KR20250138086A - 땜납 합금, 접합부, 접합재, 솔더 페이스트, 접합 구조체 및 전자 제어 장치 - Google Patents

땜납 합금, 접합부, 접합재, 솔더 페이스트, 접합 구조체 및 전자 제어 장치

Info

Publication number
KR20250138086A
KR20250138086A KR1020247022701A KR20247022701A KR20250138086A KR 20250138086 A KR20250138086 A KR 20250138086A KR 1020247022701 A KR1020247022701 A KR 1020247022701A KR 20247022701 A KR20247022701 A KR 20247022701A KR 20250138086 A KR20250138086 A KR 20250138086A
Authority
KR
South Korea
Prior art keywords
mass
solder
joint
solder alloy
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247022701A
Other languages
English (en)
Korean (ko)
Inventor
다카노리 시마자키
도모키 아사노
마사야 아라이
Original Assignee
가부시키가이샤 다무라 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 다무라 세이사쿠쇼 filed Critical 가부시키가이샤 다무라 세이사쿠쇼
Publication of KR20250138086A publication Critical patent/KR20250138086A/ko
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams or slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264Bi as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C12/00Alloys based on antimony or bismuth
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020247022701A 2023-01-24 2023-01-24 땜납 합금, 접합부, 접합재, 솔더 페이스트, 접합 구조체 및 전자 제어 장치 Pending KR20250138086A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002160 WO2024157366A1 (ja) 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

Publications (1)

Publication Number Publication Date
KR20250138086A true KR20250138086A (ko) 2025-09-19

Family

ID=86052921

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247022701A Pending KR20250138086A (ko) 2023-01-24 2023-01-24 땜납 합금, 접합부, 접합재, 솔더 페이스트, 접합 구조체 및 전자 제어 장치

Country Status (7)

Country Link
US (1) US20250018509A1 (https=)
EP (1) EP4656751A1 (https=)
JP (1) JP7262695B1 (https=)
KR (1) KR20250138086A (https=)
CN (1) CN118748957A (https=)
TW (1) TW202440956A (https=)
WO (1) WO2024157366A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6477965B1 (ja) 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
JP6804126B1 (ja) 2019-04-11 2020-12-23 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部
JP6951438B2 (ja) 2016-08-11 2021-10-20 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドBeijing Compo Advanced Technology Co.,Ltd. SnBiSb系低温鉛フリーはんだ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Sn−Ag−Bi系はんだ
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6951438B2 (ja) 2016-08-11 2021-10-20 ベイジン コンポー アドバンスト テクノロジー カンパニー リミテッドBeijing Compo Advanced Technology Co.,Ltd. SnBiSb系低温鉛フリーはんだ
JP6477965B1 (ja) 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
JP6804126B1 (ja) 2019-04-11 2020-12-23 株式会社日本スペリア社 鉛フリーはんだ合金及びはんだ接合部

Also Published As

Publication number Publication date
JPWO2024157366A1 (https=) 2024-08-02
CN118748957A (zh) 2024-10-08
TW202440956A (zh) 2024-10-16
US20250018509A1 (en) 2025-01-16
EP4656751A1 (en) 2025-12-03
JP7262695B1 (ja) 2023-04-21
WO2024157366A1 (ja) 2024-08-02

Similar Documents

Publication Publication Date Title
EP3321025B1 (en) Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device
JP6755837B2 (ja) 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP6138843B2 (ja) 鉛フリーはんだ合金含有ソルダペースト組成物、はんだ接合体構造および電子回路基板
WO2018164171A1 (ja) 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
KR20210103389A (ko) 납 프리 땜납 합금, 땜납 접합용 재료, 전자 회로 실장 기판 및 전자 제어 장치
CN111093889A (zh) 无铅软钎料合金、电子电路安装基板及电子控制装置
JP7148761B1 (ja) はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置
JP6795630B2 (ja) 鉛フリーはんだ合金、ソルダペースト組成物、電子回路基板および電子制御装置
JP7262695B1 (ja) はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置
EP3476520B1 (en) Lead-free solder alloy, electronic circuit board, and electronic control device
JP7406052B1 (ja) はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置
CN120265420A (zh) 焊接方法、焊膏、焊料助剂和焊料接头
US12569940B2 (en) Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device
JP7148760B1 (ja) はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置
US20260070162A1 (en) Solder alloy, solder paste, printed circuit board, and electronic control device
KR20190028985A (ko) 납 프리 땜납 합금, 전자 회로 기판 및 전자 제어 장치
JP2024062898A (ja) はんだ合金、ソルダペースト、プリント回路基板及び電子制御装置
KR20250041178A (ko) 땜납 합금, 땜납 페이스트 및 땜납 조인트
JP2023141365A (ja) 鉛フリーはんだ合金、ソルダペースト、電子回路実装基板及び電子制御装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000