KR0166369B1 - 반도체 웨이퍼 시료 용기와 시료 작성법 - Google Patents

반도체 웨이퍼 시료 용기와 시료 작성법 Download PDF

Info

Publication number
KR0166369B1
KR0166369B1 KR1019910701304A KR910701304A KR0166369B1 KR 0166369 B1 KR0166369 B1 KR 0166369B1 KR 1019910701304 A KR1019910701304 A KR 1019910701304A KR 910701304 A KR910701304 A KR 910701304A KR 0166369 B1 KR0166369 B1 KR 0166369B1
Authority
KR
South Korea
Prior art keywords
wafer
container
sample
plate
cover
Prior art date
Application number
KR1019910701304A
Other languages
English (en)
Korean (ko)
Other versions
KR920702021A (ko
Inventor
히사시 무라오까
다께요시 가끼자끼
Original Assignee
히사시 무라오까
가부시끼가이샤 퓨렉스
다께요시 가끼자끼
가부시끼가이샤 가끼자끼세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히사시 무라오까, 가부시끼가이샤 퓨렉스, 다께요시 가끼자끼, 가부시끼가이샤 가끼자끼세이사꾸쇼 filed Critical 히사시 무라오까
Publication of KR920702021A publication Critical patent/KR920702021A/ko
Application granted granted Critical
Publication of KR0166369B1 publication Critical patent/KR0166369B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1019910701304A 1990-02-19 1991-02-19 반도체 웨이퍼 시료 용기와 시료 작성법 KR0166369B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP90-36029 1990-02-19
JP2036029A JP2978192B2 (ja) 1990-02-19 1990-02-19 半導体ウエハー試料作成法

Publications (2)

Publication Number Publication Date
KR920702021A KR920702021A (ko) 1992-08-12
KR0166369B1 true KR0166369B1 (ko) 1999-02-01

Family

ID=12458292

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701304A KR0166369B1 (ko) 1990-02-19 1991-02-19 반도체 웨이퍼 시료 용기와 시료 작성법

Country Status (5)

Country Link
US (1) US5284802A (US06373033-20020416-M00035.png)
JP (1) JP2978192B2 (US06373033-20020416-M00035.png)
KR (1) KR0166369B1 (US06373033-20020416-M00035.png)
DE (1) DE4190241T (US06373033-20020416-M00035.png)
WO (1) WO1991012631A1 (US06373033-20020416-M00035.png)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0169786B1 (ko) * 1995-12-21 1999-02-18 김광호 웨이퍼 표면 불순물의 전 처리 분석 장치
JP2882377B2 (ja) * 1996-08-23 1999-04-12 日本電気株式会社 金属の回収容器及び金属の回収方法
JPH10178077A (ja) * 1996-12-17 1998-06-30 Nec Corp 半導体基板の定量汚染試料の作製方法
US6474474B2 (en) * 1998-02-06 2002-11-05 Sumitomo Metal Industries, Ltd. Sheet support container
US6341695B1 (en) 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6177279B1 (en) * 1998-11-12 2001-01-23 Memc Electronic Materials, Inc. Ion extraction process for single side wafers
US6550619B2 (en) 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
EP3401946A1 (en) * 2003-06-13 2018-11-14 Nikon Corporation Exposure apparatus and device manufacturing method
TWI470371B (zh) 2003-12-03 2015-01-21 尼康股份有限公司 An exposure apparatus, an exposure method, an element manufacturing method, and an optical component
JP4644035B2 (ja) * 2005-05-25 2011-03-02 ミライアル株式会社 枚葉収納容器
JP4893156B2 (ja) * 2006-08-21 2012-03-07 栗田工業株式会社 水質評価方法及びそれに用いられる基板接触器具
JP5642377B2 (ja) * 2009-11-30 2014-12-17 株式会社住化分析センター 基板収納容器および当該容器を搬送するための搬送容器
TWI541928B (zh) * 2011-10-14 2016-07-11 晶元光電股份有限公司 晶圓載具
DE102021131131B4 (de) 2021-11-26 2023-08-10 Carl Zeiss Industrielle Messtechnik Gmbh Behälter-Box, Messgerät und Messverfahren

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022836U (ja) * 1983-07-23 1985-02-16 沖電気工業株式会社 試料ホルダ
JPS60106982U (ja) * 1983-12-27 1985-07-20 パイオニア株式会社 コンパクトデイスクケ−ス
AT381405B (de) * 1984-09-24 1986-10-10 Lift Verkaufsgeraete Gmbh Anordnung zur sicherung einer aufzeichnungsplatte, insbesondere cd-platte, gegen eine unbefugte entnahme
JPS6193073A (ja) * 1984-10-01 1986-05-12 キヤノン株式会社 薄板片収納用ケ−ス
JPS61144545A (ja) * 1984-12-18 1986-07-02 Toshiba Corp 薄膜薄板溶解装置
JPS61221649A (ja) * 1985-03-28 1986-10-02 Toshiba Corp 半導体薄膜の分解装置
JPS63158840A (ja) * 1986-12-23 1988-07-01 Toshiba Corp 半導体基板の薄膜分解方法及び装置
JPS63195540A (ja) * 1987-02-09 1988-08-12 Toshiba Corp 半導体薄膜の分解装置
JPH01104038U (US06373033-20020416-M00035.png) * 1987-12-25 1989-07-13
JPH01199882A (ja) * 1988-01-26 1989-08-11 Nec Home Electron Ltd ディスク収容装置

Also Published As

Publication number Publication date
KR920702021A (ko) 1992-08-12
DE4190241T (US06373033-20020416-M00035.png) 1992-03-12
WO1991012631A1 (en) 1991-08-22
US5284802A (en) 1994-02-08
JP2978192B2 (ja) 1999-11-15
JPH03240254A (ja) 1991-10-25

Similar Documents

Publication Publication Date Title
KR0166369B1 (ko) 반도체 웨이퍼 시료 용기와 시료 작성법
KR910006220B1 (ko) 불순물의 측정방법 및 측정장치
US6164133A (en) Method and apparatus for pre-processing of semiconductor substrate surface analysis
Alfassi Determination of trace elements
JP3179175B2 (ja) 分析前処理方法
EP0137409B1 (en) Resolution device for semiconductor thin films
US5994142A (en) Method for collecting a metallic contaminants from a wafer
US5428990A (en) Method of evaluation segregation of solid-liquid interface and segregation apparatus thereof
JP3414976B2 (ja) 不純物分析試料容器およびそれに用いられる試料収容部材
US5055413A (en) Method of measuring impurities in oxide films using a meltable sample collection stick
JP4204434B2 (ja) ウェーハ周辺部の被測定物を回収する方法および装置
JP3890047B2 (ja) 石英中の金属分析方法及び分析用治具
JPH02272359A (ja) ウェハ表面の不純物量の測定方法
JPH085526A (ja) 溶液試料サンプリング治具
US20070065944A1 (en) Stabilizing Griess reagent for explosives detection
JPH01189558A (ja) Ｓｉ半導体基板の表面分析方法
JPS6378057A (ja) 不純物分析法
JPS61144545A (ja) 薄膜薄板溶解装置
JPH0718241U (ja) 平板状試料の表面上極微量不純物の抽出器
JP2003152038A (ja) 半導体基板の分析方法及び分析装置
JPH06132376A (ja) ウエーハ分析器具
JP2003185543A (ja) 半導体ウエーハの不純物分析用治具及びそれを用いた半導体ウエーハの不純物分析方法
JP2002134576A (ja) 半導体基板の表面評価分析装置とそれに用いる冶具
JP3298089B2 (ja) 分析試料調製方法及び分析試料調製装置
JPS61251740A (ja) 半導体薄膜分解装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20060830

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee