JP7148761B1 - はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置 - Google Patents

はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置 Download PDF

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Publication number
JP7148761B1
JP7148761B1 JP2022538358A JP2022538358A JP7148761B1 JP 7148761 B1 JP7148761 B1 JP 7148761B1 JP 2022538358 A JP2022538358 A JP 2022538358A JP 2022538358 A JP2022538358 A JP 2022538358A JP 7148761 B1 JP7148761 B1 JP 7148761B1
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Japan
Prior art keywords
mass
solder alloy
joined
joint
solder
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JP2022538358A
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Japanese (ja)
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JPWO2023243108A5 (https=
JPWO2023243108A1 (https=
Inventor
貴則 嶋崎
大輔 丸山
元気 越智
正也 新井
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Tamura Corp
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Tamura Corp
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Publication of JPWO2023243108A1 publication Critical patent/JPWO2023243108A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2022538358A 2022-06-17 2022-06-17 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置 Active JP7148761B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/024434 WO2023243108A1 (ja) 2022-06-17 2022-06-17 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置

Publications (3)

Publication Number Publication Date
JP7148761B1 true JP7148761B1 (ja) 2022-10-05
JPWO2023243108A1 JPWO2023243108A1 (https=) 2023-12-21
JPWO2023243108A5 JPWO2023243108A5 (https=) 2024-05-28

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Family Applications (1)

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JP2022538358A Active JP7148761B1 (ja) 2022-06-17 2022-06-17 はんだ合金、接合部、接合材、ソルダペースト、接合構造体および制御装置

Country Status (2)

Country Link
JP (1) JP7148761B1 (https=)
WO (1) WO2023243108A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115647644A (zh) * 2022-10-09 2023-01-31 云南锡业集团（控股）有限责任公司研发中心 一种五元包共晶高韧性低温锡铋系焊料及其制备方法
JP7674691B1 (ja) * 2024-12-19 2025-05-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、およびはんだ継手

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105195915A (zh) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
JP2017177211A (ja) * 2016-03-31 2017-10-05 株式会社タムラ製作所 はんだ合金およびはんだ組成物
JP2018023987A (ja) * 2016-08-09 2018-02-15 株式会社日本スペリア社 接合方法
WO2018174162A1 (ja) * 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
WO2019171978A1 (ja) * 2018-03-08 2019-09-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
WO2020047481A1 (en) * 2018-08-31 2020-03-05 Indium Corporation Snbi and snin solder alloys

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105195915A (zh) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 一种低温无铅焊料合金
JP2017177211A (ja) * 2016-03-31 2017-10-05 株式会社タムラ製作所 はんだ合金およびはんだ組成物
JP2018023987A (ja) * 2016-08-09 2018-02-15 株式会社日本スペリア社 接合方法
WO2018174162A1 (ja) * 2017-03-23 2018-09-27 株式会社日本スペリア社 はんだ継手
WO2019171978A1 (ja) * 2018-03-08 2019-09-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
WO2020047481A1 (en) * 2018-08-31 2020-03-05 Indium Corporation Snbi and snin solder alloys

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115647644A (zh) * 2022-10-09 2023-01-31 云南锡业集团（控股）有限责任公司研发中心 一种五元包共晶高韧性低温锡铋系焊料及其制备方法
JP7674691B1 (ja) * 2024-12-19 2025-05-12 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、およびはんだ継手

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JPWO2023243108A1 (https=) 2023-12-21

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