KR100407042B1 - 칩커버 - Google Patents

칩커버 Download PDF

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Publication number
KR100407042B1
KR100407042B1 KR1019970707692A KR19970707692A KR100407042B1 KR 100407042 B1 KR100407042 B1 KR 100407042B1 KR 1019970707692 A KR1019970707692 A KR 1019970707692A KR 19970707692 A KR19970707692 A KR 19970707692A KR 100407042 B1 KR100407042 B1 KR 100407042B1
Authority
KR
South Korea
Prior art keywords
chip
cover
chip cover
activator
activated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019970707692A
Other languages
English (en)
Korean (ko)
Other versions
KR19990008167A (ko
Inventor
데틀레프 후도이
요제프 키르쉬바우어
크리스틀 니델레
페터 슈탐프카
한스-힌네르크 슈테칸
Original Assignee
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지멘스 악티엔게젤샤프트 filed Critical 지멘스 악티엔게젤샤프트
Publication of KR19990008167A publication Critical patent/KR19990008167A/ko
Application granted granted Critical
Publication of KR100407042B1 publication Critical patent/KR100407042B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Storage Device Security (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019970707692A 1995-04-25 1996-04-09 칩커버 Expired - Fee Related KR100407042B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19515188A DE19515188C2 (de) 1995-04-25 1995-04-25 Chip-Abdeckung
DE19515188.7 1995-04-25

Publications (2)

Publication Number Publication Date
KR19990008167A KR19990008167A (ko) 1999-01-25
KR100407042B1 true KR100407042B1 (ko) 2004-02-18

Family

ID=7760323

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970707692A Expired - Fee Related KR100407042B1 (ko) 1995-04-25 1996-04-09 칩커버

Country Status (9)

Country Link
EP (1) EP0823129A1 (cg-RX-API-DMAC7.html)
JP (1) JPH11504164A (cg-RX-API-DMAC7.html)
KR (1) KR100407042B1 (cg-RX-API-DMAC7.html)
CN (1) CN1135616C (cg-RX-API-DMAC7.html)
DE (1) DE19515188C2 (cg-RX-API-DMAC7.html)
IN (1) IN188645B (cg-RX-API-DMAC7.html)
RU (1) RU2164720C2 (cg-RX-API-DMAC7.html)
UA (1) UA57704C2 (cg-RX-API-DMAC7.html)
WO (1) WO1996034409A1 (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19841498C2 (de) * 1998-09-10 2002-02-21 Beru Ag Verfahren zum Herstellen eines Elektronikbauelementes, insbesondere eines Hallsensors
EP1041482A1 (de) * 1999-03-26 2000-10-04 Siemens Aktiengesellschaft Manipulationssichere integrierte Schaltung
DE19957120A1 (de) * 1999-11-26 2001-05-31 Infineon Technologies Ag Vertikal integrierte Schaltungsanordnung und Verfahren zum Betreiben einer vertikal integrierten Schaltungsanordnung
DE10105987A1 (de) 2001-02-09 2002-08-29 Infineon Technologies Ag Datenverarbeitungsvorrichtung
DE10131014C1 (de) * 2001-06-27 2002-09-05 Infineon Technologies Ag Gegen Analyse geschütztes Halbleiterbauelement und zugehöriges Herstellungsverfahren
FR2872610B1 (fr) * 2004-07-02 2007-06-08 Commissariat Energie Atomique Dispositif de securisation de composants
JP5194932B2 (ja) * 2008-03-26 2013-05-08 富士通セミコンダクター株式会社 半導体装置および半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0510433A2 (en) * 1991-04-26 1992-10-28 Hughes Aircraft Company Secure circuit structure
US5233563A (en) * 1992-01-13 1993-08-03 Ncr Corporation Memory security device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3725671A (en) * 1970-11-02 1973-04-03 Us Navy Pyrotechnic eradication of microcircuits
DE3602960C1 (de) * 1986-01-31 1987-02-19 Philips Patentverwaltung Dickschicht-Schaltungsanordnung mit einer keramischen Substratplatte
CA2067331A1 (en) * 1989-10-03 1991-04-04 Joseph Unsworth Electro-active cradle circuits for the detection of access or penetration
JPH0521655A (ja) * 1990-11-28 1993-01-29 Mitsubishi Electric Corp 半導体装置および半導体装置用パツケージ
RU2024110C1 (ru) * 1991-04-10 1994-11-30 Научно-исследовательский институт точной технологии Интегральная микросхема
US5389738A (en) * 1992-05-04 1995-02-14 Motorola, Inc. Tamperproof arrangement for an integrated circuit device
US5399441A (en) * 1994-04-12 1995-03-21 Dow Corning Corporation Method of applying opaque coatings

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0510433A2 (en) * 1991-04-26 1992-10-28 Hughes Aircraft Company Secure circuit structure
US5233563A (en) * 1992-01-13 1993-08-03 Ncr Corporation Memory security device

Also Published As

Publication number Publication date
JPH11504164A (ja) 1999-04-06
DE19515188A1 (de) 1996-11-07
KR19990008167A (ko) 1999-01-25
DE19515188C2 (de) 1998-02-19
UA57704C2 (uk) 2003-07-15
EP0823129A1 (de) 1998-02-11
WO1996034409A1 (de) 1996-10-31
CN1135616C (zh) 2004-01-21
RU2164720C2 (ru) 2001-03-27
CN1182499A (zh) 1998-05-20
IN188645B (cg-RX-API-DMAC7.html) 2002-10-26

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