TWI689766B - Method and apparatus for repairing light leakage defect - Google Patents

Abstract

Disclosed are a method and apparatus for repairing a light leakage defect, wherein a non-transparent layer is formed in the outside of a glass substrate through which light at the defective pixel position of a display panel including a defective pixel passes. The method includes processing a given depth of a glass substrate where a defective pixel of a display panel is positioned by a laser and forming a non-transparent layer in a defect area of the defective pixel using a material of the glass substrate in the processing. The laser is a femtosecond or nanosecond pulse laser having a frequency of 1Hz or more. The wavelength of the laser is 300 mm or less. The focus of the laser beam may be determined by the focal lens of an objective lens or scanner.

Description

Method and equipment for repairing light leakage defects

Cross-reference of related applications

This application claims the rights and interests of Korean Patent Application No. 10-2018-0107948 filed with the Korean Intellectual Property Office on September 10, 2018. The entire contents of the patent application are incorporated by reference In this article.

The present invention relates to a method and equipment for repairing light leakage defects of a display device such as a liquid crystal display (LCD) or an organic light-emitting diode (OLED).

In a display device, defective pixels that deteriorate image quality may appear. Generally speaking, a few defective pixels located in a location where the user's eyes are not concerned may be permitted. However, the presence of defective pixels reduces the value of the display device, and the display device may be discarded according to circumstances. Therefore, defective pixels are one of the most important factors that reduce production efficiency and increase costs.

Therefore, if the defective pixels of the display device that has been almost completed can be repaired, the production efficiency can be improved. For this purpose, several pixel repair techniques for display devices have been developed.

One of the pixel repair methods is to blacken defective pixels. Defective pixels can be divided into bright pixels and dead pixels. The yield rate of the display device panel can be improved by blackening the bright-point pixels, because the criterion for the normally-accepted bright-point pixels is stricter than the criterion for the dead-point pixels.

Existing methods of blackening such bright-spot pixels include: a method of melting the black matrix by irradiating the laser to the black matrix and blackening the bright-spot pixels by inducing the material of the molten black matrix toward the defective pixel; A color by radiating the laser directly to the area where the light passes The method of color filter or color filter structure makes the color of the transmissive area become black and the bright spot pixel becomes black.

The polarizing properties and focal length of the focusing lens can be used in order to focus energy on a specific layer such as a black matrix or color filter layer for blackening, so that other layers or parts of the panel will not be damaged when performing laser repair.

Korean Patent No. 1009813060000 discloses "a method for repairing a liquid crystal display panel using polarized light". Under this situation, a method for repairing a method of blackening a defective portion of a pixel by using a polarizing plate mounted on the liquid crystal panel itself is disclosed. However, the conventional technology has a problem that pixels cannot be repaired because most defective pixels are not suitable for repair using existing repair methods.

For example, the method of using the black matrix in the existing methods has a great limitation depending on whether oxygen and carbon are present in the components or the small and large specific gravity of oxygen and carbon and the amount and thickness of the black matrix. The color filter material carbonization method depends on whether a component such as oxygen, carbon, or bromine (Br) is present in the component and is variously applied, and is affected by liquid crystal generated by energy during the carbonization process. In detail, vertically oriented liquid crystals can cause problems because the radiation resilience of the adjacent liquid crystals is damaged when the radiation laser is used for repair. In addition, in display devices such as OLEDs, blackening or conductive foreign material extrusion methods are widely used, but many defects may occur that cannot be repaired depending on the defects.

In addition, when there are multi-connectivity foreign substances (ie, defective pixels) connected above two or more pixels, it is difficult to repair such defective pixels. When there is a white defect foreign substance that appears because the part of the color filter layer in the pixel has been torn off, the problem is that there is still light leakage due to the part where the color filter layer has been torn off This phenomenon is because the part is no longer blackened, but the color filter layer is blackened by laser.

The present invention has been made to solve the problem that the production efficiency can be reduced due to the situation that it is difficult to repair in the existing blackening method for defective pixels in the display device as described above. An object of the present invention is to provide a method and equipment for repairing light leakage defects, which can improve the repair efficiency, because the method and equipment can be applied by the existing Method to resolve the type of pixel defects.

A method of repairing a light leakage defect according to one aspect of the present invention includes: processing a given depth of a glass substrate where a defective pixel of a display panel is positioned by a laser; and using in the processing A material of the glass substrate forms an opaque layer in a defect area of the defective pixel.

In one embodiment, the size of the non-transparent layer is the size of the defect area or larger.

In one embodiment, the laser is a femtosecond or nanosecond pulsed laser with a frequency of 1 Hz or greater. The processing of the glass substrate by the laser is performed using a block, scan, or pattern processing method, which includes controlling the energy output, frequency, processing time, and speed of the laser to control the processing depth.

In one embodiment, the laser has a wavelength of 300 nm or less. An optical system is configured to have a numerical aperture (NA) corresponding to the given depth, so that the focal point of the laser beam has an expansion angle that is relatively larger than the size of the defect area.

In one embodiment, the focus of the beam can be determined by an objective lens or a focusing lens of a scanner.

In one embodiment, forming the non-transparent layer includes forming a cover film made of metal or opaque ink over the material of the glass substrate to cover the defect area. The cover film can be formed by a printing scheme using laser chemical vapor deposition (LCVD), ink coating, or an electrohydrodynamic (EHD) jet.

An apparatus for repairing a light leakage defect according to one aspect of the present invention includes: a laser configured to generate a laser light having a deep ultraviolet (DUV) wavelength of 300 nm or less; an optical system, It is configured to control one focal point of the laser; an epi-illumination illumination unit configured to illuminate a processing area where the focal point is formed; and a camera configured to monitor the focal point; and a control It is configured to control the processing depth of a glass substrate in the processing area and the laser energy transferred to the glass substrate based on an image of the camera. After the treatment, the thickness of a portion of the glass substrate is covered by the material of the glass substrate removed by the laser to cover a light leakage defect area in the processing area.

In one embodiment, the beam focus of the laser has an expansion angle that is relatively larger than the size of the light leakage defect area of the optical system, the optical system is configured to have a numerical aperture corresponding to a given depth ( NA). The optical system may include a DUV objective lens.

In one embodiment, the apparatus may further include a cover layer forming unit configured to form a cover layer made of opaque ink or a metal film over the material of the glass substrate, thereby Cover the light leakage defect area.

According to another aspect of the present invention, a method of repairing a light leakage defect includes forming a non-transparent layer (or an opaque material film) in the exterior of a glass substrate, one of a display panel including a defective pixel has The light at the position of the defective pixel passes through the glass substrate.

In one embodiment, the thickness of the outer portion of the glass substrate can be removed, and the non-transparent layer can be positioned in the removed location. Under this condition, laser light may be radiated to remove the thickness portion outside the glass substrate.

In one embodiment, the wavelength of the laser used for the laser radiation is selected to be in the range of 300 nm to 400 nm. The laser may be laser light in a region having a low light transmittance and low absorption for a common glass substrate, such as laser light in a deep ultraviolet (DUV) region.

In one embodiment, when radiating laser light for removing the thickness of a portion of the glass substrate, an element of an optical system on a laser light path can be controlled so that the laser light energy is concentrated on a corresponding glass substrate Externally, in order to prevent deterioration or breakage of a material layer in a corresponding pixel. For example, the optical system may be configured so that a focus is focused on the outside of a glass substrate to be removed, and then expands at a wide angle after passing the focus position to rarely achieve heating and volatilization effects.

In addition, in order to transfer the thermal energy of the laser light to a surrounding component without deteriorating or breaking a surrounding element, the pulse type laser light that continues for a short time in a period longer than a given period can be repeatedly radiated, making a The thermal effect is limited to a focus area and concentrates on the focus area for a period of time.

In one embodiment, the non-transparent layer formed in the exterior of the glass substrate may be formed of a metal film or opaque ink having a low light transmittance between the thin films. Such non- The transparent layer may be formed by fine direct patterning of a printing scheme such as laser chemical vapor deposition (LCVD) or using an electrohydrodynamic (EHD) spray, depending on the material.

In one embodiment, the formation of the non-transparent layer can be performed in a complementary manner with the existing blackening process, thereby preventing light leakage.

According to another aspect of the present invention, a display device including a light leakage defect repair unit includes an opaque layer formed in a defect area of a defective pixel, the defective pixel including a glass of a display panel A light leakage defect in the substrate. The non-transparent layer is formed as a material of the glass substrate by processing a portion of the glass substrate adjacent to the defective pixel.

In one embodiment, the non-transparent layer may further include opaque ink or a metal film formed on the material of the glass substrate.

100‧‧‧Lower substrate

110‧‧‧Laser supply unit

111‧‧‧Laser light source

113‧‧‧Laser light source

115‧‧‧ Beam splitter

117‧‧‧Laser

120‧‧‧Slit

130‧‧‧ source gas supply pipe

135‧‧‧ exhaust pipe

140‧‧‧Laser tube lens

151‧‧‧beam splitter

153‧‧‧ Epi-illumination lighting unit

155‧‧‧Transmission lamp

157‧‧‧slit lamp

160‧‧‧Objective system

160a‧‧‧tube lens

160b‧‧‧tube lens

160c‧‧‧tube lens

170‧‧‧ substrate

175‧‧‧platform

191‧‧‧ Beam splitter

192‧‧‧Reflecting mirror

193‧‧‧Charge coupled device

194‧‧‧Image lens tube lens

200‧‧‧Upper substrate

211‧‧‧Glass substrate

221‧‧‧Black Matrix

231‧‧‧Color filter layer

241‧‧‧Protection coating film

251‧‧‧Common electrode

261‧‧‧non-transparent layer

300‧‧‧Liquid crystal layer

S1‧‧‧Signal

S2‧‧‧Signal

FIG. 1 is a cross-sectional view showing a state where an opaque material film has been formed in a defective pixel of a display device according to an embodiment of the present invention.

2 is a conceptual diagram schematically showing a configuration of an example of a repair device suitable for a method according to an embodiment of the present invention.

FIG. 3 is a reference diagram for illustrating an optical method for preventing thermal shock or deterioration of other elements displaying a pattern.

FIG. 4 is a transmission diagram for each wavelength of laser light in a wavelength band suitable for laser processing of a glass substrate surface in a method according to an embodiment of the present invention.

In the following, detailed embodiments of the present invention are described in detail with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view showing a state where an opaque material film has been formed in a defective pixel of a display device according to an embodiment of the present invention.

In this case, the display device is an LCD to which a-Si thin film transistor (TFT) has been applied. Figure 1 shows the overall configuration of the pixel unit.

The panel of the configuration display device basically includes an upper substrate 200 and a liquid crystal layer 300 And lower substrate 100.

In the lower substrate, the gate electrode and the gate line are formed on the glass substrate through thin film stacking and patterning. The gate insulating film is formed on the gate electrode and the gate line. A semiconductor film is formed. The data line, the source electrode and the drain electrode are formed through a conductive layer stacking process and a patterning process. Therefore, a TFT for driving each pixel is formed.

The detailed configuration of the TFT can be formed in various forms using other known methods. The a-Si TFT can be replaced with a TFT having a different structure such as an LTPS TFT or an oxide TFT.

An interlayer dielectric film with through holes is formed in the drain region on the TFT. The pixel electrode is formed on the interlayer dielectric film. A passivation film or an alignment film may be further formed on the pixel electrode.

In the upper substrate 200, a black matrix 221 and a color filter layer 231 are formed on the bottom of the glass substrate 211. The protective coating film 241 and the common electrode 251 are sequentially formed. A passivation film or an alignment film may be further formed under the common electrode.

The liquid crystal layer 300 exists between the upper substrate 200 and the lower substrate 100. In this situation, the liquid crystal layer 300 is initially oriented vertically.

In the embodiment of the present invention, it is assumed that there is a defective pixel, because the abnormality may occur in the black matrix 221 or the color filter layer 231 of the upper substrate 200 of the pixel, or the abnormality may occur in the TFT or the lower substrate 100 In other components. In order to prevent light leakage in defective pixels, the thickness of the portion of the glass substrate has been removed from the outside (surface) of the upper substrate so that it is larger than the size of the pixel electrode, preferably up to the pixel area, and the black matrix is covered . The removed portion has been filled with a non-transparent layer 261 having a thickness approximately similar to the removed thickness.

A material having an extremely low light transmittance, such as opaque ink or metal film, may be used as the non-transparent layer 261. In ultra-high image quality displays, the non-transparent layer must be accurately positioned at the corresponding pixel position because of the high degree of pixel integration and the extremely small pixel size. For such accurate tasks, precision printing methods such as laser chemical vapor deposition (LCVD) method or electrohydrodynamic (EHD) spray, which is a direct patterning method, can be used.

In FIG. 1, the non-transparent layer 261 has been depicted as being formed in the surface of the glass substrate over the entire area of the defective pixel where light leakage can occur. In general, the pixel electrode is formed in the main area through which light passes. When the light transmission voltage is applied to the main area, the liquid crystal array Changes in the main area, but diffraction or reflection can be performed in the main area with optical properties. Such diffraction or reflection may be used to cause light leakage in areas other than the pixel electrode. In addition, although light leakage is rarely seen at the front depending on the viewing angle, light leakage can be clearly seen from the side.

Therefore, the non-transparent layer may be formed in a region larger than the pixel electrode of the defective pixel, so as to maximize the protection of the defective pixel from light leakage by considering light leakage attributable to the viewing angle or diffraction. In order to prevent defective pixels to the greatest extent without blocking the open portions of adjacent pixels, a non-transparent layer may be formed to cover the entire area of the black matrix forming the boundary between the corresponding pixel and the adjacent pixel plus the area of the corresponding pixel.

After the non-transparent layer is formed, the phase difference plate or the polarizing plate is further positioned on the glass substrate. Therefore, the non-transparent layer itself is rarely scratched or removed by external force, but can be removed during the process. For this reason, after the non-transparent layer is formed, a relatively hard passivation film that can be adhered to the non-transparent layer may be further formed to protect the non-transparent layer. In detail, if the non-transparent layer is directly formed on the glass substrate without the process of removing the thickness of the portion of the glass substrate, a passivation film may be further necessary because the non-transparent layer can be detached during the process.

Therefore, in a pixel having such a structure, the liquid crystal layer does not serve as a switch for blocking light due to defects in the pixel. Therefore, when light leaks through the pixel, the non-transparent layer formed in the exterior of the glass substrate blocks the leaked light, thereby making the pixel regarded as a dark spot.

In the embodiments of the present invention, the non-transparent layer has been illustrated as being formed only in the upper substrate, but may be formed in the exterior of the lower substrate, or may be formed in both the upper and lower substrates.

In addition, in the embodiments of the present invention, the black matrix processing for pixel blackening or color filter blackening has been shown as not performed. However, to supplement the deficiencies of the state in which the blackening task based on such criteria has been performed, a non-transparent layer may be formed in the exterior of the glass substrate via an additional blackening task.

2 is a conceptual diagram schematically showing a configuration of an example of a repair device suitable for a method according to an embodiment of the present invention.

Referring to FIG. 2, the laser supply unit 110 for laser processing is positioned at the top. The laser light emitted from the laser supply unit has a slit 120 or a mask cut in a given form Cut state. The laser light passes through the objective lens system 160 via the laser tube lens 140 and the beam splitters 191 and 151, and then is incident on the processing area of the substrate 170. Several lens combinations are placed in the objective lens system 160 so that the laser light can be selected and passed through the barrel lenses 160a, 160b, and 160c with the most suitable lens combination. The laser light may include a pulse laser of 10 fs to 100 ns with a frequency of 1 Hz or more.

In order to radiate the laser light to the processing area of the substrate 170, the position where the laser light is radiated and the position of the substrate can be relatively adjusted so that the laser light is radiated at a position where the substrate stops intermittently after the substrate moves or when the substrate continuously moves To the processing area of the substrate. In general, such relative movement can be performed by a transfer device for determining the plane position by independently moving the platform 175, on which the substrate is positioned on the X axis and the Y axis. In another embodiment, the laser supply unit 110, the optical system, and the source gas supply tube 130 may be formed as a single module, and processing using a laser such as LCVD may be performed while moving the module relative to the substrate. A heater (not shown) for preheating the substrate to facilitate laser processing may be further positioned on the substrate platform 175.

The source gas supply pipe 130 and the exhaust pipe 135 are disposed near the processing area, so that the source gas or precursor gas of metal or other conductive material used to form the wiring pattern is supplied to the processing area. The by-products generated during the formation of the wiring pattern are quickly discharged to the outside through the discharge pipe 135 without adversely affecting the procedure.

The epi-illumination lighting unit 153 is prepared. The light from the epi-illumination illumination unit travels along the optical axis of the laser light source through the beam splitter 151 below the laser tube lens 140, and is radiated above the processing area of the substrate 170 through the objective lens system 160. The image of the processing area of the substrate in the state where the processing area has been irradiated by the epi-illumination illumination unit passes through the objective lens system 160 in the reverse direction. The image is separated from the laser beam axis passing through the beam splitter 191, and is input to the charge coupled device 193, such as a video camera, through the image tube lens 194 and the mirror 192.

The camera is configured for workers to adjust the degree of laser processing, while monitoring the image of the substrate processing area, or connected to an automatic control device (not shown), so that the laser control device connected to the automatic control device can control.

The automatic control device may be a computer system, which is combined with the controllable element of the present invention To control the components according to the program or manually. When the automatic control device is connected to the camera, it can obtain the result by processing the camera image using an image processing program, and can move necessary components automatically or based on the result based on the result.

In addition to the epi-illumination illumination unit 153, the transmissive lamp 155 for illuminating the substrate so that the substrate transmits at the back side of the substrate and the slit lamp 157 for illuminating the part above the slit or the mask can be further arranged and used if necessary Make a lamp.

The laser supply unit 110 includes a plurality of laser light sources 111 and 113 and a beam splitter 115 that guides the laser to a common optical path and a common optical axis. In this case, although not shown in the figure, the laser supply unit 110 may further include a beam shaping unit (not shown in the figure) that is responsible for shaping the optical form.

The laser supply unit 110 has been shown to include a plurality of laser light sources, but the tasks of LCVD and thickness removal of a portion of the glass substrate can be performed by changing the output or using a single laser light source radiation method. In the laser supply unit, the choice of detailed laser light source can be performed to drive one laser light source and stop the driving of other laser light sources, but shielding unnecessary laser light sources can be used to simultaneously drive all plural laser light sources method. A baffle (not shown) can be positioned to block the laser light from each laser light source for a relatively short period of time.

In such a configuration, when only the necessary laser light source is selected, the task of removing the thickness of the portion of the glass substrate and the LCVD procedure for the corresponding position can be used when the substrate is already on the platform 175 The bit method is easily executed without changing the position or setting of other components.

In order to perform LCVD, it is necessary to supply the source gas for the material for forming the wiring pattern on the substrate to the processing region of the substrate where the laser light will reach. An example of performing laser sintering by supplying material powders other than the source gas to the processing area and radiating laser light may also be considered. However, in the embodiments of the present invention, metal wiring patterns in the form of alloys are formed by supplying gaseous precursor materials. For example, tungsten hexacarbonyl "W(CO) ₆ "can be used as a source gas including tungsten.

When the thickness of the portion of the glass substrate is removed, sufficiently high energy is concentrated on the substrate, and therefore the glass partially evaporates, as long as the laser light is radiated to the corresponding position, but the surrounding components are not It should be damaged or should not be attributable to failure due to heat dissipation nearby. In addition, cracks or notches attributable to thermal shock should not appear in the glass substrate.

In order to prevent such heat conduction and environmental degradation to the environment, it is used to repeatedly radiate pulse type laser light, continue at a high output for a relatively long period of time for a short time, so that the thermal effect is limited to the focal area for a short time to strongly A laser light source with heating and evaporation enabled can be used as a laser light source for radiating laser light. Such a laser light source can be considered to have a very low frequency of 1 Hz, with a femtosecond or nanosecond pulse width.

The laser light used to remove a portion of the glass substrate may be continuously radiated to the substrate as fine spots, or may be radiated to the substrate in the form of a block in a given area. If the block area in the form of a block is wide, excessive energy is used for evaporation, and therefore heat can be transferred to surrounding elements, thereby causing damage and deterioration. In order to avoid such problems, the laser light is radiated in the form of dots, but the procedure of removing the part of the glass substrate can be performed until the necessary thickness of the glass substrate is removed from the area between given areas such as the pixel area, so that the laser light The form of vibration travels back and forth in a given area.

In the method according to an embodiment of the present invention, when radiating laser light for removing the thickness of a portion of the glass substrate, the components of the optical system on the laser light path, for example, the settings of the objective lens system or the scanner can be adjusted The focal length of the focusing lens causes the laser light energy to be concentrated outside the glass substrate, so as to prevent the deterioration or breakage of the material layer in the corresponding pixel. For example, briefly as shown in FIG. 3, the optical system may be configured such that the laser light 117 is focused on the outside of the glass substrate 211 to be removed by the objective lens system 160, and then expanded at a wide angle after passing the focal position Rarely achieve heating and volatilization.

The aforementioned laser, optical system, and camera may be included in the light leakage defect repairing apparatus according to the embodiment of the present invention, and may be controlled by the controller of the light leakage defect repairing apparatus. The controller can be connected to the charge coupled device 193, the laser light source of the laser supply unit 110 (refer to 111 in FIG. 2) and the actuator of the objective lens system 160, and can transmit and receive signals (for example, S1 and S2) or data. The controller may be implemented by at least one selected from the following: a logic circuit, a microcomputer, a program logic controller, and a computing device. For example, a computing device may include a memory configured to store software modules or programs for implementing a method of repairing light leakage defects, and a processor connected to the memory to execute the programs or software modules.

That is, the light leakage defect repairing apparatus according to an embodiment of the present invention may include: a laser configured to generate femtosecond laser light having a deep ultraviolet (DUV) wavelength of 300 nm or less; an optical system, which is Configured to adjust the focus of the laser; Epi-illumination lighting unit, which is configured to radiate light to the processing area where the focus is formed; Camera, which is configured to monitor the focus; and Controller, which is configured to be based on The image of the camera controls the processing depth of the glass substrate in the processing area and the laser energy transferred to the glass substrate.

In this case, after processing, the thickness of the glass substrate is covered by the material of the glass substrate removed by the laser to cover the light leakage defect area in the processing area.

In addition, the optical system may be configured to have a numerical aperture (NA) corresponding to a given depth, such that the focal point of the laser beam has an expansion angle that is relatively larger than the size of the defect area, that is, the light leakage defect area. In this case, the optical system may be a DUV objective lens.

In addition, although not shown, the light leakage defect repairing apparatus according to an embodiment of the present invention may further include a cover film forming unit configured to be formed on the material of the glass substrate and made of opaque ink or metal film The cover film covers the light leakage defect area.

As described above, in the method according to an embodiment of the present invention, the laser light radiated to the thickness of the portion of the substrate for removing the glass substrate may be laser light as follows: The substrate has laser light with a wavelength of 300 nm or less in a region with a low light transmittance and high absorption, such as a DUV region. If the absorption is high, heating and evaporation can be actively performed, because the laser light changes into thermal energy in the glass. The light transmittance of each laser light wavelength for each thickness of the glass substrate is shown in FIG. 4. It can be seen from FIG. 4 that the light transmittance of glass is extremely low in the deep ultraviolet region having a wavelength of 300 nm to 200 nm.

According to the embodiments of the present invention, although repair cannot be performed using the existing blackening method, blackening repair can be achieved. Therefore, the repair efficiency of the flat panel display can be improved, and the defect rate of the display device can be reduced, thereby enhancing the yield.

Although the preferred embodiments of the present invention have been mainly described, those skilled in the art should understand that the present invention can be modified and changed in various ways without departing from the spirit and scope of the present invention described in the scope of the patent application.

100‧‧‧Lower substrate

200‧‧‧Upper substrate

300‧‧‧Liquid crystal layer

211‧‧‧Glass substrate

221‧‧‧Black Matrix

231‧‧‧Color filter layer

241‧‧‧Protection coating film

251‧‧‧Common electrode

261‧‧‧non-transparent layer

Claims (8)

A method for repairing a light leakage defect, comprising: processing a given depth of a glass substrate where a defective pixel of a display panel is positioned by a laser; and one of the defective pixels in the process A non-transparent layer is formed on the defect area as a material of the glass substrate. The method for repairing a light leakage defect according to claim 1, wherein a size of the non-transparent layer is one size or larger of the defect area. A method for repairing a light leakage defect as claimed in claim 1, wherein: the laser includes a 10fs to 100ns pulsed laser with a frequency of 1 Hz or more, and the glass substrate processed by the laser uses a region Block, scan, or pattern processing methods are performed. The processing method includes controlling the energy output, frequency, processing time, and speed of the laser to control the processing depth. A method for repairing a light leakage defect as in claim 3, wherein: one wavelength of the laser is 300 nm or less, and an optical system is configured to have a numerical aperture (NA) corresponding to the given depth, The focus of a beam of the laser has an expansion angle that is relatively larger than a size of the defect area. The method for repairing a light leakage defect according to claim 4, wherein the focus of the light beam is determined by a focusing lens of an objective lens or a scanner. A method for repairing a light leakage defect as claimed in claim 1, wherein the forming of the non-transparent layer includes forming a cover layer made of metal or opaque ink on the material of the glass substrate to cover the defect area, the cover layer It is formed by a printing scheme using laser chemical vapor deposition (LCVD), ink coating, or an electrohydrodynamic (EHD) jet. An apparatus for repairing a light leakage defect, which includes: a laser having a deep ultraviolet (DUV) wavelength of 300 nm or less; an optical system configured to control one focal point of the laser; An epi-illumination illumination unit configured to illuminate a processing area where the focal point is formed; and a camera configured to monitor the focal point; and a controller configured to be based on an image of the camera Controlling the processing depth of a glass substrate in the processing area and the laser energy transferred to the glass substrate, wherein a material of a portion of the glass substrate that has been processed so that a thickness of the glass substrate is removed by the laser Covering a light leakage defect area in the processing area; the beam focus of the laser has an expansion angle relatively larger than a size of the light leakage defect area by the optical system, the optical system is configured to have a corresponding A numerical aperture (NA) at a given depth, and the optical system includes a deep ultraviolet (DUV) objective lens. The device for repairing a light leakage defect according to claim 7, further comprising a cover layer forming unit configured to form on the material of the glass substrate made of opaque ink or a metal film Into a covering layer to cover the light leakage defect area.

Images