KR100251239B1 - 기판이송적재방법 및 기판이송적재장치 - Google Patents

기판이송적재방법 및 기판이송적재장치 Download PDF

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Publication number
KR100251239B1
KR100251239B1 KR1019960017165A KR19960017165A KR100251239B1 KR 100251239 B1 KR100251239 B1 KR 100251239B1 KR 1019960017165 A KR1019960017165 A KR 1019960017165A KR 19960017165 A KR19960017165 A KR 19960017165A KR 100251239 B1 KR100251239 B1 KR 100251239B1
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KR
South Korea
Prior art keywords
substrate
transfer
loading
transfer loading
take
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019960017165A
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English (en)
Korean (ko)
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KR960044021A (ko
Inventor
노리유키 히라타
쇼지 고마츠
Original Assignee
니시무로 타이죠
가부시끼가이샤 도시바
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Publication of KR960044021A publication Critical patent/KR960044021A/ko
Application granted granted Critical
Publication of KR100251239B1 publication Critical patent/KR100251239B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
KR1019960017165A 1995-05-18 1996-05-18 기판이송적재방법 및 기판이송적재장치 Expired - Lifetime KR100251239B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP95-120194 1995-05-18
JP12019495 1995-05-18
JP9-120194 1997-04-22

Publications (2)

Publication Number Publication Date
KR960044021A KR960044021A (ko) 1996-12-23
KR100251239B1 true KR100251239B1 (ko) 2000-04-15

Family

ID=14780244

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017165A Expired - Lifetime KR100251239B1 (ko) 1995-05-18 1996-05-18 기판이송적재방법 및 기판이송적재장치

Country Status (3)

Country Link
US (3) US5740059A (enExample)
KR (1) KR100251239B1 (enExample)
TW (1) TW319751B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100819817B1 (ko) * 2006-03-30 2008-04-07 주식회사 에스에프에이 반송 로봇

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TW319751B (enExample) * 1995-05-18 1997-11-11 Toshiba Co Ltd
JPH08335622A (ja) * 1995-06-07 1996-12-17 Tokyo Electron Ltd 基板搬送装置
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
US6942738B1 (en) 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US6723174B2 (en) * 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
JP3741401B2 (ja) * 1998-02-27 2006-02-01 キヤノン株式会社 基板搬送装置、半導体製造装置および液晶プレート製造装置
US6244121B1 (en) * 1998-03-06 2001-06-12 Applied Materials, Inc. Sensor device for non-intrusive diagnosis of a semiconductor processing system
US6085125A (en) * 1998-05-11 2000-07-04 Genmark Automation, Inc. Prealigner and planarity teaching station
US6298280B1 (en) * 1998-09-28 2001-10-02 Asyst Technologies, Inc. Method for in-cassette wafer center determination
TW469483B (en) * 1999-04-19 2001-12-21 Applied Materials Inc Method and apparatus for aligning a cassette
US6763281B2 (en) 1999-04-19 2004-07-13 Applied Materials, Inc Apparatus for alignment of automated workpiece handling systems
US6356337B1 (en) * 2000-03-08 2002-03-12 Anvik Corporation Two-sided substrate imaging using single-approach projection optics
AU2001268656A1 (en) * 2000-07-07 2002-01-21 Semitool, Inc. Automated processing system
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US7572092B2 (en) * 2002-10-07 2009-08-11 Brooks Automation, Inc. Substrate alignment system
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
US6944517B2 (en) 2003-07-03 2005-09-13 Brooks Automation, Inc. Substrate apparatus calibration and synchronization procedure
KR20050038134A (ko) * 2003-10-21 2005-04-27 삼성전자주식회사 기판 스토킹 시스템
KR100568867B1 (ko) * 2004-03-18 2006-04-10 삼성전자주식회사 웨이퍼 좌표감지장치 및 그 웨이퍼 좌표감지 기능을 갖는반도체 제조설비
US7611124B2 (en) 2004-12-22 2009-11-03 Tokyo Electron Limited Vacuum processing apparatus
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method
JP2009500869A (ja) * 2005-07-11 2009-01-08 ブルックス オートメーション インコーポレイテッド オンザフライ（ｏｎｔｈｅｆｌｙ）ワークピースセンタリングを備えた装置
TWD114184S1 (zh) * 2005-08-12 2006-12-01 東京威力科創股份有限公司 半導體晶圓輸送裝置
TWD114133S1 (zh) * 2005-08-12 2006-12-01 東京威力科創股份有限公司 半導體晶圓輸送裝置
TWD112956S1 (zh) * 2005-08-12 2006-09-11 東京威力科創股份有限公司 半導體晶圓輸送裝置之平台臂
TWD112955S1 (zh) * 2005-08-12 2006-09-11 東京威力科創股份有限公司 半導體晶圓輸送裝置之平台臂
TWD114134S1 (zh) * 2005-08-12 2006-12-01 東京威力科創股份有限公司 半導體晶圓輸送裝置
US7387484B2 (en) * 2005-12-21 2008-06-17 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer positioning systems and methods thereof
CH699754B1 (de) * 2008-10-20 2020-11-13 Tec Sem Ag Speichervorrichtung für eine Zwischenlagerung von Objekten für die Produktion von Halbleiterbauelementen
DE102009016288B4 (de) * 2009-01-02 2013-11-21 Singulus Technologies Ag Verfahren und Vorrichtung für die Ausrichtung von Substraten
US8215890B2 (en) * 2009-03-12 2012-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor wafer robot alignment system and method
MY161955A (en) * 2009-03-30 2017-05-15 Ats Automation Tooling Systems Inc Systems and methods for handling wafers
DE102009016811A1 (de) * 2009-04-09 2010-10-14 Aes Motomation Gmbh Verfahren zur automatischen Vermessung und zum Einlernen von Lagepositionen von Objekten innerhalb eines Substratprozessiersystems mittels Sensorträger und zugehöriger Sensorträger
JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
JP6208419B2 (ja) * 2012-09-19 2017-10-04 株式会社ダイヘン 算出装置、搬送ロボットシステム、及び算出方法
JP5935676B2 (ja) * 2012-12-07 2016-06-15 東京エレクトロン株式会社 基板処理装置、基板装置の運用方法及び記憶媒体
CN104103481A (zh) * 2013-04-10 2014-10-15 上海和辉光电有限公司 玻璃基板的缺角检测装置、具有该装置的干蚀刻机台及缺角检测方法
JP5949741B2 (ja) * 2013-12-19 2016-07-13 株式会社安川電機 ロボットシステム及び検出方法
TWI643801B (zh) * 2016-03-04 2018-12-11 長岡制作所股份有限公司 Workpiece separation and transportation system and method
JP6685213B2 (ja) * 2016-09-29 2020-04-22 株式会社Ｓｃｒｅｅｎホールディングス 基板整列装置、基板処理装置、基板配列装置、基板整列方法、基板処理方法および基板配列方法
CN107131825B (zh) * 2017-03-24 2019-08-09 北京工业大学 一种判别并记录硅片位置的检测装置及方法
US10741433B2 (en) 2017-11-29 2020-08-11 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer pod alignment
JP7002307B2 (ja) * 2017-11-30 2022-01-20 株式会社荏原製作所 基板搬送システム、基板処理装置、ハンド位置調整方法
JP2019110200A (ja) * 2017-12-18 2019-07-04 株式会社荏原製作所 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
JP2021048322A (ja) * 2019-09-19 2021-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7664063B2 (ja) * 2021-03-19 2025-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7568366B2 (ja) * 2021-03-24 2024-10-16 東京エレクトロン株式会社 基板搬送方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100819817B1 (ko) * 2006-03-30 2008-04-07 주식회사 에스에프에이 반송 로봇

Also Published As

Publication number Publication date
US6327512B1 (en) 2001-12-04
US6459947B1 (en) 2002-10-01
KR960044021A (ko) 1996-12-23
US5740059A (en) 1998-04-14
US20020026259A1 (en) 2002-02-28
TW319751B (enExample) 1997-11-11

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