JP7262695B1 - はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 - Google Patents

はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 Download PDF

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Publication number
JP7262695B1
JP7262695B1 JP2023505858A JP2023505858A JP7262695B1 JP 7262695 B1 JP7262695 B1 JP 7262695B1 JP 2023505858 A JP2023505858 A JP 2023505858A JP 2023505858 A JP2023505858 A JP 2023505858A JP 7262695 B1 JP7262695 B1 JP 7262695B1
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Japan
Prior art keywords
joined
joint
mass
solder alloy
solder
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JP2023505858A
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Japanese (ja)
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JPWO2024157366A1 (https=
JPWO2024157366A5 (https=
Inventor
貴則 嶋崎
智紀 浅野
正也 新井
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Tamura Corp
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Tamura Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams or slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264Bi as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C12/00Alloys based on antimony or bismuth
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2023505858A 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 Active JP7262695B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002160 WO2024157366A1 (ja) 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

Publications (3)

Publication Number Publication Date
JP7262695B1 true JP7262695B1 (ja) 2023-04-21
JPWO2024157366A1 JPWO2024157366A1 (https=) 2024-08-02
JPWO2024157366A5 JPWO2024157366A5 (https=) 2024-12-24

Family

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JP2023505858A Active JP7262695B1 (ja) 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

Country Status (7)

Country Link
US (1) US20250018509A1 (https=)
EP (1) EP4656751A1 (https=)
JP (1) JP7262695B1 (https=)
KR (1) KR20250138086A (https=)
CN (1) CN118748957A (https=)
TW (1) TW202440956A (https=)
WO (1) WO2024157366A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Sn−Ag−Bi系はんだ
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
JP2017051984A (ja) * 2015-09-10 2017-03-16 株式会社弘輝 はんだ合金及びはんだ組成物
WO2019171978A1 (ja) * 2018-03-08 2019-09-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
WO2020209384A1 (ja) * 2019-04-11 2020-10-15 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106216872B (zh) 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Sn−Ag−Bi系はんだ
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
JP2017051984A (ja) * 2015-09-10 2017-03-16 株式会社弘輝 はんだ合金及びはんだ組成物
WO2019171978A1 (ja) * 2018-03-08 2019-09-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
WO2020209384A1 (ja) * 2019-04-11 2020-10-15 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部

Also Published As

Publication number Publication date
JPWO2024157366A1 (https=) 2024-08-02
CN118748957A (zh) 2024-10-08
TW202440956A (zh) 2024-10-16
US20250018509A1 (en) 2025-01-16
EP4656751A1 (en) 2025-12-03
KR20250138086A (ko) 2025-09-19
WO2024157366A1 (ja) 2024-08-02

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