JPWO2023199375A5 - - Google Patents

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Publication number
JPWO2023199375A5
JPWO2023199375A5 JP2022547771A JP2022547771A JPWO2023199375A5 JP WO2023199375 A5 JPWO2023199375 A5 JP WO2023199375A5 JP 2022547771 A JP2022547771 A JP 2022547771A JP 2022547771 A JP2022547771 A JP 2022547771A JP WO2023199375 A5 JPWO2023199375 A5 JP WO2023199375A5
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JP
Japan
Prior art keywords
sealing ring
corner
device substrate
sealing
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022547771A
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English (en)
Japanese (ja)
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JP7231118B1 (ja
JPWO2023199375A1 (https=
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Priority claimed from PCT/JP2022/017500 external-priority patent/WO2023199375A1/ja
Application granted granted Critical
Publication of JP7231118B1 publication Critical patent/JP7231118B1/ja
Publication of JPWO2023199375A1 publication Critical patent/JPWO2023199375A1/ja
Publication of JPWO2023199375A5 publication Critical patent/JPWO2023199375A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2022547771A 2022-04-11 2022-04-11 中空パッケージ Active JP7231118B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017500 WO2023199375A1 (ja) 2022-04-11 2022-04-11 中空パッケージ

Publications (3)

Publication Number Publication Date
JP7231118B1 JP7231118B1 (ja) 2023-03-01
JPWO2023199375A1 JPWO2023199375A1 (https=) 2023-10-19
JPWO2023199375A5 true JPWO2023199375A5 (https=) 2024-03-21

Family

ID=85380665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022547771A Active JP7231118B1 (ja) 2022-04-11 2022-04-11 中空パッケージ

Country Status (4)

Country Link
US (1) US12550755B2 (https=)
JP (1) JP7231118B1 (https=)
CN (1) CN118900818A (https=)
WO (1) WO2023199375A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878897B2 (ja) 2002-08-30 2007-02-07 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP2006173557A (ja) * 2004-11-22 2006-06-29 Toshiba Corp 中空型半導体装置とその製造方法
JP2008192700A (ja) * 2007-02-01 2008-08-21 Alps Electric Co Ltd 電子部品
JP2008218811A (ja) 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
TWI429570B (zh) * 2012-03-23 2014-03-11 Gudeng Prec Ind Co Ltd 具有扣合結構之光罩盒
NO2944700T3 (https=) * 2013-07-11 2018-03-17
JP2015170685A (ja) 2014-03-06 2015-09-28 三菱電機株式会社 基板装置
US10314171B1 (en) * 2017-12-29 2019-06-04 Intel Corporation Package assembly with hermetic cavity
JP2019153849A (ja) * 2018-02-28 2019-09-12 セイコーエプソン株式会社 発振器、電子機器および移動体
JP7056853B2 (ja) * 2018-03-15 2022-04-19 日清紡マイクロデバイス株式会社 Ｍｅｍｓ素子の実装構造
WO2020069089A1 (en) * 2018-09-26 2020-04-02 Ignite, Inc. A mems package
TWI687760B (zh) * 2019-04-16 2020-03-11 家登精密工業股份有限公司 具有擾流結構的光罩盒
CN110155934A (zh) * 2019-04-22 2019-08-23 武汉衍熙微器件有限公司 一种mems器件及其制作方法
JP7074147B2 (ja) * 2020-01-15 2022-05-24 セイコーエプソン株式会社 電子デバイス、電子機器、および移動体

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