JPWO2024157366A5 - - Google Patents

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Publication number
JPWO2024157366A5
JPWO2024157366A5 JP2023505858A JP2023505858A JPWO2024157366A5 JP WO2024157366 A5 JPWO2024157366 A5 JP WO2024157366A5 JP 2023505858 A JP2023505858 A JP 2023505858A JP 2023505858 A JP2023505858 A JP 2023505858A JP WO2024157366 A5 JPWO2024157366 A5 JP WO2024157366A5
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JP
Japan
Prior art keywords
joint
joined
mass
workpiece
solder alloy
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Granted
Application number
JP2023505858A
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English (en)
Japanese (ja)
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JPWO2024157366A1 (https=
JP7262695B1 (ja
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Priority claimed from PCT/JP2023/002160 external-priority patent/WO2024157366A1/ja
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Publication of JP7262695B1 publication Critical patent/JP7262695B1/ja
Publication of JPWO2024157366A1 publication Critical patent/JPWO2024157366A1/ja
Publication of JPWO2024157366A5 publication Critical patent/JPWO2024157366A5/ja
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JP2023505858A 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 Active JP7262695B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002160 WO2024157366A1 (ja) 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

Publications (3)

Publication Number Publication Date
JP7262695B1 JP7262695B1 (ja) 2023-04-21
JPWO2024157366A1 JPWO2024157366A1 (https=) 2024-08-02
JPWO2024157366A5 true JPWO2024157366A5 (https=) 2024-12-24

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ID=86052921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023505858A Active JP7262695B1 (ja) 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

Country Status (7)

Country Link
US (1) US20250018509A1 (https=)
EP (1) EP4656751A1 (https=)
JP (1) JP7262695B1 (https=)
KR (1) KR20250138086A (https=)
CN (1) CN118748957A (https=)
TW (1) TW202440956A (https=)
WO (1) WO2024157366A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Ｓｎ−Ａｇ−Ｂｉ系はんだ
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
CN106216872B (zh) 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
JP6477965B1 (ja) * 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
TWI819210B (zh) 2019-04-11 2023-10-21 日商日本斯倍利亞股份有限公司 無鉛焊錫合金及焊錫接合部

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