JP7231118B1 - 中空パッケージ - Google Patents

中空パッケージ Download PDF

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Publication number
JP7231118B1
JP7231118B1 JP2022547771A JP2022547771A JP7231118B1 JP 7231118 B1 JP7231118 B1 JP 7231118B1 JP 2022547771 A JP2022547771 A JP 2022547771A JP 2022547771 A JP2022547771 A JP 2022547771A JP 7231118 B1 JP7231118 B1 JP 7231118B1
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JP
Japan
Prior art keywords
sealing ring
device substrate
corner
substrate
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022547771A
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English (en)
Japanese (ja)
Other versions
JPWO2023199375A5 (https=
JPWO2023199375A1 (https=
Inventor
浩司 三崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of JP7231118B1 publication Critical patent/JP7231118B1/ja
Publication of JPWO2023199375A1 publication Critical patent/JPWO2023199375A1/ja
Publication of JPWO2023199375A5 publication Critical patent/JPWO2023199375A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/344—Dispositions of die-attach connectors, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Micromachines (AREA)
JP2022547771A 2022-04-11 2022-04-11 中空パッケージ Active JP7231118B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/017500 WO2023199375A1 (ja) 2022-04-11 2022-04-11 中空パッケージ

Publications (3)

Publication Number Publication Date
JP7231118B1 true JP7231118B1 (ja) 2023-03-01
JPWO2023199375A1 JPWO2023199375A1 (https=) 2023-10-19
JPWO2023199375A5 JPWO2023199375A5 (https=) 2024-03-21

Family

ID=85380665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022547771A Active JP7231118B1 (ja) 2022-04-11 2022-04-11 中空パッケージ

Country Status (4)

Country Link
US (1) US12550755B2 (https=)
JP (1) JP7231118B1 (https=)
CN (1) CN118900818A (https=)
WO (1) WO2023199375A1 (https=)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173557A (ja) * 2004-11-22 2006-06-29 Toshiba Corp 中空型半導体装置とその製造方法
JP2008192700A (ja) * 2007-02-01 2008-08-21 Alps Electric Co Ltd 電子部品
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
JP2016531421A (ja) * 2013-07-11 2016-10-06 レイセオン カンパニー 真空ゲッタとして使用されるウェファレベルのパッケージされた半田バリア
US10314171B1 (en) * 2017-12-29 2019-06-04 Intel Corporation Package assembly with hermetic cavity
JP2019155566A (ja) * 2018-03-15 2019-09-19 新日本無線株式会社 Ｍｅｍｓ素子およびその実装構造
JP2020076782A (ja) * 2020-01-15 2020-05-21 セイコーエプソン株式会社 電子デバイス、電子機器、および移動体
JP2020175500A (ja) * 2019-04-22 2020-10-29 ウーハン イエンシー マイクロ コンポーネンツ カンパニーリミテッド Ｍｅｍｓデバイス及びその製造方法
US20210276859A1 (en) * 2018-09-26 2021-09-09 Ignite, Inc. A MEMS Package

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3878897B2 (ja) 2002-08-30 2007-02-07 京セラ株式会社 半導体素子収納用パッケージおよび半導体装置
JP2008218811A (ja) 2007-03-06 2008-09-18 Hitachi Metals Ltd 機能素子パッケージ
TWI429570B (zh) * 2012-03-23 2014-03-11 Gudeng Prec Ind Co Ltd 具有扣合結構之光罩盒
JP2015170685A (ja) 2014-03-06 2015-09-28 三菱電機株式会社 基板装置
JP2019153849A (ja) * 2018-02-28 2019-09-12 セイコーエプソン株式会社 発振器、電子機器および移動体
TWI687760B (zh) * 2019-04-16 2020-03-11 家登精密工業股份有限公司 具有擾流結構的光罩盒

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173557A (ja) * 2004-11-22 2006-06-29 Toshiba Corp 中空型半導体装置とその製造方法
JP2008192700A (ja) * 2007-02-01 2008-08-21 Alps Electric Co Ltd 電子部品
JP2010161271A (ja) * 2009-01-09 2010-07-22 Panasonic Corp 半導体パッケージ
JP2016531421A (ja) * 2013-07-11 2016-10-06 レイセオン カンパニー 真空ゲッタとして使用されるウェファレベルのパッケージされた半田バリア
US10314171B1 (en) * 2017-12-29 2019-06-04 Intel Corporation Package assembly with hermetic cavity
JP2019155566A (ja) * 2018-03-15 2019-09-19 新日本無線株式会社 Ｍｅｍｓ素子およびその実装構造
US20210276859A1 (en) * 2018-09-26 2021-09-09 Ignite, Inc. A MEMS Package
JP2020175500A (ja) * 2019-04-22 2020-10-29 ウーハン イエンシー マイクロ コンポーネンツ カンパニーリミテッド Ｍｅｍｓデバイス及びその製造方法
JP2020076782A (ja) * 2020-01-15 2020-05-21 セイコーエプソン株式会社 電子デバイス、電子機器、および移動体

Also Published As

Publication number Publication date
US12550755B2 (en) 2026-02-10
US20250046746A1 (en) 2025-02-06
JPWO2023199375A1 (https=) 2023-10-19
CN118900818A (zh) 2024-11-05
WO2023199375A1 (ja) 2023-10-19

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