a predetermined angle with respect to the substrate as the origin at the center of the main surface of the substrate, and the unnecessary film portion formed at the position where the substrate holding member before rotation and the substrate are in contact with each other A method for removing an unnecessary film, characterized by performing removal. 6. The photomask blank manufacturing method having a film forming step of forming a film such as a light shielding film on a light-transmitting substrate, wherein an unnecessary film formed in an unnecessary portion in the film forming step is defined in claim 4 or 5. A method for producing a photomask blank, comprising a step of removing an unnecessary film that is removed by an unnecessary film removing method.

Images