TW263611B - - Google Patents
Info
- Publication number
- TW263611B TW263611B TW083108975A TW83108975A TW263611B TW 263611 B TW263611 B TW 263611B TW 083108975 A TW083108975 A TW 083108975A TW 83108975 A TW83108975 A TW 83108975A TW 263611 B TW263611 B TW 263611B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/411—Chip-supporting parts, e.g. die pads
- H10W70/415—Leadframe inner leads serving as die pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12753893A | 1993-09-28 | 1993-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW263611B true TW263611B (enExample) | 1995-11-21 |
Family
ID=22430635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083108975A TW263611B (enExample) | 1993-09-28 | 1994-09-27 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0645813A3 (enExample) |
| JP (1) | JP2551737B2 (enExample) |
| KR (1) | KR0144290B1 (enExample) |
| CN (1) | CN1108810A (enExample) |
| TW (1) | TW263611B (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1101597C (zh) * | 1996-11-08 | 2003-02-12 | 三星电子株式会社 | 片上引线式半导体芯片封装及其制作方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0158868B1 (ko) * | 1988-09-20 | 1998-12-01 | 미다 가쓰시게 | 반도체장치 |
| JPH02146758A (ja) * | 1988-11-28 | 1990-06-05 | Nec Corp | 樹脂封止型半導体装置 |
| US5242713A (en) * | 1988-12-23 | 1993-09-07 | International Business Machines Corporation | Method for conditioning an organic polymeric material |
| US5112942A (en) * | 1990-09-26 | 1992-05-12 | Ethyl Corporation | Polymide compositions |
| US5448450A (en) * | 1991-08-15 | 1995-09-05 | Staktek Corporation | Lead-on-chip integrated circuit apparatus |
| JPH05129469A (ja) * | 1991-10-31 | 1993-05-25 | Nec Corp | 樹脂封止型半導体装置 |
| US5286679A (en) * | 1993-03-18 | 1994-02-15 | Micron Technology, Inc. | Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer |
-
1994
- 1994-08-31 KR KR1019940021784A patent/KR0144290B1/ko not_active Expired - Fee Related
- 1994-09-01 EP EP94113711A patent/EP0645813A3/en not_active Withdrawn
- 1994-09-19 JP JP6223159A patent/JP2551737B2/ja not_active Expired - Fee Related
- 1994-09-27 TW TW083108975A patent/TW263611B/zh active
- 1994-09-28 CN CN94116464A patent/CN1108810A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR950009894A (ko) | 1995-04-26 |
| EP0645813A3 (en) | 1996-03-13 |
| KR0144290B1 (ko) | 1998-08-17 |
| EP0645813A2 (en) | 1995-03-29 |
| JP2551737B2 (ja) | 1996-11-06 |
| CN1108810A (zh) | 1995-09-20 |
| JPH07153790A (ja) | 1995-06-16 |