KR920702021A - 반도체 웨이퍼 시료 용기와 시료 작성법 - Google Patents

반도체 웨이퍼 시료 용기와 시료 작성법

Info

Publication number
KR920702021A
KR920702021A KR1019910701304A KR910701304A KR920702021A KR 920702021 A KR920702021 A KR 920702021A KR 1019910701304 A KR1019910701304 A KR 1019910701304A KR 910701304 A KR910701304 A KR 910701304A KR 920702021 A KR920702021 A KR 920702021A
Authority
KR
South Korea
Prior art keywords
plate
sample
semiconductor wafer
cover
wafer
Prior art date
Application number
KR1019910701304A
Other languages
English (en)
Other versions
KR0166369B1 (ko
Inventor
히사시 무라오까
다께요시 가끼자끼
Original Assignee
히사시 무라오까
가부시기가이샤 퓨렉스
다께요시 가끼자끼
가부시끼가이샤 가끼자끼세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히사시 무라오까, 가부시기가이샤 퓨렉스, 다께요시 가끼자끼, 가부시끼가이샤 가끼자끼세이사꾸쇼 filed Critical 히사시 무라오까
Publication of KR920702021A publication Critical patent/KR920702021A/ko
Application granted granted Critical
Publication of KR0166369B1 publication Critical patent/KR0166369B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

내용 없음

Description

반도체 웨이퍼 시료 용기와 시료 작성법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 반도체 웨이퍼의 표면 오염 평가용 용기의 반면 절단 정면도이다. 제2도는 제1도의 용기의중앙 종 단면도이다.

Claims (2)

  1. 반도체 웨이퍼 시료 용기에 있어서, 합성수지로 형성되고 시료 웨이퍼(10)를 수납하는 수납 플레이트형 부재(3)와; 상기 합성 수지로 형성되고 상기 플레이트형 부재(3)위에 장착되며, 그의 내면에 경사면(4)을 갖는 커버(5)와; 상기 웨이퍼(10)의 주위가 경사지게 상부로 연장하고, 주변과 서로 간격이 져 있는 3이상의 설상부(toguelike portions)(2)로 구성되어 있으며; 상기 커버(5)를 큰힘으로 플레이트형 부재(3)에 대향해서 눌렸을때, 상기 커버(5)의 경사면(4)에 의해서 설상부(2)가 웨이퍼(10)의 지지방향으로 구부러져, 상기 커버(5)가 플레이트형 부재(3)와 기밀성 결합을 유지하는 것을 특징으로 하는 반도체 웨이퍼 시료 용기.
  2. 반도체 웨이퍼 시료 작성법에 있어서, 반도체 웨이퍼 수납 용기를 형성하기 위하여 합성 수지로 형성된 수납 플레이트형 부재(3)와 상기 플레이트형 부재 위에 장착된 커버(5)를 조립하고; 상기 플레이트형 부재(3)의 내부에 시료 웨이퍼(10)을 수납하고; 상기 플레이트형 부재(3)와 상기 커버(5)를 기밀하게 결합시키고; 상기 시료 웨이퍼(10)의 표면의 막이나 거기에 부착된 불순물을 용해 시키기 위하여 상기 용기 내에 미량의 휘발성 산을 도입하는 단계로 이루어진 반도체 웨이퍼 시료 작성법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910701304A 1990-02-19 1991-02-19 반도체 웨이퍼 시료 용기와 시료 작성법 KR0166369B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP90-36029 1990-02-19
JP2036029A JP2978192B2 (ja) 1990-02-19 1990-02-19 半導体ウエハー試料作成法

Publications (2)

Publication Number Publication Date
KR920702021A true KR920702021A (ko) 1992-08-12
KR0166369B1 KR0166369B1 (ko) 1999-02-01

Family

ID=12458292

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910701304A KR0166369B1 (ko) 1990-02-19 1991-02-19 반도체 웨이퍼 시료 용기와 시료 작성법

Country Status (5)

Country Link
US (1) US5284802A (ko)
JP (1) JP2978192B2 (ko)
KR (1) KR0166369B1 (ko)
DE (1) DE4190241T (ko)
WO (1) WO1991012631A1 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0169786B1 (ko) * 1995-12-21 1999-02-18 김광호 웨이퍼 표면 불순물의 전 처리 분석 장치
JP2882377B2 (ja) * 1996-08-23 1999-04-12 日本電気株式会社 金属の回収容器及び金属の回収方法
JPH10178077A (ja) * 1996-12-17 1998-06-30 Nec Corp 半導体基板の定量汚染試料の作製方法
US6474474B2 (en) * 1998-02-06 2002-11-05 Sumitomo Metal Industries, Ltd. Sheet support container
US6193068B1 (en) * 1998-05-07 2001-02-27 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6341695B1 (en) * 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6177279B1 (en) * 1998-11-12 2001-01-23 Memc Electronic Materials, Inc. Ion extraction process for single side wafers
US6550619B2 (en) 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
KR101729866B1 (ko) * 2003-06-13 2017-04-24 가부시키가이샤 니콘 노광 방법, 기판 스테이지, 노광 장치, 및 디바이스 제조 방법
TWI530762B (zh) 2003-12-03 2016-04-21 尼康股份有限公司 Exposure apparatus, exposure method, and device manufacturing method
JP4644035B2 (ja) * 2005-05-25 2011-03-02 ミライアル株式会社 枚葉収納容器
JP4893156B2 (ja) * 2006-08-21 2012-03-07 栗田工業株式会社 水質評価方法及びそれに用いられる基板接触器具
JP5642377B2 (ja) * 2009-11-30 2014-12-17 株式会社住化分析センター 基板収納容器および当該容器を搬送するための搬送容器
TWI541928B (zh) * 2011-10-14 2016-07-11 晶元光電股份有限公司 晶圓載具
DE102021131131B4 (de) 2021-11-26 2023-08-10 Carl Zeiss Industrielle Messtechnik Gmbh Behälter-Box, Messgerät und Messverfahren

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022836U (ja) * 1983-07-23 1985-02-16 沖電気工業株式会社 試料ホルダ
JPS60106982U (ja) * 1983-12-27 1985-07-20 パイオニア株式会社 コンパクトデイスクケ−ス
AT381405B (de) * 1984-09-24 1986-10-10 Lift Verkaufsgeraete Gmbh Anordnung zur sicherung einer aufzeichnungsplatte, insbesondere cd-platte, gegen eine unbefugte entnahme
JPS6193073A (ja) * 1984-10-01 1986-05-12 キヤノン株式会社 薄板片収納用ケ−ス
JPS61144545A (ja) * 1984-12-18 1986-07-02 Toshiba Corp 薄膜薄板溶解装置
JPS61221649A (ja) * 1985-03-28 1986-10-02 Toshiba Corp 半導体薄膜の分解装置
JPS63158840A (ja) * 1986-12-23 1988-07-01 Toshiba Corp 半導体基板の薄膜分解方法及び装置
JPS63195540A (ja) * 1987-02-09 1988-08-12 Toshiba Corp 半導体薄膜の分解装置
JPH01104038U (ko) * 1987-12-25 1989-07-13
JPH01199882A (ja) * 1988-01-26 1989-08-11 Nec Home Electron Ltd ディスク収容装置

Also Published As

Publication number Publication date
US5284802A (en) 1994-02-08
JPH03240254A (ja) 1991-10-25
KR0166369B1 (ko) 1999-02-01
JP2978192B2 (ja) 1999-11-15
DE4190241T (ko) 1992-03-12
WO1991012631A1 (en) 1991-08-22

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