JP2025139679A5 - - Google Patents

Info

Publication number
JP2025139679A5
JP2025139679A5 JP2024038638A JP2024038638A JP2025139679A5 JP 2025139679 A5 JP2025139679 A5 JP 2025139679A5 JP 2024038638 A JP2024038638 A JP 2024038638A JP 2024038638 A JP2024038638 A JP 2024038638A JP 2025139679 A5 JP2025139679 A5 JP 2025139679A5
Authority
JP
Japan
Prior art keywords
modulus
determined
multilayer substrate
substrate unit
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024038638A
Other languages
English (en)
Japanese (ja)
Other versions
JP2025139679A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2024038638A priority Critical patent/JP2025139679A/ja
Priority claimed from JP2024038638A external-priority patent/JP2025139679A/ja
Priority to CN202510211369.5A priority patent/CN120659227A/zh
Priority to US19/074,491 priority patent/US20250294678A1/en
Publication of JP2025139679A publication Critical patent/JP2025139679A/ja
Publication of JP2025139679A5 publication Critical patent/JP2025139679A5/ja
Pending legal-status Critical Current

Links

JP2024038638A 2024-03-13 2024-03-13 樹脂多層基板及び電子機器 Pending JP2025139679A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2024038638A JP2025139679A (ja) 2024-03-13 2024-03-13 樹脂多層基板及び電子機器
CN202510211369.5A CN120659227A (zh) 2024-03-13 2025-02-25 树脂多层基板及电子设备
US19/074,491 US20250294678A1 (en) 2024-03-13 2025-03-10 Multilayer resin substrate and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2024038638A JP2025139679A (ja) 2024-03-13 2024-03-13 樹脂多層基板及び電子機器

Publications (2)

Publication Number Publication Date
JP2025139679A JP2025139679A (ja) 2025-09-29
JP2025139679A5 true JP2025139679A5 (https=) 2025-10-24

Family

ID=96998627

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024038638A Pending JP2025139679A (ja) 2024-03-13 2024-03-13 樹脂多層基板及び電子機器

Country Status (3)

Country Link
US (1) US20250294678A1 (https=)
JP (1) JP2025139679A (https=)
CN (1) CN120659227A (https=)

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