JPWO2024241516A5 - - Google Patents

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Publication number
JPWO2024241516A5
JPWO2024241516A5 JP2024508967A JP2024508967A JPWO2024241516A5 JP WO2024241516 A5 JPWO2024241516 A5 JP WO2024241516A5 JP 2024508967 A JP2024508967 A JP 2024508967A JP 2024508967 A JP2024508967 A JP 2024508967A JP WO2024241516 A5 JPWO2024241516 A5 JP WO2024241516A5
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JP
Japan
Prior art keywords
flow path
mounting surface
wafer
aspect ratio
cross
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Application number
JP2024508967A
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English (en)
Japanese (ja)
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JP7675281B2 (ja
JPWO2024241516A1 (https=
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Priority claimed from PCT/JP2023/019273 external-priority patent/WO2024241516A1/ja
Publication of JPWO2024241516A1 publication Critical patent/JPWO2024241516A1/ja
Publication of JPWO2024241516A5 publication Critical patent/JPWO2024241516A5/ja
Application granted granted Critical
Publication of JP7675281B2 publication Critical patent/JP7675281B2/ja
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JP2024508967A 2023-05-24 2023-05-24 ウエハ載置台 Active JP7675281B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/019273 WO2024241516A1 (ja) 2023-05-24 2023-05-24 ウエハ載置台

Publications (3)

Publication Number Publication Date
JPWO2024241516A1 JPWO2024241516A1 (https=) 2024-11-28
JPWO2024241516A5 true JPWO2024241516A5 (https=) 2025-04-30
JP7675281B2 JP7675281B2 (ja) 2025-05-12

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ID=93565239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024508967A Active JP7675281B2 (ja) 2023-05-24 2023-05-24 ウエハ載置台

Country Status (6)

Country Link
US (1) US20240395511A1 (https=)
JP (1) JP7675281B2 (https=)
KR (1) KR20240170521A (https=)
CN (1) CN121175793A (https=)
TW (1) TW202447830A (https=)
WO (1) WO2024241516A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025176267A (ja) * 2024-05-21 2025-12-04 Toto株式会社 静電チャック

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6740853B1 (en) * 1999-09-29 2004-05-25 Tokyo Electron Limited Multi-zone resistance heater
JP5210706B2 (ja) * 2008-05-09 2013-06-12 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理方法
JP6175437B2 (ja) * 2012-07-27 2017-08-02 京セラ株式会社 流路部材およびこれを用いた熱交換器ならびに半導体製造装置
JP5936165B2 (ja) * 2014-11-07 2016-06-15 Toto株式会社 静電チャックおよびウェーハ処理装置
WO2016197083A1 (en) * 2015-06-05 2016-12-08 Watlow Electric Manufacturing Company High thermal conductivity wafer support pedestal device
KR20170055822A (ko) * 2015-11-12 2017-05-22 세메스 주식회사 지지 유닛 및 이를 포함하는 기판 처리 장치
KR20210128002A (ko) * 2019-03-08 2021-10-25 램 리써치 코포레이션 플라즈마 프로세싱 챔버를 위한 척
JP6839314B2 (ja) * 2019-03-19 2021-03-03 日本碍子株式会社 ウエハ載置装置及びその製法
JP7365815B2 (ja) 2019-08-09 2023-10-20 東京エレクトロン株式会社 載置台及び基板処理装置
JP7688551B2 (ja) * 2021-09-20 2025-06-04 日本特殊陶業株式会社 保持部材及びその製造方法
JP7496343B2 (ja) * 2021-11-08 2024-06-06 日本碍子株式会社 ウエハ載置台
JP7620593B2 (ja) * 2022-04-26 2025-01-23 日本碍子株式会社 ウエハ載置台
US20240408712A1 (en) * 2023-06-06 2024-12-12 Applied Materials, Inc. Ceramic cooling base

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