KR100567496B1 - 얇은 원반 모양의 물건을 위한 운반 장치 - Google Patents
얇은 원반 모양의 물건을 위한 운반 장치 Download PDFInfo
- Publication number
- KR100567496B1 KR100567496B1 KR1019980055221A KR19980055221A KR100567496B1 KR 100567496 B1 KR100567496 B1 KR 100567496B1 KR 1019980055221 A KR1019980055221 A KR 1019980055221A KR 19980055221 A KR19980055221 A KR 19980055221A KR 100567496 B1 KR100567496 B1 KR 100567496B1
- Authority
- KR
- South Korea
- Prior art keywords
- support
- gas
- guide arms
- central axis
- longitudinal central
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (15)
- 평평한 표면(12)을 가진 지지체(10)를 포함하고,상기 지지체(10)내부에서 상기 표면(12)을 향해 외측으로 경사구조를 이루는 한 개이상의 가스채널(20)들이 구성되며, 상기 가스채널(20)들의 단부들중 한 개의 단부가 상기 표면(12)내에서 가스방출구를 형성하고, 가스채널들의 다른 한 개의 단부에서 상기 가스채널(20)들이 가스공급파이프(28)와 연결되며,세 개이상의 안내아암(30)들이 상기 가스방출구들과 근접한 위치에서 지지체의 외측에 배열되고, 상기 안내아암(30)들이 상기 지지체(10)의 표면(12)으로부터 돌출되며 상기 표면(12)에 대해 반경방향으로 조정되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 상기 지지체(10)가 주몸체(22) 및 인서트(18)를 포함하고, 가늘어지는 구조를 가진 원형의 상기 가스채널(20)이 상기 주몸체(22) 및 인서트(18)사이에 형성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 일체구조의 지지체가 복수개의 가스채널들을 가지고, 상기 가스채널들이 서로 이격되어 배열되며 지지체(10)의 종방향 중심축(M)에 대해 회전대칭구조로 구성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 안내아암(30)들이 지지체(10)의 종방향 중심축(M)에 대해 회전대칭구조로 구성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 상기 지지체(10)에 연결된 안내아암(30)들은 지지체(10)로부터 종방향 중심축(M)에 대해 수직으로 연장구성되는 내측부(32)를 포함하고 내측부(32)의 자유단부(34)에 연결된 외측부(36)를 포함하며, 외측부가 지지체(10)의 표면(12)으로부터 돌출하는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 5 항에 있어서, 안내아암(30)의 외측부(36)가 상기 지지체(10)의 종방향 중심축(M)과 평행하게 연장구성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 5 항에 있어서, 상기 외측부(36)가 원통형으로 구성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 5 항에 있어서, 상기 외측부(36)가 볼형상으로 구성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 상기 안내아암(30)들이 가스채널(20)의 외측에서 상기 표면의 변부로부터 돌출하는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 9 항에 있어서, 안내아암의 자유단부가 원통형 또는 볼형상으로 구성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 상기 안내아암(30)들이 지지체(10)의 종방향 중심축(M)을 향해 운동하는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 11 항에 있어서, 상기 안내아암(30)들이 지지체(10)의 종방향 중심축(M)에 대해 선회운동하는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 11 항에 있어서, 상기 안내아암(30)들이 인장상태로 제공되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 지지체(10)가 원형영역(14,16)을 가지는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
- 제 1 항에 있어서, 가스채널들이 가스방출구의 영역에서 슬릿형상으로 구성되는 것을 특징으로 하는 얇은 원판형 제품을 위한 운반장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19755694A DE19755694C2 (de) | 1997-12-16 | 1997-12-16 | Handhabungsvorrichtung für dünne, scheibenförmige Gegenstände |
DE19755694.9 | 1997-12-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990063089A KR19990063089A (ko) | 1999-07-26 |
KR100567496B1 true KR100567496B1 (ko) | 2006-08-18 |
Family
ID=7851971
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980055221A KR100567496B1 (ko) | 1997-12-16 | 1998-12-16 | 얇은 원반 모양의 물건을 위한 운반 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6152507A (ko) |
EP (1) | EP0924148B1 (ko) |
JP (1) | JPH11265926A (ko) |
KR (1) | KR100567496B1 (ko) |
AT (1) | ATE198585T1 (ko) |
DE (2) | DE19755694C2 (ko) |
TW (1) | TW415912B (ko) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
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DE19755694C2 (de) * | 1997-12-16 | 2000-05-31 | Sez Semiconduct Equip Zubehoer | Handhabungsvorrichtung für dünne, scheibenförmige Gegenstände |
US6217034B1 (en) * | 1998-09-24 | 2001-04-17 | Kla-Tencor Corporation | Edge handling wafer chuck |
JP4249869B2 (ja) * | 1999-12-22 | 2009-04-08 | 株式会社オーク製作所 | 基板搬送装置 |
DE10056544A1 (de) * | 2000-11-15 | 2002-06-06 | Infineon Technologies Ag | Verfahren und Vorrichtung zum Be- und Entladen von Halbleiterwafern |
US6689418B2 (en) | 2001-08-03 | 2004-02-10 | Applied Materials Inc. | Apparatus for wafer rinse and clean and edge etching |
DE10144409B4 (de) * | 2001-09-10 | 2004-11-18 | Infineon Technologies Ag | Vorrichtung mit einem Greifer zur Handhabung von Platten |
DE10145049C2 (de) | 2001-09-13 | 2003-10-16 | Infineon Technologies Ag | Vorrichtung zum Handhaben von Platten |
US6708701B2 (en) | 2001-10-16 | 2004-03-23 | Applied Materials Inc. | Capillary ring |
US6786996B2 (en) | 2001-10-16 | 2004-09-07 | Applied Materials Inc. | Apparatus and method for edge bead removal |
AU2003283248A1 (en) * | 2002-10-07 | 2004-05-04 | Schott Ag | Extremely thin substrate support |
DE10304425B3 (de) * | 2003-02-04 | 2004-08-05 | Infineon Technologies Ag | Vorrichtung zum Handhaben von Platten |
US20050112279A1 (en) * | 2003-11-24 | 2005-05-26 | International Business Machines Corporation | Dynamic release wafer grip and method of use |
US7938942B2 (en) * | 2004-03-12 | 2011-05-10 | Applied Materials, Inc. | Single side workpiece processing |
US8082932B2 (en) * | 2004-03-12 | 2011-12-27 | Applied Materials, Inc. | Single side workpiece processing |
US20070110895A1 (en) * | 2005-03-08 | 2007-05-17 | Jason Rye | Single side workpiece processing |
DE102004019231A1 (de) * | 2004-04-16 | 2005-11-17 | PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH | Übergabe- und Ladestation für mobile, elektrostatische Substrathalter |
JP4526316B2 (ja) * | 2004-07-16 | 2010-08-18 | 株式会社ディスコ | 被加工物搬送装置 |
US7354649B2 (en) | 2004-08-20 | 2008-04-08 | Semitool, Inc. | Semiconductor workpiece |
US7193295B2 (en) * | 2004-08-20 | 2007-03-20 | Semitool, Inc. | Process and apparatus for thinning a semiconductor workpiece |
US7288489B2 (en) * | 2004-08-20 | 2007-10-30 | Semitool, Inc. | Process for thinning a semiconductor workpiece |
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US20060046499A1 (en) * | 2004-08-20 | 2006-03-02 | Dolechek Kert L | Apparatus for use in thinning a semiconductor workpiece |
DE102004045957A1 (de) * | 2004-09-22 | 2006-04-06 | Singulus Technologies Ag | Vorrichtung zum Halten und Transportieren eines Werkstücks mit einer ebenen Oberfläche |
DE102005023828A1 (de) * | 2005-05-24 | 2006-12-07 | A U E Automations- Und Einstelltechnik Kassel Gmbh | Vorrichtung zum automatisierten Transport einer luftdurchlässigen und nicht magnetischen Filtermatte und/oder Zwischenlage für Dieselrußfilter und Verfahren hierfür |
JP2007157996A (ja) * | 2005-12-05 | 2007-06-21 | Tokyo Seimitsu Co Ltd | ワーク搬送装置及びワーク搬送方法 |
US8104488B2 (en) * | 2006-02-22 | 2012-01-31 | Applied Materials, Inc. | Single side workpiece processing |
JP4853239B2 (ja) * | 2006-11-07 | 2012-01-11 | 三菱電機株式会社 | ウェハ保持装置 |
DE102007009321A1 (de) | 2007-02-22 | 2008-08-28 | Ass Luippold Automation Systems & Services E.K. | Vorrichtung zur Stapelung und/oder Entstapelung dünnflächiger Stapelgüter |
FR2918358B1 (fr) * | 2007-07-06 | 2010-03-05 | Nbs Technologies | Systeme de prehension par le vide |
EP2260507B1 (en) | 2008-03-31 | 2012-09-26 | MEMC Electronic Materials, Inc. | Methods for etching the edge of a silicon wafer, silicon wafer, etching apparatus |
CN101590649A (zh) * | 2008-05-26 | 2009-12-02 | 鸿富锦精密工业(深圳)有限公司 | 吸取装置 |
DE102008045255A1 (de) | 2008-09-01 | 2010-03-04 | Rena Gmbh | Vorrichtung und Verfahren zum Transportieren von Substraten |
EP2359390A1 (en) | 2008-11-19 | 2011-08-24 | MEMC Electronic Materials, Inc. | Method and system for stripping the edge of a semiconductor wafer |
JP5370664B2 (ja) * | 2009-09-07 | 2013-12-18 | 村田機械株式会社 | 基板の移載装置、およびその方法 |
DE102009051565A1 (de) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Ansaug-Greifervorrichtung für flache Substrate |
JP5488037B2 (ja) * | 2010-02-23 | 2014-05-14 | 村田機械株式会社 | 移載装置及びワーク載置装置 |
KR101187684B1 (ko) * | 2010-10-25 | 2012-10-04 | 서울과학기술대학교 산학협력단 | 래디얼 플로우를 이용한 비접촉식 기판 척킹용 에어 패드 |
JP5756642B2 (ja) * | 2011-01-31 | 2015-07-29 | オイレス工業株式会社 | 離間距離調整装置およびこれを用いた搬送装置 |
CN102935942B (zh) * | 2011-08-16 | 2015-03-04 | 中芯国际集成电路制造(北京)有限公司 | 电控操作器 |
US8853054B2 (en) | 2012-03-06 | 2014-10-07 | Sunedison Semiconductor Limited | Method of manufacturing silicon-on-insulator wafers |
CN104179781B (zh) * | 2013-05-22 | 2016-03-16 | 由田新技股份有限公司 | 吸附装置及可吸附软性对象的真空吸附设备 |
EP2843695B9 (de) * | 2013-08-28 | 2021-04-14 | Mechatronic Systemtechnik GmbH | Vorrichtung, insbesondere Endeffektor |
JP2015076469A (ja) * | 2013-10-08 | 2015-04-20 | 株式会社ディスコ | ウェーハ搬送装置 |
CN104108605B (zh) * | 2014-07-08 | 2016-08-17 | 深圳市华星光电技术有限公司 | 一种玻璃基板的取放装置 |
US9911640B2 (en) * | 2015-09-01 | 2018-03-06 | Boris Kesil | Universal gripping and suction chuck |
US10373858B2 (en) | 2016-04-06 | 2019-08-06 | Lam Research Corporation | Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal |
WO2018235545A1 (ja) * | 2017-06-20 | 2018-12-27 | 株式会社コスメック | 把持装置 |
TWI791561B (zh) | 2017-07-21 | 2023-02-11 | 美商伊雷克托科學工業股份有限公司 | 非接觸式處置器及使用非接觸式處置器處置工件之方法 |
CN107512582B (zh) * | 2017-09-25 | 2019-07-26 | 浙江工贸职业技术学院 | 一种磁体成型设备的取料装置 |
US11037809B2 (en) * | 2019-07-17 | 2021-06-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Transfer device and method for transferring substrate without unexpected rotation |
US11524392B2 (en) * | 2020-11-24 | 2022-12-13 | Applied Materials, Inc. | Minimal contact gripping of thin optical devices |
CN114454075B (zh) * | 2021-03-03 | 2022-12-16 | 华中科技大学 | 凸轮驱动的晶圆定位及托起装置 |
GB202215215D0 (en) | 2022-10-14 | 2022-11-30 | Lam Res Ag | Device for conveying a wafer-shaped article |
WO2024168282A1 (en) * | 2023-02-10 | 2024-08-15 | Applied Materials, Inc. | Universal pedestal to support waveguide on optical metrology |
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1997
- 1997-12-16 DE DE19755694A patent/DE19755694C2/de not_active Expired - Fee Related
-
1998
- 1998-11-20 DE DE59800429T patent/DE59800429D1/de not_active Expired - Lifetime
- 1998-11-20 EP EP98122050A patent/EP0924148B1/de not_active Expired - Lifetime
- 1998-11-20 AT AT98122050T patent/ATE198585T1/de active
- 1998-12-10 TW TW087120526A patent/TW415912B/zh not_active IP Right Cessation
- 1998-12-14 JP JP10377811A patent/JPH11265926A/ja active Pending
- 1998-12-15 US US09/211,414 patent/US6152507A/en not_active Expired - Lifetime
- 1998-12-16 KR KR1019980055221A patent/KR100567496B1/ko not_active IP Right Cessation
Patent Citations (9)
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US3438668A (en) * | 1965-08-26 | 1969-04-15 | Gen Electric | Contactless lifter |
EP0277683A2 (en) * | 1987-02-03 | 1988-08-10 | SOCIETA' ITALIANA VETRO- SIV-SpA | Process and device for applying forces to glass sheets, in particular at a high temperature |
JPH02312256A (ja) * | 1989-05-26 | 1990-12-27 | Sumitomo Metal Ind Ltd | ウエハ保持装置 |
US4969676A (en) * | 1989-06-23 | 1990-11-13 | At&T Bell Laboratories | Air pressure pick-up tool |
JPH03238245A (ja) * | 1990-02-14 | 1991-10-24 | Sumitomo Metal Ind Ltd | 試料保持装置 |
US5762391A (en) * | 1993-10-22 | 1998-06-09 | Sez Semiconductor-Equipment Zubehor Fur Die Halbleiterfertigung Gesellschaft M.B.H. | Gripper for disk-shaped articles |
EP0924148A1 (de) * | 1997-12-16 | 1999-06-23 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG | Vorrichtung zum Transport dünner, scheibenförmiger Gegenstände |
JPH11265926A (ja) * | 1997-12-16 | 1999-09-28 | Sez Semiconductor Equip Zubehoer Fuer Die Halbleiterfertigung Ag | 薄い円板状物体の移送装置 |
US6152507A (en) * | 1997-12-16 | 2000-11-28 | Sez Semicondcutor Equipment Zubehor Fur Die Halbleiterfertigung Ag | Conveying device for thin disk-like articles |
Also Published As
Publication number | Publication date |
---|---|
EP0924148A1 (de) | 1999-06-23 |
TW415912B (en) | 2000-12-21 |
DE19755694A1 (de) | 1999-06-24 |
US6152507A (en) | 2000-11-28 |
EP0924148B1 (de) | 2001-01-10 |
DE19755694C2 (de) | 2000-05-31 |
DE59800429D1 (de) | 2001-02-15 |
JPH11265926A (ja) | 1999-09-28 |
ATE198585T1 (de) | 2001-01-15 |
KR19990063089A (ko) | 1999-07-26 |
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