JPWO2024142212A5 - - Google Patents

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Publication number
JPWO2024142212A5
JPWO2024142212A5 JP2023529936A JP2023529936A JPWO2024142212A5 JP WO2024142212 A5 JPWO2024142212 A5 JP WO2024142212A5 JP 2023529936 A JP2023529936 A JP 2023529936A JP 2023529936 A JP2023529936 A JP 2023529936A JP WO2024142212 A5 JPWO2024142212 A5 JP WO2024142212A5
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JP
Japan
Prior art keywords
semiconductor
disposed
sidewall
sealing resin
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023529936A
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English (en)
Japanese (ja)
Other versions
JP7327715B1 (ja
JPWO2024142212A1 (https=
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Priority claimed from PCT/JP2022/048098 external-priority patent/WO2024142212A1/ja
Application granted granted Critical
Publication of JP7327715B1 publication Critical patent/JP7327715B1/ja
Publication of JPWO2024142212A1 publication Critical patent/JPWO2024142212A1/ja
Publication of JPWO2024142212A5 publication Critical patent/JPWO2024142212A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023529936A 2022-12-27 2022-12-27 半導体装置 Active JP7327715B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/048098 WO2024142212A1 (ja) 2022-12-27 2022-12-27 半導体装置

Publications (3)

Publication Number Publication Date
JP7327715B1 JP7327715B1 (ja) 2023-08-16
JPWO2024142212A1 JPWO2024142212A1 (https=) 2024-07-04
JPWO2024142212A5 true JPWO2024142212A5 (https=) 2024-11-26

Family

ID=87563009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529936A Active JP7327715B1 (ja) 2022-12-27 2022-12-27 半導体装置

Country Status (5)

Country Link
US (1) US20260082989A1 (https=)
JP (1) JP7327715B1 (https=)
CN (1) CN120457539A (https=)
TW (2) TW202531518A (https=)
WO (1) WO2024142212A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04256346A (ja) * 1991-02-08 1992-09-11 Fujitsu Ltd 浸漬冷却用電子部品構造
TWI236116B (en) * 2004-11-04 2005-07-11 Advanced Semiconductor Eng High heat dissipation flip chip package structure
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
EP2172970A4 (en) * 2007-07-19 2012-04-04 Fujikura Ltd SEMICONDUCTOR HOUSING AND METHOD FOR MANUFACTURING THE SAME
JP2009253206A (ja) * 2008-04-10 2009-10-29 Sharp Corp 樹脂封止型半導体装置およびその実装構造
CN105378912B (zh) * 2014-06-09 2018-12-28 三菱电机株式会社 半导体封装件的制造方法以及半导体封装件
US9761540B2 (en) * 2015-06-24 2017-09-12 Micron Technology, Inc. Wafer level package and fabrication method thereof
DE102015223399B4 (de) * 2015-11-26 2018-11-08 Robert Bosch Gmbh Verfahren zum Verpacken mindestens eines Halbleiterbauteils und Halbleitervorrichtung
TWI848937B (zh) * 2018-07-24 2024-07-21 日商拓自達電線股份有限公司 屏蔽封裝體及屏蔽封裝體之製造方法
KR102711765B1 (ko) * 2019-03-06 2024-09-27 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US11538731B2 (en) * 2019-03-28 2022-12-27 Intel Corporation Thermal solutions for package on package (PoP) architectures

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