CN117813682A - 应力缓和结构 - Google Patents

应力缓和结构 Download PDF

Info

Publication number
CN117813682A
CN117813682A CN202180101444.2A CN202180101444A CN117813682A CN 117813682 A CN117813682 A CN 117813682A CN 202180101444 A CN202180101444 A CN 202180101444A CN 117813682 A CN117813682 A CN 117813682A
Authority
CN
China
Prior art keywords
electronic substrate
porous layer
stress relaxation
metal pattern
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180101444.2A
Other languages
English (en)
Chinese (zh)
Inventor
加茂芳幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN117813682A publication Critical patent/CN117813682A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202180101444.2A 2021-08-19 2021-08-19 应力缓和结构 Pending CN117813682A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/030314 WO2023021643A1 (ja) 2021-08-19 2021-08-19 応力緩和構造

Publications (1)

Publication Number Publication Date
CN117813682A true CN117813682A (zh) 2024-04-02

Family

ID=82847600

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180101444.2A Pending CN117813682A (zh) 2021-08-19 2021-08-19 应力缓和结构

Country Status (5)

Country Link
US (1) US20240243023A1 (https=)
JP (1) JP7118298B1 (https=)
CN (1) CN117813682A (https=)
DE (1) DE112021008123T5 (https=)
WO (1) WO2023021643A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085802A (ja) * 1999-09-16 2001-03-30 Hitachi Cable Ltd 配線基板及びそれを用いた電子装置及びその製造方法
JP2006277954A (ja) * 2005-03-28 2006-10-12 Jfe Steel Kk 断路端子台
JP2008241641A (ja) 2007-03-29 2008-10-09 Sumitomo Electric Ind Ltd インターポーザおよびその製造方法
JP2008277954A (ja) * 2007-04-26 2008-11-13 Fujitsu Media Device Kk パッケージデバイス
JP6205914B2 (ja) 2013-07-08 2017-10-04 三菱電機株式会社 モジュール構造
JP6481409B2 (ja) * 2015-02-19 2019-03-13 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
CA3055274C (en) * 2017-03-03 2021-07-27 Hiroaki Nakaya Thermoelectric conversion module provided with photothermal conversion substrate
JP7347735B2 (ja) * 2019-11-11 2023-09-20 株式会社ディスコ チャックテーブルおよびチャックテーブルの製造方法

Also Published As

Publication number Publication date
JP7118298B1 (ja) 2022-08-15
US20240243023A1 (en) 2024-07-18
JPWO2023021643A1 (https=) 2023-02-23
DE112021008123T5 (de) 2024-05-29
WO2023021643A1 (ja) 2023-02-23

Similar Documents

Publication Publication Date Title
JP2008172172A (ja) 電子制御装置及びその製造方法
CN103107101B (zh) 半导体传感器器件及其封装方法
JP2004095923A (ja) 実装基板およびこの実装基板を用いた電子デバイス
CN107039357A (zh) 芯片保护封壳和方法
JPH08167678A (ja) 半導体装置
JP5174664B2 (ja) 密閉用のパッケージ及びパッケージの製造方法
US20120119358A1 (en) Semicondiuctor package substrate and method for manufacturing the same
JP2010129810A (ja) 半導体素子搭載用基板及び半導体装置
JP2005101125A (ja) 半導体装置の製造方法及び半導体装置、回路基板並びに電子機器
CN111919520A (zh) 电子电路装置以及电路基板的制造方法
CN117813682A (zh) 应力缓和结构
US20160135293A1 (en) Substrate structures and methods of manufacture
KR101897641B1 (ko) 파워 모듈 패키지의 제조방법 및 이를 이용한 파워 모듈 패키지
CN102655715B (zh) 柔性印刷电路板及其制造方法
KR100878408B1 (ko) 웨이퍼 레벨 디바이스 패키징 방법
JP4830861B2 (ja) 接合構造体の製造方法
JPH09237869A (ja) 樹脂封止型パワーモジュール装置及びその製造方法
JP5556007B2 (ja) 電子装置
JP3918303B2 (ja) 半導体パッケージ
JP3627633B2 (ja) 半導体装置
JP2010141159A (ja) 電子装置
JP2011003682A (ja) 車載電子機器
US7427813B1 (en) Structure, material, and design for assembling a low-K Si die to achieve an industrial grade reliability wire bonding package
JP3674476B2 (ja) 半導体装置
JP2520429B2 (ja) 電子部品実装用プリント配線板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination