JPWO2023243108A5 - - Google Patents

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Publication number
JPWO2023243108A5
JPWO2023243108A5 JP2022538358A JP2022538358A JPWO2023243108A5 JP WO2023243108 A5 JPWO2023243108 A5 JP WO2023243108A5 JP 2022538358 A JP2022538358 A JP 2022538358A JP 2022538358 A JP2022538358 A JP 2022538358A JP WO2023243108 A5 JPWO2023243108 A5 JP WO2023243108A5
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JP
Japan
Prior art keywords
mass
joint
solder alloy
alloy according
workpieces
Prior art date
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Granted
Application number
JP2022538358A
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English (en)
Japanese (ja)
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JPWO2023243108A1 (https=
JP7148761B1 (ja
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Priority claimed from PCT/JP2022/024434 external-priority patent/WO2023243108A1/ja
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Publication of JP7148761B1 publication Critical patent/JP7148761B1/ja
Publication of JPWO2023243108A1 publication Critical patent/JPWO2023243108A1/ja
Publication of JPWO2023243108A5 publication Critical patent/JPWO2023243108A5/ja
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JP2022538358A 2022-06-17 2022-06-17 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置 Active JP7148761B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/024434 WO2023243108A1 (ja) 2022-06-17 2022-06-17 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置

Publications (3)

Publication Number Publication Date
JP7148761B1 JP7148761B1 (ja) 2022-10-05
JPWO2023243108A1 JPWO2023243108A1 (https=) 2023-12-21
JPWO2023243108A5 true JPWO2023243108A5 (https=) 2024-05-28

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ID=83507341

Family Applications (1)

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JP2022538358A Active JP7148761B1 (ja) 2022-06-17 2022-06-17 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置

Country Status (2)

Country Link
JP (1) JP7148761B1 (https=)
WO (1) WO2023243108A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115647644B (zh) * 2022-10-09 2024-06-25 云南锡业集团（控股）有限责任公司研发中心 一种五元包共晶高韧性低温锡铋系焊料及其制备方法
JP7674691B1 (ja) * 2024-12-19 2025-05-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、およびはんだ継手

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105195915B (zh) * 2015-10-30 2017-05-24 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
JP6730833B2 (ja) * 2016-03-31 2020-07-29 株式会社タムラ製作所 はんだ合金およびはんだ組成物
JP6755546B2 (ja) * 2016-08-09 2020-09-16 株式会社日本スペリア社 接合方法
WO2018174162A1 (ja) * 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
JP6477965B1 (ja) * 2018-03-08 2019-03-06 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN112638574A (zh) * 2018-08-31 2021-04-09 铟泰公司 SnBi和SnIn焊锡合金

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