JPH07132262A - 浸漬式の液処理装置 - Google Patents

浸漬式の液処理装置

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Publication number
JPH07132262A
JPH07132262A JP35543792A JP35543792A JPH07132262A JP H07132262 A JPH07132262 A JP H07132262A JP 35543792 A JP35543792 A JP 35543792A JP 35543792 A JP35543792 A JP 35543792A JP H07132262 A JPH07132262 A JP H07132262A
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JP2520833B2 (ja
Inventor
Osamu Hirakawa
修 平河
Minoru Ota
太田  実
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Tokyo Electron Ltd
東京エレクトロン株式会社
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Abstract

(57)【要約】 【目的】ウエハ等の被処理基板を現像液等によって液処
理するに、該処理液の供給による好ましくない影響や温
度変化による処理影響をなくすようにする。 【構成】ドーナツの収納容器を成す下容器14上に下シ
ール13を介し被処理基板5を載置し、下容器14と該
下容器14より大径の上容器15により所定の液処理を
するに際し、該上容器15の外面に載置した被処理基板
5に平行に処理液6の吐出口21を設け、被処理基板5
に対する衝撃的な処理液供給を行わないようにし、又、
該上容器15には調温機構としての温調供給通路22を
を設けて処理液の定温を図り、温度影響による処理むら
をなくし、処理液の衝撃的供給による悪影響をないよう
にする。 【効果】被処理基板5に対して供給される処理液が衝撃
的吐出によらず、静穏に液盛り状に供給され、しかも、
常に一定温度に保たれるようにすることから、被処理基
板は設計通りの均一な処理がなされ、製品精度に対する
信頼が大きく得られる。

Description

【発明の詳細な説明】
【0001】
【産業上の利用分野】開示技術は、半導体製造装置に関
する発明であり、特に、フォトレジスト膜の塗布装置や
現像装置に適用するに好適な浸漬式の液処理装置に係わ
る発明である。
【0002】
【従来の技術】当業者に周知の如く、一般に、半導体の
製造工程においては、ウエハ等の被処理基板の全面に膜
体が一様に被着される工程、例えば、フォトレジスト膜
を被着させる現像処理工程には、工程の高効率化のため
の無人化や連続処理を促進する等の見地から被処理基板
を1枚ずつ液処理する所謂枚葉式のスピン現像装置が使
用されている。
【0003】該種枚葉式のスピン現像装置においては、
通常吐出ノズル、或いは、スプレー等により現像液を被
処理基板上に放出して該現像液の表面張力の作用を介し
て液盛りするようにしているのであるが、該表面張力の
作用により被処理基板上に液盛りし得る液量には限度が
あり、又、吐出ノズルやスプレーにて現像液の放出をし
た場合、経時的に全面均一の液浸漬状態にはならず、し
たがって、該被処理基板上での好ましくない液むらの発
生や吐出現像液の基板への衝突による悪影響は防ぎ得な
い。
【0004】又、近年使用されるようになった現像液と
しては、解像度を向上させるために界面活性剤を添加し
た現像液や表面張力の低い現像液が使用される傾向があ
り、被処理基板上に表面張力の作用のみにより必要量の
現像液を液盛りすることが困難となったため、スピン現
像装置に替えて浸漬式の現像装置が望まれるようになっ
てきた。
【0005】かかる点を考慮した装置として、例えば、
図5に示す様に、実開昭60−52622号公報にて開
示された態様の浸漬式の現像装置がある。
【0006】即ち、当該図5に示す浸漬式の現像装置の
態様において、容器1内に設けたウエハホルダ3の内側
に設けられた段部4に被処理基板としてのウエハ5を収
納セットし、現像液6に浸漬して該ウエハ5の下面周辺
部とウエハホルダ3の内側の段部4とを液密に接触さ
せ、ウエハ5上に現像液6を液盛りして該ウエハ5を浸
漬状態で現像処理を行うものである。
【0007】
【発明が解決しようとする課題】しかしながら、上述の
如くこれまで知られている浸漬式の処理装置にあって
は、容器1内に設けたウエハチャック2を軸装するウエ
ハホルダ3の内側に設けられた段部4にも該段部4を介
して載置したウエハ5上面と同様に現像液6を液盛りす
ることになるため、現像後、該ウエハ5をウエハチャッ
ク2を介して高速回転し、ウエハ5の上面に図示しない
リンス液等を吹きつけて該ウエハ5を洗浄するが、その
際に遠心作用を受けて飛散したリンス液が段部4に付着
して該段部4に残存する現像液6と混ざり、その結果、
好ましくない現像むらが生じ易い欠点がある。
【0008】又、現像終了後の現像液6の排液処理機構
としてウエハ5をウエハホルダ3の段部4から浮揚する
ことにより現像液6を該ウエハホルダ3の内周部に流下
し、その内底部に形成した排液孔7から排液するように
する構造とされてあるため、該現像液6がウエハ5周辺
部の裏面に付着して残存し易く、且つ、ウエハチャック
2下部よりその内側の軸装部に浸入して筒状部8内を通
りモータ9にかかる懸念があることが避け難い難点があ
る。
【0009】更に、排液孔7がウエハホルダ3の内底部
に設けられた構造のため、設計的に機構上の制約を受
け、該排液孔7の断面積を大きくとれず、したがって、
排液速度が遅くなるという不具合がある。
【0010】又、現像液は温度の影響が大きく、したが
って、温度変化により現像むら等の生じ易いマイナス点
がある。
【0011】これらのことは、レジスト塗布装置等の液
処理装置にあっても同様の問題であった。
【0012】
【発明の目的】この発明の目的は上述従来技術に基づく
現像等の液処理の問題点を解決すべき技術的課題とし、
ウエハ等の被処理基板がクリーンで処理むらが少く、信
頼性、及び、スループット性が高く、枚葉式液処理に適
合し得るようにして機械装置産業における液処理技術利
用分野に益する優れた浸漬式の液処理装置を提供せんと
するものである。
【0013】
【課題を解決するための手段】上述目的に沿い先述特許
請求の範囲を要旨とするこの発明の構成は、前述課題を
解決するために、被処理基板の下面周辺部と液密に接触
して収納容器の底面部を成す下側の第一の容器と、該被
処理基板より大きな内径と下向き内側傾斜面が設けられ
た内壁とを有して第一の容器の上面周縁部と液密に接触
して収納容器の側壁部を構成する上側の第二の容器と、
第一の容器と該第二の容器から成る収納容器内に処理液
を非衝撃的に供給する処理液供給機構と処理液に対する
温度調整機構とが第二の容器内に設けられ、第一の容器
の下側中央部に設けられ被処理基板を真空吸着により保
持して回転して処理液等を飛散させる回転機構と、収納
容器の外側にあって第一の容器と第二の容器を離間させ
ると共に、該回転機構に被処理基板を受け渡す昇降駆動
機構と離間された第一の容器と第二の容器との間から気
体を下方に排気する排気手段とを備え、回転機構で被処
理基板を回転して該被処理基板上の液体を振り切る際、
振り切られた液体は、第二の容器の下向き内側傾斜面に
当り、これに前後して発生する飛散ミストは排気手段に
より排気されるようにされているようにした技術的手段
を講じたものである。
【0014】
【作用】而して、収納容器を成す下側の第一の容器、及
び、該第一の容器よりは大きな内径であって同芯的に上
外側に配設させた第二の容器に対し被処理基板をそれぞ
れ液密に接触させて収納セットし、該被処理基板上に該
被処理基板が浸漬するに充分な量の処理液を第二の容器
の処理液供給機構の液吐出口より温度調整機構により定
温状態で内側に向け吐出して可及的同時に非衝撃的に全
面均一に液盛り状態にし、処理むらや液の吐出時の被処
理基板への衝撃付与のない浸漬状態にして所定の液処理
が出来るようにし、液処理後は両容器、及び、被処理基
板を昇降駆動機構を介して相互に離反し、処理液は該被
処理基板上からオーバーフローし、両容器間から処理液
を落下し、第一の容器の被処理基板は真空吸着式の回転
機構により回転されて処理液を遠心力で振り切り、振り
切られた処理液は第一の容器の下向き内側傾斜面23に
当って落下し、排液孔から排液し、その間、洗浄液を放
出し、発生するミストや乾燥気体を下方に排気するよう
にしたものである。
【0015】
【実施例】次に、この発明の1実施例を図1乃至図4に
基づいて説明すれば以下の通りである。
【0016】尚、図5と同一態様部分は同一符号を用い
て説明するものとする。
【0017】図示実施例は、半導体製造装置の現像装置
に適用した態様である。
【0018】37はドーナツ状の収納容器であって、同
じくドーナツ状の同芯的な下側の第一の容器14とこれ
より大径の上外側の第二の容器15とから成り、該収納
容器37内の中央部には、例えば、真空チャック等によ
り被処理基板としてのウエハ5を下側から吸着して保持
し回転機構を成すウエハチャック12が設けられてお
り、該ウエハチャック12は下側の固定部31に取り付
け固定されたモータ30によって回転自在にされてい
る。
【0019】又、収納容器37の外側一側には該収納容
器37を昇降制御する昇降駆動部39が設けられてお
り、該昇降駆動部39は、下側の固定部31に取り付け
固定され、収納容器37を昇降すると共に前記ウエハチ
ャック12に被処理基板5を受け渡す主エアシリンダ3
2を有し、該主エアシリンダ32のロッド33の先端は
収納容器37の第二の容器15に連結され、これを昇降
する昇降金具34がアンダーハング状に延設固定され、
該昇降金具34の先端には昇降する副エアシリンダ35
が上向きに固設され、そのロッド36が第一の容器14
の底部に連結固設されている。
【0020】一方、該第一の容器14の内側上部には図
2に示す様に、ウエハ5の裏面を洗浄する洗浄ノズル2
6が第二の容器15との間に形成して設けられ、洗浄液
が該ウエハ5の裏面に対する洗浄作用をなした後、ウエ
ハ5の外周方向に流過するように指向され、下側の洗浄
液流入口25に連通している。
【0021】更に、第一の容器14の上面にはウエハ5
の下面周辺部に対して真空吸着することにより液密状に
シールする、例えば、シリコンゴム製のリップ型の環状
の下シール13が下バックアップリング部16によって
上向きに固定されている。
【0022】そして、該下シール13と下バックアップ
リング部16には真空吸引のための下開きの吸引口が設
けられて真空吸引口20と共に真空吸引接続口17に連
通し、真空吸引可能にされている。
【0023】第一の容器14の下面内部には、現像液6
の排液が該第一の容器14の下面内側に流入してモータ
30にかかるのを防ぐため外周部に外向きに傾斜する側
壁の傾斜面23とその下側の仕切板29が環状に設けら
れ、第一の容器14の下面外側寄りには現像液6を排液
するための排液管28が下延して設けられている。
【0024】又、該排液管28には、気体を排出する排
気手段としての排気口24が形成されて図示しない排気
装置に接続されている。
【0025】一方、第一の容器14の上方外側には同芯
的に該第一の容器14を取り囲むようにそれより大径で
あって熱容量の大きな第二の容器15が配置されてその
内側には図2に詳示する様に、現像液6を供給するため
の所定数複数の処理液供給機構の吐出口21,21…が
内壁面に開口され、又、浸漬処理後に該現像液6を強制
的に排液するためのその下側の同じく所定数複数の吸引
排液口27,27…と、現像液6を一定の温度に保って
現像むらの生じないようにするための温水等を供給循環
する環状の温度調整機構としての温調水流路22とが設
けられており、下面には外向き傾斜面23が形成されて
いる。
【0026】又、第二の容器15の内側下部には、第一
の容器14の真空吸引口20に対して液密にシールする
同じくシリコンゴム製のリップ型の上シール18が環状
に設けられ、該上シール18は上バックアップリング部
19により第二の容器15に固定されている。
【0027】更に、ウエハチャック12の下側には、洗
浄液等の付着した第一の容器14を迅速に乾燥するため
に所定数の多数の乾燥ノズル38,38…が設けられて
該乾燥ノズル38,38…から吹出した気体が図3に示
す様に、第一の容器14の上面に吹きつけられるようさ
れている。
【0028】上述構成において、先ず、図3に示す様
に、図示しない搬送装置によりウエハ5をウエハチャッ
ク12に載置して吸着保持する。
【0029】この時、第一の容器14と第二の容器15
は当該図3に図示する様に共に最下位の位置にあって通
常はこの状態に位置している。
【0030】次に、図4に示す様に、主エアシリンダ3
2が作動してそのロッド33を伸長させ、該ロッド33
の先端に取り付けられた昇降金具34を上昇させ、第二
の容器15を上死点まで上昇させると同時に、第一の容
器14を昇降金具34に取り付け固定されて作動してい
ない副エアシリンダ35を介して該第一の容器14の下
シール13がウエハ5の裏面より僅かに低い設定位置に
達するまで上昇させる。
【0031】次いで、その状態から図1に示す様に、副
エアシリンダ35が伸長作動してロッド36が随伴して
伸長し、第一の容器14が更に上昇する。
【0032】そこで、図2に示す様に、該第一の容器1
4が上昇すると、下シール13がウエハ5の裏面に下側
から当接し、真空吸引接続口17からの排気によりウエ
ハ5を真空吸引してウエハ5と第一の容器14を液密に
シールする。
【0033】更に、ひき続いて第一の容器14が上昇す
ると、該第一の容器14の真空吸引口20の周辺部と上
シール18が当接して真空吸引接続口17を介しての真
空吸引により第二の容器15と第一の容器14の真空吸
引口20とを液密にシールする。
【0034】そこで、上述のようにウエハ5と第一の容
器14、該第一の容器14と第二の容器15とを液密に
シールした状態に保ち、該第二の容器15の液吐出口2
1から温水等により保温された現像液6を第二の容器1
5の内側全周より均一に所定量吐出させ、ウエハ5上に
均一に液盛り状態にさせ、図1に示す様に、ウエハ5を
該現像液6中に浸漬状態にして現像を開始する。
【0035】この間、副エアシリンダ35を伸長状態に
付勢して上述液密シール状態を保持し現像を続行する。
【0036】而して、所定時間浸漬状態で現像後、該副
エアシリンダ35の作動を停止させて縮少すると、その
ロッド36が縮少して第一の容器14が下降し、図3に
示す様に、上シール18で液密にシールされていた第二
の容器15と該第一の容器14を解離し、現像液6をウ
エハ上面からのオーバーフローを介しての自然落下によ
り、又、該第一の容器14の傾斜面23を介して第一の
容器14の内側外周部に向って流下し排液管28により
排液する。
【0037】この場合、第二の容器15と第一の容器1
4の傾斜面23,23間には排液に際し充分な開口面積
が形成されるので、排液速度を相当に速く出来、又、排
液の流下する方向が傾斜面23を介して第一の容器14
の外周部に向うものであるため、モータ30側に流され
ることがなく、該モータ30に排液がかかる可能性は全
くない。
【0038】更に、ロッド36が縮少し、第一の容器1
4が下降すると、図4に示す様に、ウエハ5はウエハチ
ャック12に接近して載置され、又、下シール13によ
り液密にシールされていたウエハ5と第一の容器14は
切り離される。
【0039】この状態で、モータ30を作動させ、該ウ
エハ5を高速回転することによりウエハ5上に残存する
現像液6を遠心力により振り切ると同時に、図示しない
リンスノズルよりリンス液を該ウエハ5上に放出し、現
像作用の停止、及び、ウエハ5表面のリンスを行う。
【0040】このプロセスで現像液6の流下分とリンス
液は振り切られ、傾斜面23に衝突して下方へ反射落下
する。
【0041】又、洗浄液流入口25から洗浄液を供給さ
せ、洗浄ノズル26からウエハ5の外周部に向けて流出
させ、該ウエハ5の裏面に付着した現像液6等をも洗浄
すると共に排気口24から排気を行う。
【0042】尚、ウエハ5の回転により振り切られる現
像液6やリンス液、そして、ウエハ5の裏面に対する洗
浄液等は、第二の容器15の内側に設けられた傾斜面2
3に当って下方へと反射落下し、又、排気口24からは
排気が行われるので、第二の容器15と第一の容器14
との傾斜面23,23間の開口部分には、上方から斜め
下方へ向う排気流24aが形成されるため、リンス液等
の飛散ミストがウエハ5の面方向へ向うことを防止する
ことが出来ることから該ウエハ5への再付着を防止す
る。
【0043】上述リンス、及び、ウエハ5の裏面洗浄が
終了した後も一定時間該ウエハ5を回転してウエハ5を
乾燥させる。
【0044】而して、乾燥終了後は主エアシリンダ32
の作動を停止し、ロッド33を縮少させて収納容器37
を下降させ、図3に示す様に、初期の位置姿勢に復帰さ
せる。
【0045】そして、排気流24aを利用して、第一の
容器14の上面等に付着したリンス液等を自然乾燥させ
る。
【0046】尚、この発明の実施態様は上述実施例に限
るものでないことは勿論であり、例えば、第一の容器1
4と第二の容器15を液密にシールするべく、上述実施
例では上シール18を該第二の容器15に設けたが、該
上シール18を第一の容器14に設け、第二の容器15
の下面を平面に形成しても良い等種々の態様が採用可能
である。
【0047】但し、当該態様では第一の容器14の排液
が流下する部分に上シール18を設けるので排液性が低
下するのは避け難く、したがって、前述実施例のように
上シール18は第二の容器15に設けるのが望ましい。
【0048】又、収納容器37を昇降する手段について
も、前述実施例のようにエアシリンダ使用に限定される
ものではなく、昇降出来る機構のものであれば、他のど
のような手段を用いても構わない。
【0049】そして、現像液6の排液方式としては、前
述自然落下によるものだけではなく、例えば、第二の容
器15の吸引排液口27より現像終了後に強制的に負圧
式に吸引して排液しても良い。
【0050】かかる方式によれば、現像液6をほぼ全て
回収することが可能であり、リンス液の混入がない純粋
な現像液6を回収して再利用することも出来る。
【0051】更に、第一の容器14を排気流24aを利
用して自然乾燥させるに際し、乾燥ノズル38を併用
し、例えば、窒素(N2 )等の気体を矢印38aで示す
様に、該第一の容器14の上面方向へ強制的に噴出させ
ることにより、より速やかに該第一の容器14を乾燥さ
せることが出来る。
【0052】尚、現像速度は先述した如く温度依存性が
高く、したがって、現像中での温度変化は現像速度の変
化を介して現像むらの原因になるので該温度変化を防ぐ
のに、前述実施例のように、熱容量が大きく、現像液6
に対する熱伝導を支配する第二の容器15を利用すれ
ば、温調の効果は向上する。
【0053】又、前述実施例では第二の容器15と第一
の容器14とを上シール18を真空吸引することにより
液密に接触シールさせているが、該第二の容器15の重
量が充分な場合には、上シール18を、例えば、Oリン
グとし負圧吸引せずに機械的に液密に接触させることも
可能である。
【0054】上述実施例では浸漬式の液処理装置に適用
した態様について説明したが、被処理基板の一方側面の
全面が処理液により一様に被着される態様であればいか
なる装置にも適用出来、例えば、コーター、即ち、フォ
トレジスト膜塗布装置に適用しても良い。
【0055】而して、ドーナツ状の収納容器の上下の同
芯的配列の第一と第二の容器により被処理基板が支持回
転機構を介して浸漬式にセットされることにより処理む
ら等を生じない効果があり、処理後は該被処理基板と第
一と第二の容器が離反されてそれらの間隙部から処理液
が迅速に流下排液される効果もあり、又、処理済の処理
液や洗浄液が回転機構を介して振り切れる時第二の容器
の外向傾斜面から回転による遠心力で飛散されて衝突
し、下側に反射して落下するため、中心部の支持回転機
構の駆動部等にかからないという優れた効果が奏され
る。
【0056】そして、洗浄等の際に発生するミストは同
様に回転されると共に反射落下し排気口から排気される
ため被処理基板にはね返って付着することがないという
効果がある。
【0057】
【発明の効果】以上、この発明によれば、基本的にウエ
ハ等被処理基板をクリーンで、処理むらをなくして所定
に処理することが出来、製品に対する信頼性、及び、ス
ループット性の秀れた処理を行うことが出来る優れた効
果が奏される。
【0058】又、ウエハの外周方向から所定温度の処理
液を供給するようにしたので、ウエハに衝撃を与えない
で処理液を供給出来、均一処理が出来る効果がある。
【図面の簡単な説明】
【図1】全体概略部分断面模式構造図である。
【図2】同、A部の拡大断面図である。
【図3】同、原位置状態の部分断面模式側面図である。
【図4】同、動作中途を示す部分断面模式側面図であ
る。
【図5】従来技術の液処理装置を示す部分断面模式図で
ある。
【符号の説明】
5 ウエハ 6 現像液 12 ウエハチャック 13 下シール 14 第一の容器 15 第二の容器 16 下バックアップリング 17 真空吸引接続口 18 上シール 10 上バックアップリング 20 真空吸引口 21 液吐出口(液給排機構) 22 温調水流路 23 傾斜面 24 排気口(排気手段) 25 洗浄液流入口 26 裏面洗浄ノズル 27 吸引排液口(液給排機構) 28 排液管 29 仕切板 30 モータ 31 固定部 32 主エアシリンダ 33 ロッド 34 昇降金具 35 副エアシリンダ 36 ロッド 37 収納容器 38 乾燥ノズル 39 昇降駆動機構
フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 G03F 7/30 502 7124−2H H01L 21/027 21/306 H01L 21/306 J

Claims (1)

    【特許請求の範囲】
  1. 【請求項1】被処理基板の下面周辺部と液密に接触して
    収納容器の底面部を成す第一の容器と、該被処理基板よ
    り大きな内径を有し、該第一の容器の上面周縁部と液密
    に接触して該収納容器の側壁部を成す第二の容器と、該
    第二の容器の内周部に設けられた複数の処理液吐出口
    と、該処理液吐出口から上記第一の容器と第二の容器か
    ら成る収納容器内に処理液を供給する処理液供給機構
    と、上記処理液吐出口から吐出される処理液の温度を制
    御する上記第二の容器に設けられた温度調整機構とを備
    え、上記収納容器内に所定の温度の処理液を被処理基板
    表面に衝撃を与えることなく供給するようにしたことを
    特徴とする浸漬式の液処理装置。
JP35543792A 1992-12-21 1992-12-21 浸漬式の液処理装置 Expired - Lifetime JP2520833B2 (ja)

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Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP30065286A Division JPS63152123A (en) 1986-12-17 1986-12-17 Semiconductor manufacturing device

Publications (2)

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JPH07132262A true JPH07132262A (ja) 1995-05-23
JP2520833B2 JP2520833B2 (ja) 1996-07-31

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