JPWO2023021643A5 - - Google Patents

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Publication number
JPWO2023021643A5
JPWO2023021643A5 JP2021576940A JP2021576940A JPWO2023021643A5 JP WO2023021643 A5 JPWO2023021643 A5 JP WO2023021643A5 JP 2021576940 A JP2021576940 A JP 2021576940A JP 2021576940 A JP2021576940 A JP 2021576940A JP WO2023021643 A5 JPWO2023021643 A5 JP WO2023021643A5
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JP
Japan
Prior art keywords
metal pattern
electronic
electronic substrate
porous layer
stress relief
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Application number
JP2021576940A
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English (en)
Japanese (ja)
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JP7118298B1 (ja
JPWO2023021643A1 (https=
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Priority claimed from PCT/JP2021/030314 external-priority patent/WO2023021643A1/ja
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Publication of JP7118298B1 publication Critical patent/JP7118298B1/ja
Publication of JPWO2023021643A1 publication Critical patent/JPWO2023021643A1/ja
Publication of JPWO2023021643A5 publication Critical patent/JPWO2023021643A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021576940A 2021-08-19 2021-08-19 応力緩和構造および応力緩和構造の製造方法 Active JP7118298B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/030314 WO2023021643A1 (ja) 2021-08-19 2021-08-19 応力緩和構造

Publications (3)

Publication Number Publication Date
JP7118298B1 JP7118298B1 (ja) 2022-08-15
JPWO2023021643A1 JPWO2023021643A1 (https=) 2023-02-23
JPWO2023021643A5 true JPWO2023021643A5 (https=) 2023-07-26

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ID=82847600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021576940A Active JP7118298B1 (ja) 2021-08-19 2021-08-19 応力緩和構造および応力緩和構造の製造方法

Country Status (5)

Country Link
US (1) US20240243023A1 (https=)
JP (1) JP7118298B1 (https=)
CN (1) CN117813682A (https=)
DE (1) DE112021008123T5 (https=)
WO (1) WO2023021643A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085802A (ja) * 1999-09-16 2001-03-30 Hitachi Cable Ltd 配線基板及びそれを用いた電子装置及びその製造方法
JP2006277954A (ja) * 2005-03-28 2006-10-12 Jfe Steel Kk 断路端子台
JP2008241641A (ja) 2007-03-29 2008-10-09 Sumitomo Electric Ind Ltd インターポーザおよびその製造方法
JP2008277954A (ja) * 2007-04-26 2008-11-13 Fujitsu Media Device Kk パッケージデバイス
JP6205914B2 (ja) 2013-07-08 2017-10-04 三菱電機株式会社 モジュール構造
JP6481409B2 (ja) * 2015-02-19 2019-03-13 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
CA3055274C (en) * 2017-03-03 2021-07-27 Hiroaki Nakaya Thermoelectric conversion module provided with photothermal conversion substrate
JP7347735B2 (ja) * 2019-11-11 2023-09-20 株式会社ディスコ チャックテーブルおよびチャックテーブルの製造方法

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