JP7262695B1 - はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 - Google Patents
はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 Download PDFInfo
- Publication number
- JP7262695B1 JP7262695B1 JP2023505858A JP2023505858A JP7262695B1 JP 7262695 B1 JP7262695 B1 JP 7262695B1 JP 2023505858 A JP2023505858 A JP 2023505858A JP 2023505858 A JP2023505858 A JP 2023505858A JP 7262695 B1 JP7262695 B1 JP 7262695B1
- Authority
- JP
- Japan
- Prior art keywords
- joined
- joint
- mass
- solder alloy
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams or slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/002160 WO2024157366A1 (ja) | 2023-01-24 | 2023-01-24 | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7262695B1 true JP7262695B1 (ja) | 2023-04-21 |
| JPWO2024157366A1 JPWO2024157366A1 (https=) | 2024-08-02 |
| JPWO2024157366A5 JPWO2024157366A5 (https=) | 2024-12-24 |
Family
ID=86052921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023505858A Active JP7262695B1 (ja) | 2023-01-24 | 2023-01-24 | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250018509A1 (https=) |
| EP (1) | EP4656751A1 (https=) |
| JP (1) | JP7262695B1 (https=) |
| KR (1) | KR20250138086A (https=) |
| CN (1) | CN118748957A (https=) |
| TW (1) | TW202440956A (https=) |
| WO (1) | WO2024157366A1 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001334386A (ja) * | 2000-05-19 | 2001-12-04 | Hitachi Ltd | 電子機器用Sn−Ag−Bi系はんだ |
| CN102029479A (zh) * | 2010-12-29 | 2011-04-27 | 广州有色金属研究院 | 一种低银无铅焊料合金及其制备方法和装置 |
| JP2017051984A (ja) * | 2015-09-10 | 2017-03-16 | 株式会社弘輝 | はんだ合金及びはんだ組成物 |
| WO2019171978A1 (ja) * | 2018-03-08 | 2019-09-12 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
| WO2020209384A1 (ja) * | 2019-04-11 | 2020-10-15 | 株式会社日本スペリア社 | 鉛フリーはんだ合金及びはんだ接合部 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106216872B (zh) | 2016-08-11 | 2019-03-12 | 北京康普锡威科技有限公司 | 一种SnBiSb系低温无铅焊料及其制备方法 |
-
2023
- 2023-01-24 EP EP23918333.8A patent/EP4656751A1/en active Pending
- 2023-01-24 CN CN202380016098.7A patent/CN118748957A/zh active Pending
- 2023-01-24 KR KR1020247022701A patent/KR20250138086A/ko active Pending
- 2023-01-24 WO PCT/JP2023/002160 patent/WO2024157366A1/ja not_active Ceased
- 2023-01-24 JP JP2023505858A patent/JP7262695B1/ja active Active
- 2023-12-14 TW TW112148704A patent/TW202440956A/zh unknown
-
2024
- 2024-09-25 US US18/895,385 patent/US20250018509A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001334386A (ja) * | 2000-05-19 | 2001-12-04 | Hitachi Ltd | 電子機器用Sn−Ag−Bi系はんだ |
| CN102029479A (zh) * | 2010-12-29 | 2011-04-27 | 广州有色金属研究院 | 一种低银无铅焊料合金及其制备方法和装置 |
| JP2017051984A (ja) * | 2015-09-10 | 2017-03-16 | 株式会社弘輝 | はんだ合金及びはんだ組成物 |
| WO2019171978A1 (ja) * | 2018-03-08 | 2019-09-12 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
| WO2020209384A1 (ja) * | 2019-04-11 | 2020-10-15 | 株式会社日本スペリア社 | 鉛フリーはんだ合金及びはんだ接合部 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024157366A1 (https=) | 2024-08-02 |
| CN118748957A (zh) | 2024-10-08 |
| TW202440956A (zh) | 2024-10-16 |
| US20250018509A1 (en) | 2025-01-16 |
| EP4656751A1 (en) | 2025-12-03 |
| KR20250138086A (ko) | 2025-09-19 |
| WO2024157366A1 (ja) | 2024-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3321025B1 (en) | Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device | |
| JP6677668B2 (ja) | 鉛フリーはんだ合金、電子回路基板および電子制御装置 | |
| CN103906598A (zh) | 高冲击韧性的焊料合金 | |
| JP6560272B2 (ja) | ソルダペースト、電子回路基板及び電子制御装置 | |
| WO2018164171A1 (ja) | 鉛フリーはんだ合金、ソルダペースト及び電子回路基板 | |
| CN111683785A (zh) | 焊料合金、焊膏、焊球、带芯焊料及焊接接头 | |
| JP6578393B2 (ja) | 鉛フリーはんだ合金、電子回路実装基板及び電子制御装置 | |
| KR20210103389A (ko) | 납 프리 땜납 합금, 땜납 접합용 재료, 전자 회로 실장 기판 및 전자 제어 장치 | |
| JP7148761B1 (ja) | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置 | |
| CN117428367A (zh) | 软钎料合金、焊料球、焊膏和钎焊接头 | |
| JP6619387B2 (ja) | 鉛フリーはんだ合金 | |
| JP7262695B1 (ja) | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 | |
| JP7148760B1 (ja) | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置 | |
| JP7406052B1 (ja) | はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 | |
| JP7182753B1 (ja) | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 | |
| CN120265420A (zh) | 焊接方法、焊膏、焊料助剂和焊料接头 | |
| US20260070162A1 (en) | Solder alloy, solder paste, printed circuit board, and electronic control device | |
| JP7241716B2 (ja) | 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置 | |
| JP6916243B2 (ja) | 鉛フリーはんだ合金、電子回路基板及び電子制御装置 | |
| JP2024062898A (ja) | はんだ合金、ソルダペースト、プリント回路基板及び電子制御装置 | |
| JP2019209350A (ja) | 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230130 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230131 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20230131 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230228 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230308 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230404 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230411 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7262695 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |