KR100279954B1 - 초대규모 집적 회로를 위한 도전체 트랙 구조 - Google Patents

초대규모 집적 회로를 위한 도전체 트랙 구조 Download PDF

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Publication number
KR100279954B1
KR100279954B1 KR1019920008204A KR920008204A KR100279954B1 KR 100279954 B1 KR100279954 B1 KR 100279954B1 KR 1019920008204 A KR1019920008204 A KR 1019920008204A KR 920008204 A KR920008204 A KR 920008204A KR 100279954 B1 KR100279954 B1 KR 100279954B1
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South Korea
Prior art keywords
conductor tracks
conductor
conductor track
tracks
track structure
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Expired - Lifetime
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KR1019920008204A
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English (en)
Korean (ko)
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KR920022504A (ko
Inventor
도미니끄 사비그낙
만프레트 멘케
아르민 콜하제
하노 멜츠너
Original Assignee
칼 하인쯔 호르닝어
지멘스 악티엔게젤샤프트
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Publication of KR920022504A publication Critical patent/KR920022504A/ko
Application granted granted Critical
Publication of KR100279954B1 publication Critical patent/KR100279954B1/ko
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Microwave Amplifiers (AREA)
  • Solid State Image Pick-Up Elements (AREA)
KR1019920008204A 1991-05-15 1992-05-15 초대규모 집적 회로를 위한 도전체 트랙 구조 Expired - Lifetime KR100279954B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4115909.8 1991-05-15
DE4115909A DE4115909C1 (enExample) 1991-05-15 1991-05-15

Publications (2)

Publication Number Publication Date
KR920022504A KR920022504A (ko) 1992-12-19
KR100279954B1 true KR100279954B1 (ko) 2001-03-02

Family

ID=6431725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920008204A Expired - Lifetime KR100279954B1 (ko) 1991-05-15 1992-05-15 초대규모 집적 회로를 위한 도전체 트랙 구조

Country Status (7)

Country Link
US (1) US5289037A (enExample)
EP (1) EP0513715B1 (enExample)
JP (1) JP3129836B2 (enExample)
KR (1) KR100279954B1 (enExample)
AT (1) ATE195035T1 (enExample)
DE (2) DE4115909C1 (enExample)
TW (1) TW352190U (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122297B2 (ja) * 1993-12-28 2001-01-09 株式会社東芝 半導体装置
JPH08306774A (ja) * 1995-05-01 1996-11-22 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
US6577007B1 (en) * 1996-02-01 2003-06-10 Advanced Micro Devices, Inc. Manufacturing process for borderless vias with respect to underlying metal
JPH1092714A (ja) * 1996-09-11 1998-04-10 Mitsubishi Electric Corp 半導体装置およびその製造方法
US8350309B2 (en) 1998-03-30 2013-01-08 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory
US6353242B1 (en) 1998-03-30 2002-03-05 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory
JP4008629B2 (ja) * 1999-09-10 2007-11-14 株式会社東芝 半導体装置、その設計方法、及びその設計プログラムを格納したコンピュータ読み取り可能な記録媒体
US6522011B1 (en) * 2000-08-15 2003-02-18 Micron Technology, Inc. Low capacitance wiring layout and method for making same
DE10126566C1 (de) * 2001-05-31 2002-12-05 Infineon Technologies Ag Integrierte Schaltung
DE10259634B4 (de) * 2002-12-18 2008-02-21 Qimonda Ag Verfahren zur Herstellung von Kontakten auf einem Wafer
CN100468774C (zh) * 2004-09-29 2009-03-11 松下电器产业株式会社 半导体装置
JP4599375B2 (ja) * 2007-07-17 2010-12-15 株式会社東芝 不揮発性半導体メモリ
JP4770930B2 (ja) * 2009-01-21 2011-09-14 ソニー株式会社 クロスポイント型半導体メモリ装置及びその製造方法
JP5571030B2 (ja) * 2011-04-13 2014-08-13 株式会社東芝 集積回路装置及びその製造方法
US8441127B2 (en) * 2011-06-29 2013-05-14 Taiwan Semiconductor Manufacturing Company, Ltd. Bump-on-trace structures with wide and narrow portions
US20130026641A1 (en) * 2011-07-25 2013-01-31 United Microelectronics Corp. Conductor contact structure and forming method, and photomask pattern generating method for defining such conductor contact structure
US9184111B2 (en) * 2013-11-09 2015-11-10 Delta Electronics, Inc. Wafer-level chip scale package
US9911693B2 (en) * 2015-08-28 2018-03-06 Micron Technology, Inc. Semiconductor devices including conductive lines and methods of forming the semiconductor devices
CN108701676B (zh) * 2016-05-16 2021-07-23 美光科技公司 具有与下部布线层的屏蔽线电耦合的上部布线层的屏蔽线的组合件
US9754872B1 (en) * 2016-05-16 2017-09-05 Micron Technology, Inc. Assemblies having shield lines of an upper wiring level electrically coupled with shield lines of a lower wiring level
US10304771B2 (en) 2017-03-10 2019-05-28 Micron Technology, Inc. Assemblies having shield lines of an upper wiring layer electrically coupled with shield lines of a lower wiring layer
US10818729B2 (en) * 2018-05-17 2020-10-27 Macronix International Co., Ltd. Bit cost scalable 3D phase change cross-point memory

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4827449A (en) * 1986-06-27 1989-05-02 Oki Electric Industry Co., Ltd. Semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0048610B1 (en) * 1980-09-22 1986-01-15 Kabushiki Kaisha Toshiba Semiconductor device and its manufacture
JPS6344742A (ja) * 1986-08-12 1988-02-25 Fujitsu Ltd 半導体装置
JP2765583B2 (ja) * 1988-10-20 1998-06-18 株式会社リコー 半導体メモリ装置
JPH0379059A (ja) * 1989-08-22 1991-04-04 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP2856778B2 (ja) * 1989-09-07 1999-02-10 株式会社東芝 半導体装置の配線構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4827449A (en) * 1986-06-27 1989-05-02 Oki Electric Industry Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
EP0513715A1 (de) 1992-11-19
US5289037A (en) 1994-02-22
TW352190U (en) 1999-02-01
DE59209852D1 (de) 2000-08-31
KR920022504A (ko) 1992-12-19
DE4115909C1 (enExample) 1992-11-12
JPH05175337A (ja) 1993-07-13
EP0513715B1 (de) 2000-07-26
ATE195035T1 (de) 2000-08-15
JP3129836B2 (ja) 2001-01-31

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