CN118748957A - 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置 - Google Patents

软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置 Download PDF

Info

Publication number
CN118748957A
CN118748957A CN202380016098.7A CN202380016098A CN118748957A CN 118748957 A CN118748957 A CN 118748957A CN 202380016098 A CN202380016098 A CN 202380016098A CN 118748957 A CN118748957 A CN 118748957A
Authority
CN
China
Prior art keywords
mass
joint
solder alloy
solder
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380016098.7A
Other languages
English (en)
Chinese (zh)
Inventor
岛崎贵则
浅野智纪
新井正也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Publication of CN118748957A publication Critical patent/CN118748957A/zh
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams or slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264Bi as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C12/00Alloys based on antimony or bismuth
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN202380016098.7A 2023-01-24 2023-01-24 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置 Pending CN118748957A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/002160 WO2024157366A1 (ja) 2023-01-24 2023-01-24 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置

Publications (1)

Publication Number Publication Date
CN118748957A true CN118748957A (zh) 2024-10-08

Family

ID=86052921

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380016098.7A Pending CN118748957A (zh) 2023-01-24 2023-01-24 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置

Country Status (7)

Country Link
US (1) US20250018509A1 (https=)
EP (1) EP4656751A1 (https=)
JP (1) JP7262695B1 (https=)
KR (1) KR20250138086A (https=)
CN (1) CN118748957A (https=)
TW (1) TW202440956A (https=)
WO (1) WO2024157366A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001334386A (ja) * 2000-05-19 2001-12-04 Hitachi Ltd 電子機器用Sn−Ag−Bi系はんだ
CN102029479A (zh) * 2010-12-29 2011-04-27 广州有色金属研究院 一种低银无铅焊料合金及其制备方法和装置
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
CN106216872B (zh) 2016-08-11 2019-03-12 北京康普锡威科技有限公司 一种SnBiSb系低温无铅焊料及其制备方法
JP6477965B1 (ja) * 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
TWI819210B (zh) 2019-04-11 2023-10-21 日商日本斯倍利亞股份有限公司 無鉛焊錫合金及焊錫接合部

Also Published As

Publication number Publication date
JPWO2024157366A1 (https=) 2024-08-02
TW202440956A (zh) 2024-10-16
US20250018509A1 (en) 2025-01-16
EP4656751A1 (en) 2025-12-03
KR20250138086A (ko) 2025-09-19
JP7262695B1 (ja) 2023-04-21
WO2024157366A1 (ja) 2024-08-02

Similar Documents

Publication Publication Date Title
EP3321025B1 (en) Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device
CN106001978B (zh) 无铅软钎料合金、电子电路基板和电子控制装置
KR100999331B1 (ko) 납프리 땜납 합금
KR20120088875A (ko) 땜납 페이스트
CN111683785A (zh) 焊料合金、焊膏、焊球、带芯焊料及焊接接头
KR20210103389A (ko) 납 프리 땜납 합금, 땜납 접합용 재료, 전자 회로 실장 기판 및 전자 제어 장치
CN111093889A (zh) 无铅软钎料合金、电子电路安装基板及电子控制装置
JP7148761B1 (ja) はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置
JP6585554B2 (ja) 鉛フリーはんだ合金、電子回路基板及び電子制御装置
CN117428367A (zh) 软钎料合金、焊料球、焊膏和钎焊接头
CN118748957A (zh) 软钎料合金、接合部、接合材料、焊膏、接合结构体和电子控制装置
EP4578970A1 (en) Solder alloy, joint part, joining material, solder paste, joint structure, and electronic control device
EP3476520B1 (en) Lead-free solder alloy, electronic circuit board, and electronic control device
US20260070162A1 (en) Solder alloy, solder paste, printed circuit board, and electronic control device
KR20250168242A (ko) 땜납 합금, 땜납 볼, 땜납 프리폼, 땜납 이음 및 회로
CN120265420A (zh) 焊接方法、焊膏、焊料助剂和焊料接头
JP7406052B1 (ja) はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置
JP7148760B1 (ja) はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置
JP4432041B2 (ja) はんだ合金およびはんだボール
CN117921249A (zh) 软钎料合金、焊膏、印刷电路基板及电子控制装置
JP2005296983A (ja) はんだ合金およびはんだボール

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination