KR100224463B1 - 도포장치 및 그 제어방법 - Google Patents

도포장치 및 그 제어방법 Download PDF

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Publication number
KR100224463B1
KR100224463B1 KR1019960012023A KR19960012023A KR100224463B1 KR 100224463 B1 KR100224463 B1 KR 100224463B1 KR 1019960012023 A KR1019960012023 A KR 1019960012023A KR 19960012023 A KR19960012023 A KR 19960012023A KR 100224463 B1 KR100224463 B1 KR 100224463B1
Authority
KR
South Korea
Prior art keywords
liquid
waste liquid
exhaust
storage means
storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019960012023A
Other languages
English (en)
Korean (ko)
Other versions
KR960039199A (ko
Inventor
요시오 기무라
사토시 모리타
유지 마츠야마
Original Assignee
히가시 데쓰로
동경 엘렉트론주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 히가시 데쓰로, 동경 엘렉트론주식회사 filed Critical 히가시 데쓰로
Publication of KR960039199A publication Critical patent/KR960039199A/ko
Application granted granted Critical
Publication of KR100224463B1 publication Critical patent/KR100224463B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
KR1019960012023A 1995-04-19 1996-04-19 도포장치 및 그 제어방법 Expired - Fee Related KR100224463B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11933595 1995-04-19
JP95-119335 1995-04-19

Publications (2)

Publication Number Publication Date
KR960039199A KR960039199A (ko) 1996-11-21
KR100224463B1 true KR100224463B1 (ko) 1999-10-15

Family

ID=14758939

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960012023A Expired - Fee Related KR100224463B1 (ko) 1995-04-19 1996-04-19 도포장치 및 그 제어방법

Country Status (3)

Country Link
US (2) US5711809A (enExample)
KR (1) KR100224463B1 (enExample)
TW (1) TW306011B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200462370Y1 (ko) * 2007-08-13 2012-09-07 주식회사 케이씨텍 기액분리장치
KR20180052526A (ko) * 2016-11-10 2018-05-18 사이언테크 코포레이션 액체처리장치
KR20190025780A (ko) * 2017-09-01 2019-03-12 세메스 주식회사 기판처리장치

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5985031A (en) 1996-06-21 1999-11-16 Micron Technology, Inc. Spin coating spindle and chuck assembly
US5769945A (en) * 1996-06-21 1998-06-23 Micron Technology, Inc. Spin coating bowl exhaust system
US6129042A (en) * 1996-11-08 2000-10-10 Coburn Optical Industries, Inc. Process and machine for coating ophthalmic lenses
US6107608A (en) 1997-03-24 2000-08-22 Micron Technology, Inc. Temperature controlled spin chuck
TW418452B (en) * 1997-10-31 2001-01-11 Tokyo Electron Ltd Coating process
FR2780665B1 (fr) * 1998-07-03 2000-09-15 Oreal Procede et dispositif pour appliquer un revetement tel qu'une peinture ou un vernis
US6167935B1 (en) * 1998-09-14 2001-01-02 James E. Heider Labeling machine
JP3330335B2 (ja) * 1998-11-04 2002-09-30 東京エレクトロン株式会社 塗布膜形成装置およびエージング処理装置
US6302960B1 (en) 1998-11-23 2001-10-16 Applied Materials, Inc. Photoresist coater
KR100798769B1 (ko) * 2000-09-25 2008-01-29 동경 엘렉트론 주식회사 기판 처리장치
JP4531998B2 (ja) * 2001-02-21 2010-08-25 Ｏｋｉセミコンダクタ株式会社 廃液分離回収システム及び廃液分離回収方法
JP3713447B2 (ja) * 2001-04-05 2005-11-09 東京エレクトロン株式会社 現像処理装置
US20030037800A1 (en) * 2001-08-27 2003-02-27 Applied Materials, Inc. Method for removing contamination particles from substrate processing chambers
US20030037801A1 (en) * 2001-08-27 2003-02-27 Applied Materials, Inc. Method for increasing the efficiency of substrate processing chamber contamination detection
US6779226B2 (en) * 2001-08-27 2004-08-24 Applied Materials, Inc. Factory interface particle removal platform
JP2004000921A (ja) * 2002-04-26 2004-01-08 Seiko Epson Corp 膜体形成装置、レンズの製造方法、カラーフィルタの製造方法および有機ｅｌ装置の製造方法
JP2003338499A (ja) * 2002-05-20 2003-11-28 Tokyo Electron Ltd 膜形成方法及び膜形成装置
JP2004031400A (ja) * 2002-06-21 2004-01-29 Sipec Corp 基板処理装置及びその処理方法
US7837803B2 (en) * 2003-03-20 2010-11-23 Lam Research Ag Device and method for wet treating disc-shaped articles
US7531040B2 (en) * 2003-10-02 2009-05-12 Asml Holdings N.V. Resist recovery method
SG116641A1 (en) * 2004-04-26 2005-11-28 Matsushita Electric Industrial Co Ltd Method and apparatus for recycling ultraviolet curing resin, and method for manufacturing optical recording medium using that recycling method.
KR101310472B1 (ko) 2004-06-10 2013-09-24 가부시키가이샤 니콘 엔지니어링 노광 장치, 노광 방법 및 디바이스 제조 방법
KR100632945B1 (ko) * 2004-07-01 2006-10-12 삼성전자주식회사 상승기류를 억제할 수 있는 스핀 공정 설비 및 스핀 공정설비의 배기량 제어 방법
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
US20070298158A1 (en) * 2006-06-23 2007-12-27 Marion Keith Martin Testing bonding materials in a disc production line
US8845454B2 (en) 2008-11-21 2014-09-30 Nike, Inc. Golf club or other ball striking device having stiffened face portion
JP6219848B2 (ja) * 2012-12-28 2017-10-25 株式会社Ｓｃｒｅｅｎホールディングス 処理装置とその排気切換装置並びに排気切換ユニットと切換弁ボックス
US10354858B2 (en) * 2013-12-31 2019-07-16 Texas Instruments Incorporated Process for forming PZT or PLZT thinfilms with low defectivity
JP6715019B2 (ja) * 2016-02-09 2020-07-01 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR102139605B1 (ko) * 2018-11-06 2020-08-12 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
JP2024065869A (ja) * 2022-10-31 2024-05-15 株式会社荏原製作所 基板処理装置、基板処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2527318B2 (ja) * 1986-12-25 1996-08-21 関東化学 株式会社 レジスト組成物を回収、再使用するための方法および装置
JPH0216633A (ja) * 1988-07-05 1990-01-19 Nec Corp ソフトウェア使用権登録方式
JPH02101732A (ja) * 1988-10-11 1990-04-13 Fujitsu Ltd レジストコータ
JP2982439B2 (ja) * 1991-10-29 1999-11-22 東京エレクトロン株式会社 処理液塗布装置及び処理液塗布方法
US5358740A (en) * 1992-06-24 1994-10-25 Massachusetts Institute Of Technology Method for low pressure spin coating and low pressure spin coating apparatus
US5565034A (en) * 1993-10-29 1996-10-15 Tokyo Electron Limited Apparatus for processing substrates having a film formed on a surface of the substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200462370Y1 (ko) * 2007-08-13 2012-09-07 주식회사 케이씨텍 기액분리장치
KR20180052526A (ko) * 2016-11-10 2018-05-18 사이언테크 코포레이션 액체처리장치
KR102001309B1 (ko) * 2016-11-10 2019-07-17 사이언테크 코포레이션 액체처리장치
KR20190025780A (ko) * 2017-09-01 2019-03-12 세메스 주식회사 기판처리장치
KR102385267B1 (ko) * 2017-09-01 2022-04-13 세메스 주식회사 기판처리장치

Also Published As

Publication number Publication date
TW306011B (enExample) 1997-05-21
US5908657A (en) 1999-06-01
US5711809A (en) 1998-01-27
KR960039199A (ko) 1996-11-21

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