KR100609634B1 - 본딩 장비의 본딩 헤드 - Google Patents

본딩 장비의 본딩 헤드 Download PDF

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Publication number
KR100609634B1
KR100609634B1 KR1020060015320A KR20060015320A KR100609634B1 KR 100609634 B1 KR100609634 B1 KR 100609634B1 KR 1020060015320 A KR1020060015320 A KR 1020060015320A KR 20060015320 A KR20060015320 A KR 20060015320A KR 100609634 B1 KR100609634 B1 KR 100609634B1
Authority
KR
South Korea
Prior art keywords
moving block
head
linear motor
bonding
coupled
Prior art date
Application number
KR1020060015320A
Other languages
English (en)
Korean (ko)
Inventor
최한현
Original Assignee
주식회사 탑 엔지니어링
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 탑 엔지니어링 filed Critical 주식회사 탑 엔지니어링
Priority to KR1020060015320A priority Critical patent/KR100609634B1/ko
Application granted granted Critical
Publication of KR100609634B1 publication Critical patent/KR100609634B1/ko
Priority to TW095141948A priority patent/TWI313900B/zh
Priority to CNB2006101609046A priority patent/CN100440470C/zh
Priority to JP2006332297A priority patent/JP4981426B2/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
KR1020060015320A 2006-02-16 2006-02-16 본딩 장비의 본딩 헤드 KR100609634B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020060015320A KR100609634B1 (ko) 2006-02-16 2006-02-16 본딩 장비의 본딩 헤드
TW095141948A TWI313900B (en) 2006-02-16 2006-11-13 Bonding head for chip bonding machine
CNB2006101609046A CN100440470C (zh) 2006-02-16 2006-12-01 芯片焊接机的焊接头
JP2006332297A JP4981426B2 (ja) 2006-02-16 2006-12-08 ボンディング装置のボンディングヘッド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060015320A KR100609634B1 (ko) 2006-02-16 2006-02-16 본딩 장비의 본딩 헤드

Publications (1)

Publication Number Publication Date
KR100609634B1 true KR100609634B1 (ko) 2006-08-08

Family

ID=37185075

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060015320A KR100609634B1 (ko) 2006-02-16 2006-02-16 본딩 장비의 본딩 헤드

Country Status (4)

Country Link
JP (1) JP4981426B2 (ja)
KR (1) KR100609634B1 (ja)
CN (1) CN100440470C (ja)
TW (1) TWI313900B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100945004B1 (ko) 2009-07-27 2010-03-05 안동규 본딩장치의 압착툴
KR100978792B1 (ko) 2010-01-11 2010-08-30 (주)에이에스티 콜렛 장치 및 이를 적용한 다이 본딩 장치
KR20170024067A (ko) * 2014-07-02 2017-03-06 가부시키가이샤 신가와 실장 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110003020A (ko) * 2009-07-03 2011-01-11 주식회사 탑 엔지니어링 액정 디스펜서의 헤드 장치
JP6185955B2 (ja) * 2015-04-14 2017-08-23 株式会社新川 実装装置
CN105710580A (zh) * 2016-05-04 2016-06-29 马怡鑫 一种焊接工装

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268437A (ja) * 1990-03-19 1991-11-29 Kaijo Corp ワイヤボンディング装置
KR19980027878A (ko) * 1996-10-18 1998-07-15 김광호 다이 본딩 장치의 본더 헤드
JP2001102395A (ja) 1999-09-29 2001-04-13 Nidec Tosok Corp ダイボンディング装置用マルチヘッド
JP2004047665A (ja) 2002-07-11 2004-02-12 Shinkawa Ltd ワイヤボンディング装置
JP2004063868A (ja) 2002-07-30 2004-02-26 Renesas Technology Corp 半導体装置の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04243144A (ja) * 1991-01-18 1992-08-31 Fujitsu Ltd ボンディング用ヘッド保持機構
JP2949891B2 (ja) * 1991-04-25 1999-09-20 松下電器産業株式会社 ワイヤボンディング方法
JPH07114224B2 (ja) * 1991-04-25 1995-12-06 松下電器産業株式会社 熱圧着用ボンディングヘッド
JP3067563B2 (ja) * 1995-01-05 2000-07-17 松下電器産業株式会社 ワイヤボンディング装置
JP3246282B2 (ja) * 1995-07-28 2002-01-15 松下電器産業株式会社 表示パネルモジュールの製造装置および表示パネルモジュールの製造方法
JP2930093B2 (ja) * 1995-08-18 1999-08-03 澁谷工業株式会社 ボンディング方法
JPH11297764A (ja) * 1998-04-14 1999-10-29 Ricoh Co Ltd ボンディングツール及びそれを用いた半導体チップのボンディング方法
TW567574B (en) * 2001-12-05 2003-12-21 Esec Trading Sa Apparatus for mounting semiconductor chips
JP4294451B2 (ja) * 2003-11-21 2009-07-15 オリンパス株式会社 半導体接合装置
JP4197171B2 (ja) * 2004-05-18 2008-12-17 パナソニック株式会社 電子部品実装機

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268437A (ja) * 1990-03-19 1991-11-29 Kaijo Corp ワイヤボンディング装置
KR19980027878A (ko) * 1996-10-18 1998-07-15 김광호 다이 본딩 장치의 본더 헤드
JP2001102395A (ja) 1999-09-29 2001-04-13 Nidec Tosok Corp ダイボンディング装置用マルチヘッド
JP2004047665A (ja) 2002-07-11 2004-02-12 Shinkawa Ltd ワイヤボンディング装置
JP2004063868A (ja) 2002-07-30 2004-02-26 Renesas Technology Corp 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100945004B1 (ko) 2009-07-27 2010-03-05 안동규 본딩장치의 압착툴
KR100978792B1 (ko) 2010-01-11 2010-08-30 (주)에이에스티 콜렛 장치 및 이를 적용한 다이 본딩 장치
KR20170024067A (ko) * 2014-07-02 2017-03-06 가부시키가이샤 신가와 실장 장치
KR101918118B1 (ko) * 2014-07-02 2018-11-14 가부시키가이샤 신가와 실장 장치

Also Published As

Publication number Publication date
TW200746319A (en) 2007-12-16
JP2007221098A (ja) 2007-08-30
JP4981426B2 (ja) 2012-07-18
CN100440470C (zh) 2008-12-03
CN101022086A (zh) 2007-08-22
TWI313900B (en) 2009-08-21

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