KR0144290B1 - 마이크로전자칩에의 접착제의 사용방법 및 이 방법에 의한 반도체집적회로칩 및 캡슐화 반도체모듈 - Google Patents

마이크로전자칩에의 접착제의 사용방법 및 이 방법에 의한 반도체집적회로칩 및 캡슐화 반도체모듈

Info

Publication number
KR0144290B1
KR0144290B1 KR1019940021784A KR19940021784A KR0144290B1 KR 0144290 B1 KR0144290 B1 KR 0144290B1 KR 1019940021784 A KR1019940021784 A KR 1019940021784A KR 19940021784 A KR19940021784 A KR 19940021784A KR 0144290 B1 KR0144290 B1 KR 0144290B1
Authority
KR
South Korea
Prior art keywords
chip
adhesive
integrated circuit
wafer
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019940021784A
Other languages
English (en)
Korean (ko)
Other versions
KR950009894A (ko
Inventor
조재
Original Assignee
데이비드 엘. 해밀톤
내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데이비드 엘. 해밀톤, 내쇼날 스타치 앤드 케미칼 인베스트멘트 홀딩 코포레이션 filed Critical 데이비드 엘. 해밀톤
Publication of KR950009894A publication Critical patent/KR950009894A/ko
Application granted granted Critical
Publication of KR0144290B1 publication Critical patent/KR0144290B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10P95/00—
    • H10W70/415—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1019940021784A 1993-09-28 1994-08-31 마이크로전자칩에의 접착제의 사용방법 및 이 방법에 의한 반도체집적회로칩 및 캡슐화 반도체모듈 Expired - Fee Related KR0144290B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12753893A 1993-09-28 1993-09-28
US8/127,538 1993-09-28
US08/127,538 1993-09-28

Publications (2)

Publication Number Publication Date
KR950009894A KR950009894A (ko) 1995-04-26
KR0144290B1 true KR0144290B1 (ko) 1998-08-17

Family

ID=22430635

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940021784A Expired - Fee Related KR0144290B1 (ko) 1993-09-28 1994-08-31 마이크로전자칩에의 접착제의 사용방법 및 이 방법에 의한 반도체집적회로칩 및 캡슐화 반도체모듈

Country Status (5)

Country Link
EP (1) EP0645813A3 (enExample)
JP (1) JP2551737B2 (enExample)
KR (1) KR0144290B1 (enExample)
CN (1) CN1108810A (enExample)
TW (1) TW263611B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1101597C (zh) * 1996-11-08 2003-02-12 三星电子株式会社 片上引线式半导体芯片封装及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
JPH02146758A (ja) * 1988-11-28 1990-06-05 Nec Corp 樹脂封止型半導体装置
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5112942A (en) * 1990-09-26 1992-05-12 Ethyl Corporation Polymide compositions
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
JPH05129469A (ja) * 1991-10-31 1993-05-25 Nec Corp 樹脂封止型半導体装置
US5286679A (en) * 1993-03-18 1994-02-15 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer

Also Published As

Publication number Publication date
JPH07153790A (ja) 1995-06-16
EP0645813A2 (en) 1995-03-29
TW263611B (enExample) 1995-11-21
JP2551737B2 (ja) 1996-11-06
CN1108810A (zh) 1995-09-20
EP0645813A3 (en) 1996-03-13
KR950009894A (ko) 1995-04-26

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