CN118900818A - 中空封装 - Google Patents

中空封装 Download PDF

Info

Publication number
CN118900818A
CN118900818A CN202280090515.8A CN202280090515A CN118900818A CN 118900818 A CN118900818 A CN 118900818A CN 202280090515 A CN202280090515 A CN 202280090515A CN 118900818 A CN118900818 A CN 118900818A
Authority
CN
China
Prior art keywords
seal ring
corner
device substrate
seal
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280090515.8A
Other languages
English (en)
Chinese (zh)
Inventor
三崎浩司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN118900818A publication Critical patent/CN118900818A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/344—Dispositions of die-attach connectors, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Micromachines (AREA)
CN202280090515.8A 2022-04-11 2022-04-11 中空封装 Pending CN118900818A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017500 WO2023199375A1 (ja) 2022-04-11 2022-04-11 中空パッケージ

Publications (1)

Publication Number Publication Date
CN118900818A true CN118900818A (zh) 2024-11-05

Family

ID=85380665

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280090515.8A Pending CN118900818A (zh) 2022-04-11 2022-04-11 中空封装

Country Status (4)

Country Link
US (1) US12550755B2 (https=)
JP (1) JP7231118B1 (https=)
CN (1) CN118900818A (https=)
WO (1) WO2023199375A1 (https=)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878897B2 (ja) 2002-08-30 2007-02-07 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP2006173557A (ja) * 2004-11-22 2006-06-29 Toshiba Corp 中空型半導体装置とその製造方法
JP2008192700A (ja) * 2007-02-01 2008-08-21 Alps Electric Co Ltd 電子部品
JP2008218811A (ja) 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
TWI429570B (zh) * 2012-03-23 2014-03-11 Gudeng Prec Ind Co Ltd 具有扣合結構之光罩盒
NO2944700T3 (https=) * 2013-07-11 2018-03-17
JP2015170685A (ja) 2014-03-06 2015-09-28 三菱電機株式会社 基板装置
US10314171B1 (en) * 2017-12-29 2019-06-04 Intel Corporation Package assembly with hermetic cavity
JP2019153849A (ja) * 2018-02-28 2019-09-12 セイコーエプソン株式会社 発振器、電子機器および移動体
JP7056853B2 (ja) * 2018-03-15 2022-04-19 日清紡マイクロデバイス株式会社 Ｍｅｍｓ素子の実装構造
WO2020069089A1 (en) * 2018-09-26 2020-04-02 Ignite, Inc. A mems package
TWI687760B (zh) * 2019-04-16 2020-03-11 家登精密工業股份有限公司 具有擾流結構的光罩盒
CN110155934A (zh) * 2019-04-22 2019-08-23 武汉衍熙微器件有限公司 一种mems器件及其制作方法
JP7074147B2 (ja) * 2020-01-15 2022-05-24 セイコーエプソン株式会社 電子デバイス、電子機器、および移動体

Also Published As

Publication number Publication date
US12550755B2 (en) 2026-02-10
JP7231118B1 (ja) 2023-03-01
US20250046746A1 (en) 2025-02-06
JPWO2023199375A1 (https=) 2023-10-19
WO2023199375A1 (ja) 2023-10-19

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