JPWO2023199375A1 - - Google Patents
Info
- Publication number
- JPWO2023199375A1 JPWO2023199375A1 JP2022547771A JP2022547771A JPWO2023199375A1 JP WO2023199375 A1 JPWO2023199375 A1 JP WO2023199375A1 JP 2022547771 A JP2022547771 A JP 2022547771A JP 2022547771 A JP2022547771 A JP 2022547771A JP WO2023199375 A1 JPWO2023199375 A1 JP WO2023199375A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/331—Shapes of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/341—Dispositions of die-attach connectors, e.g. layouts
- H10W72/344—Dispositions of die-attach connectors, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/017500 WO2023199375A1 (ja) | 2022-04-11 | 2022-04-11 | 中空パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7231118B1 JP7231118B1 (ja) | 2023-03-01 |
| JPWO2023199375A1 true JPWO2023199375A1 (https=) | 2023-10-19 |
| JPWO2023199375A5 JPWO2023199375A5 (https=) | 2024-03-21 |
Family
ID=85380665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022547771A Active JP7231118B1 (ja) | 2022-04-11 | 2022-04-11 | 中空パッケージ |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12550755B2 (https=) |
| JP (1) | JP7231118B1 (https=) |
| CN (1) | CN118900818A (https=) |
| WO (1) | WO2023199375A1 (https=) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3878897B2 (ja) | 2002-08-30 | 2007-02-07 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
| JP2006173557A (ja) * | 2004-11-22 | 2006-06-29 | Toshiba Corp | 中空型半導体装置とその製造方法 |
| JP2008192700A (ja) * | 2007-02-01 | 2008-08-21 | Alps Electric Co Ltd | 電子部品 |
| JP2008218811A (ja) | 2007-03-06 | 2008-09-18 | Hitachi Metals Ltd | 機能素子パッケージ |
| JP2010161271A (ja) * | 2009-01-09 | 2010-07-22 | Panasonic Corp | 半導体パッケージ |
| TWI429570B (zh) * | 2012-03-23 | 2014-03-11 | Gudeng Prec Ind Co Ltd | 具有扣合結構之光罩盒 |
| NO2944700T3 (https=) * | 2013-07-11 | 2018-03-17 | ||
| JP2015170685A (ja) | 2014-03-06 | 2015-09-28 | 三菱電機株式会社 | 基板装置 |
| US10314171B1 (en) * | 2017-12-29 | 2019-06-04 | Intel Corporation | Package assembly with hermetic cavity |
| JP2019153849A (ja) * | 2018-02-28 | 2019-09-12 | セイコーエプソン株式会社 | 発振器、電子機器および移動体 |
| JP7056853B2 (ja) * | 2018-03-15 | 2022-04-19 | 日清紡マイクロデバイス株式会社 | Ｍｅｍｓ素子の実装構造 |
| WO2020069089A1 (en) * | 2018-09-26 | 2020-04-02 | Ignite, Inc. | A mems package |
| TWI687760B (zh) * | 2019-04-16 | 2020-03-11 | 家登精密工業股份有限公司 | 具有擾流結構的光罩盒 |
| CN110155934A (zh) * | 2019-04-22 | 2019-08-23 | 武汉衍熙微器件有限公司 | 一种mems器件及其制作方法 |
| JP7074147B2 (ja) * | 2020-01-15 | 2022-05-24 | セイコーエプソン株式会社 | 電子デバイス、電子機器、および移動体 |
-
2022
- 2022-04-11 US US18/718,192 patent/US12550755B2/en active Active
- 2022-04-11 CN CN202280090515.8A patent/CN118900818A/zh active Pending
- 2022-04-11 JP JP2022547771A patent/JP7231118B1/ja active Active
- 2022-04-11 WO PCT/JP2022/017500 patent/WO2023199375A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US12550755B2 (en) | 2026-02-10 |
| JP7231118B1 (ja) | 2023-03-01 |
| US20250046746A1 (en) | 2025-02-06 |
| CN118900818A (zh) | 2024-11-05 |
| WO2023199375A1 (ja) | 2023-10-19 |
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