JPWO2024157943A5 - - Google Patents
Info
- Publication number
- JPWO2024157943A5 JPWO2024157943A5 JP2024573050A JP2024573050A JPWO2024157943A5 JP WO2024157943 A5 JPWO2024157943 A5 JP WO2024157943A5 JP 2024573050 A JP2024573050 A JP 2024573050A JP 2024573050 A JP2024573050 A JP 2024573050A JP WO2024157943 A5 JPWO2024157943 A5 JP WO2024157943A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- substrate
- processing method
- region
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202363441559P | 2023-01-27 | 2023-01-27 | |
| US63/441,559 | 2023-01-27 | ||
| JP2023126394 | 2023-08-02 | ||
| JP2023126394 | 2023-08-02 | ||
| PCT/JP2024/001705 WO2024157943A1 (ja) | 2023-01-27 | 2024-01-22 | 基板処理方法及び基板処理システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024157943A1 JPWO2024157943A1 (https=) | 2024-08-02 |
| JPWO2024157943A5 true JPWO2024157943A5 (https=) | 2025-07-25 |
| JP7813388B2 JP7813388B2 (ja) | 2026-02-12 |
Family
ID=91970573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024573050A Active JP7813388B2 (ja) | 2023-01-27 | 2024-01-22 | 基板処理方法及び基板処理システム |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250349519A1 (https=) |
| EP (1) | EP4651182A1 (https=) |
| JP (1) | JP7813388B2 (https=) |
| KR (1) | KR20250140553A (https=) |
| CN (1) | CN120530478A (https=) |
| TW (1) | TW202503884A (https=) |
| WO (1) | WO2024157943A1 (https=) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547718A (ja) * | 1991-08-15 | 1993-02-26 | Sony Corp | ドライエツチング方法 |
| JP2008060171A (ja) * | 2006-08-29 | 2008-03-13 | Taiyo Nippon Sanso Corp | 半導体処理装置のクリーニング方法 |
| JP5968130B2 (ja) * | 2012-07-10 | 2016-08-10 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| JP6604738B2 (ja) * | 2015-04-10 | 2019-11-13 | 東京エレクトロン株式会社 | プラズマエッチング方法、パターン形成方法及びクリーニング方法 |
| US10283369B2 (en) * | 2016-08-10 | 2019-05-07 | Tokyo Electron Limited | Atomic layer etching using a boron-containing gas and hydrogen fluoride gas |
| US10546748B2 (en) * | 2017-02-17 | 2020-01-28 | Lam Research Corporation | Tin oxide films in semiconductor device manufacturing |
| US11355353B2 (en) * | 2018-01-30 | 2022-06-07 | Lam Research Corporation | Tin oxide mandrels in patterning |
| KR20200144580A (ko) | 2018-05-11 | 2020-12-29 | 램 리써치 코포레이션 | Euv 패터닝 가능한 하드 마스크들을 제조하기 위한 방법들 |
| TWI837391B (zh) * | 2019-06-26 | 2024-04-01 | 美商蘭姆研究公司 | 利用鹵化物化學品的光阻顯影 |
| KR102748920B1 (ko) * | 2019-06-27 | 2024-12-30 | 램 리써치 코포레이션 | 교번하는 에칭 및 패시베이션 프로세스 |
| TW202536930A (zh) * | 2019-06-28 | 2025-09-16 | 美商蘭姆研究公司 | 光阻膜的乾式腔室清潔 |
| EP4078292A4 (en) * | 2020-07-07 | 2023-11-22 | Lam Research Corporation | Integrated dry processes for patterning radiation photoresist patterning |
| CN116134381A (zh) * | 2020-07-17 | 2023-05-16 | 朗姆研究公司 | 含钽光致抗蚀剂 |
-
2024
- 2024-01-22 CN CN202480007859.7A patent/CN120530478A/zh active Pending
- 2024-01-22 JP JP2024573050A patent/JP7813388B2/ja active Active
- 2024-01-22 EP EP24747270.7A patent/EP4651182A1/en active Pending
- 2024-01-22 WO PCT/JP2024/001705 patent/WO2024157943A1/ja not_active Ceased
- 2024-01-22 KR KR1020257027514A patent/KR20250140553A/ko active Pending
- 2024-01-25 TW TW113102926A patent/TW202503884A/zh unknown
-
2025
- 2025-07-23 US US19/277,446 patent/US20250349519A1/en active Pending
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