FR2872610B1 - Dispositif de securisation de composants - Google Patents

Dispositif de securisation de composants

Info

Publication number
FR2872610B1
FR2872610B1 FR0451418A FR0451418A FR2872610B1 FR 2872610 B1 FR2872610 B1 FR 2872610B1 FR 0451418 A FR0451418 A FR 0451418A FR 0451418 A FR0451418 A FR 0451418A FR 2872610 B1 FR2872610 B1 FR 2872610B1
Authority
FR
France
Prior art keywords
securing components
securing
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0451418A
Other languages
English (en)
Other versions
FR2872610A1 (fr
Inventor
Jean Brun
Jean Charles Souriau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR0451418A priority Critical patent/FR2872610B1/fr
Priority to PCT/FR2005/050526 priority patent/WO2006013302A1/fr
Publication of FR2872610A1 publication Critical patent/FR2872610A1/fr
Application granted granted Critical
Publication of FR2872610B1 publication Critical patent/FR2872610B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR0451418A 2004-07-02 2004-07-02 Dispositif de securisation de composants Expired - Fee Related FR2872610B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0451418A FR2872610B1 (fr) 2004-07-02 2004-07-02 Dispositif de securisation de composants
PCT/FR2005/050526 WO2006013302A1 (fr) 2004-07-02 2005-06-30 Dispositif de securisation de composants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0451418A FR2872610B1 (fr) 2004-07-02 2004-07-02 Dispositif de securisation de composants

Publications (2)

Publication Number Publication Date
FR2872610A1 FR2872610A1 (fr) 2006-01-06
FR2872610B1 true FR2872610B1 (fr) 2007-06-08

Family

ID=34947552

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0451418A Expired - Fee Related FR2872610B1 (fr) 2004-07-02 2004-07-02 Dispositif de securisation de composants

Country Status (2)

Country Link
FR (1) FR2872610B1 (fr)
WO (1) WO2006013302A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8581251B2 (en) 2008-11-21 2013-11-12 Maxim Integrated Products, Inc. Device for protecting an electronic integrated circuit housing against physical or chemical ingression

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007051788A1 (de) * 2007-10-30 2009-05-14 Giesecke & Devrient Gmbh Halbleiterchip mit einer Schutzschicht und Verfahren zum Betrieb eines Halbleiterchip
FR3035267B1 (fr) 2015-04-20 2018-05-25 Commissariat A L'energie Atomique Et Aux Energies Alternatives Puce electronique comportant une face arriere protegee
FR3048972B1 (fr) * 2016-03-15 2018-04-06 Mbda France Materiau de leurrage ultrasonore, en particulier pour systeme d'arme
US9859226B1 (en) 2016-12-13 2018-01-02 International Business Machines Corporation Core-shell particles for anti-tampering applications
CN113675153A (zh) * 2021-08-24 2021-11-19 中国电子科技集团公司第五十八研究所 一种芯片防反向封装结构及封装方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3697668A (en) * 1968-12-13 1972-10-10 Ncr Co Self-destructible molded articles
US3725671A (en) * 1970-11-02 1973-04-03 Us Navy Pyrotechnic eradication of microcircuits
FR2686996B1 (fr) * 1992-01-31 1996-02-02 Solaic Sa Procede de fabrication d'une carte a memoire comprenant un micromodule equipe d'un capot, et carte a memoire ainsi obtenue.
US5258334A (en) * 1993-01-15 1993-11-02 The U.S. Government As Represented By The Director, National Security Agency Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
US5387480A (en) * 1993-03-08 1995-02-07 Dow Corning Corporation High dielectric constant coatings
DE19515188C2 (de) * 1995-04-25 1998-02-19 Siemens Ag Chip-Abdeckung
US5807611A (en) * 1996-10-04 1998-09-15 Dow Corning Corporation Electronic coatings
TW502286B (en) * 1999-12-09 2002-09-11 Koninkl Philips Electronics Nv Semiconductor device comprising a security coating and smartcard provided with such a device
DE10131014C1 (de) * 2001-06-27 2002-09-05 Infineon Technologies Ag Gegen Analyse geschütztes Halbleiterbauelement und zugehöriges Herstellungsverfahren
US7296299B2 (en) * 2001-07-03 2007-11-13 Hewlett-Packard Development Company, L.P. Tamper-evident and/or tamper-resistant electronic components
WO2004021437A1 (fr) * 2002-08-09 2004-03-11 Siemens Aktiengesellschaft Revetement de circuit integre semi-conducteur et procede de fabrication associe
FR2848025B1 (fr) * 2002-11-28 2005-02-11 Gemplus Card Int Protection d'un composant par nappe conductrice a contact aleatoire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8581251B2 (en) 2008-11-21 2013-11-12 Maxim Integrated Products, Inc. Device for protecting an electronic integrated circuit housing against physical or chemical ingression

Also Published As

Publication number Publication date
WO2006013302A1 (fr) 2006-02-09
FR2872610A1 (fr) 2006-01-06

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20130329