JPWO2023067926A5 - - Google Patents
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- Publication number
- JPWO2023067926A5 JPWO2023067926A5 JP2023555000A JP2023555000A JPWO2023067926A5 JP WO2023067926 A5 JPWO2023067926 A5 JP WO2023067926A5 JP 2023555000 A JP2023555000 A JP 2023555000A JP 2023555000 A JP2023555000 A JP 2023555000A JP WO2023067926 A5 JPWO2023067926 A5 JP WO2023067926A5
- Authority
- JP
- Japan
- Prior art keywords
- passivation layer
- semiconductor device
- opening
- electrode
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021172674 | 2021-10-21 | ||
| PCT/JP2022/033369 WO2023067926A1 (ja) | 2021-10-21 | 2022-09-06 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023067926A1 JPWO2023067926A1 (https=) | 2023-04-27 |
| JPWO2023067926A5 true JPWO2023067926A5 (https=) | 2024-07-09 |
Family
ID=86058991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023555000A Pending JPWO2023067926A1 (https=) | 2021-10-21 | 2022-09-06 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240347408A1 (https=) |
| JP (1) | JPWO2023067926A1 (https=) |
| CN (1) | CN117836906A (https=) |
| DE (1) | DE112022005058T5 (https=) |
| WO (1) | WO2023067926A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5619639U (https=) | 1979-07-23 | 1981-02-20 | ||
| JP2770390B2 (ja) | 1989-03-24 | 1998-07-02 | 日本電気株式会社 | 半導体装置 |
| JPH0396243A (ja) | 1989-09-08 | 1991-04-22 | Seiko Epson Corp | 半導体集積回路装置 |
| JP6406975B2 (ja) * | 2014-10-24 | 2018-10-17 | 三菱電機株式会社 | 半導体素子および半導体装置 |
| JP6528793B2 (ja) * | 2017-02-22 | 2019-06-12 | サンケン電気株式会社 | 半導体装置 |
| JP6930495B2 (ja) * | 2018-05-18 | 2021-09-01 | 株式会社デンソー | 半導体装置 |
| US12369381B2 (en) * | 2019-09-30 | 2025-07-22 | Rohm Co., Ltd. | Semiconductor device |
| JP2021172674A (ja) | 2020-04-17 | 2021-11-01 | 住友化学株式会社 | ゴム組成物、ゴム組成物を製造する方法、及び防振材 |
-
2022
- 2022-09-06 DE DE112022005058.6T patent/DE112022005058T5/de active Pending
- 2022-09-06 CN CN202280057520.9A patent/CN117836906A/zh active Pending
- 2022-09-06 WO PCT/JP2022/033369 patent/WO2023067926A1/ja not_active Ceased
- 2022-09-06 JP JP2023555000A patent/JPWO2023067926A1/ja active Pending
- 2022-09-06 US US18/293,919 patent/US20240347408A1/en active Pending
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