JPWO2024241516A1 - - Google Patents
Info
- Publication number
- JPWO2024241516A1 JPWO2024241516A1 JP2024508967A JP2024508967A JPWO2024241516A1 JP WO2024241516 A1 JPWO2024241516 A1 JP WO2024241516A1 JP 2024508967 A JP2024508967 A JP 2024508967A JP 2024508967 A JP2024508967 A JP 2024508967A JP WO2024241516 A1 JPWO2024241516 A1 JP WO2024241516A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0432—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/019273 WO2024241516A1 (ja) | 2023-05-24 | 2023-05-24 | ウエハ載置台 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024241516A1 true JPWO2024241516A1 (https=) | 2024-11-28 |
| JPWO2024241516A5 JPWO2024241516A5 (https=) | 2025-04-30 |
| JP7675281B2 JP7675281B2 (ja) | 2025-05-12 |
Family
ID=93565239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024508967A Active JP7675281B2 (ja) | 2023-05-24 | 2023-05-24 | ウエハ載置台 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240395511A1 (https=) |
| JP (1) | JP7675281B2 (https=) |
| KR (1) | KR20240170521A (https=) |
| CN (1) | CN121175793A (https=) |
| TW (1) | TW202447830A (https=) |
| WO (1) | WO2024241516A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025176267A (ja) * | 2024-05-21 | 2025-12-04 | Toto株式会社 | 静電チャック |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272535A (ja) * | 2008-05-09 | 2009-11-19 | Hitachi High-Technologies Corp | プラズマ処理装置及びプラズマ処理方法 |
| WO2014017661A1 (ja) * | 2012-07-27 | 2014-01-30 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
| JP2016096336A (ja) * | 2014-11-07 | 2016-05-26 | Toto株式会社 | 静電チャックおよびウェーハ処理装置 |
| KR20170055822A (ko) * | 2015-11-12 | 2017-05-22 | 세메스 주식회사 | 지지 유닛 및 이를 포함하는 기판 처리 장치 |
| JP2022525028A (ja) * | 2019-03-08 | 2022-05-11 | ラム リサーチ コーポレーション | プラズマ処理チャンバ用のチャック |
| JP2023044704A (ja) * | 2021-09-20 | 2023-03-31 | 日本特殊陶業株式会社 | 保持部材及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6740853B1 (en) * | 1999-09-29 | 2004-05-25 | Tokyo Electron Limited | Multi-zone resistance heater |
| WO2016197083A1 (en) * | 2015-06-05 | 2016-12-08 | Watlow Electric Manufacturing Company | High thermal conductivity wafer support pedestal device |
| JP6839314B2 (ja) * | 2019-03-19 | 2021-03-03 | 日本碍子株式会社 | ウエハ載置装置及びその製法 |
| JP7365815B2 (ja) | 2019-08-09 | 2023-10-20 | 東京エレクトロン株式会社 | 載置台及び基板処理装置 |
| JP7496343B2 (ja) * | 2021-11-08 | 2024-06-06 | 日本碍子株式会社 | ウエハ載置台 |
| JP7620593B2 (ja) * | 2022-04-26 | 2025-01-23 | 日本碍子株式会社 | ウエハ載置台 |
| US20240408712A1 (en) * | 2023-06-06 | 2024-12-12 | Applied Materials, Inc. | Ceramic cooling base |
-
2023
- 2023-05-24 WO PCT/JP2023/019273 patent/WO2024241516A1/ja not_active Ceased
- 2023-05-24 JP JP2024508967A patent/JP7675281B2/ja active Active
- 2023-05-24 KR KR1020247005381A patent/KR20240170521A/ko not_active Ceased
- 2023-05-24 CN CN202380012895.8A patent/CN121175793A/zh active Pending
-
2024
- 2024-02-14 US US18/441,111 patent/US20240395511A1/en active Pending
- 2024-04-16 TW TW113114104A patent/TW202447830A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272535A (ja) * | 2008-05-09 | 2009-11-19 | Hitachi High-Technologies Corp | プラズマ処理装置及びプラズマ処理方法 |
| WO2014017661A1 (ja) * | 2012-07-27 | 2014-01-30 | 京セラ株式会社 | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 |
| JP2016096336A (ja) * | 2014-11-07 | 2016-05-26 | Toto株式会社 | 静電チャックおよびウェーハ処理装置 |
| KR20170055822A (ko) * | 2015-11-12 | 2017-05-22 | 세메스 주식회사 | 지지 유닛 및 이를 포함하는 기판 처리 장치 |
| JP2022525028A (ja) * | 2019-03-08 | 2022-05-11 | ラム リサーチ コーポレーション | プラズマ処理チャンバ用のチャック |
| JP2023044704A (ja) * | 2021-09-20 | 2023-03-31 | 日本特殊陶業株式会社 | 保持部材及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202447830A (zh) | 2024-12-01 |
| JP7675281B2 (ja) | 2025-05-12 |
| CN121175793A (zh) | 2025-12-19 |
| KR20240170521A (ko) | 2024-12-03 |
| US20240395511A1 (en) | 2024-11-28 |
| WO2024241516A1 (ja) | 2024-11-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240214 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240214 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250422 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250425 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7675281 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |