KR100264368B1 - 집적회로 메모리 엘레멘트가 되는 pzt 캐패시터 및 그의 제조방법 - Google Patents
집적회로 메모리 엘레멘트가 되는 pzt 캐패시터 및 그의 제조방법 Download PDFInfo
- Publication number
- KR100264368B1 KR100264368B1 KR1019910022573A KR910022573A KR100264368B1 KR 100264368 B1 KR100264368 B1 KR 100264368B1 KR 1019910022573 A KR1019910022573 A KR 1019910022573A KR 910022573 A KR910022573 A KR 910022573A KR 100264368 B1 KR100264368 B1 KR 100264368B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- metal
- titanium
- platinum
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
- H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US62555590A | 1990-12-11 | 1990-12-11 | |
| US7/625,555 | 1990-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR920013712A KR920013712A (ko) | 1992-07-29 |
| KR100264368B1 true KR100264368B1 (ko) | 2000-08-16 |
Family
ID=24506629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019910022573A Expired - Lifetime KR100264368B1 (ko) | 1990-12-11 | 1991-12-10 | 집적회로 메모리 엘레멘트가 되는 pzt 캐패시터 및 그의 제조방법 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0490288A3 (enExample) |
| JP (2) | JP3254703B2 (enExample) |
| KR (1) | KR100264368B1 (enExample) |
| TW (1) | TW222348B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100269278B1 (ko) * | 1992-10-14 | 2000-10-16 | 윤종용 | 강유전체박막을이용한커패시터제조방법 |
| EP0737364B1 (en) * | 1994-10-04 | 1999-03-31 | Koninklijke Philips Electronics N.V. | Semiconductor device comprising a ferroelectric memory element with a lower electrode provided with an oxygen barrier |
| US5708302A (en) * | 1995-04-26 | 1998-01-13 | Symetrix Corporation | Bottom electrode structure for dielectric capacitors |
| KR100200299B1 (ko) * | 1995-11-30 | 1999-06-15 | 김영환 | 반도체 소자 캐패시터 형성방법 |
| KR100393197B1 (ko) * | 1996-10-31 | 2003-11-01 | 삼성전자주식회사 | 강유전체캐패시터및그제조방법 |
| JPH10200072A (ja) * | 1997-01-10 | 1998-07-31 | Sony Corp | 半導体メモリセルのキャパシタ構造及びその作製方法 |
| JP2004241632A (ja) * | 2003-02-06 | 2004-08-26 | Seiko Epson Corp | 強誘電体メモリおよびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02189969A (ja) * | 1989-01-18 | 1990-07-25 | Toshiba Corp | 電子部品 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4437139A (en) * | 1982-12-17 | 1984-03-13 | International Business Machines Corporation | Laser annealed dielectric for dual dielectric capacitor |
| KR940006708B1 (ko) * | 1989-01-26 | 1994-07-25 | 세이꼬 엡슨 가부시끼가이샤 | 반도체 장치의 제조 방법 |
| EP0396221B1 (en) * | 1989-05-05 | 1995-09-27 | Ramtron International Corporation | Integrated ferroelectric capacitor |
-
1991
- 1991-12-06 EP EP19910120962 patent/EP0490288A3/en not_active Withdrawn
- 1991-12-10 KR KR1019910022573A patent/KR100264368B1/ko not_active Expired - Lifetime
- 1991-12-11 JP JP32776691A patent/JP3254703B2/ja not_active Expired - Lifetime
- 1991-12-30 TW TW080110268A patent/TW222348B/zh active
-
2001
- 2001-08-10 JP JP2001244303A patent/JP2002064188A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02189969A (ja) * | 1989-01-18 | 1990-07-25 | Toshiba Corp | 電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3254703B2 (ja) | 2002-02-12 |
| EP0490288A2 (en) | 1992-06-17 |
| JP2002064188A (ja) | 2002-02-28 |
| TW222348B (enExample) | 1994-04-11 |
| KR920013712A (ko) | 1992-07-29 |
| JPH04287968A (ja) | 1992-10-13 |
| EP0490288A3 (en) | 1992-09-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5929475A (en) | Capacitor for integrated circuit and its fabrication method | |
| JP2573384B2 (ja) | 半導体記憶装置とその製造方法 | |
| US5406447A (en) | Capacitor used in an integrated circuit and comprising opposing electrodes having barrier metal films in contact with a dielectric film | |
| US5191510A (en) | Use of palladium as an adhesion layer and as an electrode in ferroelectric memory devices | |
| US5337207A (en) | High-permittivity dielectric capacitor for use in a semiconductor device and process for making the same | |
| US5573979A (en) | Sloped storage node for a 3-D dram cell structure | |
| JP3056973B2 (ja) | 高誘電率材料を使用する記憶キャパシタの製造方法 | |
| US5822175A (en) | Encapsulated capacitor structure having a dielectric interlayer | |
| US6468896B2 (en) | Method of fabricating semiconductor components | |
| US5920453A (en) | Completely encapsulated top electrode of a ferroelectric capacitor | |
| KR20000062325A (ko) | 집적회로전극구조 및 이것의 제조공정 | |
| KR100264368B1 (ko) | 집적회로 메모리 엘레멘트가 되는 pzt 캐패시터 및 그의 제조방법 | |
| JP3820003B2 (ja) | 薄膜キャパシタの製造方法 | |
| KR100280565B1 (ko) | 금속 대 금속 캐패시터의 집적화 공정 | |
| KR19980043406A (ko) | 반도체소자의 커패시터 및 그 제조방법 | |
| KR20020047253A (ko) | 배리어 구조물을 구비한 커패시터 전극의 제조 방법 | |
| KR19980702953A (ko) | 개선된 엘에스시오 스택 전극 제조 방법 | |
| KR100199093B1 (ko) | 반도체 소자의 커패시터 제조방법 | |
| JP3120568B2 (ja) | 薄膜キャパシタ | |
| KR920009748B1 (ko) | 적층형 캐패시터셀의 구조 및 제조방법 | |
| US6074885A (en) | Lead titanate isolation layers for use in fabricating PZT-based capacitors and similar structures | |
| JP2000228494A (ja) | キャパシタ | |
| WO1992002048A1 (fr) | Procede de fabrication d'un dispositif a semiconducteur | |
| JP3221398B2 (ja) | 容量素子およびその製造方法 | |
| JPH07107926B2 (ja) | 半導体容量素子の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| T13-X000 | Administrative time limit extension granted |
St.27 status event code: U-3-3-T10-T13-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U11-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-5-5-R10-R13-asn-PN2301 St.27 status event code: A-5-5-R10-R11-asn-PN2301 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 4 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 5 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 6 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 7 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 8 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 9 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 10 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 11 |
|
| FPAY | Annual fee payment |
Payment date: 20110421 Year of fee payment: 12 |
|
| PR1001 | Payment of annual fee |
St.27 status event code: A-4-4-U10-U11-oth-PR1001 Fee payment year number: 12 |
|
| EXPY | Expiration of term | ||
| PC1801 | Expiration of term |
St.27 status event code: N-4-6-H10-H14-oth-PC1801 Not in force date: 20111211 Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-5-5-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-4-4-P10-P22-nap-X000 |