JP2007041480A - Device and method for correcting defect of patterned substrate, and method for manufacturing patterned substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defect correction device and a defect correction method capable of reliably correcting defects, and also to provide a method for manufacturing patterned substrate by using the method. <P>SOLUTION: This device for correcting defects on a patterned substrate 6 is provided with: a mask film 5 oppositely disposed on the substrate 6; a laser beam source which emits a laser beam for disposing an opening part on the mask film 5; and a correction means of correcting the defect on the substrate 6 via the opening part disposed on the mask film 5, wherein a correction part corrected by the correction means is pressed by an elastic body 18. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a defect correction apparatus, a defect correction method, and a pattern substrate manufacturing method for correcting a defect of a pattern substrate.

  In the manufacturing process of color filters for liquid crystal displays, defects in the color filter substrate are corrected in order to improve the yield. One of the defect correction methods is a film transfer method. In a film transfer type defect correction apparatus, for example, a transfer film having a colored layer is brought into close contact with a white defect portion having no colored layer of a color filter substrate, and the defect is corrected by transferring the colored layer from the transfer film. (For example, patent document 1). In Patent Document 1, a supply reel for supplying a transfer film to a thermocompression bonding head and a take-up reel for winding up a used film are provided. In this defect correction apparatus, since the transfer film is pressed, there is a problem that the transfer film adheres to the peripheral area of the defect correction portion.

Moreover, in order to solve said problem, the defect correction apparatus using a mask film is disclosed by the applicant of this case (refer patent document 2). In this method, an opening is provided in the film by irradiating the film disposed on the defective portion with laser light. Then, the transfer layer is transferred through a mask film provided with an opening.
JP-A-9-178933 Japanese Patent No. 3580550

  In the defect correction apparatus of Patent Document 2, a transfer film is pressed from above a mask film to transfer a transfer layer onto the substrate, and then the mask film is pulled away from the substrate. At this time, the transfer layer adhering to the end of the opening of the mask film may protrude upward as the mask film rises, resulting in a shape in which horns stand at the end of the transfer layer on the substrate. . When the ITO electrode is formed on the color filter substrate after the defect correction, there is a concern that the horn-shaped portion at the end of the correction region becomes a protrusion and the formed ITO electrode is missing.

  In addition, since irregularities are formed on the surface of the color filter after the defect is corrected, when this color filter is used in a liquid crystal display device, liquid crystal alignment defects occur due to the irregularities on the surface of the color filter. There is a risk of deterioration of display characteristics such as unevenness and contrast reduction. In addition, the gap in which the liquid crystal is sealed is changed to cause a gap defect, and the completed liquid crystal display device may be a so-called point defect.

  As described above, the conventional defect correction apparatus has a problem that the defect cannot be corrected reliably. The present invention has been made against the background of such problems, and an object thereof is to provide a defect correction apparatus, a defect correction method, and a pattern substrate manufacturing method using the defect correction apparatus that can reliably correct defects. To do.

  A defect correction apparatus according to a first aspect of the present invention is a defect correction apparatus that corrects a defect on a patterned substrate (for example, the substrate 6 in the embodiment of the present invention), and is disposed opposite to the substrate. A mask film (for example, mask film 5 in the embodiment of the present invention), and a laser light source (for example, laser light source 1 in the embodiment of the present invention) that emits laser light that provides an opening in the mask film; And a correction means for correcting the defect of the substrate through an opening provided in the mask film, and the correction portion corrected by the correction means is pressed by an elastic body. Thereby, the flatness of a correction part can be improved and a defect can be corrected more reliably.

  The defect correction apparatus according to the second aspect of the present invention is the defect correction apparatus described above, wherein the correction means includes an elastic layer (for example, the thermoplastic resin 18d according to the present invention) and a transfer layer (for example, implementation of the present invention). 18b) in the embodiment (transfer film 18 in the embodiment of the present invention) and a pressing member that presses the transfer film from above the opening provided in the mask film (for example, implementation of the present invention) A transfer layer of the transfer film to the substrate through the opening, providing a correction portion, pressing the transfer film against the correction portion by the pressing member, The correction portion is pressed through an elastic layer. Thereby, the flatness of a correction part can be improved simply.

  A defect correction device according to a third aspect of the present invention is the defect correction device according to the above-described defect correction device, further comprising a peeling member disposed on the correction portion so as to be in contact with the correction portion, with the peeling member interposed therebetween. The correction part is pressed. Thereby, the flatness of a correction part can be improved more.

  The defect correction apparatus according to a fourth aspect of the present invention is the defect correction apparatus according to the above-described defect correction apparatus, wherein the peeling member is the mask film, and a portion where the opening portion of the mask film is not provided is opposed to the correction portion. And the said correction | amendment part is pressed through the said mask film. Thereby, the enlargement of a defect correction apparatus can be prevented.

  In the defect correction apparatus according to the fifth aspect of the present invention, in the defect correction apparatus described above, the mask film includes a stepped portion in which the thickness of the mask film is reduced over the entire outer periphery of the opening. Thereby, the flatness of the correction part can be further improved.

  A defect correction apparatus according to a sixth aspect of the present invention is a defect correction apparatus that corrects a defect on a patterned substrate, the mask film being opposed to the substrate, and an opening in the mask film. A laser light source for emitting a laser beam to be provided; and a correcting means for correcting a defect of the substrate through an opening provided in the mask film; and the mask film on the entire outer periphery of the opening of the mask film A stepped portion having a reduced thickness is formed. Thereby, the flatness of a correction part can be improved and a defect can be corrected more reliably.

  A defect correction method according to a seventh aspect of the present invention is a defect correction method for correcting a defect on a patterned substrate, wherein a mask film is disposed opposite to the substrate, and the mask film is irradiated with a laser beam. Then, an opening is provided in the mask film, the defect is corrected through the opening provided in the mask film, a correction portion is provided in the substrate, and the correction portion and the mask film are provided. The opening is separated from the opening, and the correction portion separated from the opening is pressed by an elastic body. Thereby, the flatness of a correction part can be improved and a defect can be corrected more reliably.

  A defect correction method according to an eighth aspect of the present invention is the above defect correction method, wherein a transfer film having an elastic layer and a transfer layer corresponding to a pattern to be transferred is disposed on the substrate, and the transfer layer is formed by a pressing member. Is transferred to the substrate through the opening, the correction portion is provided on the substrate, the transfer member is pressed against the correction portion by the pressing member, and the correction portion is pressed through the elastic layer. The flatness of the correction part can be improved easily.

  The defect correction method according to a ninth aspect of the present invention is the above-described defect correction method, wherein the correction portion is pressed against the portion of the transfer film to which the transfer layer has been transferred to press the correction portion. Thereby, the increase in a defect correction process can be suppressed.

  The defect correcting method according to a tenth aspect of the present invention is the above-described defect correcting method, wherein a peeling member that contacts the correcting portion is disposed on the correcting portion so as to face the correcting portion via the peeling member. Press. Thereby, the flatness of a correction part can be improved more.

  A defect correcting method according to an eleventh aspect of the present invention is the above-described defect correcting method, wherein the peeling member is the mask film, and a portion where the opening portion of the mask film is not provided is opposed to the correcting portion. And it presses through the said mask film. Thereby, the enlargement of a defect correction apparatus can be prevented.

  The defect correcting method according to a twelfth aspect of the present invention is the above-described defect correcting method, wherein the mask film including a stepped portion having a reduced thickness of the mask film is disposed opposite to the substrate on the entire outer periphery of the opening. . Thereby, the flatness of the correction part can be further improved.

  A defect correction method according to a thirteenth aspect of the present invention is the defect correction method for correcting a defect on a patterned substrate in the defect correction method described above, wherein a mask film is disposed oppositely on the substrate, The mask film is irradiated with laser light to form a stepped portion with a reduced thickness on the mask film, and the mask film is irradiated with laser light to cope with defects on the substrate in the stepped portion. An opening is formed, and the defect of the substrate is corrected through the opening formed in the mask film. Thereby, the flatness of the correction part can be further improved.

  A pattern substrate manufacturing method according to a fourteenth aspect of the present invention forms a pattern on a substrate, detects a defect on the substrate, and corrects the defect by any one of the defect correction methods described above. Thereby, the pattern board which corrected the defect reliably can be manufactured.

  The present invention provides a defect correction apparatus, a defect correction method, and a pattern substrate manufacturing method using the defect correction apparatus that can reliably correct defects.

  Embodiments of the present invention will be described below with reference to the drawings. The following description shows preferred embodiments of the present invention, and the scope of the present invention is not limited to the following embodiments. In the following description, the same reference numerals indicate substantially the same contents.

  A pattern substrate defect correcting apparatus according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a top view schematically showing the configuration of the defect correcting device, and FIG. 2 is a side sectional view showing the configuration of the defect correcting device. The defect correcting apparatus according to the present embodiment includes a stage 7, a transfer film loader 21, a trash 22, a frame 31, a Y rail 32, a frame 33, an X rail 34, a repair head 35, a movable rail 36, and a light source head 37. Yes.

  Here, a case where a color filter substrate 6 (hereinafter referred to as a substrate 6) used in a display device such as a liquid crystal display device is corrected will be described. The substrate 6 includes three colored layers of R, G, and B and a light shielding layer provided between the colored layers. The defect correction apparatus according to the present embodiment optically detects a defect on the substrate 6 and corrects the detected defect by a film transfer method. Further, in this embodiment, as described in the specification of 3580550, an opening is provided in the mask film by irradiation with pulsed laser light, and the transfer layer of the transfer film is interposed through the mask film provided with the opening. Is transferred to the substrate by the thermal transfer method. In addition, the board | substrate 6 corrected with the defect correction apparatus concerning this invention is not restricted to a color filter board | substrate, For example, the board | substrate with a light shielding pattern in which only the light shielding layer was formed may be sufficient.

  In this embodiment, as will be described in detail later, in order to flatten the transfer layer transferred onto the substrate 6, it is pressed by a thermal transfer rod attached in the repair head 35 via a mask film and a transfer film. . Therefore, the thermal transfer rod has two functions of forming and flattening the transfer layer. In addition, you may provide a separate member for formation and planarization of a transfer layer. Here, the transfer layer formed on the substrate 6 corresponds to the correction portion described in the claims. Further, a portion where the correction portion is formed is set as a correction region.

  A frame-like frame 33 is provided on the gantry 31. On the frame-like frame 33, a stage 7 made of a transparent glass plate is provided. That is, the vicinity of the outer periphery of the stage 7 is supported by the frame 33. The frame 33 is fixed to the gantry 31, and the stage 7 is fixed to the frame 33. On the stage 7, a substrate 6 having a colored layer formed on the upper surface is placed. The stage 7 may be an XYZ stage, an XY stage, or a Y stage.

  A Y rail 32 is provided outside the stage 7. The Y rails 32 are disposed on both sides of the stage 7 along the Y direction. An X rail 34 is provided on the two Y rails 32. The X rail 34 is provided along the X direction so as to straddle the substrate 6. A repair head 35 is attached to the X rail 34. The repair head 35 is provided so as to be movable with respect to the X rail 34. Thereby, the repair head 35 moves along the X direction. As will be described later, the repair head 35 is provided with a defect detection mechanism for detecting a defect and a defect correction mechanism for correcting the defect.

  Further, the X rail 34 is provided so as to be movable with respect to the Y rail 32. As a result, the X rail 34 moves in the Y direction. Therefore, the repair head 35 moves on the substrate 6 in the XY directions. That is, the repair head 35 can be moved two-dimensionally by moving the repair head 35 in the X direction and moving the X rail 34 to which the repair head 35 is attached in the Y direction. Thereby, it is possible to detect and correct defects on the entire surface of the substrate 6. In addition, since the footprint of the defect correction apparatus can be reduced, productivity can be improved. The repair head 35 and the X rail 34 can be driven using a known method such as an AC servo motor. Further, the stage 7 on which the substrate 6 is placed may move in the XY directions.

  A movable rail 36 is provided below the stage 7. A light source head 37 is attached to the movable rail 36. Similar to the repair head 35, the light source head 37 is provided so as to be movable in the XY directions. That is, the light source head 37 is provided to be movable in the X direction, and the movable rail 36 is provided to be movable in the Y direction. Further, the light source head 37 can move following the movement of the repair head 35. That is, when the repair head 35 moves, the light source head 37 moves by the same distance in the direction in which the repair head 35 moves. As a result, the light source head 37 moves to the same position as the repair head 35 in the XY plane. The light source head 37 is provided with an illumination light source for transmitted illumination and a UV light source that is irradiated when the transfer layer is transferred. The light source head 37 will be described later.

  A transfer film loader 21 is provided outside the substrate 6 and the stage 7. Four transfer film loaders 21 are provided corresponding to the R, G, and B colored layers and the light shielding layers of the color filter. That is, the defect correction apparatus is provided with an R transfer film loader 21, a G transfer film loader 21, a B transfer film loader 21, and a black transfer film loader 21 for a light shielding layer (BM). The transfer film loader 21 supplies a piece of transfer film corresponding to each color.

  The configuration of the transfer film loader 21 will be described with reference to FIG. FIG. 3 is a side sectional view showing the configuration of the transfer film loader 21. As shown in FIG. 3, the transfer film loader 21 includes a transfer film supply reel 25, a cover film take-up reel 26, and a film cutter 27. A transfer film 18 is wound around the transfer film supply reel 25. A cover film 18a for protecting the transfer layer is provided on the surface of the transfer film 18 on the transfer layer side. That is, the transfer film 18 to which the cover film 18 a is attached is wound around the transfer film supply reel 25. The front end side of the cover film 18 a is peeled off from the transfer film 18 and attached to the cover film take-up reel 26. The cover film take-up reel 26 is provided with a rotational drive mechanism such as a motor. By rotating the cover film take-up reel 26, the cover film 18 a is gradually wound up while being peeled off from the transfer film 18.

  When the cover film take-up reel 26 is rotated and the cover film 18 a is taken up, the transfer film 18 is sent out from the transfer film supply reel 25 in the direction of the arrow. Thereby, the transfer film 18 is fed in the direction of the film cutter 27. A film cutter 27 is provided on the leading end side of the transfer film 18. The transferred transfer film 18 can be cut out by the film cutter 27. In this way, a piece of the transfer film 18 can be cut out from the transfer film supply reel 25. For example, the transfer film 18 can be cut into a width of about 10 mm and a length of about 30 mm. The pieces of the transfer film 18 may be changed according to the size of the defect to be corrected. The film cutter 27 may be provided on the repair head 35 and the transfer film 18 of the transfer film loader 21 may be cut by driving the repair head 35. In this way, the fragments are supplied from the roll of the transfer film 18 wound around the transfer film supply reel 25.

  In the defect correcting apparatus, four transfer film loaders 21 having the above-described configuration are provided so as to correspond to the R, G, and B colored layers and the light shielding layers. That is, a transfer film 18 having a transfer layer colored in red is wound around the transfer film supply reel 25 around the R transfer film loader 21. Similarly, a transfer film 18 having a green colored transfer layer is transferred to the G transfer film loader 21, and a transfer film 18 having a blue colored transfer layer is transferred to the B transfer film loader 21 to transfer the light shielding layer. A transfer film 18 having a transfer layer colored in black is wound around a transfer film supply reel 25 around the film loader 21. Note that four transfer films 18 may be wound around one transfer film reel 25 provided in the transfer film loader 21. In this case, the transfer film reel 25 becomes wide, but the transfer film loader 21 can be made one.

  A trash 22 is provided outside the substrate 6 and the stage 7. By dropping the used transfer film 18 on the trash 22, the trash 22 can be discarded.

  Next, the configuration of the repair head 35 and the light source head 37 will be described with reference to FIGS. FIG. 4 is a side sectional view schematically showing the configuration of the repair head 35 and the light source head 37. FIG. 5 is a top view schematically showing the configuration of the repair head 35. First, the configuration of the repair head 35 will be described. The repair head 35 includes a mask film reel 8, a halogen lamp 14, an optical system 41, a film holder 42, a thermal transfer rod 43, a mask film fixing jig 44, a heater rod 45, a high temperature blower 46, a casing 47, and a mask film pressing rod 48. It has. The casing 47 is attached to the X rail 34 so as to be movable in the X direction. The housing 47 includes a mask film reel 8, an optical system 41, a film holder 42, a thermal transfer rod 43, a mask film fixing jig 44, a heater rod 45, a high temperature blower 46, and a mask film pressing rod 48. Are attached and move with the housing 47. That is, by sliding the housing 47 with respect to the X rail, the structure in the repair head 35 moves in the X direction. The lower side of the housing 47, that is, the substrate 6 side is open. Structures within the repair head 35 are accessible to the substrate 6 for defect detection and defect correction.

  A mask film 5 is disposed on the substrate 6 so as to face the substrate 6. The mask film 5 can be made of a material that can be easily laser ablated or a transparent material. In this embodiment, for example, about 10 μm of polyimide is used. An opening is provided in the mask film 5, and the transfer layer of the transfer film 18 is transferred to the substrate 6 through the opening. The mask film 5 is wound around a mask film reel 8. One of the two mask film reels 8 is a take-up reel, and the other is a supply reel. When the take-up mask film reel 8 is rotated, the mask film 5 is sent out from the supply mask film reel 8 in the direction of the arrow in FIG. Thereby, the unused part of the mask film 5 is supplied onto the substrate 6. Through this mask film 5, observation of defects and defect correction are performed. The mask film 5 is sent out in the Y direction. That is, the mask film 5 is fed in a direction perpendicular to the moving direction of the repair head 35.

  Further, the mask film reel 8 can be clamped to the X rail 34 instead of the housing 47 of the repair head 35. That is, it is possible to select whether to fix the mask film reel 8 to the X rail 34 or to the housing 47 of the repair head 35. When the mask film reel 8 is clamped to the X rail 34, the mask film reel 8 and the mask film 5 are fixed in the same position on the substrate 6 even if the repair head 35 moves. At the time of defect correction, the mask film reel 8 is clamped with respect to the X rail 34, and the position of the mask film reel 8 is fixed. At the time of inspection, the mask film reel 8 is clamped to the repair head 35, and the mask film 5 is moved according to the movement of the repair head 35. When the mask film reel 8 is clamped with respect to the X rail 34, the mask film reel 8 may be moved downward so that the position of the mask film 5 is close to the substrate 6. Further, an arm for clamping the repair head 35 on the X rail 34 may be provided.

  A mask film fixing jig 44 is provided on the mask film 5. A method of fixing the mask film 5 using the mask film fixing jig 44 will be described with reference to FIG. FIG. 6 is a side view showing configurations of the mask film fixing jig 44 and the mask film pressing rod 48. In FIG. 6, the substrate 6 is not shown for clarity of explanation. As shown in FIG. 6, the mask film fixing jig 44 is provided so as to be movable in the vertical direction. The mask film fixing jig 44 is a clamper that fixes the mask film 5 to the substrate 6. At the time of defect correction, the mask film fixing jig 44 is lowered and the mask film 5 is pressed against the substrate 6. That is, the angle of the mask film fixing jig 44 is changed, the tip of the mask film fixing jig 44 is lowered, and the mask film 5 and the substrate 6 are brought into contact with each other. At this time, tension is applied to the mask film 5 by a winding motor of the mask film reel 8. Thereby, the mask film 5 adheres to the substrate 6, and the mask film 5 can be fixed to the substrate 6. While correcting the defect, the position of the opening of the mask film 5 and the position of the defect can be matched. It is preferable to provide a mask film fixing jig 44 on both sides of the opening of the mask film 5. It is also possible to charge the mask film 5 and fix it to the substrate 6 by electrostatic force. The tip of the mask film fixing jig 44 can be made of silicone rubber.

  Similarly to the mask film reel 8, the mask film fixing jig 44 can be directly clamped to the X rail 34. It is possible to select whether to fix the mask film fixing jig 44 to the X rail 34 or to the casing 47 of the repair head 35. When the mask film fixing jig 44 is directly clamped to the X rail 34, the mask film fixing jig 44 is fixed in the same position on the substrate 6 even if the repair head 35 moves. While the transfer layer is being transferred from the transfer film 18, the mask film reel 8 and the mask film fixing jig 44 are clamped to the X rail 34 so that the repair head 35 moves relative to the substrate 6 even if it moves in the X direction. Avoid moving. Note that the mask film fixing jig 44 can be moved in the up-down direction (Z direction) regardless of which one is fixed. In this manner, a fixing unit for fixing the mask film fixing jig 44 and the mask film reel 8 to the X rail 34 and a fixing unit for fixing the repair head 35 are provided.

  When the mask film 5 is placed on the substrate 6 by the mask film fixing jig 44 as described above, the mask film pressing rod 48 that removes the air contained between the mask film 5 and the substrate 6 is attached to the repair head 44. Is provided. The mask film pressing rod 48 is provided so as to be movable in the vertical direction. As shown in FIG. 6, the mask film pressing rod 48 presses the mask film 5 at the defect correction portion against the substrate 6 in a state where the mask film 5 is in contact with the substrate 6. Thereby, the air of a defect correction location escapes from the horizontal direction. Specifically, in a state where the mask film 5 is fixed to the substrate 6, the repair head 35 is moved so that the mask film pressing rod 48 is disposed on the defective portion. At this time, the mask film reel 8 and the mask film fixing jig 44 are directly locked to the X rail 34. Then, the mask film pressing rod 48 is moved downward to bring the mask film 5 and the substrate 6 at the defective portion into close contact. Thereby, there is no space between the mask film 5 and the substrate 6, and air can be removed. Then, the mask film pressing rod 48 is moved upward. Thereby, since generation | occurrence | production of the bubble between the board | substrate 6 and the mask film 5 in a defect location can be prevented, the defect correction by transcription | transfer can be performed reliably. The mask film pressing rod 48 is preferably made of an elastic body such as silicone rubber at the tip.

  As shown in FIG. 4, the repair head 35 is further provided with a halogen lamp 14. The halogen lamp 14 heats the transfer layer after transfer. This will be described later. The optical system 41 includes a light source for performing reflected illumination, a two-dimensional photodetector for detecting defects, a pulse laser light source for providing an opening in the mask film 5, and a UV light source for UV irradiation. And optical components for them. The configuration of the optical system 41 will be described later.

  Two suction pads 49 are provided below the film holder 42. The suction pad 49 sucks both ends of the fragment of the transfer film 18. For example, a pipe for sucking air is attached to the film holder 42. Thereby, the piece of the transfer film 18 is adsorbed to the adsorption pad 49. Note that not only vacuum suction but also electrostatic suction may be used. Furthermore, the transfer film 18 may be mechanically held. The repair head 35 is moved so that the film holder 42 is disposed on the transfer film 18 supplied from the transfer film loader 21. When air is sucked from the suction pad 49, a piece of the transfer film 18 is held on the suction pad 49. At this time, the mask film reel 8 is fixed to the X rail 34 so that the mask film 5 is not disposed below the film holder 42. That is, with the mask film reel 8 fixed to the X rail 34, the repair head 35 is moved, and the positions of the mask film 5 and the film holder 42 are shifted.

  The repair head 35 is moved to a location where a defect is detected by the optical system 41 in a state where the fragments of the transfer film 18 are adsorbed. Thereby, the film holder 42 moves to a position corresponding to the defect of the substrate 6. Therefore, a fragment of the transfer film 18 is disposed on the opening of the mask film 5 corresponding to the defective portion. Then, the film holder 42 is moved downward, and a piece of the transfer film 18 is disposed in the vicinity of the defective portion of the substrate 6.

  A thermal transfer rod 43 is disposed on the film holder 42. The thermal transfer rod 43 is provided so as to be movable in the vertical direction. As the thermal transfer rod 43, for example, a cylindrical member having a diameter of 3 mm can be used. A through hole is provided in the central portion of the film holder 42. The thermal transfer rod 43 presses a piece of the transfer film 18 against the substrate 6 through the through hole. Thereby, the fragment of the transfer film 18 is pressed against the substrate, and the transfer layer of the fragment of the transfer film 18 is transferred to the defective portion. Thereby, the correction part corresponding to the magnitude | size of the opening part of the mask film 5 is formed on a board | substrate. Further, the thermal transfer rod 43 presses the transferred transfer layer (corrected portion) through an unused portion where the openings of the transfer film 18 and the mask film 5 are not provided. In addition, you may arrange | position the thermal transfer rod 43 between two film holders 42 between them. The thermal transfer rod 43 is heated to about 120 ° C., for example.

  When the repair head 35 is moved in the X direction with the mask film reel 8 clamped to the X rail 34, the optical system 41 is disposed on the mask film 5. That is, the film holder 42 arranged on the mask film 5 is displaced from the mask film 5, and the optical system 41 moves on the mask film 5. As a result, it becomes possible to observe defects and transfer the transfer layer through the mask film. That is, when observing a defect in the substrate 6, the optical system 41 is disposed on the mask film 5 and the defect is optically observed through the mask film 5. Then, with the mask film reel 8 and the mask film fixing jig 44 clamped to the X rail 34, the mask film fixing jig 44 is pressed down to fix the mask film 5 to the substrate. Further, the air is removed by the mask film pressing rod 48. The mask film 5 is provided with an opening by irradiating a pulse laser beam from a laser light source provided in the optical system 41. Then, the repair head 35 is moved, and the film holder 42 is disposed on the mask film 5. At this time, since the mask film 5 does not move, an opening is disposed at the defective portion. Further, a thermal transfer rod 43 is disposed on the opening of the mask film 5. Then, the thermal transfer rod 43 is pressed to transfer the transfer layer to the substrate 6. Thereby, defect correction can be performed. The film holder 42 and the optical system 41 are provided in the X direction, that is, the direction perpendicular to the feed direction of the mask film 5. Thereby, since the space | interval of the film reel 8 can be narrowed, size reduction of the repair head 35 can be achieved.

  The heater rod 45 and the high temperature blower 46 are provided to dry and thermally crosslink the transfer layer after transfer. The heater rod 45 is provided so as to be movable in the vertical direction. For example, the heater rod 45 heated to 180 ° C. or higher is lowered and brought into contact with the transfer layer. As a result, the temperature of the transfer layer rises and the transfer layer can be thermally crosslinked. The high temperature blower 46 blows a high temperature drying gas to the transfer layer. Thereby, the transfer layer can be dried and thermally crosslinked. Note that the transfer layer can be heated and crosslinked by infrared rays irradiated from the halogen lamp 14.

  In the present invention, since the transfer film loader 21 is not provided in the repair head 35, the repair head can be reduced in size. Therefore, even when the halogen lamp 14, the high temperature blower 46, and the heater rod 45 are provided in the repair head 35, the repair head 35 can be prevented from being enlarged. As a result, the footprint of the defect correction apparatus can be reduced, and productivity can be improved. Further, by providing the repair head 35 with the high-temperature blower and the heater rod 45, the repair head 35 can move the high-temperature blower and the heater rod 45 to the transfer location at high speed. Thereby, the correction time can be shortened, and the productivity can be further improved. Note that the halogen lamp 14, the high temperature blower 46, and the heater rod 45 may not be provided in the repair head 35, and at least one of them is preferably provided in the repair head 35.

  The light source head 37 disposed on the lower side of the stage 7 is provided with a UV light source 52 and an illumination light source 51. The illumination light source 51 is disposed so as to coincide with the optical axis of the optical system 41 of the repair head 35. The illumination light source 51 performs transmission illumination for capturing a transmission image. That is, the illumination light source 51 emits illumination light for transmission observation when a defect is detected or when it is confirmed whether or not defect correction has been normally performed. The light emitted from the illumination light source 51 enters the substrate 6 through the transparent stage 7. Then, the transmitted light that has passed through the substrate 6 is detected by a CCD camera or the like provided in the optical system 41. Thereby, a transmission image can be taken. The UV light source 52 irradiates the transfer layer with ultraviolet rays (UV light) from the back side of the substrate 6 while transferring the transfer layer from the piece of the transfer film 18 to the substrate 6 by the thermal transfer rod 43. Although not shown in FIG. 4, an optical component such as a lens may be provided in the light source head 37.

  Next, the configuration of the optical system 41 will be described with reference to FIG. FIG. 7 is a diagram showing the configuration of the optical system 41 and the light source head 37. The optical system 41 includes a half mirror 3, a laser light source 1, a beam shaping mechanism 2, an objective lens 4, a lamp light source 9, a filter 10, a half mirror 11, and a CCD camera 12. The optical system 41 further includes a UV light source 13 that irradiates the transfer layer transferred to the defective portion of the substrate 6 with UV light from the substrate surface. The lamp light source 9, the half mirror 3, the half mirror 11, the filter 10, the CCD camera 12, and the illumination light source 51 of the light source head 37 of the optical system 41 confirm whether or not the defect detection or defect correction has been normally performed. Used for. That is, a defect is detected by observing a reflected image or a transmitted image of the substrate 6.

  A configuration for observing the reflected image of the substrate 6 will be described. A lamp light source 9 provided in the optical system 41 is used as a reflection observation light source. The lamp light source 9 emits white light for illuminating the surface of the substrate 6. The light for reflection observation emitted from the lamp light source 9 passes through the filter 10 and enters the half mirror 11. The filter 10 is a wavelength tunable filter and can transmit / shield only a predetermined wavelength. Here, the filter 10 can emit light having a wavelength suitable for defect detection. The light incident on the half mirror 11 is reflected in the direction of the substrate 6. This light passes through the half mirror 3 and enters the objective lens 4. A mask film 5 is provided between the objective lens 4 and the substrate 6 so as to face the substrate 6. Then, the light condensed by the objective lens 4 passes through the mask film 5 and enters the surface of the substrate 6. Thereby, a part of the substrate 6 can be illuminated from the upper surface of the substrate 6. The light reflected by the substrate 6 passes through the mask film 5, the objective lens 4, the half mirror 3 and the half mirror 11 and enters the CCD camera 12. The CCD camera 12 detects a reflected image based on the reflected light on the surface of the substrate 6. Thereby, the reflected image of the substrate 6 can be observed.

  Next, a configuration for observing a transmission image will be described. In the present invention, the illumination light source 51 is used for the light source head 37 in order to observe the transmission image of the substrate 6. The illumination light source 51 is provided on the optical axis of the objective lens 4. That is, the optical axis of the illumination light source 51 coincides with the optical axis of the optical system for observing the reflected image. The illumination light source 51 causes the transmitted illumination light to enter the substrate 6 from the back side of the substrate 6 through the stage 7. The transmitted light that has passed through the substrate 6 passes through the mask film 5, the objective lens 4, the half mirror 3, and the half mirror 11 and enters the CCD camera 12. As the illumination light source 51, a lamp light source can be used similarly to the observation of the reflected image. Further, a filter such as a lens or a wavelength tunable filter may be provided for the illumination light source 51. When a defect is detected, the repair head 35 and the light source head are moved in synchronization. Thereby, since the transmitted illumination light and the reflected illumination light are incident on the substrate with the same optical axis, by controlling the ON / OFF of the lamp light source 9 and the illumination light source 51 independently, either the transmitted image or the reflected image can be obtained. Whether to take an image can be easily switched.

  In the above description, the substrate 6 is observed through the mask film 5, but the present invention is not limited to this. For example, the mask film 5 can be removed from between the substrate 6 and the optical system 41 for observation. That is, you may observe in the state which shifted the mask film 5 from the optical axis.

  The CCD camera 12 is connected to an information processing apparatus such as a personal computer (PC), and determines the presence or absence of a defect in the substrate 6 based on the detected image. For example, a die-to-die method for comparing with a detected reference die can be used. If the detected image is different from the reference die, it is determined as a defective portion. With this defect detection mechanism, an opaque black defect and a transparent white defect can be distinguished and detected. Further, the PC is connected to the XY drive mechanism of the repair head 35, the detection location is specified from the position of the repair head 35 at the time of defect detection, and the coordinates of the defective pixel on the substrate are detected. Of course, the defect detection mechanism is not limited to the illustrated configuration, and a defect detection mechanism having a configuration other than this may be used. About this defect detection mechanism, the structure similar to the conventional defect detection apparatus can be used. By moving the repair head 35, the relative position of the light from the substrate 6 and the lamp light source 9 is changed to detect the defect on the entire surface of the substrate 6. The information processing apparatus stores the coordinates of the defective portion of the substrate 6 in association with the defect type (R, G, B, light shielding layer) and the size of the defect.

  The defect detected by the above-described defect detection mechanism is corrected by the defect correction mechanism. The defect correction mechanism will be described below. The laser light source 1 is a Q switch YAG laser, and can emit a short pulse light of 10 nsec or less. The short pulse laser beam emitted from the laser light source 1 enters the beam shaping mechanism 2. The beam shaping mechanism 2 includes an aperture, a slit, or a lens, and can form a short pulse light spot into a beam spot having an appropriate shape. For example, the beam spot of the short pulse light on the substrate is formed into a rectangular shape substantially the same as the pixel of the color filter. Or you may make it shape | mold in the shape substantially the same as the shape of a defect. The half mirror 3 reflects short pulse light in the direction of the substrate 6. Here, the respective optical components are arranged so that the light from the laser light source 1 and the lamp light source 9 are coaxial. The short pulse laser beam reflected by the half mirror 3 is applied to the mask film 5. At this time, the mask film 5 is fixed by the mask film fixing jig 44. That is, an opening is formed in the mask film 5 in a state where the mask film 5 is fixed to the substrate 6.

  Further, the half mirror 3 may be a mirror that efficiently reflects the laser light from the laser light source 1. For example, a dichroic mirror or a reflection mirror having a high reflectance with respect to the wavelength of the laser beam may be used. Thereby, since the laser beam 1 can be efficiently applied to the mask film 5, the output of the laser light source 1 can be reduced. In this case, the half mirror 3 may be removed from the optical path during defect detection or defect observation. That is, at the time of defect detection or defect observation, the half mirror 3 is preferably removed from the optical path of the lamp light source 9 in order to illuminate the substrate 6 with light having a wavelength suitable for defect detection and defect observation. At this time, the half mirror 3 is mechanically moved so as to be removed from the optical path. At the time of defect detection and observation, the half mirror 3 is removed from the optical path of the lamp light source 9, and the half mirror 3 is arranged on the optical path of the lamp light source 9 when the opening is formed.

  The configuration of the mask film 5 and the substrate 6 will be described with reference to FIG. FIG. 8 is an enlarged cross-sectional view showing the configuration of the corrected portion. FIG. 8A shows the configuration of the mask film 5 and the substrate 6 during irradiation with short pulse light. FIG. 8B shows a configuration of the substrate 6 from which the mask film 5 and the colored layer of the defective pixel are removed. The substrate 6 includes a red (R) colored layer 61, a green (G) colored layer 62, a blue (B) colored layer 63, and a black matrix (BM) 64. These are provided on the upper surface side of the substrate 6, not shown in FIG. 8, but on the repair head 35 side. The BM 64 is made of black resin or the like and is formed in a matrix. Between the BM 64, an R colored layer 61, a G colored layer 62, and a B colored layer 63 are formed of a resin in which a pigment corresponding to the color of each colored layer is dispersed. Although not shown here, a protective film or an ITO electrode may be formed on the R colored layer 61, the G colored layer 62, the B colored layer 63, and the BM 64.

  Here, as shown in FIG. 8A, it is assumed that a white portion is provided in the R colored layer 61. In other words, it is assumed that there is a portion where the R colored layer 61 is not attached to a part of the pixels to be the R colored layer 61. A pixel provided with such a blank portion is detected as a defective pixel that transmits light by a defect detection mechanism. The mask film 5 is substantially in contact with the substrate 6.

  Here, a defect correction method using the defect correction apparatus will be described. The defective pixel is irradiated with short pulse light of 10 nsec or less from the laser light source 1 shown in FIG. The short pulse light condensed by the objective lens 4 is incident on the mask film 5 adjacent to the substrate 6. The power of this short pulse light is adjusted so as to partially open the mask film 5 by laser ablation. In this embodiment, since a polyimide film is used, if the third harmonic of 355 nm or the fourth harmonic of 266 nm of the YAG short pulse laser light source 1 is used, the mask film 5 is easily absorbed because the short pulse light is absorbed. An opening can be provided in the. In addition, since the polyimide film is substantially transparent without light absorption in the visible light region, it is easy to observe, and a defect can be detected using the lamp light source 9. The mask film 5 is not limited to polyimide, but may be made of a material that is opened by chemical irradiation, thermal decomposition, sublimation, or ablation by light irradiation. Since the laser beam is shaped by the beam shaping mechanism 2 so as to have a defect shape or pixel shape, the shape of the opening of the mask film 5 should be substantially the same as the shape of the defect shape or R pixel. Can do. The correction region of the R colored layer 61 and a part of the mask film can be removed almost simultaneously by laser ablation.

  The removed R colored layer 61 is detached from the substrate 6 through the opening of the mask film 5. As a result, the defective portion of the R colored layer 61 of the white defective pixel can be removed, resulting in a white defect 66 as shown in FIG. At this time, the colored layer 61 removed from the substrate 6 adheres to the mask film 5. Since the periphery of the correction portion is covered with the mask film 5, the R colored layer 61 does not adhere to the periphery of the correction portion and create a new defect. Thus, the mask film 5 and defects can be removed substantially simultaneously by laser ablation. Although the removed colored layer 61 of R is a single piece, it may become a large number of debris and land on the mask film. The power of the laser light source 1 may be adjusted so that the mask film 5 is gradually perforated, or may be adjusted so that the mask film 5 is perforated and the colored layer is removed simultaneously.

  In the above description, the colored layer 61 is removed from the white pixels, but the present invention can also be applied to a pixel to which foreign matter is attached. In this case, the foreign matter adhering to the pixel can be prevented from adhering to the substrate 6 again by the mask film 5. When the foreign matter is transparent, laser ablation does not occur even if the foreign matter is irradiated with short pulse light because no light is absorbed. In contrast, when a film that absorbs light, such as polyimide, is used as the mask film 5 and a short pulse laser beam is irradiated with the absorbing film substantially in contact with the top of the foreign matter, the film opens by laser ablation. At the same time, foreign substances can be momentarily pressed against the substrate by the gas or debris that has come forward, and can be detached from the substrate by subsequent recoil. Since the colored layer 61 is removed together with the foreign matter on the substrate by the above-described processing, the black defect becomes a white defect 66 that transmits light.

  The transfer layer of the fragment of the transfer film 18 is transferred to the pixel that has become the white defect 66. Specifically, the repair head 35 shown in FIG. 4 is moved while the mask film 5 is fixed to the substrate 6. Thereby, the optical system 41 moves from above the opening, and the film holder 42 is disposed on the opening. With the transfer film 18 adsorbed, the film holder 42 is lowered, and a piece of the transfer film 18 is placed on the opening. Thereby, the opening is covered with the fragment of the transfer film 18, and the fragment of the transfer film 18 can be opposed to the portion of the white defect 66.

  The transfer film 18 is a transfer film having a transfer layer that is transferred by thermal transfer. For example, Transer (registered trademark) manufactured by Fuji Photo Film Co., Ltd. can be used. The configuration of the transfer film 18 will be described with reference to FIG.

  The transfer film 18 includes a cushion layer 18d formed on the base layer 18e. An oxygen blocking layer 18c is provided on the cushion layer 18d, and a transfer layer 18b colored with various pigments is provided thereon. The transfer layer 18b is formed of, for example, a photosensitive resin. The pigment of the transfer layer 18b is colored according to the pixel of the color filter to be corrected. The transfer layer 18b is transferred to the substrate 6 to correct the defect. A polypropylene cover film 18a is pressure-bonded on the transfer layer 18b for surface protection. In addition, a conductive antistatic layer 18f is provided on the back surface of the base layer 18e for the purpose of preventing adhesion of dust or the like by peeling electrification.

  The base layer 18e is made of, for example, PET having a thickness of about 75 μm. As the cushion layer 18d, a weak alkali-soluble thermoplastic resin having a thickness of about 20 μm can be used. The cushion layer 18d can absorb the step in the defective portion of the substrate and improve the adhesion of the transfer layer. The oxygen blocking layer was 1.6 μm thick, the transfer layer 18 b was 2.0 μm thick, and the cover film was 1.2 μm thick. With the cover film 18 a peeled off by the transfer film loader 21, the transfer film 18 is held by the film holder 42. The configuration of the transfer film 18 described above is a typical example, and is not limited to the configuration described above. For example, the oxygen blocking layer 18c or the antistatic layer 18f may not be provided. The transfer layer 18b is not limited to the photosensitive resin layer, and may be a colored layer corresponding to the pattern to be transferred.

  The thermal transfer rod 43 is provided so as to be movable up and down. When the transfer layer 18 b of the transfer film 18 is attached, the thermal transfer rod 43 moves downward to press the transfer film 18 against the substrate 6. The configuration of the substrate 6 and the transfer film 18 at this time is shown in FIG. FIG. 10 is a cross-sectional view showing the configuration of the substrate 6 in the correction portion. Here, illustration of the oxygen blocking layer 18c, the base layer 18e, and the antistatic layer 18f of the transfer film 18 is omitted. When the transfer film 18 is pressed by the thermal transfer rod 43, the configuration shown in FIG.

  By pressing the thermal transfer rod 43, the mask film 5 having an opening is sandwiched between the substrate 6 and the transfer film 18. Therefore, the transfer layer 18 b is pressed against the defect position of the substrate 6 through the opening of the mask film 5. Since the opening is provided at the same size and the same position as the place where the colored layer 61 is removed by laser ablation, it coincides with the place that needs to be corrected. By transferring the transfer layer 18b through the mask film 5, the transfer layer 18b adheres to the substrate 6 at the opening. On the other hand, the transfer layer 18 b is attached to the upper surface of the mask film 5 in a region other than the opening. Thereby, the correction part to which the transfer layer 18b was transferred only at the defective portion can be provided.

  As described above, by transferring the transfer layer 18b serving as the colored layer through the opening of the mask film 5, it is possible to prevent the transfer layer 18b from adhering to a region other than the defective portion. As a result, the transfer layer 18b can be transferred only to the defective portion with a simple configuration, and the defect can be corrected accurately. Further, since the transfer layer 18b is not attached to an extra portion, it is not necessary to remove the extra transfer layer 18b in a later step, and productivity can be improved.

  Further, in this embodiment, the transfer layer 18b is pressed through the thermoplastic resin layer 18d. The thermoplastic resin layer 18d has elasticity when heated, and functions as a cushion layer when the transfer film 18 is pressed against the substrate 6. Thereby, the step on the substrate caused by the colored layer 62, the BM 64, and the mask film 5 is absorbed, so that the transfer layer 18b can be accurately transferred. Since the thermoplastic resin layer 18d has a thickness of 20 μm, for example, even if the colored layer is 2 μm, the BM is 2 μm, and the mask film 5 is about 10 μm in thickness, it absorbs the steps generated by these and accurately transfers them. can do.

Here, while pressing the thermal transfer rod 43 to thermally transfer the transfer layer 18 b, UV light is irradiated from the back side of the substrate 6 by the UV light source 52 of the light source head 37. Thereby, the adhesiveness with respect to the board | substrate 6 of the transfer layer 18b can be improved. The irradiation amount of UV light from the back side is, for example, about 50 mJ / cm ² .

  After the thermal transfer rod 43 is raised and separated from the substrate 6, the film holder 42 is raised and the transfer film 18 is separated from the substrate 6. At the same time, the mask film fixing jig 44 is raised to separate the mask film 5 from the substrate 6. Thereby, the mask film 5 having the transfer layer 18b attached to the upper surface is peeled off from the substrate. Accordingly, the correction portion is separated from the opening. As a result, the configuration shown in FIG. At this time, it is pulled by the mask film 5 and becomes a shape in which a horn stands on the end of the transferred transfer layer 18b. That is, the transfer layer adhering to the end of the opening of the mask film 5 protrudes upward as the mask film rises.

In order to suppress this horn shape, the transfer layer (correction portion) transferred onto the substrate 6 by the elastic body through the peelable member is pressed again. Specifically, first, the mask film reel 8 is rotated to supply the mask film 5 in which no opening is formed. Thereby, the mask film 5 which is not provided with the opening part is arrange | positioned on a correction part. That is, the part where the opening part of the mask film 5 is not provided is arranged opposite to the correction part. Accordingly, the mask film 5 comes into contact with the correction portion. Then, the transfer layer formed on the substrate 6 is pressed by the thermal transfer rod 43 using the mask film 5 as the peelable member and the thermoplastic resin layer 18d of the transfer film used for forming the transfer layer as the elastic body. Thereby, as shown in FIG.10 (c), the height of the horn shape part of a transfer layer can be made low, and the flatness within a pixel can be improved. At this time, since the film holder 42 holding the transfer film 18 is not moved, the mask film 5 is disposed between a portion where the transfer layer of the transfer film 18 is not provided and the correction portion. For example, in the present embodiment, a pressure of 8 kg / cm ² is applied to the correction portion by the thermal transfer rod 43 heated to 120 ° C. As a result, the height of the horn portion, which was about 4 μm before pressing, can be made about 1.0 μm. Moreover, since the horn part of a correction part spreads so that the boundary part of a correction part and an uncorrected part (normal part) may be covered, coverage improves and it can suppress the light leak in the said boundary part.

  In the present embodiment, the mask film 5 is diverted as the peelable member, and the transfer film 18 is diverted as the elastic body. By pressing using the thermal transfer rod 43, the height of the horn shape at the end of the transfer layer can be reduced without adding another configuration. For this reason, an increase in the size of the repair head 35 can be prevented. However, it does not prevent separately providing the peelable member, the elastic body, and the pressing member. Further, the peelable member may be provided as necessary and may be omitted. Furthermore, the pressing member itself may be formed of a material including an elastic body. For example, you may press with the press member which consists of elastic bodies, such as rubber | gum. Moreover, you may press through the peelable film which has an elastic layer. The peelable film should just be the thickness of the grade along the unevenness | corrugation of the pattern of a board | substrate. Moreover, the process of moving the transfer film 18 can be omitted by pressing the correction portion at the location where the transfer layer of the transfer film 18 is transferred.

  Thus, after the transfer layer 18b is thermally transferred by a dry process, the correction portion can be flattened. Further, after raising the mask film fixing jig 44, the mask film reel 8 is rotated. When the oxygen barrier layer 18c or the thermoplastic resin layer 18d adheres to the substrate 6 side, a shower spray process is performed with a weak alkaline aqueous solution to remove the oxygen barrier layer 18c or the thermoplastic resin layer 18d in a subsequent cleaning step. . Alternatively, the oxygen blocking layer 18c and the thermoplastic resin layer 18d are removed by a method such as scraping with an abrasive tape or wiping with a cloth tape. As a result, as shown in FIG. 10D, a flat transfer layer 18b that becomes a colored layer is transferred to the position of the white defect.

  When the transfer layer (corrected portion) on the substrate 6 is heated in the heating step (step S112) described later, the height of the corrected portion becomes substantially equal to the height of the other colored layer (uncorrected portion) having no defect. .

  By using the mask film 5 in this manner, characteristics such as thickness, color, and transmittance of the layer transferred as the colored layer can be easily controlled. That is, by forming the transfer layer 18b of the transfer film 18 with desired characteristics, the corrected colored layer can be corrected so as to be in approximately the same state as a normal colored layer. Thereby, accurate defect correction can be performed. In the thermal transfer process described above, to increase the transfer speed. The substrate 6 may be preheated. For example, preliminary heating can be performed by irradiating infrared rays from the halogen lamp 14.

  After peeling the mask film 5 from the substrate 6, the repair head 35 is moved so that the UV light source 13 is disposed on the transfer portion. Then, UV light is irradiated from a UV light source 13 provided on the surface side of the substrate 6. Thereby, UV light is irradiated from both surfaces of the transfer layer 18b. Therefore, the transfer layer 18b can be uniformly irradiated with UV light, and the transfer layer 18b made of a photosensitive resin is uniformly cured. The optical system 41 may be provided with a lens or a filter for the UV light source 13.

  When the UV light is irradiated from the front side, the repair head 35 is moved so that the heater rod 45 is disposed immediately above the transfer layer 18 b attached to the substrate 6. The heater rod 45 is set to a temperature higher than that of the thermal transfer rod 43. Then, the heater rod 45 is pressed against the substrate 6 to heat the transfer layer 18b. Thereby, a thermal crosslinking reaction can be caused in the transfer layer 18b. Alternatively, heating may be performed by infrared rays from the lamp light source 9 provided in the optical system 41 or the halogen lamp 14 provided in the repair head 35. Further, after the repair head 35 is moved, a high-temperature drying gas is blown from the high-temperature blower 46 to dry the transfer layer 18b. In addition, you may heat with the heater rod 45, blowing high temperature dry gas with a high temperature blower. Thereby, processing time can be shortened and productivity can be improved. Thereby, the transfer layer 8b can be solidified and the transfer layer 18b can be stabilized. Furthermore, it is possible to reduce the occurrence of peeling of the transfer layer 18b in a later process (for example, a cleaning process). Therefore, a defect can be corrected reliably. Furthermore, the flatness of the transfer layer 18b can be improved. The heater rod 45 may be shared with the thermal transfer rod 43, but is preferably provided separately in order to reduce the temperature change time.

  Furthermore, a step portion may be provided around the opening of the mask film 5 in order to improve the flatness of the correction portion. This will be described with reference to FIG. FIG. 11 shows the shape of the mask film 5 when the thickness of the periphery of the opening 5a of the mask film 5 is thus reduced. Fig.11 (a) is a top view of the mask film 5, FIG.11 (b) is AA sectional drawing of Fig.11 (a). As shown in FIG. 11, a thin step portion 5 b is provided so as to surround the periphery of the opening 5 a of the mask film 5. For example, when the size of the opening 5a is a square with a side length of 100 μm, the stepped portion 5b is set to a square with a side length of 300 μm, and the opening 5a is arranged at the center. can do. The mask film 5 having such a shape can be formed by changing the total irradiation power from the laser light source 1 described above. For example, the mask film having the above shape can be formed by changing the number of times of irradiation with the short pulse light from the laser light source 1.

  For example, the irradiation region of the pulse laser beam on the mask film is formed into a square shape with a side of 300 μm by the beam forming mechanism 2. In this state, 30 shots of pulsed laser light are irradiated. Thereby, the thickness of the mask film in the irradiation region becomes 3.75 μm. Next, a pulsed laser beam is irradiated to the center of the square region having one side of 300 μm and the square region having one side of 100 μm. In other words, the irradiation region of the pulse laser beam is made square with a side of 100 μm by the beam forming mechanism. In this state, 40 shots of pulsed laser light are applied to the thinned region of the mask film 5. Thereby, the mask film 5 can penetrate and the opening part 5a can be provided. Moreover, since the area | region around the opening part 5a is 3.75 micrometers in thickness, the level | step-difference part 5b can be formed. As described above, the stepped portion can be formed by changing the irradiation amount of the laser light according to the region. The procedure for providing the opening 5a and the step 5b is not limited to the above. For example, after irradiating the region corresponding to the opening 5a with the laser beam, the region corresponding to the stepped portion 5b may be irradiated with the laser beam. The step portion 5b may be provided so as to surround the entire outer periphery of the opening 5a.

  By performing transfer using the mask film 5 having the step portion 5b as described above, the step on the substrate 6 caused by the colored layer 62, the BM 64, and the mask film 5 is reduced. It becomes uniform and the flatness of the transfer layer 18b can be improved.

  Next, the procedure of the defect correction method will be described with reference to FIG. FIG. 12 is a flowchart showing the procedure of the defect correction method. First, the defect of the substrate 6 is optically detected (step S101). Here, the optical system 41 provided in the repair head 35 and the illumination light source 51 provided in the light source head 37 are used. Then, the repair head 35 and the light source head 37 are moved synchronously so that the optical axis of the CCD camera of the optical system 41 and the optical axis of the illumination light source 51 coincide. As a result, transmission observation is possible, and defect detection efficiency can be improved. Of course, the defect may be detected by reflection observation. The repair head 35 and the light source head 37 are scanned to inspect the entire surface of the substrate. Then, for each detected defect, the position on the substrate, the type of defect, the size of the defect, and the like are associated and stored in the information processing apparatus. Note that the mask film 5 may be removed from the optical path when a defect is detected.

  When the defect inspection for the substrate 6 is completed, the correction location and the correction color are determined (step S102). At this time, it may be automatically determined by processing in the information processing apparatus, or the operator may determine the correction color by observing the defective part. Then, the repair head 35 is moved to the transfer film loader 21 corresponding to the correction color (step S103).

  After the repair head 35 is moved to a position corresponding to the transfer film loader 21, the transfer film 18 is held (step S104). Here, the color transfer film 18 corresponding to the defect to be corrected is held. Specifically, a piece of the transfer film 18 supplied by the transfer film loader 21 is adsorbed by the film holder 42. It is not necessary for the light source head 37 to follow the movement of the repair head. That is, the light source head 37 may be moved to a position corresponding to the defect to be detected.

  Next, the repair head 35 is moved to the defective part (step S105). At this time, the optical system 41 of the repair head 35 is arranged at the coordinates of the defect stored in the information processing apparatus. Further, the illumination light source 51 of the light source head 37 is disposed at a position corresponding to the defective portion. Then, the substrate 6 may be observed through the mask film by irradiating the substrate with light from the illumination light source 51 or the lamp light source 9. In this case, it is possible to confirm whether the position is accurately aligned with the position of the defect. That is, it can be confirmed that the optical axis of the optical system 41 is exactly coincident with the position of the defect. If the alignment is not accurately performed, fine adjustment may be performed by moving the repair head 35 and the light source head 37.

  When the repair head 35 is moved to the defective portion, the mask film 5 is fixed to the substrate 6 (step S106). First, the mask film reel 8 and the mask film fixing jig 44 are clamped with respect to the X rail 34. Thereby, even when the repair head 35 is moved, the position of the mask film 5 does not shift. Then, the mask film fixing jig 44 is moved downward to press the mask film 5 against the substrate 6. Thereby, the mask film 5 is pressure-bonded to the substrate 6 and fixed. And the air between a board | substrate and the mask film 5 is removed by the mask film pressing rod 48, and an adhesiveness is improved.

  Then, the mask film 5 is irradiated with laser light from the laser light source 1 of the optical system 41 to form an opening (step S107). At this time, the beam shaping mechanism is adjusted according to the size of the defect to be corrected. Thereby, it can be set as the magnitude | size corresponding to the defect which corrects the magnitude | size of an opening part. For example, the size of the opening can be made substantially coincident with one pixel of the color filter. In the optical system 41, the laser beam from the laser light source 1 and the optical axis of the illumination light from the lamp light source 9 coincide with each other. That is, since the light from the laser light source 1 and the lamp light source 9 are adjusted to be on the same optical axis, the laser spot on the mask film 5 and the spot of the illumination light for observation are at substantially the same position. Therefore, the laser light from the laser light source 1 and the illumination light from the lamp light source 9 are incident on the same position on the substrate 6. Thereby, an opening can be accurately formed at a location corresponding to a defect. Further, the step portion 5b may be formed so as to surround the entire outer periphery of the opening in step S107.

  After forming the opening, the film holder 42 is moved onto the mask film 5 (step S108). That is, the repair head 35 is moved in the X direction, the position of the optical system 41 is shifted from above the opening of the mask film 5, and the film holder 42 is disposed on the mask film 5. Thereby, the transfer film 18 and the thermal transfer rod 43 are disposed on the opening of the mask film 5. At this time, since the mask film reel 8 and the mask film fixing jig 44 are fixed to the X rail 34, the mask film 5 does not move. Therefore, the opening of the mask film 5 is aligned with the defective portion.

  Next, pressure-bonding of the transfer film and UV irradiation from the back side are performed (step S109). Specifically, the thermal transfer rod 43 disposed on the opening is lowered to press the transfer film 18 against the substrate 6. Thereby, the transfer layer of the transfer film 18 is transferred to the substrate 6 through the opening. In the present invention, since the mask film 5 is used, the transfer layer is pressure-bonded only at a portion corresponding to the opening of the substrate 6. Even if the portion other than the opening is pressed by the thermal transfer rod 43, it is masked by the mask film 5 and therefore does not adhere to the substrate 6. Thereby, the transfer layer 18b can be transferred only to the defective portion, and accurate defect correction can be performed. Further, while pressing the transfer film 18 with the thermal transfer rod 43, UV light is irradiated from the back surface side of the substrate 6 by the UV light source 52 of the light source head 37. Thereby, the transfer layer can be cured, and the adhesion of the transfer layer to the substrate 6 can be improved. In addition, it is preferable to arrange | position so that the light source head 37 may be moved before step S107, and UV light may be irradiated to the position corresponding to an opening part.

  Then, after the transfer layer is transferred, the transfer film 18 is peeled off from the mask film 5. For example, after raising the thermal transfer rod 43 and cooling the transfer film 18, the film holder 42 with the mask film 5 adsorbed is raised to separate the transfer film 18 from the mask film 5. Then, the mask film fixing jig 44 is raised to peel the mask film 5 from the substrate 6. As a result, the mask film 5 and the substrate 6 can be separated.

  Thereafter, the transfer layer (correction portion) transferred to the substrate 6 is pressed (step S110). Specifically, first, the mask film reel 8 is rotated to move the unused portion of the mask film 5 below the film holder 42. Thereby, the unused part of the mask film 5 is opposingly arranged on the correction part. Then, the mask film 5 is fixed to the substrate 6. The mask film reel 8 and the mask film fixing jig 44 are clamped with respect to the X rail 34. Then, the mask film fixing jig 44 is moved downward to press the mask film 5 against the substrate 6. Then, the air between a board | substrate and the mask film 5 is removed by the mask film pressing rod 48, and an adhesiveness is improved. Thereby, the mask film 5 is disposed to face the substrate 6. Then, the thermal transfer rod 43 disposed on the unused portion of the mask film 5 is lowered and the transfer film 18 is pressed against the substrate 6 again. Thereby, the height of the horn formed at the end of the transfer layer transferred onto the substrate 6 through the opening can be reduced.

  After pressing the transfer layer, the transfer film 18 is peeled from the mask film 5. After the thermal transfer rod 43 is raised and the transfer film 18 is cooled, the film holder 42 with the mask film 5 adsorbed is raised to separate the transfer film 18 from the mask film 5. Then, the mask film fixing jig 44 is raised to peel the mask film 5 from the substrate 6. As a result, the mask film 5 and the substrate 6 can be separated. At this time, the mask film reel 8 may be rotated to move the unused portion of the mask film 5 below the film holder 42.

  After separating the mask film 5 from the substrate, the transfer layer is irradiated with UV light from the surface of the substrate 6 (step S111). Specifically, the repair head 35 is moved to the transfer location so that the UV light source 13 provided in the optical system 41 is at a position corresponding to the transfer location. Then, the UV light source 13 irradiates the transfer layer with UV light. At this time, since the mask film 5 is not provided on the transfer portion, the UV light is irradiated without passing through the mask film 5.

  When the UV light irradiation is completed, the transfer layer is heated (step S112). Specifically, the repair head 35 is moved in the X direction, and the heated heater rod 45 is opposed to the transfer location. Then, the heater rod 45 is moved downward to press the transfer layer. The transfer layer is heated by the heat from the heater rod 45. Thereby, the correction part formed on the board | substrate 6 becomes the same height as another colored layer without a defect. Further, the repair head 35 is moved in the X direction, and the high temperature blower 46 is opposed to the transfer location. Then, a high-temperature dry gas is blown to heat the transfer layer transferred to the substrate 6. Alternatively, the halogen lamp 14 provided in the optical system 41 may be used for heating. Thereby, the transfer layer transferred to the substrate 6 is thermally cross-linked, and the transfer layer can be solidified. When the transfer layer is thermally cross-linked, the transfer layer is chemically stabilized and the elution of impurities can be prevented. Furthermore, it is possible to prevent peeling of the transfer layer in a later step. Thereby, defect correction is completed. In addition, when there are many defect locations on the substrate 6, heating may be performed collectively after the transfer of all the defects to one substrate 6 is completed. Specifically, the transfer layer may be transferred to all the defective portions without heating, and the substrate 6 may be heated in a high temperature oven.

  After the defect correction is completed, the used transfer film is discarded (step S113). Specifically, the repair head 35 is moved, and the film holder 42 that adsorbs the pieces of the used transfer film 18 is moved onto the trash 22. And adsorption | suction with the film holder 42 is stopped, and the fragment | piece of the used transfer film 18 is open | released. As a result, the pieces of the used transfer film 18 can be discarded. Immediately after this, a piece of the transfer film 18 corresponding to the next defect may be held.

  Further, when there are a plurality of defects on the substrate 6, the process is repeated from step S102. At this time, the mask film reel 8 is rotated to use a portion where the transfer layer is not attached to the upper surface of the mask film 5. Thereby, the defect can be corrected for the entire substrate 6. Note that, after step S112, the corrected portion may be observed by the optical system 41 to confirm whether or not the defect has been corrected normally. When the defect is not normally corrected, the same part may be corrected again with the part as a defect.

  The configuration of the optical system and the like of the defect detection mechanism and the defect correction mechanism shown in the figure is an example, and other optical components such as a filter, a lens, and a mirror may be provided. In the above description, the color filter substrate of a display device such as a liquid crystal display device has been described. However, the present invention can also be used for a color filter substrate for a solid-state imaging device such as a CCD camera. Of course, it can be used for pattern substrates other than the color filter substrate. For example, it can be used to correct a phosphor such as a PDP or a cathode ray tube. Further, it can be used for a thin film transistor array substrate of a liquid crystal display device. In this case, the transfer film is provided with a conductive layer made of a metal such as chromium, and the conductive layer is transferred with short pulse light, whereby the pattern of the wiring, the electrode, and the like can be corrected. Thereby, the disconnection of the wiring can be repaired. Or you may make it correct the defect of the insulating layer between wiring by providing an insulating film in a film. Furthermore, the photomask pattern can be corrected. Also in this case, the pattern can be corrected by transferring a light shielding layer such as a resin colored in chrome or black. In order to correct defects in this way, it is possible to correct various types of pattern substrate defects by providing a film with a transfer layer (colored layer, light-shielding layer, conductive layer, etc.) of a material corresponding to the location to be corrected. it can.

  In the above description, the defect is a pixel provided with a white portion, but the defect may be a foreign material made of a transparent material. Furthermore, a colored layer or the like that is not provided with high accuracy may be removed. These foreign substances that must be removed are referred to as defects. The defect can be corrected by removing the defect and transferring the transfer layer 18b. Further, the defect can be corrected by transferring the transfer layer to the defective portion where the predetermined pattern is not formed at the time of pattern formation. By performing defect correction using the above-described defect correction apparatus, it is possible to improve the productivity of pattern substrate manufacturing. That is, the repair head can be reduced in size, and the size of the apparatus can be reduced. Therefore, a footprint can be reduced and productivity can be improved. Furthermore, since the repair head 35 is not provided with a transfer film reel or the like, the repair head 35 can have a simple structure. Therefore, even when the heater such as the heater rod 45 or the optical system 41 is attached to the repair head 35, the repair head 35 can be prevented from being enlarged.

  Further, by performing defect correction using the above-described defect correction apparatus, a pattern substrate with good flatness can be manufactured. Furthermore, since the flatness of the transfer layer can be improved without adding another configuration to the repair head, an increase in the size of the repair head can be suppressed. In the present embodiment, the configuration in which the transfer layer formed on the substrate 6 is pressed by the thermal transfer rod has been described. However, the present invention is not limited to this. For example, the pattern on the substrate 6 can be polished to reduce the height of the horns formed at the end of the transfer layer on the substrate 6 so that the surface of the pattern can be planarized. In the present embodiment, a method for transferring a transfer layer using a transfer film is used as a method for forming a correction portion, but the present invention is not limited to this. For example, the present invention can be applied to a case where correction is performed by a spray coating method using a mask having an opening. That is, by pressing with an elastic body, the uneven shape in the correction region can be flattened, and the formation of protrusions can be suppressed. Further, since the horn shape at the end of the opening covers the boundary between the correction region and the normal portion, light leakage from the periphery of the correction region can be prevented.

  The transfer film 18 and the mask film 5 are not limited to films having the above-described configuration. The repair head 35 is not limited to the one that holds a piece of the transfer film, and a transfer film loader may be provided in the repair head 35 itself. Moreover, the process of the defect correction method shown in FIG. 12 is a process of a typical correction method, and this invention is not limited to this. The defect inspection apparatus according to the present invention is not limited to the above-described configuration. For example, the observation CCD camera 12 may be provided in the light source head 37 instead of the repair head 35. The UV light source 13, halogen lamp 14, heater rod 45 or high temperature blower 46 is preferably provided in the repair head 35. Since it is not necessary to provide a new head other than the repair head, the cost of the defect correcting device can be reduced. Further, by providing these in the same head, the moving distance of the head is shortened, and the processing time for defect correction can be shortened. Note that the defect correction apparatus described above is suitable for a pattern substrate in which different types of patterns are formed, such as a color filter substrate, and a plurality of transfer films are required. Thereby, the productivity of the pattern substrate can be improved.

It is a top view which shows the whole structure of the defect correction apparatus concerning this invention. It is side surface sectional drawing which shows the whole structure of the defect correction apparatus concerning this invention. It is side surface sectional drawing which shows the structure of the transfer film loader used for the defect correction apparatus concerning this invention. It is side surface sectional drawing which shows the structure of the repair head used for the defect correction apparatus concerning this invention. It is a top view which shows the structure of the repair head used for the defect correction apparatus concerning this invention. It is a side view which shows the structure of the film fixing jig of the defect correction apparatus concerning this invention. It is side surface sectional drawing which expands and shows the structure of the defect part of the defect correction apparatus concerning this invention. It is a side view which shows the structure of the repair head and light source head which are used for the defect correction apparatus concerning this invention. It is sectional drawing which shows the structure of the film which has a transfer layer concerning this invention. It is side surface sectional drawing which expands and shows the structure of the defect part of the defect correction apparatus concerning this invention. It is a figure which shows an example of the shape of the opening part of the mask film concerning embodiment of this invention. It is a flowchart which shows the procedure of the defect correction method concerning embodiment of this invention.

Explanation of symbols

1 Laser light source, 2 Beam shaping mechanism, 3 Half mirror, 4 Objective lens,
5 mask film, 5a opening, 5b step, 6 substrate, 7 stage,
8 mask film reel, 9 lamp light source, 10 wavelength tunable filter,
11 half mirror, 12 CCD camera, 13 UV light source, 14 halogen lamp,
18 transfer film, 21 transfer film loader, 22 trash,
25 transfer film supply reel, 26 transfer film take-up reel,
31 frame, 32 Y rail, 33 frame, 34 X rail, 35 repair head,
36 movable rail, 37 light source head, 41 optical system, 42 film holder,
43 thermal transfer rod, 44 mask film fixing jig, 45 heater rod,
46 high temperature blower, 47 housing, 48 mask film pressing rod,
49 suction pad, 51 illumination light source, 52 UV light source,
61 red colored layer, 62 green colored layer, 63 blue colored layer,
64 black matrix, 65 foreign matter, 66 white defect,

Claims (14)

A defect correction apparatus for correcting defects on a patterned substrate,
A mask film disposed oppositely on the substrate;
A laser light source that emits laser light that provides an opening in the mask film;
Correction means for correcting defects of the substrate through an opening provided in the mask film,
A defect correction device for pressing the correction portion corrected by the correction means with an elastic body. The correction means includes a transfer film having an elastic layer and a transfer layer, and a pressing member that presses the transfer film from above an opening provided in the mask film,
Transfer the transfer layer of the transfer film to the substrate through the opening, providing a correction portion,
The defect correction apparatus according to claim 1, wherein the transfer member is pressed against the correction portion by the pressing member, and the correction portion is pressed through the elastic layer. A peeling member disposed on the correction portion so as to be in contact with the correction portion.
The defect correction apparatus according to claim 1, wherein the correction portion is pressed through the peeling member. The peeling member is the mask film;
The defect correction apparatus according to claim 3, wherein a portion where the opening of the mask film is not provided is disposed opposite to the correction portion, and the correction portion is pressed through the mask film.   The said mask film is a defect correction apparatus in any one of Claims 1 thru | or 4 provided with the level | step-difference part which made the thickness of the said mask film thin to the whole outer periphery of the said opening part. A defect correction apparatus for correcting defects on a patterned substrate,
A mask film disposed oppositely on the substrate;
A laser light source that emits laser light that provides an opening in the mask film;
Correction means for correcting defects of the substrate through an opening provided in the mask film,
The defect correction apparatus by which the level | step-difference part which made the thickness of the said mask film thin is formed in the whole outer periphery of the said opening part of the said mask film. A defect correction method for correcting defects on a patterned substrate, comprising:
A mask film is disposed opposite to the substrate,
Irradiating the mask film with laser light, providing an opening in the mask film,
Correcting the defect through the opening provided in the mask film, providing a correction portion on the substrate,
Separating the correction portion and the opening provided in the mask film;
A defect correction method of pressing a correction portion spaced apart from the opening by an elastic body. A transfer film having an elastic layer and a transfer layer corresponding to a pattern to be transferred is disposed on the substrate, the transfer layer is transferred to the substrate through the opening by a pressing member, and the correction portion is provided on the substrate. ,
The defect correction method according to claim 7, wherein the transfer member is pressed against the correction portion by the pressing member, and the correction portion is pressed through the elastic layer.   The defect correction method according to claim 8, wherein the portion to which the transfer layer of the transfer film has been transferred is pressed against the correction portion to press the correction portion.   The defect correction method according to claim 7, wherein a peeling member that comes into contact with the correction portion is disposed on the correction portion so as to press the correction portion via the peeling member. The peeling member is the mask film;
The defect correction method according to claim 10, wherein a portion of the mask film not provided with an opening is disposed opposite to the correction portion and pressed via the mask film.   The defect correction method according to any one of claims 7 to 11, wherein the mask film having a stepped portion in which the thickness of the mask film is reduced on the entire outer periphery of the opening is disposed to face the substrate. A defect correction method for correcting defects on a patterned substrate, comprising:
A mask film is disposed opposite to the substrate,
Irradiating the mask film with laser light to form a stepped portion with a reduced thickness on the mask film,
Irradiating the mask film with laser light, forming an opening corresponding to a defect on the substrate in the stepped portion,
A defect correction method for correcting a defect of the substrate through an opening formed in the mask film. Forming a pattern on the substrate,
Detecting defects on the substrate;
A method for manufacturing a patterned substrate, wherein a defect is corrected by the defect correcting method according to claim 7.

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