CN1108810A - 一种敷施粘合剂于微电子芯片的方法 - Google Patents

一种敷施粘合剂于微电子芯片的方法 Download PDF

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Publication number
CN1108810A
CN1108810A CN94116464A CN94116464A CN1108810A CN 1108810 A CN1108810 A CN 1108810A CN 94116464 A CN94116464 A CN 94116464A CN 94116464 A CN94116464 A CN 94116464A CN 1108810 A CN1108810 A CN 1108810A
Authority
CN
China
Prior art keywords
adhesive
chip
integrated circuit
semiconductor integrated
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN94116464A
Other languages
English (en)
Chinese (zh)
Inventor
J·赵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Starch and Chemical Investment Holding Corp
Original Assignee
National Starch and Chemical Investment Holding Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Starch and Chemical Investment Holding Corp filed Critical National Starch and Chemical Investment Holding Corp
Publication of CN1108810A publication Critical patent/CN1108810A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN94116464A 1993-09-28 1994-09-28 一种敷施粘合剂于微电子芯片的方法 Pending CN1108810A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12753893A 1993-09-28 1993-09-28
US127,538 1993-09-28

Publications (1)

Publication Number Publication Date
CN1108810A true CN1108810A (zh) 1995-09-20

Family

ID=22430635

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94116464A Pending CN1108810A (zh) 1993-09-28 1994-09-28 一种敷施粘合剂于微电子芯片的方法

Country Status (5)

Country Link
EP (1) EP0645813A3 (enExample)
JP (1) JP2551737B2 (enExample)
KR (1) KR0144290B1 (enExample)
CN (1) CN1108810A (enExample)
TW (1) TW263611B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1101597C (zh) * 1996-11-08 2003-02-12 三星电子株式会社 片上引线式半导体芯片封装及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
JPH02146758A (ja) * 1988-11-28 1990-06-05 Nec Corp 樹脂封止型半導体装置
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5112942A (en) * 1990-09-26 1992-05-12 Ethyl Corporation Polymide compositions
US5448450A (en) * 1991-08-15 1995-09-05 Staktek Corporation Lead-on-chip integrated circuit apparatus
JPH05129469A (ja) * 1991-10-31 1993-05-25 Nec Corp 樹脂封止型半導体装置
US5286679A (en) * 1993-03-18 1994-02-15 Micron Technology, Inc. Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1101597C (zh) * 1996-11-08 2003-02-12 三星电子株式会社 片上引线式半导体芯片封装及其制作方法

Also Published As

Publication number Publication date
JPH07153790A (ja) 1995-06-16
KR950009894A (ko) 1995-04-26
EP0645813A2 (en) 1995-03-29
EP0645813A3 (en) 1996-03-13
TW263611B (enExample) 1995-11-21
KR0144290B1 (ko) 1998-08-17
JP2551737B2 (ja) 1996-11-06

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Legal Events

Date Code Title Description
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C06 Publication
PB01 Publication
C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication