FR2872610B1 - DEVICE FOR SECURING COMPONENTS - Google Patents
DEVICE FOR SECURING COMPONENTSInfo
- Publication number
- FR2872610B1 FR2872610B1 FR0451418A FR0451418A FR2872610B1 FR 2872610 B1 FR2872610 B1 FR 2872610B1 FR 0451418 A FR0451418 A FR 0451418A FR 0451418 A FR0451418 A FR 0451418A FR 2872610 B1 FR2872610 B1 FR 2872610B1
- Authority
- FR
- France
- Prior art keywords
- securing components
- securing
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0451418A FR2872610B1 (en) | 2004-07-02 | 2004-07-02 | DEVICE FOR SECURING COMPONENTS |
PCT/FR2005/050526 WO2006013302A1 (en) | 2004-07-02 | 2005-06-30 | Device for making secure components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0451418A FR2872610B1 (en) | 2004-07-02 | 2004-07-02 | DEVICE FOR SECURING COMPONENTS |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2872610A1 FR2872610A1 (en) | 2006-01-06 |
FR2872610B1 true FR2872610B1 (en) | 2007-06-08 |
Family
ID=34947552
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0451418A Expired - Fee Related FR2872610B1 (en) | 2004-07-02 | 2004-07-02 | DEVICE FOR SECURING COMPONENTS |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2872610B1 (en) |
WO (1) | WO2006013302A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8581251B2 (en) | 2008-11-21 | 2013-11-12 | Maxim Integrated Products, Inc. | Device for protecting an electronic integrated circuit housing against physical or chemical ingression |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007051788A1 (en) * | 2007-10-30 | 2009-05-14 | Giesecke & Devrient Gmbh | Semiconductor chip with a protective layer and method for operating a semiconductor chip |
FR3035267B1 (en) | 2015-04-20 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | ELECTRONIC CHIP COMPRISING A PROTECTED BACK PANEL |
FR3048972B1 (en) * | 2016-03-15 | 2018-04-06 | Mbda France | ULTRASONIC SURFACE MATERIAL, IN PARTICULAR FOR AN ARM SYSTEM |
US9859226B1 (en) | 2016-12-13 | 2018-01-02 | International Business Machines Corporation | Core-shell particles for anti-tampering applications |
CN113675153A (en) * | 2021-08-24 | 2021-11-19 | 中国电子科技集团公司第五十八研究所 | Chip anti-reverse packaging structure and packaging method |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3697668A (en) * | 1968-12-13 | 1972-10-10 | Ncr Co | Self-destructible molded articles |
US3725671A (en) * | 1970-11-02 | 1973-04-03 | Us Navy | Pyrotechnic eradication of microcircuits |
FR2686996B1 (en) * | 1992-01-31 | 1996-02-02 | Solaic Sa | METHOD FOR MANUFACTURING A MEMORY CARD COMPRISING A MICROMODULE EQUIPPED WITH A COVER, AND MEMORY CARD THUS OBTAINED. |
US5258334A (en) * | 1993-01-15 | 1993-11-02 | The U.S. Government As Represented By The Director, National Security Agency | Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices |
US5371404A (en) * | 1993-02-04 | 1994-12-06 | Motorola, Inc. | Thermally conductive integrated circuit package with radio frequency shielding |
US5387480A (en) * | 1993-03-08 | 1995-02-07 | Dow Corning Corporation | High dielectric constant coatings |
DE19515188C2 (en) * | 1995-04-25 | 1998-02-19 | Siemens Ag | Chip cover |
US5807611A (en) * | 1996-10-04 | 1998-09-15 | Dow Corning Corporation | Electronic coatings |
TW502286B (en) * | 1999-12-09 | 2002-09-11 | Koninkl Philips Electronics Nv | Semiconductor device comprising a security coating and smartcard provided with such a device |
DE10131014C1 (en) * | 2001-06-27 | 2002-09-05 | Infineon Technologies Ag | Semiconductor element used in a chip card in the pay-per-view television sector comprises a chip, and a device for deactivating the chip consisting of a hollow chamber containing an activator |
US7296299B2 (en) * | 2001-07-03 | 2007-11-13 | Hewlett-Packard Development Company, L.P. | Tamper-evident and/or tamper-resistant electronic components |
WO2004021437A1 (en) * | 2002-08-09 | 2004-03-11 | Siemens Aktiengesellschaft | Coating of an integrated semiconductor circuit, and method for producing said coating |
FR2848025B1 (en) * | 2002-11-28 | 2005-02-11 | Gemplus Card Int | PROTECTION OF A COMPONENT BY RANDOM CONTACT CONDUCTIVE FLOOR |
-
2004
- 2004-07-02 FR FR0451418A patent/FR2872610B1/en not_active Expired - Fee Related
-
2005
- 2005-06-30 WO PCT/FR2005/050526 patent/WO2006013302A1/en active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8581251B2 (en) | 2008-11-21 | 2013-11-12 | Maxim Integrated Products, Inc. | Device for protecting an electronic integrated circuit housing against physical or chemical ingression |
Also Published As
Publication number | Publication date |
---|---|
FR2872610A1 (en) | 2006-01-06 |
WO2006013302A1 (en) | 2006-02-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20130329 |